CN113118974A

CN113118974A - Shot peening device and shot peening method

Info

Publication number: CN113118974A
Application number: CN202011125004.4A
Authority: CN
Inventors: 井上巧一
Original assignee: Sintokogio Ltd
Current assignee: Sintokogio Ltd
Priority date: 2020-01-14
Filing date: 2020-10-20
Publication date: 2021-07-16
Also published as: TW202128356A; KR20210091651A; JP7259773B2; JP2021109290A

Abstract

The invention provides a shot peening apparatus and a shot peening method capable of improving machining accuracy. A shot peening device (10) is provided with a table (12) on which a workpiece (W) is placed, a nozzle (13) for spraying a shot material (M) onto the surface of the workpiece, a moving mechanism (15), and a rotating mechanism (14). The moving mechanism (15) performs a first scanning process in which the nozzle (13) is moved relatively in a first direction on the surface of the workpiece (W) in a state in which the nozzle ejects the ejection material, and a second scanning process in which the nozzle is moved relatively in a second direction on the surface of the workpiece in a state in which the nozzle (13) ejects the ejection material. The rotation mechanism rotates the table relative to the nozzle by a first rotation angle formed by a first direction and a second direction with a rotation Axis (AX) as an axis between the first scanning process and the second scanning process.

Description

Shot peening device and shot peening method

Technical Field

The present disclosure relates to a shot peening apparatus and a shot peening method.

Background

Conventionally, a shot peening method is known in which a material is ejected from a nozzle toward a workpiece to machine the surface of the workpiece. In such shot peening, the nozzle scans the surface of the workpiece by relatively moving the nozzle with respect to the workpiece. Thereby, the ejection material is ejected along the movement trajectory (see patent documents 1 and 2).

Patent document 1: japanese patent laid-open No. 2007-176701

Patent document 2: international publication No. 2013/145348

When the nozzle is moved, the bending of the hose for supplying the spray material to the nozzle and the bending of the hose for supplying the compressed air to the nozzle may change, which may affect the machining accuracy. When the workpiece is moved by fixing the nozzle, although the deflection of the hose does not change, there is room for improvement in order to uniformly process the surface of the workpiece.

Disclosure of Invention

In the art, improvement in machining accuracy is desired.

A shot peening apparatus according to one aspect of the present disclosure is an apparatus for working a workpiece. The shot peening apparatus includes a table, a nozzle, a moving mechanism, and a rotating mechanism. The work table carries a work. The nozzle ejects a spray material toward the surface of the workpiece. The moving mechanism relatively moves the nozzle with respect to the table on a plane along the surface of the workpiece. The rotation mechanism rotates the table relative to the nozzle with a rotation axis intersecting the plane as an axis. The moving mechanism performs a first scanning process and a second scanning process. In the first scanning process, the nozzle is moved relative to the workpiece in a first direction on the surface while the nozzle ejects the ejection material. In the second scanning process, the nozzle is moved relative to the workpiece in the second direction while the nozzle ejects the ejection material. The second direction is a direction on the surface of the workpiece that intersects the first direction. The rotation mechanism rotates the table relative to the nozzle by a first rotation angle formed by a first direction and a second direction with the rotation axis as an axis between the first scanning process and the second scanning process.

In the shot peening apparatus, a first scanning process is performed in which the nozzle is moved relative to the workpiece in a first direction (which is a direction on the surface of the workpiece) while the nozzle ejects the blasting material, and then the table is rotated relative to the nozzle about the rotation axis by a first rotation angle formed by the first direction and the second direction. Then, a second scanning process is performed in which the nozzle is relatively moved with respect to a second direction of the workpiece on the surface of the workpiece in a state in which the nozzle ejects the ejection material. Even if the processing spot occurs in the workpiece in the first scanning process, the processing spot can be dispersed because the nozzle is moved in a direction different from the first scanning process in the second scanning process. This makes the machining accuracy uniform, and therefore, the machining accuracy can be improved.

The moving mechanism may move the nozzle relative to the table in the first scanning process so that the nozzle ejects the ejection material along a first movement trajectory including a plurality of first scanning lines extending in the first direction and a plurality of first transfer lines. The first transmission line connects two adjacent first scanning lines among the plurality of first scanning lines. In the second scanning process, the moving mechanism may relatively move the nozzle with respect to the table so that the nozzle ejects the ejection material along the second movement trajectory. The second moving track includes a plurality of second scanning lines and a plurality of second conveying lines. The second scan line extends in a second direction. The second scan lines are connected to two adjacent second scan lines among the plurality of second scan lines. At this time, the first scanning process can be performed only by relatively moving the nozzle with respect to the table along the first movement trajectory. Similarly, the second scanning process can be performed only by relatively moving the nozzle with respect to the stage along the second movement trajectory.

The plurality of first transfer lines and the plurality of second transfer lines may be provided at positions different from the surface of the workpiece, respectively, as viewed in the direction in which the rotary shaft extends. At this time, in the first scanning process, the ejection material is ejected on the surface of the workpiece along the plurality of first scanning lines, and in the second scanning process, the ejection material is ejected on the surface of the workpiece along the plurality of second scanning lines. Therefore, by appropriately setting the wiring intervals of the plurality of first scanning lines and the wiring intervals of the plurality of second scanning lines, the ejection material can be ejected on the entire surface of the workpiece.

The nozzle may also continue to eject the ejection material during movement along the first movement trajectory and the second movement trajectory. For example, when the ejection of the ejection material is resumed after the ejection of the ejection material is stopped, it may take time to stabilize the ejection pressure. In contrast, by continuing to eject the ejection material, the time required to stabilize the ejection pressure can be omitted, and thus the machining time can be shortened.

The moving mechanism may further perform a third scanning process of relatively moving the nozzle with respect to the workpiece in a third direction on the surface of the workpiece intersecting the second direction in a state where the nozzle ejects the ejection material. The rotation mechanism may rotate the stage relative to the nozzle by a second rotation angle formed by the second direction and the third direction with the rotation axis as an axis between the second scanning process and the third scanning process. The second rotation angle may also be equal to the first rotation angle. In this case, since each scanning process is performed every time the stage is rotated relative to the nozzle at a constant rotation angle, the processing unevenness can be effectively dispersed. This makes the machining accuracy more uniform, and therefore the machining accuracy can be further improved.

The rotation mechanism may rotate the table about the rotation axis. In this case, the scanning direction can be changed by rotating only the table without changing the behavior of the nozzle. Therefore, the machining accuracy can be improved without complicating the device configuration.

The moving mechanism may include a first moving mechanism for moving the table and a second moving mechanism for moving the nozzle. For example, the shot peening can be performed by moving the table in only one axial direction by the first moving mechanism and moving the nozzle in only one axial direction by the second moving mechanism. Therefore, the structure of the moving mechanism can be simplified.

The nozzle may also be fixed. The moving mechanism may also move the table. At this time, since the nozzle is fixed, the deflection of the hose for supplying the spray material or the compressed air to the nozzle does not change. Therefore, since the processing unevenness due to the change in the bending of the hose is not generated, the processing accuracy can be further improved.

