CN113681145B - 超声焊接系统及其使用方法 - Google Patents

超声焊接系统及其使用方法 Download PDF

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Publication number
CN113681145B
CN113681145B CN202111073625.7A CN202111073625A CN113681145B CN 113681145 B CN113681145 B CN 113681145B CN 202111073625 A CN202111073625 A CN 202111073625A CN 113681145 B CN113681145 B CN 113681145B
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China
Prior art keywords
workpiece
ultrasonic
welding system
ultrasonic welding
base structure
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CN202111073625.7A
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English (en)
Chinese (zh)
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CN113681145A (zh
Inventor
C·卢钦格
O·瓦伦丁
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Kulicke and Soffa Industries Inc
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Kulicke and Soffa Industries Inc
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Publication of CN113681145A publication Critical patent/CN113681145A/zh
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B23K20/106Features related to sonotrodes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/26Auxiliary equipment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/02Carriages for supporting the welding or cutting element
    • B23K37/0211Carriages for supporting the welding or cutting element travelling on a guide member, e.g. rail, track
    • B23K37/0235Carriages for supporting the welding or cutting element travelling on a guide member, e.g. rail, track the guide member forming part of a portal
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/04Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
    • B23K37/0426Fixtures for other work
    • B23K37/0435Clamps
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/04Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
    • B23K37/047Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work moving work to adjust its position between soldering, welding or cutting steps
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
CN202111073625.7A 2017-04-04 2018-04-03 超声焊接系统及其使用方法 Active CN113681145B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201762481408P 2017-04-04 2017-04-04
US62/481,408 2017-04-04
PCT/US2018/025941 WO2018187364A1 (en) 2017-04-04 2018-04-03 Ultrasonic welding systems and methods of using the same
CN201880023804.XA CN110891726B (zh) 2017-04-04 2018-04-03 超声焊接系统及其使用方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201880023804.XA Division CN110891726B (zh) 2017-04-04 2018-04-03 超声焊接系统及其使用方法

Publications (2)

Publication Number Publication Date
CN113681145A CN113681145A (zh) 2021-11-23
CN113681145B true CN113681145B (zh) 2023-02-03

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CN202111073625.7A Active CN113681145B (zh) 2017-04-04 2018-04-03 超声焊接系统及其使用方法
CN201880023804.XA Active CN110891726B (zh) 2017-04-04 2018-04-03 超声焊接系统及其使用方法

Family Applications After (1)

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CN201880023804.XA Active CN110891726B (zh) 2017-04-04 2018-04-03 超声焊接系统及其使用方法

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US (2) US10882134B2 (https=)
EP (3) EP4681866A3 (https=)
JP (1) JP7181217B2 (https=)
CN (2) CN113681145B (https=)
WO (1) WO2018187364A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4681866A3 (en) 2017-04-04 2026-04-29 Kulicke and Soffa Industries, Inc. Ultrasonic welding system and method of operating an ultrasonic welding system
EP4403292A3 (en) 2018-11-28 2024-11-06 Kulicke and Soffa Industries, Inc. Ultrasonic welding systems and methods of using the same
JP7316573B2 (ja) * 2018-12-19 2023-07-28 パナソニックIpマネジメント株式会社 溶接システム及びそれを用いたワークの溶接方法
WO2020250002A1 (en) * 2019-06-10 2020-12-17 Easy Automation S.R.L. System for the application of a threadlike element on a substrate
US11850676B2 (en) 2020-06-03 2023-12-26 Kulicke And Soffa Industries, Inc. Ultrasonic welding systems, methods of using the same, and related workpieces including welded conductive pins
CN120981314A (zh) 2023-04-19 2025-11-18 库利克和索夫工业公司 用于导电引脚的超声焊接系统和相关方法
US20250187103A1 (en) * 2023-12-07 2025-06-12 Kulicke And Soffa Industries, Inc. Conductive pins, power modules, ultrasonic welding systems, and methods of using the same

