CN113681145B - 超声焊接系统及其使用方法 - Google Patents
超声焊接系统及其使用方法 Download PDFInfo
- Publication number
- CN113681145B CN113681145B CN202111073625.7A CN202111073625A CN113681145B CN 113681145 B CN113681145 B CN 113681145B CN 202111073625 A CN202111073625 A CN 202111073625A CN 113681145 B CN113681145 B CN 113681145B
- Authority
- CN
- China
- Prior art keywords
- workpiece
- ultrasonic
- welding system
- ultrasonic welding
- base structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
- B23K20/106—Features related to sonotrodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/26—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
- B23K37/02—Carriages for supporting the welding or cutting element
- B23K37/0211—Carriages for supporting the welding or cutting element travelling on a guide member, e.g. rail, track
- B23K37/0235—Carriages for supporting the welding or cutting element travelling on a guide member, e.g. rail, track the guide member forming part of a portal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
- B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
- B23K37/0426—Fixtures for other work
- B23K37/0435—Clamps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
- B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
- B23K37/047—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work moving work to adjust its position between soldering, welding or cutting steps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762481408P | 2017-04-04 | 2017-04-04 | |
| US62/481,408 | 2017-04-04 | ||
| CN201880023804.XA CN110891726B (zh) | 2017-04-04 | 2018-04-03 | 超声焊接系统及其使用方法 |
| PCT/US2018/025941 WO2018187364A1 (en) | 2017-04-04 | 2018-04-03 | Ultrasonic welding systems and methods of using the same |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880023804.XA Division CN110891726B (zh) | 2017-04-04 | 2018-04-03 | 超声焊接系统及其使用方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113681145A CN113681145A (zh) | 2021-11-23 |
| CN113681145B true CN113681145B (zh) | 2023-02-03 |
Family
ID=63713546
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111073625.7A Active CN113681145B (zh) | 2017-04-04 | 2018-04-03 | 超声焊接系统及其使用方法 |
| CN201880023804.XA Active CN110891726B (zh) | 2017-04-04 | 2018-04-03 | 超声焊接系统及其使用方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880023804.XA Active CN110891726B (zh) | 2017-04-04 | 2018-04-03 | 超声焊接系统及其使用方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US10882134B2 (enExample) |
| EP (2) | EP3606695B1 (enExample) |
| JP (1) | JP7181217B2 (enExample) |
| CN (2) | CN113681145B (enExample) |
| WO (1) | WO2018187364A1 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020112635A1 (en) | 2018-11-28 | 2020-06-04 | Kulicke And Soffa Industries, Inc. | Ultrasonic welding systems and methods of using the same |
| EP3900871A4 (en) * | 2018-12-19 | 2022-02-16 | Panasonic Intellectual Property Management Co., Ltd. | WELDING DEVICE AND WELDING METHOD FOR WELDING WORKPIECES WITH IT |
| WO2020250002A1 (en) * | 2019-06-10 | 2020-12-17 | Easy Automation S.R.L. | System for the application of a threadlike element on a substrate |
| US11850676B2 (en) | 2020-06-03 | 2023-12-26 | Kulicke And Soffa Industries, Inc. | Ultrasonic welding systems, methods of using the same, and related workpieces including welded conductive pins |
| CN120981314A (zh) | 2023-04-19 | 2025-11-18 | 库利克和索夫工业公司 | 用于导电引脚的超声焊接系统和相关方法 |