The moving mechanism may also move the nozzle. In this case, since it is not necessary to provide a moving mechanism on the table, the apparatus structure can be simplified.

Other side shot peening methods of the present disclosure are methods of machining a workpiece. The shot peening method includes a step of performing a first scanning process and a step of performing a second scanning process. In the first scanning process, the nozzle is relatively moved with respect to the workpiece in a first direction on the surface of the workpiece in a state where the nozzle ejects the ejection material. After the first scanning process, the workpiece is relatively rotated by a predetermined rotation angle with respect to the nozzle about a rotation axis intersecting a plane along the surface of the workpiece. In the second scanning process, the nozzle is moved relative to the workpiece in a second direction on the surface of the workpiece intersecting the first direction while the nozzle ejects the ejection material. The rotation angle is an angle formed by the first direction and the second direction.

In the shot peening method, a first scanning process is performed in which the nozzle is moved relative to the workpiece in a first direction (on the surface of the workpiece) while the nozzle ejects the shot material, and then the workpiece is rotated relative to the nozzle (about the rotation axis) by a rotation angle defined by the first direction and a second direction. Then, a second scanning process is performed in which the nozzle is relatively moved in a second direction (on the surface as the workpiece) with respect to the workpiece in a state in which the nozzle ejects the ejection material. Even if the workpiece has a processing spot in the first scanning process, the processing spot can be dispersed by moving the nozzle in a direction different from that in the first scanning process in the second scanning process. This makes the machining accuracy uniform, and therefore, the machining accuracy can be improved.

[ Effect of the invention ]

According to the aspects and embodiments of the present disclosure, a shot peening apparatus and a shot peening method capable of improving machining accuracy can be provided.

Drawings

Fig. 1 is a diagram schematically showing a shot peening system including a shot peening apparatus according to an embodiment.

Fig. 2 is a perspective view showing the structure of the shot peening apparatus of fig. 1.

Fig. 3 is a sectional view showing the structure of the supply device of fig. 1.

Fig. 4 is a flowchart illustrating a shot peening method according to an embodiment.

Fig. 5 is a flowchart showing the shot peening process of fig. 4 in detail.

Fig. 6 is a diagram for explaining shot peening performed by the shot peening apparatus of fig. 2.

Fig. 7 is a diagram for explaining a relationship between the first scanning process and the second scanning process.

Description of reference numerals:

1 … shot peening system; 10 … shot-peening device; 12 … a workbench; a 13 … nozzle; 14 … a rotation mechanism; 15 … moving mechanism; a 51 … moving mechanism (first moving mechanism); a 52 … moving mechanism (second moving mechanism); AX … rotating shaft; d1 … direction (first direction); d2 … direction (second direction); d3 … direction (third direction); the direction D4 …; m … spray material; MP1 … movement trace (first movement trace); MP2 … movement trace (second movement trace); MP3 … movement track; MP4 … movement track; a PL1 … conveyor line (first conveyor line); a PL2 … conveyor line (second conveyor line); a PL3 … transfer line; a PL4 … transfer line; SL1 … scan line (first scan line); SL2 … scan lines (second scan lines); SL3 … scan lines; SL4 … scan lines; w … workpiece.

Detailed Description

Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and redundant description is omitted.

Fig. 1 is a diagram schematically showing a shot peening system including a shot peening apparatus according to an embodiment. Fig. 2 is a perspective view showing the structure of the shot peening apparatus of fig. 1. Fig. 3 is a sectional view showing the structure of the supply device of fig. 1. The shot peening system 1 shown in fig. 1 includes a shot peening device 10, a classifying mechanism 20, a dust collector 30, a supply device 40, and a control device 50.

The shot peening apparatus 10 is an apparatus that machines a workpiece W by blasting a shot material M supplied from a supply device 40 toward the workpiece W. The blasting method of the shot peening device 10 is, for example, a suction method. Examples of the blasting material M include particles of aluminum oxide, particles of silicon carbide, and glass beads. The workpiece W is made of, for example, a hard and brittle material. Examples of hard and brittle materials include aluminum nitride, aluminum oxide, glass, lithium tantalate, silicon, and sapphire. Examples of the processing include cutting, grooving, drilling, embossing, and roughening. As the workpiece W, a glass substrate or a silicon substrate used for a printed circuit board, a sapphire substrate of a Light Emitting Diode (LED), a Complementary Metal-Oxide Semiconductor (C-MOS), or the like may be used.

The shot peening device 10 includes a housing 11, a table 12, and a nozzle 13. A shot peening chamber R is defined inside the housing 11. The lower portion of the housing 11 defines a tapered collection space V whose width decreases downward. The table 12 is a table on which the workpiece W is placed. The table 12 is provided in the shot peening chamber R. The table 12 has a mounting surface 12 a. The workpiece W is mounted on the mounting surface 12a and fixed. The mounting surface 12a may be a suction surface for sucking and fixing the workpiece W.

The nozzle 13 ejects the spray material M toward the surface (machining surface) of the workpiece W. The nozzle 13 is disposed in the shot-peening chamber R above the table 12. An ejection port 13a is provided at the tip of the nozzle 13. The nozzle 13 is provided in the shot peening chamber R such that the ejection port 13a faces the mounting surface 12a of the table 12. The nozzle 13 sprays the spray material M together with the compressed air. The nozzle 13 is, for example, a suction nozzle. The nozzle 13 may be a direct pressure type nozzle. One end of a hose 16 and one end of a hose 17 are connected to the nozzle 13. The nozzle 13 sprays the spray material M supplied from the hose 16 together with the compressed air supplied from the hose 17 as a solid-gas two-phase flow.

As shown in fig. 2, the shot peening device 10 further includes a rotation mechanism 14 and a movement mechanism 15. The rotation mechanism 14 is a mechanism for rotating the table 12 relative to the nozzle 13 on the XY plane with the rotation axis AX as an axis. Here, "the table 12 is relatively rotated with respect to the nozzle 13 around the rotation axis AX" means that the fixed nozzle 13 rotates only the table 12 around the rotation axis AX, the fixed table 12 rotates only the nozzle 13 around the rotation axis AX, and both the table 12 and the nozzle 13 rotate around the rotation axis AX. The rotation axis AX extends in the Z-axis direction, and intersects (is orthogonal to) the XY plane. The XY plane is a plane along the surface of the workpiece W. In the present embodiment, the rotation mechanism 14 rotates the table 12 about the rotation axis AX. The rotation mechanism 14 is provided on the back surface of the table 12 opposite to the placement surface 12 a. The rotation mechanism 14 includes a connection mechanism (shaft) for connecting the table 12 and the rotation mechanism 14, and a motor for rotationally driving the connection mechanism. The rotation mechanism 14 rotates the table 12 on the XY plane by driving a motor.