Family Cites Families (93)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3995845A (en) * 1972-12-26 1976-12-07 Rca Corporation Ultrasonic wire bonding chuck
US3926357A (en) * 1973-10-09 1975-12-16 Du Pont Process for applying contacts
US4301958A (en) * 1978-08-24 1981-11-24 Fujitsu Limited Arrangement for automatically fabricating and bonding semiconductor devices
JPS5530810A (en) * 1978-08-25 1980-03-04 Fujitsu Ltd Automatic bonding system for semiconductor device assembling
US4411721A (en) * 1982-02-25 1983-10-25 The Mead Corporation Apparatus and method for attaching fastener tapes
US4872052A (en) * 1986-12-03 1989-10-03 View Engineering, Inc. Semiconductor device inspection system
JP2555876B2 (ja) * 1988-06-29 1996-11-20 日本電気株式会社 インナー・リード・ボンディング装置
JPH081920B2 (ja) * 1990-06-08 1996-01-10 株式会社東芝 ワイヤボンディング装置
US5614057A (en) * 1992-02-19 1997-03-25 Mim Industries, Inc. Automatic ultrasonic fusing system
US5427301A (en) * 1994-05-06 1995-06-27 Ford Motor Company Ultrasonic flip chip process and apparatus
CH692091A5 (de) 1994-07-01 2002-01-31 Woodwelding Ag Verfahren zum Zusammenfügen von Teilen aus Holz oder aus holzähnlichen Materialien.
JPH0820071A (ja) * 1994-07-07 1996-01-23 Kiyoshi Shinoda 超音波溶着装置
JP3455344B2 (ja) * 1995-10-20 2003-10-14 株式会社オートネットワーク技術研究所 超音波溶接装置
JP2915350B2 (ja) * 1996-07-05 1999-07-05 株式会社アルテクス 超音波振動接合チップ実装装置
JP3354063B2 (ja) * 1996-11-29 2002-12-09 株式会社新川 リードフレーム供給方法及び供給装置
WO1999066547A1 (en) * 1998-06-19 1999-12-23 Matsushita Electric Industrial Co., Ltd. Method and device for forming bump
JP2000068327A (ja) * 1998-08-20 2000-03-03 Matsushita Electric Ind Co Ltd 部品の実装方法と装置
US20050145306A1 (en) * 1998-09-03 2005-07-07 Uit, L.L.C. Company Welded joints with new properties and provision of such properties by ultrasonic impact treatment
US6820792B2 (en) * 1998-09-30 2004-11-23 Samsung Electronics Co., Ltd. Die bonding equipment
JP3290632B2 (ja) * 1999-01-06 2002-06-10 株式会社アルテクス 超音波振動接合装置
JP4128319B2 (ja) * 1999-12-24 2008-07-30 株式会社新川 マルチチップボンディング方法及び装置
JP3566166B2 (ja) 2000-02-10 2004-09-15 株式会社新川 ツール位置測定方法、オフセット測定方法、基準部材およびボンディング装置
DE10101236A1 (de) 2001-01-12 2002-07-25 Schunk Ultraschalltechnik Gmbh Verfahren und Vorrichtung zum Verbinden von Leitern
US6616030B2 (en) * 2001-05-07 2003-09-09 West Bond, Inc. Gantry mounted ultrasonic wire bonder with orbital bonding tool head
JP3966765B2 (ja) 2002-05-24 2007-08-29 松下電器産業株式会社 部品保持部材再生装置及び部品装着方法
US7819302B2 (en) * 2004-09-30 2010-10-26 The Boeing Company Aluminum end caps ultrasonically welded to end of aluminum tube
JP2006135249A (ja) * 2004-11-09 2006-05-25 Fujitsu Ltd 超音波実装方法およびこれに用いる超音波実装装置
JP4792945B2 (ja) * 2005-01-28 2011-10-12 日産自動車株式会社 超音波接合装置および接合構造体
JP4539454B2 (ja) * 2005-06-20 2010-09-08 パナソニック株式会社 電子部品の熱圧着ツールおよび電子部品の実装装置ならびに実装方法
JP4577509B2 (ja) 2005-06-22 2010-11-10 トヨタ自動車株式会社 パワー半導体モジュール及びその製造方法
DE102005048368B3 (de) 2005-10-10 2007-05-03 Schunk Ultraschalltechnik Gmbh Verfahren zum Herstellen einer Schweißverbindung zwischen elektrischen Leitern
US7568606B2 (en) * 2006-10-19 2009-08-04 Asm Technology Singapore Pte Ltd. Electronic device handler for a bonding apparatus
US7666541B2 (en) * 2006-11-03 2010-02-23 The Gillette Company Ultrasonic metal welding techniques and batteries manufactured using such techniques
WO2008126211A1 (ja) * 2007-03-28 2008-10-23 Fujitsu Limited 超音波接合装置及び超音波接合方法