Family Cites Families (82)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3995845A (en) * | 1972-12-26 | 1976-12-07 | Rca Corporation | Ultrasonic wire bonding chuck |
| US3926357A (en) * | 1973-10-09 | 1975-12-16 | Du Pont | Process for applying contacts |
| US4301958A (en) * | 1978-08-24 | 1981-11-24 | Fujitsu Limited | Arrangement for automatically fabricating and bonding semiconductor devices |
| JPS5530810A (en) * | 1978-08-25 | 1980-03-04 | Fujitsu Ltd | Automatic bonding system for semiconductor device assembling |
| US4411721A (en) * | 1982-02-25 | 1983-10-25 | The Mead Corporation | Apparatus and method for attaching fastener tapes |
| US4872052A (en) * | 1986-12-03 | 1989-10-03 | View Engineering, Inc. | Semiconductor device inspection system |
| JP2555876B2 (ja) * | 1988-06-29 | 1996-11-20 | 日本電気株式会社 | インナー・リード・ボンディング装置 |
| JPH081920B2 (ja) * | 1990-06-08 | 1996-01-10 | 株式会社東芝 | ワイヤボンディング装置 |
| US5614057A (en) * | 1992-02-19 | 1997-03-25 | Mim Industries, Inc. | Automatic ultrasonic fusing system |
| US5427301A (en) * | 1994-05-06 | 1995-06-27 | Ford Motor Company | Ultrasonic flip chip process and apparatus |
| JPH0820071A (ja) * | 1994-07-07 | 1996-01-23 | Kiyoshi Shinoda | 超音波溶着装置 |
| JP3455344B2 (ja) * | 1995-10-20 | 2003-10-14 | 株式会社オートネットワーク技術研究所 | 超音波溶接装置 |
| JP2915350B2 (ja) * | 1996-07-05 | 1999-07-05 | 株式会社アルテクス | 超音波振動接合チップ実装装置 |
| JP3354063B2 (ja) * | 1996-11-29 | 2002-12-09 | 株式会社新川 | リードフレーム供給方法及び供給装置 |
| WO1999066547A1 (en) * | 1998-06-19 | 1999-12-23 | Matsushita Electric Industrial Co., Ltd. | Method and device for forming bump |
| JP2000068327A (ja) * | 1998-08-20 | 2000-03-03 | Matsushita Electric Ind Co Ltd | 部品の実装方法と装置 |
| US20050145306A1 (en) * | 1998-09-03 | 2005-07-07 | Uit, L.L.C. Company | Welded joints with new properties and provision of such properties by ultrasonic impact treatment |
| US6820792B2 (en) * | 1998-09-30 | 2004-11-23 | Samsung Electronics Co., Ltd. | Die bonding equipment |
| JP3290632B2 (ja) * | 1999-01-06 | 2002-06-10 | 株式会社アルテクス | 超音波振動接合装置 |
| JP4128319B2 (ja) * | 1999-12-24 | 2008-07-30 | 株式会社新川 | マルチチップボンディング方法及び装置 |
| JP3566166B2 (ja) * | 2000-02-10 | 2004-09-15 | 株式会社新川 | ツール位置測定方法、オフセット測定方法、基準部材およびボンディング装置 |
| US6616030B2 (en) * | 2001-05-07 | 2003-09-09 | West Bond, Inc. | Gantry mounted ultrasonic wire bonder with orbital bonding tool head |
| US7819302B2 (en) * | 2004-09-30 | 2010-10-26 | The Boeing Company | Aluminum end caps ultrasonically welded to end of aluminum tube |
| JP2006135249A (ja) * | 2004-11-09 | 2006-05-25 | Fujitsu Ltd | 超音波実装方法およびこれに用いる超音波実装装置 |
| JP4792945B2 (ja) * | 2005-01-28 | 2011-10-12 | 日産自動車株式会社 | 超音波接合装置および接合構造体 |
| JP4539454B2 (ja) * | 2005-06-20 | 2010-09-08 | パナソニック株式会社 | 電子部品の熱圧着ツールおよび電子部品の実装装置ならびに実装方法 |
| JP4577509B2 (ja) | 2005-06-22 | 2010-11-10 | トヨタ自動車株式会社 | パワー半導体モジュール及びその製造方法 |
| DE102005048368B3 (de) | 2005-10-10 | 2007-05-03 | Schunk Ultraschalltechnik Gmbh | Verfahren zum Herstellen einer Schweißverbindung zwischen elektrischen Leitern |
| US7568606B2 (en) * | 2006-10-19 | 2009-08-04 | Asm Technology Singapore Pte Ltd. | Electronic device handler for a bonding apparatus |
| US7666541B2 (en) * | 2006-11-03 | 2010-02-23 | The Gillette Company | Ultrasonic metal welding techniques and batteries manufactured using such techniques |
| WO2008126211A1 (ja) * | 2007-03-28 | 2008-10-23 | Fujitsu Limited | 超音波接合装置及び超音波接合方法 |