The moving mechanism 15 is a mechanism for moving the nozzle 13 relative to the table 12 on the XY plane. Here, "the nozzle 13 is moved relative to the table 12" includes that the table 12 is fixed and only the nozzle 13 is moved, that the nozzle 13 is fixed and only the table 12 is moved, and that both the table 12 and the nozzle 13 are moved. In the present embodiment, the moving mechanism 15 includes a moving mechanism 51 (first moving mechanism) for moving the table 12 and a moving mechanism 52 (second moving mechanism) for moving the nozzle 13.

The moving mechanism 51 is provided in the shot peening chamber R and disposed below the table 12. The moving mechanism 51 has a guide rail 51a extending in the Y-axis direction. The moving mechanism 51 further includes a link mechanism for movably connecting the table 12 and the rotating mechanism 14 to the guide rail 51a together, and a motor for driving the link mechanism. The moving mechanism 51 moves the table 12 in the Y-axis direction by driving a motor. The moving speed of the table 12 by the moving mechanism 51 is set as appropriate in accordance with the size, shape, and material of the workpiece W, the pattern formed on the workpiece W, and the like.

The moving mechanism 52 is provided in the shot peening chamber R and is disposed above the nozzle 13. The moving mechanism 52 has a guide rail 52a extending in the X-axis direction. The moving mechanism 52 further includes a connecting mechanism for movably connecting the nozzle 13 to the guide rail 52a, and a motor for driving the connecting mechanism. The moving mechanism 52 moves the nozzle 13 in the X-axis direction by driving a motor. The moving speed of the nozzle 13 by the moving mechanism 52 is appropriately set in accordance with the size, shape, and material of the workpiece W, the pattern formed on the workpiece W, and the like.

In the shot peening apparatus 10 having the above-described configuration, the workpiece W is machined. The shot peening is described in detail later. The spray material M sprayed from the nozzle 13 toward the workpiece W is collected in the collection space V of the housing 11. An opening 11a for supplying the collected ejection material M to the classification mechanism 20 is formed in the bottom of the housing 11. One end of the recovery pipe 21 is connected to the opening 11 a. The other end of the recovery pipe 21 is connected to the classification mechanism 20.

The classification mechanism 20 is a mechanism that sucks the powder and granular material including the blasting material M ejected from the nozzle 13 toward the workpiece W and separates the powder and granular material into the reusable blasting material M and the dust (a general term for the cutting powder of the workpiece W generated by shot blasting, the blasting material M having a size that cannot be reused, and the like) that is the other powder and granular material. The classifying mechanism 20 is, for example, a cyclone classifier. One end of the duct 31 is connected to the classifying mechanism 20. The other end of the guide pipe 31 is connected to the dust collector 30.

The dust collector 30 is a device that collects the pieces of the ejected material M and the cutting powder of the workpiece W. The dust collector 30 sucks the duct 31 and generates an air flow from the opening 11a of the housing 11 toward the dust collector 30 through the recovery pipe 21, the classifying mechanism 20, and the duct 31. By this airflow, the powder particles containing the used blasting material M collected in the collection space V of the casing 11 are conveyed to the classifying mechanism 20. By the operation of the dust collector 30, a rotating airflow is generated inside the classifying mechanism 20, and the heavy powder particles (reusable jet material M) fall downward. On the other hand, light-weight powder particles (dust) are attracted to the dust collector 30 via the duct 31. The dust sucked through the dust collector 30 is captured using a filter.

The supply device 40 is a device for supplying the shot material M to the shot peening device 10. The supply device 40 is provided below the classification mechanism 20. As shown in fig. 3, the supply device 40 includes a hopper 41, a valve body 42, a vibrator 43, and a conveying mechanism 44.

The hopper 41 is a container for storing the blasting material M. The hopper 41 has a shape in which the cross-sectional area decreases downward. The hopper 41 may have a circular or polygonal cross-sectional shape.

The valve body 42 is provided at a connection portion between the classifying mechanism 20 and the hopper 41, and has a function of communicating or closing a space of the classifying mechanism 20 and a space of the hopper 41. When the reusable shot material M is deposited in a predetermined amount on the lower portion of the classifying mechanism 20, the valve body 42 is opened, and the predetermined amount of the shot material M drops into the hopper 41. Thereafter, by closing the valve body 42, the space of the classifying mechanism 20 and the space of the hopper 41 are closed. The timing of opening and closing the valve body 42 may be controlled by the amount of the reusable injection material M deposited or may be controlled by time.

The valve body 42 is provided when there is a fear that the reusable blasting material M accumulated in the case where the classifying mechanism 20 communicates with the hopper 41 is lifted by the airflow toward the dust collector 30. Therefore, the valve body 42 can be omitted without such a fear.

The vibrator 43 is a device that vibrates the hopper 41. Examples of the vibrator 43 include an air vibrator, a piston vibrator, and a rotary vibrator. The vibrator 43 is attached to, for example, a side wall of the hopper 41. The vibrator 43 vibrates the hopper 41 to suppress unevenness (unevenness) or remaining of the blasting material M in the hopper 41, thereby smoothly supplying the blasting material M from the hopper 41 to the conveying mechanism 44. By providing the vibrator 43 near the lower end of the hopper 41, unevenness or remaining of the blasting material M in the hopper 41 is further suppressed, and the supply of the blasting material M is facilitated.

The conveyance mechanism 44 takes out a constant amount of the blasting material M from the hopper 41, and supplies the taken-out blasting material M to the nozzle 13 via the hose 16. The conveying mechanism 44 includes a groove 45, a conveying screw 46, a motor 47, and a restricting plate 48. The groove 45 has a cylindrical shape with both ends closed. One end 45a of the groove 45 is positioned below the hopper 41, and a supply port 45c is formed in the upper surface thereof. The supply port 45c is connected to the lower end of the hopper 41. A discharge port 45d is formed in the lower surface of the other end 45b of the groove 45.

The conveyance screw 46 is housed in the groove 45. The conveyance screw 46 includes a conveyance shaft 46a and a blade 46 b. The conveyance shaft 46a penetrates the side wall of the closed end 45a and is connected to the motor 47. The blades 46b are spirally fixed to the outer peripheral surface of the conveying shaft 46a such that two adjacent blades 46b are arranged at a predetermined interval. The motor 47 rotationally drives the conveyance screw 46.

The limiting plate 48 is a member for increasing the bulk density (filling rate) of the ejection material M in the groove 45. The restriction plate 48 has a shape partitioning the inner space of the groove 45. In the present embodiment, the limiting plate 48 is a circular plate-like member. The regulating plate 48 is provided at the front end of the conveying shaft 46a, and is fixed to the front end of the conveying shaft 46 a. The peripheral edge of the regulating plate 48 may be fixed to the inner wall of the groove 45. The regulating plate 48 is provided with a through hole through which the ejection material M can pass. The through hole penetrates the regulating plate 48 in the direction in which the conveying shaft 46a extends. The aperture ratio of the limiting plate 48 is set in accordance with the particle diameter of the blasting material M, the desired bulk density, and the like. The aperture ratio of the limiting plate 48 is a ratio of an area occupied by the through-holes among areas surrounded by the outer periphery of the limiting plate 48 when the limiting plate 48 is viewed from the direction in which the conveying shaft 46a extends.