JP4917957B2 (ja) 2007-04-27 2012-04-18 パナソニック株式会社 超音波接合装置および電子部品の接合方法
CN101652845B (zh) 2007-04-27 2012-02-01 松下电器产业株式会社 电子元器件安装装置及电子元器件安装方法
WO2009044560A1 (ja) * 2007-10-03 2009-04-09 Panasonic Corporation 粘着テープ貼付装置及びテープ接続方法
JP5313751B2 (ja) * 2008-05-07 2013-10-09 パナソニック株式会社 電子部品装着装置
JP5281550B2 (ja) * 2008-12-08 2013-09-04 パナソニック株式会社 ボンディングツール、電子部品装着装置、および電子部品装着方法
JP5099064B2 (ja) * 2009-04-07 2012-12-12 パナソニック株式会社 電子部品実装システムおよび電子部品実装方法
US7810699B1 (en) * 2009-04-22 2010-10-12 Gm Global Technology Operations, Inc. Method and system for optimized vibration welding
US9038688B2 (en) * 2009-04-29 2015-05-26 Covidien Lp System and method for making tapered looped suture
WO2011137269A2 (en) * 2010-04-30 2011-11-03 Orthodyne Electronics Corporation Ultrasonic bonding systems and methods of using the same
US8973807B2 (en) * 2010-05-20 2015-03-10 Panasonic Intellectual Property Management Co., Ltd. Bonding tool, electronic component mounting apparatus, and manufacturing method of bonding tool
WO2012012335A2 (en) * 2010-07-19 2012-01-26 Orthodyne Electronics Corporation Ultrasonic bonding systems including workholder and ribbon feeding system
JP2012024790A (ja) * 2010-07-21 2012-02-09 Yazaki Corp 超音波溶着装置
JP5686555B2 (ja) * 2010-09-08 2015-03-18 富士機械製造株式会社 製造システム構築方法
US8231044B2 (en) * 2010-10-01 2012-07-31 Orthodyne Electronics Corporation Solar substrate ribbon bonding system
US8196798B2 (en) * 2010-10-08 2012-06-12 Kulicke And Soffa Industries, Inc. Solar substrate ribbon bonding system
JP2013539919A (ja) * 2010-10-13 2013-10-28 アーベーベー・リサーチ・リミテッド 半導体モジュールおよび半導体モジュールを製造する方法
US9272802B2 (en) * 2010-10-26 2016-03-01 Rinco Ultrasonics USA, Inc. Stepped sonotrode and anvil energy director grids for narrow/complex ultrasonic welds of improved durability
US9393641B2 (en) * 2010-12-29 2016-07-19 Orthodyne Electronics Corporation Methods and systems for aligning tooling elements of ultrasonic bonding systems
KR101305255B1 (ko) 2011-02-23 2013-09-06 주식회사 엘지화학 초음파 용접의 강도 검사 방법 및 장치
JP2013051366A (ja) * 2011-08-31 2013-03-14 Hitachi Ltd パワーモジュール及びその製造方法
JP5747164B2 (ja) * 2011-09-27 2015-07-08 パナソニックIpマネジメント株式会社 電子部品実装システム
JP5667601B2 (ja) 2012-06-12 2015-02-12 三菱電機エンジニアリング株式会社 超音波接合方法および超音波接合装置
KR101369312B1 (ko) * 2012-07-24 2014-03-04 주식회사 알리 차량용 램프 케이싱 초음파 용착 장치
JP6033011B2 (ja) 2012-09-12 2016-11-30 三菱電機株式会社 電力用半導体装置および電力用半導体装置の製造方法
CN102861984B (zh) * 2012-10-09 2015-06-24 雷广伟 一种动力电池正负极柱四头超声波焊接设备
US20140110833A1 (en) * 2012-10-24 2014-04-24 Samsung Electro-Mechanics Co., Ltd. Power module package
ES1078227Y (es) 2012-11-21 2013-03-08 Carmona Manuel Ruiz Equipo para unir un cuerpo laminar a la embocadura de una caja
EP2769919A4 (en) * 2012-11-21 2015-05-20 Carmona Manuel Ruiz EQUIPMENT FOR ASSEMBLING A LAMELLAR BODY AT THE OPENING OF A BODY
DE102013106349A1 (de) 2013-05-13 2014-11-13 Schunk Sonosystems Gmbh Verfahren zum Ermitteln des Verdichtungsgrades eines Knotens
DE102013208749B4 (de) * 2013-05-13 2015-11-19 Schunk Sonosystems Gmbh Ultraschallschweißvorrichtung sowie Verfahren zum Verschweißen von Komponenten mittels einer Ultraschallschweißvorrichtung
DE102013107637A1 (de) 2013-07-18 2015-01-22 Schunk Sonosystems Gmbh Verfahren zur Herstellung eines Knotens durch Schweißen
US9793571B2 (en) * 2013-10-03 2017-10-17 Nissan Motor Co., Ltd. Apparatus for bonding separators in electrical devices
