CN113529432A - 导电织物及其制备方法 - Google Patents

导电织物及其制备方法 Download PDF

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CN113529432A
CN113529432A CN202010410778.5A CN202010410778A CN113529432A CN 113529432 A CN113529432 A CN 113529432A CN 202010410778 A CN202010410778 A CN 202010410778A CN 113529432 A CN113529432 A CN 113529432A
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conductive
silver
fabric
conductive fabric
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周暐皓
吴政樑
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Taiwan Textile Research Institute
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Abstract

一种导电织物包括基布及导电膜。导电膜配置于所述基布上。导电膜包括聚氨酯树脂及含银导体，其中含银导体为55重量份至80重量份，而聚氨酯树脂为8重量份至12重量份。导电膜具有良好的弹性并提供导电功能，因此导电织物适合用于运动服饰。

Description

导电织物及其制备方法
技术领域
本揭露有关于一种导电织物，特别是有关于一种弹性佳且拉伸时电阻变异率低的电热织物。
背景技术
近年来，随着科技的快速进步，已开发出具有多样化功能的织物，以提升人类生活的便利。举例而言，织物上可附着电子元件，通过附有电子元件的织物制成的服饰，可应用至更多新的领域。例如，智能手表、穿戴式计步器、智能手环等。再者，搭配现今智能产品的盛行风潮，这些电子装置也已成为消费性市场的主流商品。另一方面，由于这些穿戴式电子装置于消费性市场造成巨大回响，结合电子装置与穿着服饰的产品也陆续问世。
由于运动风气的盛行，相关产品蓬勃发展，导电织物的弹性逐渐受到重视。然而，一般的导电织物会因为拉伸而造成电阻变异率高，进而影响电子装置的性能。因此，如何提出一种可解决上述问题的导电织物，是目前业界亟欲投入研发资源解决的问题之一。
发明内容
有鉴于此，本揭露的一目的在于提出一种可解决上述问题的导电织物。
为了达到上述目的，本揭露的一实施方式提供一种导电织物包括基布及导电膜。导电膜配置于所述基布上。导电膜包括聚氨酯树脂及含银导体，其中含银导体为55重量份至80重量份，而聚氨酯树脂为8重量份至12重量份。
于本揭露的一个实施方式中，聚氨酯树脂的制备方法包括以下步骤。将异氰酸酯及丙三醇混合，以形成中间产物。将中间产物、聚醚多元醇及催化剂混合，以形成聚氨酯树脂。
于本揭露的一个实施方式中，聚氨酯树脂包括以式(1)表示的分子结构：
Figure BDA0002493131890000021
其中k、n1、n2、n3、n4、n5、n6、m1及m2为正整数，且(k+m1+m2+4):(n1+n2+n3+n4+m1×n5+m2×n6)介于10:5至10:7之间。
于本揭露的一个实施方式中，含银导体包括片状银粉，且片状银粉的最长轴介于2μm至10μm。
于本揭露的一个实施方式中，含银导体包括纳米银线，其中纳米银线的线径介于40nm至160nm，且纳米银线的长径比(aspect ratio)介于100至1000。
于本揭露的一个实施方式中，导电膜的厚度介于5μm至55μm。此外，本揭露的导电织物拉伸至长度为120％时导电织物的电阻变异率可低于25％。
本揭露的一实施方式提供一种导电织物的制备方法，包括提供基布及以下步骤。进行混合步骤，将聚氨酯树脂、含银导体及正丙醇混合，以得到导电银浆，其中含银导体为55重量份至80重量份，聚氨酯树脂为8重量份至12重量份，且正丙醇为8重量份至35重量份。进行涂布步骤，将导电银浆涂布于基布上。进行烘烤干燥步骤，对经涂布步骤的基布进行烘烤干燥，以在基布上形成导电膜。
于本揭露的一个实施方式中，在导电织物的制备方法中所得到的导电银浆的粘度介于29,000cP至54,500cP。
根据本揭露上述实施方式，本揭露所提供的导电织物具有低的电阻变异率，因此适用于运动服饰。通过调整导电膜的成分及组成比例能改善其成膜性、导电能力及电阻变异率。在导电织物的制备方法中，导电银浆添加正丙醇来取代毒性较强的溶剂，因此本制备方法中所配置出的导电银浆具有好的生物友善性。此外，本揭露所配置成的导电银浆具有适当的粘度，因此便于后续加工使用。
以上所述仅是用以阐述本揭露所欲解决的问题、解决问题的技术手段、及其产生的功效等等，本揭露的具体细节将在下文的实施方式及相关附图中详细介绍。
附图说明
为让本揭露的上述和其他目的、特征、优点与实施例能更明显易懂，所附附图的说明如下：
