CN113118974A - 喷丸加工装置以及喷丸加工方法 - Google Patents
喷丸加工装置以及喷丸加工方法 Download PDFInfo
- Publication number
- CN113118974A CN113118974A CN202011125004.4A CN202011125004A CN113118974A CN 113118974 A CN113118974 A CN 113118974A CN 202011125004 A CN202011125004 A CN 202011125004A CN 113118974 A CN113118974 A CN 113118974A
- Authority
- CN
- China
- Prior art keywords
- nozzle
- workpiece
- scanning process
- shot peening
- rotation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 130
- 238000005480 shot peening Methods 0.000 title claims abstract description 83
- 230000007246 mechanism Effects 0.000 claims abstract description 171
- 239000000463 material Substances 0.000 claims abstract description 147
- 230000008569 process Effects 0.000 claims abstract description 109
- 238000003754 machining Methods 0.000 claims abstract description 25
- 230000033001 locomotion Effects 0.000 claims description 94
- 239000007921 spray Substances 0.000 claims description 20
- 238000005507 spraying Methods 0.000 abstract 1
- 238000005422 blasting Methods 0.000 description 20
- 239000000428 dust Substances 0.000 description 18
- 230000008859 change Effects 0.000 description 7
- 239000000843 powder Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 230000001105 regulatory effect Effects 0.000 description 5
- 230000004044 response Effects 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000008187 granular material Substances 0.000 description 3
- 238000011084 recovery Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000006399 behavior Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000004482 other powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 230000005514 two-phase flow Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C3/00—Abrasive blasting machines or devices; Plants
- B24C3/18—Abrasive blasting machines or devices; Plants essentially provided with means for moving workpieces into different working positions
- B24C3/20—Abrasive blasting machines or devices; Plants essentially provided with means for moving workpieces into different working positions the work being supported by turntables
- B24C3/22—Apparatus using nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C3/00—Abrasive blasting machines or devices; Plants
- B24C3/02—Abrasive blasting machines or devices; Plants characterised by the arrangement of the component assemblies with respect to each other
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C5/00—Devices or accessories for generating abrasive blasts
- B24C5/02—Blast guns, e.g. for generating high velocity abrasive fluid jets for cutting materials
- B24C5/04—Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C9/00—Appurtenances of abrasive blasting machines or devices, e.g. working chambers, arrangements for handling used abrasive material
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Spray Control Apparatus (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020-003649 | 2020-01-14 | ||
JP2020003649A JP7259773B2 (ja) | 2020-01-14 | 2020-01-14 | ブラスト加工装置及びブラスト加工方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN113118974A true CN113118974A (zh) | 2021-07-16 |
Family
ID=76772226
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202011125004.4A Pending CN113118974A (zh) | 2020-01-14 | 2020-10-20 | 喷丸加工装置以及喷丸加工方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7259773B2 (ko) |
KR (1) | KR20210091651A (ko) |
CN (1) | CN113118974A (ko) |
TW (1) | TW202128356A (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115302410A (zh) * | 2022-08-31 | 2022-11-08 | 无锡艾迪尔机械制造有限公司 | 一种水喷砂除锈设备 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102571216B1 (ko) * | 2022-04-15 | 2023-08-25 | 이상헌 | 태양광패널의 유리판제거장치 및 태양광패널의 유리판제거방법 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5573446A (en) * | 1995-02-16 | 1996-11-12 | Eastman Kodak Company | Abrasive air spray shaping of optical surfaces |
JPH09300219A (ja) * | 1996-05-14 | 1997-11-25 | Sony Corp | パウダービーム加工機及び加工方法 |
CN102725107A (zh) * | 2010-10-27 | 2012-10-10 | 新东工业株式会社 | 喷丸加工装置 |
CN103430281A (zh) * | 2011-07-21 | 2013-12-04 | 新东工业株式会社 | 用于半导体元件的基板的处理方法 |
US20150202739A1 (en) * | 2012-07-27 | 2015-07-23 | Applied Materials, Inc. | Roughened substrate support |
CA3037825A1 (en) * | 2016-09-28 | 2018-04-05 | Sintokogio, Ltd. | Drilling method, resist layer, and fiber-reinforced plastic |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5263639B2 (ja) | 2005-11-30 | 2013-08-14 | 新東工業株式会社 | ブラスト加工装置に使用する粉粒体定量供給装置及び粉粒体定量供給方法 |
CN103503112B (zh) | 2012-03-30 | 2016-08-17 | 新东工业株式会社 | 半导体元件用基板的弯曲矫正装置及弯曲矫正方法 |
-
2020
- 2020-01-14 JP JP2020003649A patent/JP7259773B2/ja active Active
- 2020-10-20 CN CN202011125004.4A patent/CN113118974A/zh active Pending
- 2020-10-21 TW TW109136527A patent/TW202128356A/zh unknown
- 2020-11-18 KR KR1020200154813A patent/KR20210091651A/ko active Search and Examination
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5573446A (en) * | 1995-02-16 | 1996-11-12 | Eastman Kodak Company | Abrasive air spray shaping of optical surfaces |
JPH09300219A (ja) * | 1996-05-14 | 1997-11-25 | Sony Corp | パウダービーム加工機及び加工方法 |
CN102725107A (zh) * | 2010-10-27 | 2012-10-10 | 新东工业株式会社 | 喷丸加工装置 |
CN103430281A (zh) * | 2011-07-21 | 2013-12-04 | 新东工业株式会社 | 用于半导体元件的基板的处理方法 |
US20150202739A1 (en) * | 2012-07-27 | 2015-07-23 | Applied Materials, Inc. | Roughened substrate support |
CA3037825A1 (en) * | 2016-09-28 | 2018-04-05 | Sintokogio, Ltd. | Drilling method, resist layer, and fiber-reinforced plastic |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115302410A (zh) * | 2022-08-31 | 2022-11-08 | 无锡艾迪尔机械制造有限公司 | 一种水喷砂除锈设备 |
CN115302410B (zh) * | 2022-08-31 | 2023-09-19 | 无锡艾迪尔机械制造有限公司 | 一种水喷砂除锈设备 |
Also Published As
Publication number | Publication date |
---|---|
JP7259773B2 (ja) | 2023-04-18 |
JP2021109290A (ja) | 2021-08-02 |
KR20210091651A (ko) | 2021-07-22 |
TW202128356A (zh) | 2021-08-01 |
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PB01 | Publication | ||
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