KR102783058B1 - 접속 구조체, 접속 구조체의 제조 방법, 접속 재료, 및 피복 도전 입자 - Google Patents

접속 구조체, 접속 구조체의 제조 방법, 접속 재료, 및 피복 도전 입자 Download PDF

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KR102783058B1
KR102783058B1 KR1020217035504A KR20217035504A KR102783058B1 KR 102783058 B1 KR102783058 B1 KR 102783058B1 KR 1020217035504 A KR1020217035504 A KR 1020217035504A KR 20217035504 A KR20217035504 A KR 20217035504A KR 102783058 B1 KR102783058 B1 KR 102783058B1
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South Korea
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metal
particles
terminal
conductive
particle
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Korean (ko)
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KR20210140773A (ko
Inventor
유스케 다나카
마사하루 아오키
사오리 스기오카
히데츠구 나미키
쇼코 구가
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데쿠세리아루즈 가부시키가이샤
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Priority claimed from PCT/JP2020/017582 external-priority patent/WO2020222301A1/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Conductive Materials (AREA)
  • Wire Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Insulated Conductors (AREA)
KR1020217035504A 2019-05-01 2020-04-23 접속 구조체, 접속 구조체의 제조 방법, 접속 재료, 및 피복 도전 입자 Active KR102783058B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2019-087150 2019-05-01
JP2019087150 2019-05-01
PCT/JP2020/017582 WO2020222301A1 (ja) 2019-05-01 2020-04-23 接続構造体、接続構造体の製造方法、接続材料、及び被覆導電粒子
JPJP-P-2020-076961 2020-04-23
JP2020076961A JP7592399B2 (ja) 2019-05-01 2020-04-23 接続構造体、接続構造体の製造方法、接続材料、及び被覆導電粒子

Publications (2)

Publication Number Publication Date
KR20210140773A KR20210140773A (ko) 2021-11-23
KR102783058B1 true KR102783058B1 (ko) 2025-03-17

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KR1020217035504A Active KR102783058B1 (ko) 2019-05-01 2020-04-23 접속 구조체, 접속 구조체의 제조 방법, 접속 재료, 및 피복 도전 입자

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JP (1) JP7592399B2 (enExample)
KR (1) KR102783058B1 (enExample)
CN (1) CN113728402B (enExample)
TW (1) TWI883000B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114170925A (zh) * 2021-12-07 2022-03-11 Tcl华星光电技术有限公司 显示模组及其制作方法
KR102743445B1 (ko) * 2022-12-06 2024-12-16 덕산네오룩스 주식회사 도전입자, 도전재료 및 접속 구조체

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001220691A (ja) * 2000-02-03 2001-08-14 Okuno Chem Ind Co Ltd 導電性微粒子
JP2018046010A (ja) * 2016-09-09 2018-03-22 積水化学工業株式会社 金属原子含有粒子、接続材料、接続構造体及び接続構造体の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005317270A (ja) 2004-04-27 2005-11-10 Sekisui Chem Co Ltd 導電性微粒子及び導電接続構造体
JP4863988B2 (ja) * 2005-01-25 2012-01-25 積水化学工業株式会社 導電性微粒子、及び異方性導電材料
CN101689410B (zh) * 2007-08-02 2013-10-16 日立化成株式会社 电路连接材料、使用它的电路构件的连接结构及电路构件的连接方法
EP2265100A1 (en) * 2008-03-31 2010-12-22 Mitsubishi Electric Corporation Low-temperature fired ceramic circuit board
JP5887086B2 (ja) 2011-08-11 2016-03-16 株式会社タムラ製作所 導電性材料
JP2014143189A (ja) * 2012-12-27 2014-08-07 Sekisui Chem Co Ltd 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体
WO2014133124A1 (ja) * 2013-02-28 2014-09-04 積水化学工業株式会社 導電性微粒子、異方性導電材料、及び、導電接続構造体
KR102309135B1 (ko) 2017-03-06 2021-10-07 데쿠세리아루즈 가부시키가이샤 수지 조성물, 수지 조성물의 제조 방법, 및 구조체
US20200269315A1 (en) * 2017-09-20 2020-08-27 Sekisui Chemical Co., Ltd. Metal-containing particle, connection material, connection structure, method for manufacturing connection structure, conduction inspection member, and conduction inspection device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001220691A (ja) * 2000-02-03 2001-08-14 Okuno Chem Ind Co Ltd 導電性微粒子
JP2018046010A (ja) * 2016-09-09 2018-03-22 積水化学工業株式会社 金属原子含有粒子、接続材料、接続構造体及び接続構造体の製造方法

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Publication number Publication date
JP7592399B2 (ja) 2024-12-02
TW202103185A (zh) 2021-01-16
KR20210140773A (ko) 2021-11-23
CN113728402A (zh) 2021-11-30
CN113728402B (zh) 2024-01-09
TWI883000B (zh) 2025-05-11
JP2020184530A (ja) 2020-11-12

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