US9136240B2 (en) 2013-10-08 2015-09-15 Kulicke And Soffa Industries, Inc. Systems and methods for bonding semiconductor elements
CN105765715B (zh) * 2013-11-26 2018-08-03 三菱电机株式会社 功率模块以及功率模块的制造方法
US20150210003A1 (en) 2014-01-28 2015-07-30 Frito-Lay Noth America, Inc. Transverse Sonotrode Design for Ultrasonic Welding
JP6091443B2 (ja) * 2014-01-31 2017-03-08 三菱電機株式会社 半導体モジュール
KR102342932B1 (ko) 2014-02-04 2021-12-24 부트벨딩 에스아 커넥터 및 이를 이용하는 방법
KR102300970B1 (ko) * 2014-07-02 2021-09-09 미쓰비시 마테리알 가부시키가이샤 접합체의 제조 방법, 다층 접합체의 제조 방법, 파워 모듈용 기판의 제조 방법, 히트 싱크가 부착된 파워 모듈용 기판의 제조 방법 및 적층체의 제조 장치
US9837363B2 (en) * 2014-07-04 2017-12-05 Mitsubishi Materials Corporation Power-module substrate unit and power module
JP6406983B2 (ja) 2014-11-12 2018-10-17 三菱電機株式会社 半導体装置およびその製造方法
US9475232B2 (en) * 2014-12-01 2016-10-25 Zee.Aero Inc. Damping and isolating vibration during ultrasonic welding
US10239150B2 (en) 2014-12-09 2019-03-26 GM Global Technology Operations LLC Ultrasonic welding of composites using C frame tooling
US10559538B2 (en) * 2015-02-25 2020-02-11 Mitsubishi Electric Corporation Power module
KR101619782B1 (ko) * 2015-04-14 2016-05-12 제엠제코(주) 반도체 기판의 초음파 웰딩 접합 장치
WO2016199621A1 (ja) 2015-06-11 2016-12-15 三菱電機株式会社 電力用半導体装置の製造方法および電力用半導体装置
JP2017024040A (ja) 2015-07-22 2017-02-02 矢崎総業株式会社 超音波接合装置
CN204991892U (zh) * 2015-09-14 2016-01-20 福建亚亨动力科技集团有限公司 一种电池自动盖帽生产线
WO2017056175A1 (ja) * 2015-09-29 2017-04-06 東芝三菱電機産業システム株式会社 超音波振動接合装置
KR102490863B1 (ko) * 2015-11-04 2023-01-20 삼성에스디아이 주식회사 이차전지의 제조방법
KR101734712B1 (ko) * 2015-12-09 2017-05-11 현대자동차주식회사 파워모듈
US10439235B2 (en) * 2016-01-27 2019-10-08 Faith Technologies, Inc. Process for joining incompatible materials and materials formed thereby
JP6685143B2 (ja) * 2016-02-03 2020-04-22 三菱電機株式会社 電極端子、半導体装置及び電力変換装置
CN107546214B (zh) * 2016-06-23 2020-02-07 台达电子工业股份有限公司 功率模块封装结构
JP6752536B2 (ja) * 2016-08-04 2020-09-09 東芝三菱電機産業システム株式会社 超音波接合用ツール及び超音波接合装置
TWI599664B (zh) * 2016-09-13 2017-09-21 樂金股份有限公司 用於功率模組封裝之金屬帶材
US10471545B2 (en) * 2016-11-23 2019-11-12 Rohinni, LLC Top-side laser for direct transfer of semiconductor devices
EP4681866A3 (en) 2017-04-04 2026-04-29 Kulicke and Soffa Industries, Inc. Ultrasonic welding system and method of operating an ultrasonic welding system
WO2019075289A1 (en) * 2017-10-13 2019-04-18 Kulicke And Soffa Industries, Inc. CONDUCTIVE TERMINALS, OMNIBUS BARS, AND METHODS OF PREPARING THE SAME, AND METHODS OF ASSEMBLING POWER MODULES THEREOF
EP4403292A3 (en) * 2018-11-28 2024-11-06 Kulicke and Soffa Industries, Inc. Ultrasonic welding systems and methods of using the same

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Publication number Publication date
EP3606695A1 (en) 2020-02-12
US20200290148A1 (en) 2020-09-17
WO2018187364A1 (en) 2018-10-11
EP4269019A2 (en) 2023-11-01
EP4269019B1 (en) 2025-07-09
JP2020512939A (ja) 2020-04-30
EP3606695B1 (en) 2023-06-07
US20210078099A1 (en) 2021-03-18
CN113681145A (zh) 2021-11-23
CN110891726A (zh) 2020-03-17
US10882134B2 (en) 2021-01-05
EP4269019A3 (en) 2024-02-21
EP4681866A2 (en) 2026-01-21
US11364565B2 (en) 2022-06-21
CN110891726B (zh) 2021-08-24
EP3606695A4 (en) 2021-01-20
WO2018187364A8 (en) 2020-01-30
JP7181217B2 (ja) 2022-11-30
EP4681866A3 (en) 2026-04-29

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