CN113728402B - 连接结构体、连接结构体的制造方法、连接材料和被覆导电颗粒 - Google Patents

连接结构体、连接结构体的制造方法、连接材料和被覆导电颗粒 Download PDF

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Publication number
CN113728402B
CN113728402B CN202080032355.2A CN202080032355A CN113728402B CN 113728402 B CN113728402 B CN 113728402B CN 202080032355 A CN202080032355 A CN 202080032355A CN 113728402 B CN113728402 B CN 113728402B
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China
Prior art keywords
particles
metal
terminal
conductive
conductive layer
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CN202080032355.2A
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Chinese (zh)
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CN113728402A (zh
Inventor
田中雄介
青木正治
杉冈早织
波木秀次
久我生子
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Dexerials Corp
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Dexerials Corp
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Priority claimed from PCT/JP2020/017582 external-priority patent/WO2020222301A1/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Conductive Materials (AREA)
  • Wire Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN202080032355.2A 2019-05-01 2020-04-23 连接结构体、连接结构体的制造方法、连接材料和被覆导电颗粒 Active CN113728402B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019-087150 2019-05-01
JP2019087150 2019-05-01
PCT/JP2020/017582 WO2020222301A1 (ja) 2019-05-01 2020-04-23 接続構造体、接続構造体の製造方法、接続材料、及び被覆導電粒子

Publications (2)

Publication Number Publication Date
CN113728402A CN113728402A (zh) 2021-11-30
CN113728402B true CN113728402B (zh) 2024-01-09

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CN202080032355.2A Active CN113728402B (zh) 2019-05-01 2020-04-23 连接结构体、连接结构体的制造方法、连接材料和被覆导电颗粒

Country Status (4)

Country Link
JP (1) JP7592399B2 (enExample)
KR (1) KR102783058B1 (enExample)
CN (1) CN113728402B (enExample)
TW (1) TWI883000B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114170925A (zh) * 2021-12-07 2022-03-11 Tcl华星光电技术有限公司 显示模组及其制作方法
KR102743445B1 (ko) * 2022-12-06 2024-12-16 덕산네오룩스 주식회사 도전입자, 도전재료 및 접속 구조체

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101983543A (zh) * 2008-03-31 2011-03-02 三菱电机株式会社 低温烧成陶瓷电路基板
KR20150081368A (ko) * 2013-02-28 2015-07-13 세키스이가가쿠 고교가부시키가이샤 도전성 미립자, 이방성 도전 재료 및 도전 접속 구조체
JP2018046010A (ja) * 2016-09-09 2018-03-22 積水化学工業株式会社 金属原子含有粒子、接続材料、接続構造体及び接続構造体の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001220691A (ja) * 2000-02-03 2001-08-14 Okuno Chem Ind Co Ltd 導電性微粒子
JP2005317270A (ja) 2004-04-27 2005-11-10 Sekisui Chem Co Ltd 導電性微粒子及び導電接続構造体
WO2006080289A1 (ja) * 2005-01-25 2006-08-03 Sekisui Chemical Co., Ltd. 導電性微粒子、及び異方性導電材料
EP2178094A4 (en) * 2007-08-02 2013-02-20 Hitachi Chemical Co Ltd SWITCHING CONNECTING MATERIAL AND CONNECTING STRUCTURE OF A SWITCHING ELEMENT AND CONNECTION METHOD OF A SWITCHING ELEMENT ON THE SWITCHING CONNECTING MATERIAL
JP5887086B2 (ja) 2011-08-11 2016-03-16 株式会社タムラ製作所 導電性材料
JP2014143189A (ja) * 2012-12-27 2014-08-07 Sekisui Chem Co Ltd 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体
CN110300780A (zh) 2017-03-06 2019-10-01 迪睿合株式会社 树脂组合物、树脂组合物的制备方法和结构体
KR102572563B1 (ko) * 2017-09-20 2023-08-30 세키스이가가쿠 고교가부시키가이샤 금속 함유 입자, 접속 재료, 접속 구조체, 접속 구조체의 제조 방법, 도통 검사용 부재 및 도통 검사 장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101983543A (zh) * 2008-03-31 2011-03-02 三菱电机株式会社 低温烧成陶瓷电路基板
KR20150081368A (ko) * 2013-02-28 2015-07-13 세키스이가가쿠 고교가부시키가이샤 도전성 미립자, 이방성 도전 재료 및 도전 접속 구조체
JP2018046010A (ja) * 2016-09-09 2018-03-22 積水化学工業株式会社 金属原子含有粒子、接続材料、接続構造体及び接続構造体の製造方法

Also Published As

Publication number Publication date
CN113728402A (zh) 2021-11-30
TW202103185A (zh) 2021-01-16
KR102783058B1 (ko) 2025-03-17
JP7592399B2 (ja) 2024-12-02
TWI883000B (zh) 2025-05-11
KR20210140773A (ko) 2021-11-23
JP2020184530A (ja) 2020-11-12

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