TWI883000B - 連接構造體、連接構造體之製造方法、連接材料及被覆導電粒子 - Google Patents

連接構造體、連接構造體之製造方法、連接材料及被覆導電粒子 Download PDF

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Publication number
TWI883000B
TWI883000B TW109114319A TW109114319A TWI883000B TW I883000 B TWI883000 B TW I883000B TW 109114319 A TW109114319 A TW 109114319A TW 109114319 A TW109114319 A TW 109114319A TW I883000 B TWI883000 B TW I883000B
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TW
Taiwan
Prior art keywords
particles
metal
terminal
conductive
conductive layer
Prior art date
Application number
TW109114319A
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English (en)
Chinese (zh)
Other versions
TW202103185A (zh
Inventor
田中雄介
青木正治
杉岡早織
波木秀次
久我生子
Original Assignee
日商迪睿合股份有限公司
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Publication date
Application filed by 日商迪睿合股份有限公司 filed Critical 日商迪睿合股份有限公司
Publication of TW202103185A publication Critical patent/TW202103185A/zh
Application granted granted Critical
Publication of TWI883000B publication Critical patent/TWI883000B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Conductive Materials (AREA)
  • Wire Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW109114319A 2019-05-01 2020-04-29 連接構造體、連接構造體之製造方法、連接材料及被覆導電粒子 TWI883000B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2019-087150 2019-05-01
JP2019087150 2019-05-01
JP2020076961A JP7592399B2 (ja) 2019-05-01 2020-04-23 接続構造体、接続構造体の製造方法、接続材料、及び被覆導電粒子
JP2020-076961 2020-04-23

Publications (2)

Publication Number Publication Date
TW202103185A TW202103185A (zh) 2021-01-16
TWI883000B true TWI883000B (zh) 2025-05-11

Family

ID=73044245

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109114319A TWI883000B (zh) 2019-05-01 2020-04-29 連接構造體、連接構造體之製造方法、連接材料及被覆導電粒子

Country Status (4)

Country Link
JP (1) JP7592399B2 (enExample)
KR (1) KR102783058B1 (enExample)
CN (1) CN113728402B (enExample)
TW (1) TWI883000B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114170925A (zh) * 2021-12-07 2022-03-11 Tcl华星光电技术有限公司 显示模组及其制作方法
KR102743445B1 (ko) * 2022-12-06 2024-12-16 덕산네오룩스 주식회사 도전입자, 도전재료 및 접속 구조체

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201915215A (zh) * 2017-09-20 2019-04-16 日商積水化學工業股份有限公司 含金屬粒子、連接材料、連接結構體、連接結構體之製造方法、導通檢查用構件及導通檢查裝置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001220691A (ja) * 2000-02-03 2001-08-14 Okuno Chem Ind Co Ltd 導電性微粒子
JP2005317270A (ja) 2004-04-27 2005-11-10 Sekisui Chem Co Ltd 導電性微粒子及び導電接続構造体
WO2006080289A1 (ja) * 2005-01-25 2006-08-03 Sekisui Chemical Co., Ltd. 導電性微粒子、及び異方性導電材料
EP2178094A4 (en) * 2007-08-02 2013-02-20 Hitachi Chemical Co Ltd SWITCHING CONNECTING MATERIAL AND CONNECTING STRUCTURE OF A SWITCHING ELEMENT AND CONNECTION METHOD OF A SWITCHING ELEMENT ON THE SWITCHING CONNECTING MATERIAL
KR101086804B1 (ko) * 2008-03-31 2011-11-25 미쓰비시덴키 가부시키가이샤 저온 소성 세라믹 회로 기판
JP5887086B2 (ja) 2011-08-11 2016-03-16 株式会社タムラ製作所 導電性材料
JP2014143189A (ja) * 2012-12-27 2014-08-07 Sekisui Chem Co Ltd 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体
WO2014133124A1 (ja) * 2013-02-28 2014-09-04 積水化学工業株式会社 導電性微粒子、異方性導電材料、及び、導電接続構造体
JP7007138B2 (ja) * 2016-09-09 2022-02-10 積水化学工業株式会社 金属原子含有粒子、接続材料、接続構造体及び接続構造体の製造方法
CN110300780A (zh) 2017-03-06 2019-10-01 迪睿合株式会社 树脂组合物、树脂组合物的制备方法和结构体

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201915215A (zh) * 2017-09-20 2019-04-16 日商積水化學工業股份有限公司 含金屬粒子、連接材料、連接結構體、連接結構體之製造方法、導通檢查用構件及導通檢查裝置

Also Published As

Publication number Publication date
CN113728402B (zh) 2024-01-09
CN113728402A (zh) 2021-11-30
TW202103185A (zh) 2021-01-16
KR102783058B1 (ko) 2025-03-17
JP7592399B2 (ja) 2024-12-02
KR20210140773A (ko) 2021-11-23
JP2020184530A (ja) 2020-11-12

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