A constant amount of the blasting material M stored in the hopper 41 is introduced into the tank 45 from the supply port 45c, and advances at a constant speed from the end 45a toward the end 45b by the rotation of the conveyance screw 46. When the ejection material M reaches the limiting plate 48, the limiting plate 48 compresses the ejection material M, thereby removing air between the ejection materials M and increasing the bulk density of the ejection material M. Thus, the bulk density of the injection material M reaches a predetermined density in the front of the regulating plate 48, and becomes a large block. The block is crushed when the through hole passes through, and the jet material M reaches the end 45 b. Since the conveyance shaft 46a is not disposed at the end portion 45b, the ejection material M passing through the restriction plate 48 is discharged from the discharge port 45d to the outside without adhering to the conveyance shaft 46 a. In this way, the supply device 40 supplies the shot material M to the shot-peening device 10 by a constant amount at a time.

The control device 50 is a controller for collectively controlling the shot peening system 1. The control device 50 is configured as a computer system including a processor such as a CPU (Central Processing Unit), a Memory such as a RAM (Random Access Memory) and a ROM (Read Only Memory), an input device such as a touch panel, a mouse and a keyboard, an output device such as a display, and a communication device such as a network card. The functions of the control device 50 are realized by operating the respective hardware under the control of a processor based on a computer program stored in a memory.

The control device 50 is connected to the rotation mechanism 14, the movement mechanism 15, the classification mechanism 20, the dust collector 30, and the supply device 40, for example, so as to be able to communicate with each other. The control device 50 sends control signals to the rotating mechanism 14, the moving mechanism 15, the classifying mechanism 20, the dust collector 30, and the supply device 40. The moving direction, moving speed, rotating direction and rotating angle of the table 12, the moving direction and moving speed of the nozzle 13, the operation and operation stop of the classifying mechanism 20, the operation and operation stop of the dust collector 30, and the operation and operation stop of the supplying device 40 are controlled by control signals sent from the control device 50.

Next, a series of processing of the shot peening method performed by the shot peening apparatus 10 will be described. Fig. 4 is a flowchart illustrating a shot peening method according to an embodiment. Fig. 5 is a flowchart showing the shot peening process of fig. 4 in detail. Fig. 6 is a diagram for explaining shot peening performed by the shot peening apparatus of fig. 2. In fig. 6, a virtual reference position Pref is shown on the workpiece W in order to clarify the direction (rotation angle) of the workpiece W on the XY plane.

As shown in fig. 4, first, a preparation step of the workpiece W is performed (step S1). In step S1, a mask pattern is formed on the surface of the workpiece W. Specifically, the work W is heated, and the mask material is attached to (the surface of) the heated work W by the laminator. Then, the work W to which the mask material is attached is placed in an exposure machine. In the exposure machine, a CCD (Charge Coupled Device) camera is used to align the position of the pattern original with the workpiece W, and exposure is performed. Then, the exposed workpiece W is disposed in the developing machine. In the developing machine, a developing solution is sprayed while rotating the work W, thereby forming a mask pattern.

Next, a preparatory process of shot peening is performed (step S2). In step S2, the operation patterns of the rotation mechanism 14 and the movement mechanism 15 are set in the control device 50. The motion pattern includes a moving trajectory and a moving speed of the nozzle 13, a rotation angle of the table 12, the number of scans, and the like. The setting information indicating the operation pattern is stored in the memory of the control device 50. The blasting material M is fed into the hopper 41 of the feeder 40. The ejection material M is charged in an amount corresponding to the ejection amount. Then, the compressed air is supplied to the nozzle 13 through the hose 17, and the injection pressure of the injection material M is adjusted to a predetermined pressure by operating the pressure valve. At this time, the spray material M may be supplied to the nozzle 13 through the hose 16, and the spray material M may be sprayed from the nozzle 13. After the injection pressure is adjusted, the supply of the compressed air is stopped.

Subsequently, a shot peening step is performed (step S3). Although each process of step S3 is performed under the control of the control device 50, the description of the control signals sent from the control device 50 to each unit may be omitted for the sake of simplicity. In step S3, as shown in fig. 5, first, the workpiece W is assembled (step S31). Specifically, a door (not shown) of the housing 11 is opened, and the workpiece W is placed on the placement surface 12a of the table 12 by the transfer robot. After the workpiece W is placed on the placement surface 12a, the door of the housing 11 is closed.

Next, the operations of the respective devices of the shot peening system 1 are started (step S32). For example, after the operation of the dust collector 30 is started, the compressed air is supplied to the nozzle 13 via the hose 17. Thereafter, the operation of the supply device 40 is started, and the spray material M is supplied to the nozzle 13 via the hose 16.

Next, the first scanning process is performed (step S33). As shown in fig. 6, the moving mechanism 15 moves the nozzle 13 relatively with respect to a direction D1 (first direction) of the workpiece W on the surface of the workpiece W in a state where the nozzle 13 ejects the ejection material M (first scanning process). The direction D1 is a direction set on the surface of the workpiece W and is a direction when the workpiece W is fixed. That is, when the workpiece W is rotated by the rotation angle θ, the direction D1 is also rotated by the rotation angle θ in the same direction. Specifically, in the first scanning process, the moving mechanism 15 moves the nozzle 13 relative to the table 12 so that the nozzle 13 ejects the ejection material M along the movement locus MP1 (first movement locus).

The moving locus MP1 has a zigzag shape, and includes a plurality of scanning lines SL1 (first scanning lines) and a plurality of transfer lines PL1 (first transfer lines). The scanning line SL1 is a line segment extending in the direction D1 on the surface of the workpiece W. The plurality of scanning lines SL1 have the same length and are arranged parallel to each other at equal intervals. A part of the plurality of scanning lines SL1 is disposed on the surface of the workpiece W. The transfer line PL1 is a line segment extending in a direction intersecting (orthogonal to) the direction D1. The plurality of conveying lines PL1 have the same length as each other. The plurality of transfer lines PL1 are connected to two adjacent scan lines SL1 among the plurality of scan lines SL1, respectively. The plurality of feed lines PL1 are provided at positions different from the surface of the workpiece W (outside the surface of the workpiece W) when viewed in the direction in which the rotation axis AX extends (Z-axis direction).

In the present embodiment, the moving mechanism 52 moves the nozzle 13 in the X-axis direction, and the moving mechanism 51 moves the table 12 in the Y-axis direction. Therefore, the rotation angle of the table 12 is adjusted so that the extending direction of the scanning line SL1 coincides with the X-axis direction and the extending direction of the transfer line PL1 coincides with the Y-axis direction. Then, the positions of the table 12 and the nozzle 13 are adjusted so that the nozzle 13 is positioned above one end of the movement locus MP 1. Then, the nozzle 13 is moved in the positive X-axis direction from one end of the movement locus MP1 by the moving mechanism 52, and the nozzle 13 ejects the ejection material M along the first scanning line SL 1. Then, the nozzle 13 reaches the end of the first scanning line SL1, and the moving mechanism 51 moves the table 12 one pitch in the positive Y-axis direction in response thereto. At this time, since the nozzle 13 continues to eject the ejected material M, the ejected material M is ejected along the first transfer line PL 1.

Then, the moving mechanism 52 moves the nozzle 13 in the X-axis negative direction corresponding to the movement of the table 12 by one pitch, whereby the nozzle 13 ejects the ejection material M along the second scanning line SL 1. The nozzle 13 reaches the end of the second scanning line SL1, and the moving mechanism 51 moves the table 12 one pitch in the positive Y-axis direction in response to this. By repeating the above operations, the nozzle 13 ejects the ejection material M from one end to the other end of the movement locus MP1 along the movement locus MP 1. When the nozzle 13 reaches the other end of the movement locus MP1, the moving mechanism 15 moves the nozzle 13 relative to the table 12 so that the nozzle 13 ejects the ejection material M along the movement locus MP1 from the other end toward the one end of the movement locus MP 1. Further, the nozzle 13 continues to eject the ejection material M during the movement along the movement locus MP 1.

Next, when the nozzle 13 reaches one end of the movement locus MP1, the rotation mechanism 14 rotates the table 12 relative to the nozzle 13 by a rotation angle θ (first rotation angle) about the rotation axis AX (step S34). That is, the rotation mechanism 14 rotates the table 12 relative to the nozzle 13 by a rotation angle θ about the rotation axis AX between the first scanning process and a second scanning process described later. Here, the rotation mechanism 14 rotates the table 12 by a rotation angle θ about the rotation axis AX. The rotation angle θ is set in a range of 22.5 degrees to 120 degrees, for example. The rotation angle θ is set to an angle smaller than 360 degrees out of a divisor of 360 degrees, for example. In the present embodiment, the rotation angle θ is 90 degrees.

Next, the second scanning process is performed (step S35). As shown in fig. 6, the moving mechanism 15 moves the nozzle 13 relatively to the direction D2 (second direction) of the workpiece W on the surface of the workpiece W in a state where the nozzle 13 ejects the ejection material M (second scanning process). The direction D2 is a direction set on the surface of the workpiece W and is a direction when the workpiece W is fixed. That is, when the workpiece W is rotated by the rotation angle θ, the direction D2 is also rotated by the rotation angle θ in the same direction. The direction D2 intersects the direction D1, and the angle between the direction D1 and the direction D2 is the rotation angle θ.

Specifically, in the second scanning process, the moving mechanism 15 moves the nozzle 13 relative to the table 12 so that the nozzle 13 ejects the ejection material M along the movement locus MP2 (second movement locus). The movement locus MP2 is obtained by rotating the movement locus MP1 by the rotation angle θ in the direction opposite to the rotation direction of the table 12 with respect to the workpiece W. Here, since the workpiece W rotates by the rotation angle θ, the movement locus MP2 is the same as the movement locus MP1 in the XY plane. That is, the extending direction of the scanning line SL2 coincides with the X-axis direction, and the extending direction of the transfer line PL2 coincides with the Y-axis direction.

The moving locus MP2 has the same shape as the moving locus MP1, and includes a plurality of scanning lines SL2 (second scanning lines) and a plurality of transfer lines PL2 (second transfer lines). The scanning line SL2 is a line segment extending in the direction D2 on the surface of the workpiece W. The plurality of scanning lines SL2 have the same length and are arranged parallel to each other at equal intervals. A part of the plurality of scanning lines SL2 is disposed on the surface of the workpiece W. The transfer line PL2 is a line segment extending in a direction intersecting (orthogonal to) the direction D2. The plurality of conveying lines PL2 have the same length as each other. The plurality of transfer lines PL2 are connected to two adjacent scan lines SL2 among the plurality of scan lines SL2, respectively. The plurality of feed lines PL2 are provided at positions different from the surface of the workpiece W (outside the surface of the workpiece W) when viewed in the direction in which the rotation axis AX extends (Z-axis direction).

As in the first scanning process, the nozzle 13 is moved in the positive X-axis direction from one end of the movement locus MP2 by the moving mechanism 52, and the nozzle 13 ejects the ejection material M along the first scanning line SL 2. Then, the nozzle 13 reaches the end of the first scanning line SL2, and the moving mechanism 51 moves the table 12 one pitch in the positive Y-axis direction in response thereto. At this time, since the nozzle 13 continues to eject the ejected material M, the ejected material M is ejected along the first transfer line PL 2. Then, the moving mechanism 52 moves the nozzle 13 in the X-axis negative direction corresponding to the movement of the table 12 by one pitch, whereby the nozzle 13 ejects the ejection material M along the second scanning line SL 2. The moving mechanism 51 moves the stage 12 by one pitch in the positive Y-axis direction corresponding to the nozzle 13 reaching the end of the second scanning line SL 2.

By repeating the above operations, the nozzle 13 ejects the ejection material M from one end to the other end of the movement locus MP2 along the movement locus MP 2. When the nozzle 13 reaches the other end of the movement locus MP2, the moving mechanism 15 moves the nozzle 13 relative to the table 12 so that the nozzle 13 ejects the ejection material M along the movement locus MP2 from the other end toward the one end of the movement locus MP 2. Further, the nozzle 13 continues to eject the ejection material M during the movement along the movement locus MP 2.

Next, when the nozzle 13 reaches one end of the movement locus MP2, the control device 50 determines whether or not the rotation is performed a predetermined number of times (step S36). The predetermined number of times is expressed by (360/theta). times.N-1 times using the number of revolutions N for rotating the workpiece W by 360 degrees. When the rotation angle θ is 90 degrees and the rotation speed N is 11, the predetermined number of times is 43 times. Since only one rotation is performed, the controller 50 determines that the rotation is not performed for a predetermined number of times (step S36; no), and the rotation mechanism 14 rotates the table 12 relative to the nozzle 13 by the rotation angle θ (second rotation angle) about the rotation axis AX (step S34). That is, the rotation mechanism 14 rotates the table 12 by the rotation angle θ relative to the nozzle 13 around the rotation axis AX between the second scanning process and a third scanning process described later. Here, the rotation mechanism 14 rotates the table 12 by a rotation angle θ about the rotation axis AX.

Next, the third scanning process is performed (step S35). As shown in fig. 6, the moving mechanism 15 moves the nozzle 13 relatively to the direction D3 (third direction) of the workpiece W on the surface of the workpiece W in a state where the nozzle 13 ejects the ejection material M (third scanning process). The direction D3 is a direction set on the surface of the workpiece W and is a direction when the workpiece W is fixed. That is, when the workpiece W is rotated by the rotation angle θ, the direction D3 is also rotated by the rotation angle θ in the same direction. The direction D3 intersects the direction D2, and the angle between the direction D2 and the direction D3 is the rotation angle θ. In the present embodiment, since the rotation angle θ is 90 degrees, the direction D3 is the same direction as the direction D1.