图1绘示为一实施方式中导电织物的剖面示意图；以及
图2绘示为一实施方式中导电织物制备方法的流程图。
【符号说明】
100:导电织物
110:基布
130:导电膜
131:聚氨酯树脂
133:含银导体
200:制备方法
S210:步骤
S230:步骤
S250:步骤
S270:步骤
具体实施方式
在本文中，由“一数值至另一数值”表示的范围，是一种避免在说明书中一一列举该范围中的所有数值的概要性表示方式。因此，某一特定数值范围的记载，涵盖该数值范围内的任意数值以及由该数值范围内的任意数值界定出的较小数值范围，如同在说明书中明文写出该任意数值和该较小数值范围一样。
本文使用的“约”、“近似”、“本质上”、或“实质上”包括所述值和在本领域普通技术人员确定的特定值的可接受的偏差范围内的平均值，考虑到所讨论的测量和与测量相关的误差的特定数量(即，测量系统的限制)。例如，“约”可以表示在所述值的一个或多个标准偏差内，或例如±30％、±20％、±15％、±10％、±5％内。再者，本文使用的“约”、“近似”、“本质上”、或“实质上”可依量测性质或其它性质，来选择较可接受的偏差范围或标准偏差，而可不用一个标准偏差适用全部性质。
本揭露内容提供一种导电织物，在拉伸时具有低的电阻变异率，而能保持为良好的导电回路，从而适用于运动服饰。相较于习知的技术，本揭露提供的导电织物的导电膜具有良好的弹性。此外，导电织物的制备方法中的导电银浆也具有好的生物友善性及合适的粘性，以便于后续加工。在本揭露内容中，电阻变异率＝100％×[(拉伸时的电阻值X2-拉伸前的电阻值X1)/拉伸前的电阻值X1]。
请参考图1，图1绘示为本揭露一实施方式导电织物100的剖面示意图。导电织物100包括基布110及配置于基布110上的导电膜130。在一些实施方式中，基布110可例如是针织布、梭织布或不织布等布料，且基布110的材料可包括聚酯、尼龙、棉、聚丙烯、聚氨酯或其组合。
导电膜130包括聚氨酯树脂131及含银导体133，其中聚氨酯树脂131做为含银导体133的载体，含银导体133做为导电膜130中的主要导电介质，以使得导电膜130可同时具有弹性及导电性。于一些实施方式中，导电膜130的厚度介于5μm至55μm，从而适于配置在导电织物100的基布110上以提供导电织物100的导电性，并使得导电织物100拉伸时具有低的电阻变异率。于一些实施方式中，当导电织物100拉伸至长度为120％时，导电织物100的电阻变异率低于25％。因此，当使用者运动而拉伸导电织物100时，导电织物100仍能保持低的电阻变异率及良好的导电功能。
聚氨酯树脂131做为含银导体133的载体，以形成导电膜130。由于聚氨酯树脂131具有好的弹性，故使用其来形成导电膜130时，导电膜130可具有良好的弹性。
于一些实施方式中，聚氨酯树脂131包括以式(1)表示的分子结构以加强互穿(interpenetrating)作用，进而提升导电膜130的弹性，其中式(1)如下：
Figure BDA0002493131890000041
其中k、n1、n2、n3、n4、n5、n6、m1及m2为正整数，其中(k+m1+m2+4):(n1+n2+n3+n4+m1×n5+m2×n6)介于10:5至10:7之间。当聚氨酯树脂131具有上述式(1)的分子结构时，聚氨酯树脂131的树枝状结构可以串连含银导体133，进而在导电织物100受到拉伸时保持导电能力及低电阻变异率。
于一些实施方式中，聚氨酯树脂131的制备方法可包括：将异氰酸酯及丙三醇混合，以形成中间产物；以及，将中间产物、聚醚多元醇及催化剂混合，以形成聚氨酯树脂131。具体而言，异氰酸酯可例如是4,4-二环己基甲烷二异氰酸酯(H12MDI)；催化剂可例如是二月桂酸二丁基锡、二乙酸二丁基锡、三氟甲磺酸、甲基磺酸、磷酸二苯酯、氨基吡啶、或例如是二氮杂二环辛烷、氮异环碳烯的其他含氮杂环；聚醚多元醇可例如是分子量介于2000至3000之间的四氢呋喃均聚醚(PTMEG)。此外，中间产物包括以式(2)表示的分子结构：
Figure BDA0002493131890000051
于式(2)中，m为正整数。在一些实施方式中，用于制备聚氨酯树脂131的异氰酸酯及聚醚多元醇的莫耳比可例如是介于10：5至10：7之间，因此式(1)中的(k+m1+m2+4):(n1+n2+n3+n4+m1×n5+m2×n6)可介于10:5至10:7之间。
含银导体133可均匀分布在聚氨酯树脂131中，以做为导电膜130中的主要导电介质。含银导体133可包括银金属粉末或银合金粉末。于一些实施方式中，含银导体133可包括片状银粉，其中片状银粉的最长轴介于2μm至10μm，且长径比(aspect ratio)小于1：30。于另一些实施方式中，含银导体133可包括纳米银线，其中纳米银线的线径介于40nm至160nm，且纳米银线的长径比介于100至1000。通过上述选择可以提高含银导体133的分散性，进而能改善导电织物100的导电能力并降低导电织物100拉伸后的电阻变异率。此外，由于纳米银线的长径比明显较大，通过长径比可清楚区分银粉及纳米银线的具体差异。
