CN113388805A - 蒸镀掩模和蒸镀掩模的制造方法 - Google Patents
蒸镀掩模和蒸镀掩模的制造方法 Download PDFInfo
- Publication number
- CN113388805A CN113388805A CN202110265013.1A CN202110265013A CN113388805A CN 113388805 A CN113388805 A CN 113388805A CN 202110265013 A CN202110265013 A CN 202110265013A CN 113388805 A CN113388805 A CN 113388805A
- Authority
- CN
- China
- Prior art keywords
- vapor deposition
- plating layer
- mask
- deposition mask
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007740 vapor deposition Methods 0.000 title claims abstract description 148
- 238000000034 method Methods 0.000 title claims abstract description 50
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 49
- 238000007747 plating Methods 0.000 claims abstract description 80
- 230000004888 barrier function Effects 0.000 claims abstract description 17
- 239000010410 layer Substances 0.000 claims description 118
- 239000000463 material Substances 0.000 claims description 39
- 238000003825 pressing Methods 0.000 claims description 26
- 230000008859 change Effects 0.000 claims description 4
- 239000011247 coating layer Substances 0.000 claims 1
- 230000007547 defect Effects 0.000 abstract description 6
- 230000008020 evaporation Effects 0.000 abstract description 4
- 238000001704 evaporation Methods 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 description 43
- 239000010408 film Substances 0.000 description 30
- 239000012790 adhesive layer Substances 0.000 description 19
- 239000002184 metal Substances 0.000 description 17
- 229910052751 metal Inorganic materials 0.000 description 17
- 229920002120 photoresistant polymer Polymers 0.000 description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- 238000000151 deposition Methods 0.000 description 7
- 238000005323 electroforming Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 239000010409 thin film Substances 0.000 description 7
- 230000004048 modification Effects 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 230000008021 deposition Effects 0.000 description 5
- 239000012071 phase Substances 0.000 description 4
- 229910001374 Invar Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229920001651 Cyanoacrylate Polymers 0.000 description 1
- MWCLLHOVUTZFKS-UHFFFAOYSA-N Methyl cyanoacrylate Chemical compound COC(=O)C(=C)C#N MWCLLHOVUTZFKS-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000010532 solid phase synthesis reaction Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 239000011364 vaporized material Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-041786 | 2020-03-11 | ||
| JP2020041786A JP2021143365A (ja) | 2020-03-11 | 2020-03-11 | 蒸着マスクおよび蒸着マスクの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113388805A true CN113388805A (zh) | 2021-09-14 |
| CN113388805B CN113388805B (zh) | 2024-07-02 |
Family
ID=77617458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110265013.1A Active CN113388805B (zh) | 2020-03-11 | 2021-03-11 | 蒸镀掩模和蒸镀掩模的制造方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2021143365A (ja) |
| KR (1) | KR102667660B1 (ja) |
| CN (1) | CN113388805B (ja) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102327918A (zh) * | 2011-08-08 | 2012-01-25 | 上海天灵开关厂有限公司 | 铜排孔毛刺的无切削加工方法 |
| KR20140060837A (ko) * | 2012-11-12 | 2014-05-21 | 성낙훈 | 도금 방법에 의한 날개형 메탈 마스크와 그 제작방법 |
| CN107419217A (zh) * | 2016-05-23 | 2017-12-01 | 日立麦克赛尔株式会社 | 蒸镀掩膜及其制造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009087840A (ja) | 2007-10-02 | 2009-04-23 | Seiko Epson Corp | 蒸着マスク、蒸着マスクの製造方法、有機ｅｌ素子、電子機器 |
| JP5958804B2 (ja) | 2012-03-30 | 2016-08-02 | 株式会社ブイ・テクノロジー | 蒸着マスク、蒸着マスクの製造方法及び有機ｅｌ表示装置の製造方法 |
| KR20140062290A (ko) * | 2012-11-14 | 2014-05-23 | 성낙훈 | 날개부를 구비한 메탈 마스크와 그의 제작방법. |
| JP7121918B2 (ja) * | 2016-12-14 | 2022-08-19 | 大日本印刷株式会社 | 蒸着マスク装置及び蒸着マスク装置の製造方法 |
| JP2019044253A (ja) * | 2017-09-07 | 2019-03-22 | 株式会社ジャパンディスプレイ | 蒸着マスク、蒸着マスクの作製方法、および表示装置の製造方法 |
| JP2020026554A (ja) * | 2018-08-10 | 2020-02-20 | 大日本印刷株式会社 | 蒸着マスク及び蒸着マスクの製造方法 |
-
2020
- 2020-03-11 JP JP2020041786A patent/JP2021143365A/ja active Pending
-
2021
- 2021-03-10 KR KR1020210031202A patent/KR102667660B1/ko active IP Right Grant
- 2021-03-11 CN CN202110265013.1A patent/CN113388805B/zh active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102327918A (zh) * | 2011-08-08 | 2012-01-25 | 上海天灵开关厂有限公司 | 铜排孔毛刺的无切削加工方法 |
| KR20140060837A (ko) * | 2012-11-12 | 2014-05-21 | 성낙훈 | 도금 방법에 의한 날개형 메탈 마스크와 그 제작방법 |
| CN107419217A (zh) * | 2016-05-23 | 2017-12-01 | 日立麦克赛尔株式会社 | 蒸镀掩膜及其制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113388805B (zh) | 2024-07-02 |
| KR20210114884A (ko) | 2021-09-24 |
| KR102667660B1 (ko) | 2024-05-22 |
| JP2021143365A (ja) | 2021-09-24 |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant |