JPWO2020225884A1 - - Google Patents

Info

Publication number
JPWO2020225884A1
JPWO2020225884A1 JP2021518258A JP2021518258A JPWO2020225884A1 JP WO2020225884 A1 JPWO2020225884 A1 JP WO2020225884A1 JP 2021518258 A JP2021518258 A JP 2021518258A JP 2021518258 A JP2021518258 A JP 2021518258A JP WO2020225884 A1 JPWO2020225884 A1 JP WO2020225884A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021518258A
Other languages
Japanese (ja)
Other versions
JPWO2020225884A5 (en
JP7294412B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020225884A1 publication Critical patent/JPWO2020225884A1/ja
Publication of JPWO2020225884A5 publication Critical patent/JPWO2020225884A5/ja
Application granted granted Critical
Publication of JP7294412B2 publication Critical patent/JP7294412B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2021518258A 2019-05-08 2019-05-08 resin particle mixture Active JP7294412B2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/018444 WO2020225884A1 (en) 2019-05-08 2019-05-08 Resin particle mixture

Publications (3)

Publication Number Publication Date
JPWO2020225884A1 true JPWO2020225884A1 (en) 2020-11-12
JPWO2020225884A5 JPWO2020225884A5 (en) 2022-02-08
JP7294412B2 JP7294412B2 (en) 2023-06-20

Family

ID=73050795

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021518258A Active JP7294412B2 (en) 2019-05-08 2019-05-08 resin particle mixture

Country Status (3)

Country Link
JP (1) JP7294412B2 (en)
CN (1) CN113785000A (en)
WO (1) WO2020225884A1 (en)

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62289572A (en) * 1986-06-07 1987-12-16 Agency Of Ind Science & Technol Self-curing epoxy compound
JPS63223020A (en) * 1987-03-13 1988-09-16 Ube Ind Ltd Production of polyphenols
JPH04288317A (en) * 1990-05-28 1992-10-13 Somar Corp Powdered epoxy resin composition and production thereof
JPH04359023A (en) * 1991-06-05 1992-12-11 Nippon Unicar Co Ltd Silicone block copolymer and epoxy resin composition for molding
JPH10204331A (en) * 1997-01-28 1998-08-04 Sumitomo Chem Co Ltd Powder coating material and article coated therewith
JPH11322897A (en) * 1998-05-20 1999-11-26 Nippon Kayaku Co Ltd Photocationically polymerizable epoxy resin-based solid composition and article
JP2004002792A (en) * 2002-04-12 2004-01-08 Toto Kasei Co Ltd Epoxy powder coating composition
JP2004292645A (en) * 2003-03-27 2004-10-21 Sumitomo Bakelite Co Ltd Epoxy resin powder coating
JP2007269980A (en) * 2006-03-31 2007-10-18 Dainippon Ink & Chem Inc Epoxy resin composition for powder coating
JP2008063488A (en) * 2006-09-08 2008-03-21 Ntn Corp Resin sliding material
JP2011017018A (en) * 2010-09-10 2011-01-27 Mitsubishi Chemicals Corp Epoxy resin composition and semiconductor device
JP2011131389A (en) * 2009-12-22 2011-07-07 Seiko Epson Corp Liquid ejecting head and liquid ejecting apparatus
US20140179835A1 (en) * 2012-12-26 2014-06-26 Min Gyum KIM Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated using the same
WO2016117295A1 (en) * 2015-01-19 2016-07-28 日本曹達株式会社 Production method for inclusion compound

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3685669B2 (en) * 1999-11-01 2005-08-24 ジャパンエポキシレジン株式会社 Epoxy resin composition

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62289572A (en) * 1986-06-07 1987-12-16 Agency Of Ind Science & Technol Self-curing epoxy compound
JPS63223020A (en) * 1987-03-13 1988-09-16 Ube Ind Ltd Production of polyphenols
JPH04288317A (en) * 1990-05-28 1992-10-13 Somar Corp Powdered epoxy resin composition and production thereof
JPH04359023A (en) * 1991-06-05 1992-12-11 Nippon Unicar Co Ltd Silicone block copolymer and epoxy resin composition for molding
JPH10204331A (en) * 1997-01-28 1998-08-04 Sumitomo Chem Co Ltd Powder coating material and article coated therewith
JPH11322897A (en) * 1998-05-20 1999-11-26 Nippon Kayaku Co Ltd Photocationically polymerizable epoxy resin-based solid composition and article
JP2004002792A (en) * 2002-04-12 2004-01-08 Toto Kasei Co Ltd Epoxy powder coating composition
JP2004292645A (en) * 2003-03-27 2004-10-21 Sumitomo Bakelite Co Ltd Epoxy resin powder coating
JP2007269980A (en) * 2006-03-31 2007-10-18 Dainippon Ink & Chem Inc Epoxy resin composition for powder coating
JP2008063488A (en) * 2006-09-08 2008-03-21 Ntn Corp Resin sliding material
JP2011131389A (en) * 2009-12-22 2011-07-07 Seiko Epson Corp Liquid ejecting head and liquid ejecting apparatus
JP2011017018A (en) * 2010-09-10 2011-01-27 Mitsubishi Chemicals Corp Epoxy resin composition and semiconductor device
US20140179835A1 (en) * 2012-12-26 2014-06-26 Min Gyum KIM Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated using the same
WO2016117295A1 (en) * 2015-01-19 2016-07-28 日本曹達株式会社 Production method for inclusion compound

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
社団法人高分子学会, 高分子辞典, vol. 第３版, JPN6019025972, 30 June 2005 (2005-06-30), JP, pages 524, ISSN: 0004932427 *

Also Published As

Publication number Publication date
CN113785000A (en) 2021-12-10
WO2020225884A1 (en) 2020-11-12
JP7294412B2 (en) 2023-06-20

Similar Documents

Publication Publication Date Title
BR112019017762A2 (en)
BR112021013854A2 (en)
BR112021018450A2 (en)
BR112021017939A2 (en)
BR112021017892A2 (en)
BR112019016141A2 (en)
AU2020104490A4 (en)
BR112021017738A2 (en)
BR112021017782A2 (en)
BR112019016138A2 (en)
BR112019016142A2 (en)
BR112021018168A2 (en)
BR112021017728A2 (en)
BR112021018102A2 (en)
BR112021017637A2 (en)
BR112021008711A2 (en)
BR112021018452A2 (en)
BR112021012348A2 (en)
BR112021018250A2 (en)
BR112021018084A2 (en)
BR112021018093A2 (en)
BR112021013944A2 (en)
BR112021013128A2 (en)
BR112021018484A2 (en)
BR112021017732A2 (en)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20211019

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220307

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20221129

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20230127

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230131

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20230509

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20230522

R151 Written notification of patent or utility model registration

Ref document number: 7294412

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350