Specifically, in the third scanning process, the moving mechanism 15 moves the nozzle 13 relative to the table 12 so that the nozzle 13 ejects the ejection material M along the movement locus MP 3. The movement locus MP3 is obtained by rotating the movement locus MP2 by the rotation angle θ in the direction opposite to the rotation direction of the table 12 with respect to the workpiece W. Here, since the workpiece W rotates by the rotation angle θ, the movement locus MP3 is the same as the movement loci MP1, MP2, respectively, in the XY plane. That is, the extending direction of the scanning line SL3 coincides with the X-axis direction, and the extending direction of the transfer line PL3 coincides with the Y-axis direction.

The moving locus MP3 has the same shape as the moving locus MP2, and includes a plurality of scanning lines SL3 and a plurality of transfer lines PL 3. The scanning line SL3 is a line segment extending in the direction D3. The plurality of scanning lines SL3 have the same length and are arranged parallel to each other at equal intervals. A part of the plurality of scanning lines SL3 is disposed on the surface of the workpiece W. The transfer line PL3 is a line segment extending in a direction intersecting (orthogonal to) the direction D3. The plurality of conveying lines PL3 have the same length as each other. The plurality of transfer lines PL3 are connected to two adjacent scan lines SL3 among the plurality of scan lines SL3, respectively. The plurality of feed lines PL3 are provided at positions different from the surface of the workpiece W (outside the surface of the workpiece W) when viewed in the direction in which the rotation axis AX extends (Z-axis direction).

Similarly to the first and second scanning processes, the nozzle 13 is moved in the positive X-axis direction from one end of the movement locus MP3 by the moving mechanism 52, and the nozzle 13 ejects the ejection material M along the first scanning line SL 3. Then, the nozzle 13 reaches the end of the first scanning line SL3, and the moving mechanism 51 moves the table 12 one pitch in the positive Y-axis direction in response thereto. At this time, since the nozzle 13 continues to eject the ejected material M, the ejected material M is ejected along the first transfer line PL 3. Then, the moving mechanism 52 moves the nozzle 13 in the X-axis negative direction corresponding to the movement of the table 12 by one pitch, whereby the nozzle 13 ejects the ejection material M along the second scanning line SL 3. The moving mechanism 51 moves the stage 12 by one pitch in the positive Y-axis direction corresponding to the nozzle 13 reaching the end of the second scanning line SL 3.

By repeating the above operations, the nozzle 13 ejects the ejection material M from one end to the other end of the movement locus MP3 along the movement locus MP 3. When the nozzle 13 reaches the other end of the movement locus MP3, the moving mechanism 15 moves the nozzle 13 relative to the table 12 so that the nozzle 13 ejects the ejection material M along the movement locus MP3 from the other end toward the one end of the movement locus MP 3. Further, the nozzle 13 continues to eject the ejection material M during the movement along the movement locus MP 3.

Next, when the nozzle 13 reaches one end of the movement locus MP3, the control device 50 determines whether or not the rotation is performed a predetermined number of times (step S36). Since the rotation is performed only twice, the controller 50 determines that the rotation is not performed a predetermined number of times (step S36; no), and the rotation mechanism 14 rotates the table 12 relative to the nozzle 13 by the rotation angle θ about the rotation axis AX (step S34). That is, the rotation mechanism 14 rotates the table 12 by the rotation angle θ relative to the nozzle 13 around the rotation axis AX between the third scanning process and a fourth scanning process described later. Here, the rotation mechanism 14 rotates the table 12 by a rotation angle θ about the rotation axis AX.

Next, the fourth scanning process is performed (step S35). As shown in fig. 6, the moving mechanism 15 moves the nozzle 13 relatively with respect to the direction D4 of the workpiece W on the surface of the workpiece W in a state where the nozzle 13 ejects the ejection material M (fourth scanning process). The direction D4 is a direction set on the surface of the workpiece W and is a direction when the workpiece W is fixed. That is, when the workpiece W is rotated by the rotation angle θ, the direction D4 is also rotated by the rotation angle θ in the same direction. The direction D4 intersects the direction D3, and the angle between the direction D3 and the direction D4 is the rotation angle θ. In the present embodiment, since the rotation angle θ is 90 degrees, the direction D4 is the same direction as the direction D2.

Specifically, in the fourth scanning process, the moving mechanism 15 moves the nozzle 13 relative to the table 12 so that the nozzle 13 ejects the ejection material M along the movement locus MP 4. The movement locus MP4 is obtained by rotating the movement locus MP3 by the rotation angle θ in the direction opposite to the rotation direction of the table 12 with respect to the workpiece W. Here, since the workpiece W rotates by the rotation angle θ, the movement locus MP4 is the same as the movement loci MP1, MP2, MP3, respectively, in the XY plane. That is, the extending direction of the scanning line SL4 coincides with the X-axis direction, and the extending direction of the transfer line PL4 coincides with the Y-axis direction.

The moving locus MP4 has the same shape as the moving locus MP3, and includes a plurality of scanning lines SL4 and a plurality of transfer lines PL 4. The scanning line SL4 is a line segment extending in the direction D4. The plurality of scanning lines SL4 have the same length and are arranged parallel to each other at equal intervals. A part of the plurality of scanning lines SL4 is disposed on the surface of the workpiece W. The transfer line PL4 is a line segment extending in a direction intersecting (orthogonal to) the direction D4. The plurality of conveying lines PL4 have the same length as each other. The plurality of transfer lines PL4 are connected to two adjacent scan lines SL4 among the plurality of scan lines SL4, respectively. The plurality of feed lines PL4 are provided at positions different from the surface of the workpiece W (outside the surface of the workpiece W) when viewed in the direction in which the rotation axis AX extends (Z-axis direction).

As in the first to third scanning processes, the nozzle 13 is moved in the positive X-axis direction from one end of the movement locus MP4 by the moving mechanism 52, and the nozzle 13 ejects the ejection material M along the first scanning line SL 4. Then, the nozzle 13 reaches the end of the first scanning line SL4, and the moving mechanism 51 moves the table 12 one pitch in the positive Y-axis direction in response thereto. At this time, since the nozzle 13 continues to eject the ejected material M, the ejected material M is ejected along the first transfer line PL 4. Then, the moving mechanism 52 moves the nozzle 13 in the X-axis negative direction corresponding to the movement of the table 12 by one pitch, whereby the nozzle 13 ejects the ejection material M along the second scanning line SL 4. The moving mechanism 51 moves the stage 12 by one pitch in the positive Y-axis direction corresponding to the nozzle 13 reaching the end of the second scanning line SL 4.

By repeating the above operations, the nozzle 13 ejects the ejection material M from one end to the other end of the movement locus MP4 along the movement locus MP 4. When the nozzle 13 reaches the other end of the movement locus MP4, the moving mechanism 15 moves the nozzle 13 relative to the table 12 so that the nozzle 13 ejects the ejection material M along the movement locus MP4 from the other end toward the one end of the movement locus MP 4. Further, the nozzle 13 continues to eject the ejection material M during the movement along the movement locus MP 4.