在导电膜130中，聚氨酯树脂131为8重量份至12重量份，而含银导体133为55重量份至80重量份。若导电膜130中的含银导体133比例低于55重量份，则导电膜130导电能力不佳，从而影响导电织物100拉伸后的电阻变异率。详细来说，由于含银导体133是通过彼此间的物理性接触来传导电流，故当其在导电膜130中的含量低于55重量份时，则会因为含银导体133的密度太低而无法有效地接触，而在导电织物100受到拉伸时在区域间形成电流断路，进而影响导电织物100的电阻变异率。然而，若含银导体133比例高于80重量份，则含银导体133难以均匀分布在聚氨酯树脂131，导致导电膜130的成膜性差，难以配置在基布110上。
图2绘示为本揭露的一实施方式提供的一种导电织物的制备方法200的流程图。
请参考图2，首先，在步骤S210中，提供基布。基布的种类及材料如上所述，故于此不再赘述。
接着，在步骤S230中，进行混合步骤，将聚氨酯树脂、含银导体及正丙醇混合，以得到导电银浆。在一些实施方式中，可将8重量份至12重量份的聚氨酯树脂、55重量份至80重量份的含银导体及8重量份至35重量份的正丙醇混合，以得到导电银浆。含银导体的种类或材料如上所述，故于此不再赘述。此外，由于使用正丙醇做为溶剂，故相较于传统导电银浆的制程而言，本揭露的导电银浆具有环境及生物友善性。此外，在一些实施方式中，步骤S230所得到的导电银浆的粘度可介于29,000cP至54,500cP，以适用于例如是网版印刷的后续加工。
接着，在步骤S250中，进行涂布步骤，以将导电银浆涂布于基布上。在一些实施方式中，可通过湿式刮棒或网版印刷将导电银浆涂布于基布上，但本揭露不以此为限。
最后，在步骤S270中，进行烘烤干燥步骤，对经涂布步骤的基布进行烘烤干燥，以在基布上形成导电膜，从而形成导电织物。在一些实施方式中，烘烤干燥步骤的温度可介于120℃至160℃之间，但本揭露不以此为限。
综上所述，在步骤S210～步骤S270中，由于使用低毒性的正丙醇做为溶剂，故本揭露的导电织物的制备方法具有环境及生物友善性。此外，由于使用特定含量的聚氨酯树脂、含银导体及正丙醇来形成导电银浆，故导电银浆具有特定的粘度，可通过例如是网版印刷等涂布方式配置在基布上，以得到适于各种应用的导电织物。
下文将参照实施例及各比较例，更具体地描述本揭露的特征及功效。应了解到，在不逾越本揭露范畴的情况下，可适当地改变所用材料、其量及比率、处理细节以及处理流程等等。因此，不应由下文所述的实施例对本揭露作出限制性的解释。
<实验例1:导电织物配方的莫耳数比对电阻变异率评估>
本实验例中，由不同莫耳数比的H12MDI及PTMEG制成各实施例及各比较例的导电织物。将导电织物拉伸至原长度的150％并利用DIN 54345-1标准方法以两点探针检验导电度来测量导电织物的电阻变异率，其中电阻变异率＝100％×[(拉伸时的电阻值X2-拉伸前的电阻值X1)/拉伸前的电阻值X1]，测试结果如表一所示。
如表一所示的导电织物中，基布由热塑性聚氨酯所制成，导电膜厚度为50微米，且导电膜中的聚氨酯树脂具有10重量份而片状银粉具有60重量份，片状银粉的最长轴介于2μm至5μm。
表一
比较例/实施例 H12MD：PTMEG 电阻变异率
比较例1 20：6 3900％
比较例2 20：8 1500％
实施例1 20：10 100％
实施例2 20：11 20％
实施例3 20：12 100％
实施例4 20：14 100％
如表一所示，以不同莫耳数比的H12MDI与PTMEG制成的聚氨酯树脂影响导电织物拉伸后的电阻变异率。表一所示为导电织物拉伸长度为原长度的150％的电阻变异率。由此可知，相较于比较例1及2，实施例1至4的导电织物被拉伸后保持低的电阻变异率。
<实验例2:导电膜厚度对电阻变异率评估>
本实验例中，由不同导电膜厚度制成各实施例及各比较例的导电织物。将导电织物拉伸至原长度的120％并利用DIN 54345-1标准方法以两点探针检验导电度来测量导电织物的电阻变异率，测试结果如表二所示。
如表二所示的导电织物中，基布由热塑性聚氨酯所制成，导电膜中的聚氨酯树脂具有10重量份而片状银粉具有60重量份，此外聚氨酯树脂以H12MDI及PTMEG的莫耳数比为20：11所制成，片状银粉的最长轴介于2μm至5μm。
表二
比较例/实施例 导电膜厚度 电阻变异率
比较例3 70微米 42.85％
实施例5 52微米 22.22％
实施例6 27微米 18.75％
实施例7 10微米 24％
如表二所示，导电膜厚度也影响导电织物拉伸后的电阻变异率。由此可知，相较于比较例3，实施例5至7所示的导电膜厚度范围能让导电织物拉伸后保持低的电阻变异率。
根据本揭露上述实施方式，调整导电织物的导电膜厚度及组成可降低导电织物拉伸后的电阻变异率。导电膜中聚氨酯树脂的树枝状结构可以串连含银导体，进而提升导电膜的导电能力及降低电阻变异率。此外，片状银粉能改善导电织物的导电能力，而添加纳米银线，能提升银粉的分散度。在导电织物的制备过程中，以正丙醇取代习知的溶剂所配置出的导电银浆具有更佳的生物友善性，且所配置成的导电银浆具有较佳的粘度，因此便于后续加工使用。
虽然本揭露已以实施方式揭露如上，然其并非用以限定本揭露，任何熟悉此技艺者，在不脱离本揭露的精神和范围内，当可作各种的更动与润饰，因此本揭露的保护范围当视所附的权利要求书所界定的范围为准。

