JP7592399B2 - 接続構造体、接続構造体の製造方法、接続材料、及び被覆導電粒子 - Google Patents

接続構造体、接続構造体の製造方法、接続材料、及び被覆導電粒子 Download PDF

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Publication number
JP7592399B2
JP7592399B2 JP2020076961A JP2020076961A JP7592399B2 JP 7592399 B2 JP7592399 B2 JP 7592399B2 JP 2020076961 A JP2020076961 A JP 2020076961A JP 2020076961 A JP2020076961 A JP 2020076961A JP 7592399 B2 JP7592399 B2 JP 7592399B2
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Japan
Prior art keywords
particles
metal
conductive
conductive layer
terminal
Prior art date
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JP2020076961A
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English (en)
Japanese (ja)
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JP2020184530A5 (enExample
JP2020184530A (ja
Inventor
雄介 田中
正治 青木
早織 杉岡
秀次 波木
生子 久我
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
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Dexerials Corp
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Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to PCT/JP2020/017582 priority Critical patent/WO2020222301A1/ja
Priority to KR1020217035504A priority patent/KR102783058B1/ko
Priority to US17/607,466 priority patent/US12237096B2/en
Priority to TW109114319A priority patent/TWI883000B/zh
Publication of JP2020184530A publication Critical patent/JP2020184530A/ja
Publication of JP2020184530A5 publication Critical patent/JP2020184530A5/ja
Priority to JP2024166460A priority patent/JP2024175135A/ja
Application granted granted Critical
Publication of JP7592399B2 publication Critical patent/JP7592399B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Conductive Materials (AREA)
  • Wire Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2020076961A 2019-05-01 2020-04-23 接続構造体、接続構造体の製造方法、接続材料、及び被覆導電粒子 Active JP7592399B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
PCT/JP2020/017582 WO2020222301A1 (ja) 2019-05-01 2020-04-23 接続構造体、接続構造体の製造方法、接続材料、及び被覆導電粒子
KR1020217035504A KR102783058B1 (ko) 2019-05-01 2020-04-23 접속 구조체, 접속 구조체의 제조 방법, 접속 재료, 및 피복 도전 입자
US17/607,466 US12237096B2 (en) 2019-05-01 2020-04-23 Connection structure, method of manufacturing connection structure, connection material, and coated conductive particle
TW109114319A TWI883000B (zh) 2019-05-01 2020-04-29 連接構造體、連接構造體之製造方法、連接材料及被覆導電粒子
JP2024166460A JP2024175135A (ja) 2019-05-01 2024-09-25 接続構造体、接続構造体の製造方法、接続材料、及び被覆導電粒子

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019087150 2019-05-01
JP2019087150 2019-05-01

Related Child Applications (1)

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JP2024166460A Division JP2024175135A (ja) 2019-05-01 2024-09-25 接続構造体、接続構造体の製造方法、接続材料、及び被覆導電粒子

Publications (3)

Publication Number Publication Date
JP2020184530A JP2020184530A (ja) 2020-11-12
JP2020184530A5 JP2020184530A5 (enExample) 2023-04-28
JP7592399B2 true JP7592399B2 (ja) 2024-12-02

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JP2020076961A Active JP7592399B2 (ja) 2019-05-01 2020-04-23 接続構造体、接続構造体の製造方法、接続材料、及び被覆導電粒子

Country Status (4)

Country Link
JP (1) JP7592399B2 (enExample)
KR (1) KR102783058B1 (enExample)
CN (1) CN113728402B (enExample)
TW (1) TWI883000B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114170925A (zh) * 2021-12-07 2022-03-11 Tcl华星光电技术有限公司 显示模组及其制作方法
KR102743445B1 (ko) * 2022-12-06 2024-12-16 덕산네오룩스 주식회사 도전입자, 도전재료 및 접속 구조체

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006080289A1 (ja) 2005-01-25 2006-08-03 Sekisui Chemical Co., Ltd. 導電性微粒子、及び異方性導電材料
JP2013209648A (ja) 2007-08-02 2013-10-10 Hitachi Chemical Co Ltd 回路接続材料
JP2014143189A (ja) 2012-12-27 2014-08-07 Sekisui Chem Co Ltd 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体
JP2018046010A (ja) 2016-09-09 2018-03-22 積水化学工業株式会社 金属原子含有粒子、接続材料、接続構造体及び接続構造体の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001220691A (ja) * 2000-02-03 2001-08-14 Okuno Chem Ind Co Ltd 導電性微粒子
JP2005317270A (ja) 2004-04-27 2005-11-10 Sekisui Chem Co Ltd 導電性微粒子及び導電接続構造体
KR101086804B1 (ko) * 2008-03-31 2011-11-25 미쓰비시덴키 가부시키가이샤 저온 소성 세라믹 회로 기판
JP5887086B2 (ja) 2011-08-11 2016-03-16 株式会社タムラ製作所 導電性材料
WO2014133124A1 (ja) * 2013-02-28 2014-09-04 積水化学工業株式会社 導電性微粒子、異方性導電材料、及び、導電接続構造体
CN110300780A (zh) 2017-03-06 2019-10-01 迪睿合株式会社 树脂组合物、树脂组合物的制备方法和结构体
KR102572563B1 (ko) * 2017-09-20 2023-08-30 세키스이가가쿠 고교가부시키가이샤 금속 함유 입자, 접속 재료, 접속 구조체, 접속 구조체의 제조 방법, 도통 검사용 부재 및 도통 검사 장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006080289A1 (ja) 2005-01-25 2006-08-03 Sekisui Chemical Co., Ltd. 導電性微粒子、及び異方性導電材料
JP2013209648A (ja) 2007-08-02 2013-10-10 Hitachi Chemical Co Ltd 回路接続材料
JP2014143189A (ja) 2012-12-27 2014-08-07 Sekisui Chem Co Ltd 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体
JP2018046010A (ja) 2016-09-09 2018-03-22 積水化学工業株式会社 金属原子含有粒子、接続材料、接続構造体及び接続構造体の製造方法

Also Published As

Publication number Publication date
CN113728402B (zh) 2024-01-09
CN113728402A (zh) 2021-11-30
TW202103185A (zh) 2021-01-16
KR102783058B1 (ko) 2025-03-17
TWI883000B (zh) 2025-05-11
KR20210140773A (ko) 2021-11-23
JP2020184530A (ja) 2020-11-12

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