| TW200925092A (en) * | 2007-10-03 | 2009-06-16 | Panasonic Corp | Apparatus for bonding adhesive tape, and method for connecting tape member |
| JP5313751B2 (ja) * | 2008-05-07 | 2013-10-09 | パナソニック株式会社 | 電子部品装着装置 |
| JP5281550B2 (ja) * | 2008-12-08 | 2013-09-04 | パナソニック株式会社 | ボンディングツール、電子部品装着装置、および電子部品装着方法 |
| JP5099064B2 (ja) * | 2009-04-07 | 2012-12-12 | パナソニック株式会社 | 電子部品実装システムおよび電子部品実装方法 |
| US7810699B1 (en) * | 2009-04-22 | 2010-10-12 | Gm Global Technology Operations, Inc. | Method and system for optimized vibration welding |
| US9038688B2 (en) * | 2009-04-29 | 2015-05-26 | Covidien Lp | System and method for making tapered looped suture |
| US8544717B2 (en) * | 2010-04-30 | 2013-10-01 | Orthodyne Electronics Corporation | Ultrasonic bonding systems and methods of using the same |
| KR101385803B1 (ko) * | 2010-05-20 | 2014-04-16 | 파나소닉 주식회사 | 본딩 툴, 전자부품 장착장치 및 본딩 툴의 제조방법 |
| US8651354B2 (en) * | 2010-07-19 | 2014-02-18 | Orthodyne Electronics Corporation | Ultrasonic bonding systems including workholder and ribbon feeding system |
| JP2012024790A (ja) * | 2010-07-21 | 2012-02-09 | Yazaki Corp | 超音波溶着装置 |
| JP5686555B2 (ja) * | 2010-09-08 | 2015-03-18 | 富士機械製造株式会社 | 製造システム構築方法 |
| US8231044B2 (en) * | 2010-10-01 | 2012-07-31 | Orthodyne Electronics Corporation | Solar substrate ribbon bonding system |
| US8196798B2 (en) * | 2010-10-08 | 2012-06-12 | Kulicke And Soffa Industries, Inc. | Solar substrate ribbon bonding system |
| WO2012049087A2 (en) * | 2010-10-13 | 2012-04-19 | Abb Research Ltd | Semiconductor module and method of manufacturing a semiconductor module |
| US9272802B2 (en) * | 2010-10-26 | 2016-03-01 | Rinco Ultrasonics USA, Inc. | Stepped sonotrode and anvil energy director grids for narrow/complex ultrasonic welds of improved durability |
| WO2012092058A2 (en) * | 2010-12-29 | 2012-07-05 | Orthodyne Electroncis Corporation | Methods and systems for aligning tooling elements of ultrasonic bonding systems |
| KR101305255B1 (ko) * | 2011-02-23 | 2013-09-06 | 주식회사 엘지화학 | 초음파 용접의 강도 검사 방법 및 장치 |
| JP2013051366A (ja) * | 2011-08-31 | 2013-03-14 | Hitachi Ltd | パワーモジュール及びその製造方法 |
| JP5747164B2 (ja) * | 2011-09-27 | 2015-07-08 | パナソニックIpマネジメント株式会社 | 電子部品実装システム |
| KR101369312B1 (ko) * | 2012-07-24 | 2014-03-04 | 주식회사 알리 | 차량용 램프 케이싱 초음파 용착 장치 |
| JP6033011B2 (ja) | 2012-09-12 | 2016-11-30 | 三菱電機株式会社 | 電力用半導体装置および電力用半導体装置の製造方法 |
| CN102861984B (zh) * | 2012-10-09 | 2015-06-24 | 雷广伟 | 一种动力电池正负极柱四头超声波焊接设备 |
| US20140110833A1 (en) * | 2012-10-24 | 2014-04-24 | Samsung Electro-Mechanics Co., Ltd. | Power module package |
| ES1078227Y (es) * | 2012-11-21 | 2013-03-08 | Carmona Manuel Ruiz | Equipo para unir un cuerpo laminar a la embocadura de una caja |
| EP2769919A4 (en) * | 2012-11-21 | 2015-05-20 | Carmona Manuel Ruiz | EQUIPMENT FOR ASSEMBLING A LAMELLAR BODY AT THE OPENING OF A BODY |
| DE102013208749B4 (de) * | 2013-05-13 | 2015-11-19 | Schunk Sonosystems Gmbh | Ultraschallschweißvorrichtung sowie Verfahren zum Verschweißen von Komponenten mittels einer Ultraschallschweißvorrichtung |
| WO2015050228A1 (ja) * | 2013-10-03 | 2015-04-09 | 日産自動車株式会社 | 電気デバイスのセパレータ接合装置 |
| CN105765715B (zh) * | 2013-11-26 | 2018-08-03 | 三菱电机株式会社 | 功率模块以及功率模块的制造方法 |
| US20150210003A1 (en) | 2014-01-28 | 2015-07-30 | Frito-Lay Noth America, Inc. | Transverse Sonotrode Design for Ultrasonic Welding |
| JP6091443B2 (ja) * | 2014-01-31 | 2017-03-08 | 三菱電機株式会社 | 半導体モジュール |
| JP6550971B2 (ja) * | 2014-07-02 | 2019-07-31 | 三菱マテリアル株式会社 | 接合体の製造方法、多層接合体の製造方法、パワーモジュール用基板の製造方法及びヒートシンク付パワーモジュール用基板の製造方法 |