Next, when the nozzle 13 reaches one end of the movement locus MP4, the control device 50 determines whether or not the rotation is performed a predetermined number of times (step S36). Since only three rotations are performed, the controller 50 determines that the predetermined number of rotations have not been performed (step S36; no), and the rotation mechanism 14 rotates the table 12 relative to the nozzle 13 by the rotation angle θ about the rotation axis AX (step S34). Here, the rotation mechanism 14 rotates the table 12 by a rotation angle θ about the rotation axis AX. Thus, the workpiece W is rotated by 360 degrees, and the first to fourth scanning processes are sequentially repeated.

Then, when the control device 50 determines that the predetermined number of rotations has been performed in step S36 (step S36; YES), each device of the shot peening system 1 is stopped (step S37). In step S37, for example, after the supply device 40 is stopped, the supply of compressed air is stopped.

Subsequently, the workpiece W is collected (step S38). Specifically, the door of the housing 11 is opened to remove dust adhering to the surface of the workpiece W by air blowing not shown. Then, the workpiece W is conveyed to the outside from the placement surface 12a of the table 12 by the conveying robot, and the workpiece W is collected. After the workpiece W is collected, another workpiece W may be placed on the placement surface 12a of the table 12 by the transfer robot, and after the workpiece W is placed on the placement surface 12a, the door of the housing 11 may be closed. At this time, step S32 to step S38 are performed again. The dust collector 30 may be stopped when the other work W is not processed.

As described above, the series of processing of the shot peening method performed by the shot peening apparatus 10 is completed.

Here, a relationship between the first scanning process and the second scanning process is described. Fig. 7 is a diagram for explaining a relationship between the first scanning process and the second scanning process. In the example shown in fig. 7, the rotation angle θ is 60 degrees. In fig. 7, for convenience of explanation, only the scan line SL1 and the scan line SL2 passing through the center of the surface of the workpiece W are illustrated.

As described above, in the first scanning process of the step S33, the ejection material M is ejected along the scan line SL1 extending in the direction D1 on the surface of the workpiece W. Next, in step S34, the table 12 is rotated about the rotation axis AX (see fig. 2) by a rotation angle θ (60 degrees). Next, in the second scanning process of the process S35, the ejection material M is ejected along the scanning line SL2 extending in the direction D2 on the surface of the workpiece W. As shown in fig. 7, the angle between the scan line SL1 and the scan line SL2 is the same as the rotation angle θ. That is, the angle between the direction D1 and the direction D2 is the same as the rotation angle θ. Similarly, in two consecutive scanning processes, the angle between the scanning line used in the preceding scanning process (the direction of the scanning line) and the scanning line used in the subsequent scanning process (the direction of the scanning line) is also the same as the rotation angle θ.

The effects of the shot peening apparatus 10 and the shot peening method described above will be described. When the spray nozzle 13 is moved relative to the surface of the workpiece W to spray the spray material M, the flow direction of the spray material or the compressed air may be changed by a change in the deflection of the

hoses

16 and 17, and the spray pressure may be changed. In addition, in the surface of the workpiece W, a region where the jetted material is jetted along one scan line partially overlaps with a region where the jetted material is jetted along the other scan line, whereby there is a possibility that processing spots (rib spots) are generated. In this way, there is a possibility that the depth of machining may vary depending on the scanning direction (the relative movement direction of the nozzle 13 with respect to the workpiece W).

In contrast, in the shot peening apparatus 10 and the shot peening method, the first scanning process is performed in which the nozzle 13 is moved relative to the workpiece W in the direction D1 on the surface of the workpiece W with the shot material M ejected from the nozzle 13, and thereafter the table 12 is rotated relative to the nozzle 13 by the rotation angle θ about the rotation axis AX. Then, a second scanning process is performed in which the nozzle 13 is relatively moved with respect to the direction D2 in which the workpiece W is on the surface of the workpiece W, with the nozzle 13 ejecting the ejection material M. Then, a third scanning process is performed in which the table 12 is rotated relative to the nozzle 13 by a rotation angle θ about the rotation axis AX, and the nozzle 13 is moved relative to the workpiece W in the direction D3 on the surface of the workpiece W while the nozzle 13 ejects the spray material M. Then, a fourth scanning process is performed in which the table 12 is rotated relative to the nozzle 13 by a rotation angle θ about the rotation axis AX, and the nozzle 13 is moved relative to the workpiece W in the direction D4 on the surface of the workpiece W while the nozzle 13 ejects the shot material M. Therefore, even if the machining spot occurs in the workpiece in the first scanning process, the machining spot can be dispersed by moving the nozzle in a direction different from that of the first scanning process in the second scanning process, the third scanning process, and the fourth scanning process. This makes the machining accuracy uniform, and therefore, the machining accuracy can be improved.

Since each scanning process is performed every time the table 12 is rotated at a constant rotation angle θ relative to the nozzle 13, the processing unevenness can be effectively dispersed. This makes the machining accuracy more uniform, and therefore the machining accuracy can be further improved.

The first scanning process, the second scanning process, the third scanning process, and the fourth scanning process can be performed only by relatively moving the nozzle 13 with respect to the table 12 along the movement trajectories MP1, MP2, MP3, and MP4, respectively.

The transfer lines PL1, PL2, PL3, PL4 are provided outside (at positions different from the surface of the workpiece W) the surface of the workpiece W, respectively, as viewed in the direction in which the rotation axis AX extends. That is, the transfer lines PL1, PL2, PL3, PL4 are not provided on the surface of the workpiece W. Therefore, in the first scanning process, the ejection material M is ejected on the surface of the workpiece W along the plurality of scanning lines SL1, in the second scanning process, the ejection material M is ejected on the surface of the workpiece W along the plurality of scanning lines SL2, in the third scanning process, the ejection material M is ejected on the surface of the workpiece W along the plurality of scanning lines SL3, and in the fourth scanning process, the ejection material M is ejected on the surface of the workpiece W along the plurality of scanning lines SL 4. Therefore, by appropriately setting the wiring interval of the scanning lines SL1, the wiring interval of the scanning lines SL2, the wiring interval of the scanning lines SL3, and the wiring interval of the scanning lines SL4, the ejection material M can be ejected on the entire surface of the workpiece W.

The nozzle 13 continues to eject the ejection material M during the movement along the movement trajectories MP1, MP2, MP3, MP 4. For example, when the ejection of the ejection material M is restarted after the ejection of the ejection material M is stopped, it may take time to stabilize the ejection pressure. In contrast, by continuing to eject the ejection material M, the time required to stabilize the ejection pressure can be omitted, and thus the machining time can be shortened.

The rotation mechanism 14 rotates the table 12 about the rotation axis AX. Therefore, the scanning direction can be changed by rotating only the table 12 without changing the behavior of the nozzle 13. Therefore, the machining accuracy can be improved without complicating the apparatus structure of the shot peening apparatus 10.

The moving mechanism 15 includes a moving mechanism 51 for moving the table 12 and a moving mechanism 52 for moving the nozzle 13. In the present embodiment, the shot peening can be performed by moving the table only in the Y-axis direction by the moving mechanism 51 and moving the nozzle 13 only in the X-axis direction by the moving mechanism 52. Therefore, since the moving

mechanisms

51 and 52 can be single-axis moving type moving mechanisms, the structure of the moving mechanism 15 can be simplified.