Claims (10)

1.一种导电织物，其特征在于，包括：
基布；以及
导电膜，配置于所述基布上，其中所述导电膜包括：
聚氨酯树脂；以及
含银导体，其中所述含银导体为55重量份至80重量份，而所述聚氨酯树脂为8重量份至12重量份。
2.根据权利要求1所述的导电织物，其特征在于，所述聚氨酯树脂的制备方法包括：
将异氰酸酯及丙三醇混合，以形成中间产物；以及
将所述中间产物、聚醚多元醇及催化剂混合，以形成所述聚氨酯树脂。
3.根据权利要求1所述的导电织物，其特征在于，所述聚氨酯树脂包括以式(1)表示的分子结构：
Figure FDA0002493131880000011
其中k、n1、n2、n3、n4、n5、n6、m1及m2为正整数，且(k+m1+m2+4):(n1+n2+n3+n4+m1×n5+m2×n6)介于10:5至10:7之间。
4.根据权利要求1所述的导电织物，其特征在于，所述含银导体包括片状银粉，且所述片状银粉的最长轴介于2μm至10μm。
5.根据权利要求1所述的导电织物，其特征在于，所述含银导体包括纳米银线，其中所述纳米银线的线径介于40nm至160nm，且所述纳米银线的长径比介于100至1000。
6.根据权利要求1所述的导电织物，其特征在于，所述导电膜的厚度介于5μm至55μm。
7.根据权利要求1所述的导电织物，其特征在于，当所述导电织物拉伸至长度为120％时，所述导电织物的电阻变异率低于25％。
8.一种导电织物的制备方法，其特征在于，包括：
提供基布；
进行混合步骤，将聚氨酯树脂、含银导体及正丙醇混合，以得到导电银浆，其中所述含银导体为55重量份至80重量份，而所述聚氨酯树脂为8重量份至12重量份；
进行涂布步骤，将所述导电银浆涂布于所述基布上；以及
进行烘烤干燥步骤，对经所述涂布步骤的所述基布进行烘烤干燥，以在所述基布上形成导电膜。
9.根据权利要求8所述的导电织物的制备方法，其特征在于，所述正丙醇为8重量份至35重量份。
10.根据权利要求8所述的导电织物的制备方法，其特征在于，所述导电银浆的粘度介于29,000cP至54,500cP。
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