| WO2016002803A1 (ja) * | 2014-07-04 | 2016-01-07 | 三菱マテリアル株式会社 | パワーモジュール用基板ユニット及びパワーモジュール |
| JP6406983B2 (ja) | 2014-11-12 | 2018-10-17 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
| US9475232B2 (en) * | 2014-12-01 | 2016-10-25 | Zee.Aero Inc. | Damping and isolating vibration during ultrasonic welding |
| US10239150B2 (en) * | 2014-12-09 | 2019-03-26 | GM Global Technology Operations LLC | Ultrasonic welding of composites using C frame tooling |
| DE112016000904T5 (de) * | 2015-02-25 | 2017-11-09 | Mitsubishi Electric Corporation | Leistungsmodul |
| KR101619782B1 (ko) * | 2015-04-14 | 2016-05-12 | 제엠제코(주) | 반도체 기판의 초음파 웰딩 접합 장치 |
| WO2016199621A1 (ja) | 2015-06-11 | 2016-12-15 | 三菱電機株式会社 | 電力用半導体装置の製造方法および電力用半導体装置 |
| JP2017024040A (ja) | 2015-07-22 | 2017-02-02 | 矢崎総業株式会社 | 超音波接合装置 |
| CN204991892U (zh) * | 2015-09-14 | 2016-01-20 | 福建亚亨动力科技集团有限公司 | 一种电池自动盖帽生产线 |
| DE112015006985B4 (de) * | 2015-09-29 | 2023-10-12 | Toshiba Mitsubishi-Electric Industrial Systems Corporation | Ultraschallvibrationsverbindungsgerät |
| KR102490863B1 (ko) * | 2015-11-04 | 2023-01-20 | 삼성에스디아이 주식회사 | 이차전지의 제조방법 |
| KR101734712B1 (ko) * | 2015-12-09 | 2017-05-11 | 현대자동차주식회사 | 파워모듈 |
| US10439235B2 (en) * | 2016-01-27 | 2019-10-08 | Faith Technologies, Inc. | Process for joining incompatible materials and materials formed thereby |
| JP6685143B2 (ja) * | 2016-02-03 | 2020-04-22 | 三菱電機株式会社 | 電極端子、半導体装置及び電力変換装置 |
| CN107546214B (zh) * | 2016-06-23 | 2020-02-07 | 台达电子工业股份有限公司 | 功率模块封装结构 |
| US10946475B2 (en) * | 2016-08-04 | 2021-03-16 | Toshiba Mitsubishi-Electric Industrial Systems Corporation | Tool for ultrasonic bonding and apparatus for ultrasonic bonding |
| TWI599664B (zh) * | 2016-09-13 | 2017-09-21 | 樂金股份有限公司 | 用於功率模組封裝之金屬帶材 |
| US10471545B2 (en) * | 2016-11-23 | 2019-11-12 | Rohinni, LLC | Top-side laser for direct transfer of semiconductor devices |
| CN111201683A (zh) * | 2017-10-13 | 2020-05-26 | 库利克和索夫工业公司 | 导电端子、汇流条及其制造方法、以及组装相关的功率模块的方法 |
| WO2020112635A1 (en) * | 2018-11-28 | 2020-06-04 | Kulicke And Soffa Industries, Inc. | Ultrasonic welding systems and methods of using the same |
-
2018
- 2018-04-03 EP EP18781172.4A patent/EP3606695B1/en active Active
- 2018-04-03 JP JP2019554509A patent/JP7181217B2/ja active Active
- 2018-04-03 CN CN202111073625.7A patent/CN113681145B/zh active Active
- 2018-04-03 WO PCT/US2018/025941 patent/WO2018187364A1/en not_active Ceased
- 2018-04-03 CN CN201880023804.XA patent/CN110891726B/zh active Active
- 2018-04-03 US US16/321,635 patent/US10882134B2/en active Active
- 2018-04-03 EP EP23020278.0A patent/EP4269019B1/en active Active
-
2020
- 2020-11-25 US US17/104,711 patent/US11364565B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20200290148A1 (en) | 2020-09-17 |
| CN110891726B (zh) | 2021-08-24 |
| EP4269019A2 (en) | 2023-11-01 |
| US20210078099A1 (en) | 2021-03-18 |
| EP3606695A1 (en) | 2020-02-12 |
| US11364565B2 (en) | 2022-06-21 |
| JP2020512939A (ja) | 2020-04-30 |
| WO2018187364A8 (en) | 2020-01-30 |
| EP3606695B1 (en) | 2023-06-07 |
| US10882134B2 (en) | 2021-01-05 |
| CN110891726A (zh) | 2020-03-17 |
| EP4269019A3 (en) | 2024-02-21 |
| CN113681145A (zh) | 2021-11-23 |
| EP4269019B1 (en) | 2025-07-09 |
| EP3606695A4 (en) | 2021-01-20 |
| JP7181217B2 (ja) | 2022-11-30 |
| WO2018187364A1 (en) | 2018-10-11 |
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