In the above embodiment, the workpiece W is made of a hard and brittle material. When the workpiece W is subjected to shot peening, the surface (machined surface) of the workpiece W is cut with small damage, and therefore the workpiece W is easily affected by the variation in the shot pressure.

The shot peening apparatus and shot peening method according to the present disclosure are not limited to the above embodiments.

The material for forming the work W is not limited to a hard and brittle material, and may be a metal material, a resin material, or the like.

The moving trajectories MP1, MP2, MP3, and MP4 may not include the transfer lines PL1, PL2, PL3, and PL4, respectively.

In the above embodiment, the nozzle 13 reciprocates along the movement trajectories MP1, MP2, MP3, and MP4 in the one-time scanning process, respectively, but may move in a single pass along the movement trajectories MP1, MP2, MP3, and MP4, respectively. The nozzle 13 may be moved three or more times along the movement trajectories MP1, MP2, MP3, and MP4 in one scanning process. When the nozzle 13 reciprocates along the movement trajectories MP1, MP2, MP3, and MP4, respectively, the positional relationship between the stage 12 and the nozzle 13 at the end of the scanning process and the positional relationship between the stage 12 and the nozzle 13 at the start of the scanning process can be made the same.

In the above embodiment, the rotation angle θ is 90 degrees, but may be other angles. The number of movement trajectories is changed corresponding to the rotation angle θ. In the above embodiment, the rotation mechanism 14 rotates the table 12 at the constant rotation angle θ every scanning process, but the table 12 may be rotated at a different rotation angle.

In the above embodiment, the ejection of the ejection material M is continued while the nozzle 13 is moved along the movement trajectories MP1, MP2, MP3, MP4, but the ejection of the ejection material M may be stopped while being moved along the transfer lines PL1, PL2, PL3, PL 4. The nozzle 13 may also stop the ejection of the ejection material M during movement along a portion of the scan lines SL1, SL2, SL3, SL4 that is not provided on the surface of the workpiece W.

In the above embodiment, the rotation mechanism 14 rotates the table 12 about the rotation axis AX, but the configuration of the rotation mechanism 14 is not limited to this. The rotation mechanism 14 may rotate the nozzle 13 around the rotation axis AX. At this time, the rotation mechanism 14 rotates the movement mechanism 15 together with the nozzle 13 by a rotation angle θ, for example.

In the above embodiment, the moving mechanism 15 includes the moving mechanism 51 for moving the table 12 in the Y-axis direction and the moving mechanism 52 for moving the nozzle 13 in the X-axis direction, but the configuration of the moving mechanism 15 is not limited to this.

The nozzle 13 may be fixed, and the moving mechanism 15 may move the table 12 in the X-axis direction and the Y-axis direction. The moving mechanism 15 is, for example, an XY table. At this time, since the nozzle 13 is fixed, the bending of the

hoses

16 and 17 does not change. Therefore, since the processing unevenness due to the change in the bending of the

hoses

16 and 17 is not generated, the processing accuracy can be further improved.

The moving mechanism 15 may move the nozzle 13 in the X-axis direction and the Y-axis direction without moving the table 12. The moving mechanism 15 is, for example, an XY table. In this case, since it is not necessary to provide a moving mechanism on the table 12, the apparatus structure of the shot-peening apparatus 10 can be simplified. Further, since it is not necessary to secure a space for moving the table 12, the shot peening device 10 can be prevented from being enlarged.

Claims

1. A shot-peening apparatus for machining a workpiece, comprising:

a table on which the workpiece is placed;

a nozzle that ejects a spray material toward a surface of the workpiece;

a moving mechanism that relatively moves the nozzle with respect to the stage on a plane along the surface of the workpiece; and

a rotation mechanism for rotating the table relative to the nozzle with a rotation axis intersecting the plane as an axis,

the moving mechanism performs a first scanning process and a second scanning process,

in the first scanning process, the nozzle is relatively moved with respect to the workpiece in a first direction on the surface of the workpiece in a state where the nozzle ejects the ejected material,

in the second scanning process, the nozzle is relatively moved in a second direction on the surface of the workpiece intersecting the first direction with respect to the workpiece in a state where the nozzle ejects the ejection material,

the rotation mechanism rotates the stage relative to the nozzle by a first rotation angle formed by the first direction and the second direction with the rotation axis as an axis between the first scanning process and the second scanning process.

2. The shot peening apparatus according to claim 1,

the moving mechanism relatively moves the nozzle with respect to the table in the first scanning process so that the nozzle ejects the ejected material along a first movement trajectory including a plurality of first scan lines extending in the first direction and a plurality of first transfer lines connecting two adjacent first scan lines among the plurality of first scan lines,

the moving mechanism relatively moves the nozzle with respect to the table in the second scanning process so that the nozzle ejects the ejection material along a second movement trajectory including a plurality of second scanning lines extending in the second direction and a plurality of second transfer lines connecting two second scanning lines adjacent to each other among the plurality of second scanning lines.

3. The shot peening apparatus according to claim 2,

the plurality of first transfer lines and the plurality of second transfer lines are respectively provided at positions different from the surface of the workpiece as viewed from a direction in which the rotation shaft extends.

4. The shot peening apparatus according to claim 2 or 3, wherein,

the nozzle continues to eject the ejection material during movement along the first movement trajectory and the second movement trajectory.

5. The shot peening apparatus according to any one of claims 1 to 4, wherein,

the moving mechanism further performs a third scanning process of relatively moving the nozzle with respect to the workpiece in a third direction on the surface of the workpiece intersecting the second direction in a state where the nozzle ejects the ejection material,

the rotation mechanism rotates the stage relative to the nozzle about the rotation axis by a second rotation angle formed by the second direction and the third direction between the second scanning process and the third scanning process,

the second angle of rotation is equal to the first angle of rotation.

6. The shot peening apparatus according to any one of claims 1 to 5, wherein,

the rotating mechanism enables the workbench to rotate by taking the rotating shaft as an axis.

7. The shot peening apparatus according to any one of claims 1 to 6, wherein,

the moving mechanism includes a first moving mechanism that moves the table and a second moving mechanism that moves the nozzle.

8. The shot peening apparatus according to any one of claims 1 to 6, wherein,

the nozzle is fixed in a fixed position and,

the moving mechanism moves the table.

9. The shot peening apparatus according to any one of claims 1 to 6, wherein,

the moving mechanism moves the nozzle.

10. A shot peening method for machining a workpiece, wherein,

the shot peening method includes the steps of:

performing a first scanning process in which a nozzle is relatively moved in a first direction on a surface of a workpiece with respect to the workpiece in a state in which the nozzle ejects an ejection material;

rotating the workpiece relative to the nozzle by a predetermined rotation angle with a rotation axis intersecting a plane along the surface of the workpiece as an axis after the first scanning process; and

performing a second scanning process in which the nozzle is relatively moved with respect to the workpiece in a second direction on the surface of the workpiece intersecting the first direction in a state in which the nozzle ejects the ejection material,

the rotation angle is an angle formed by the first direction and the second direction.