JP2021109290A - Blast processing device and blast processing method - Google Patents

Abstract

To provide a blast processing device and a blast processing method which can improve processing accuracy.SOLUTION: A blast processing device 10 comprises a table 12 on which a work-piece W is placed, a nozzle 13 that jets a jet-material M toward a surface of the work-piece W, a moving mechanism 15 and a rotating mechanism 14. The moving mechanism 15 performs first scanning processing for moving the nozzle 13 in a first direction on the surface relatively to the work-piece W, with the nozzle 13 jetting the jet-material M, and second scanning processing for moving the nozzle 13 in a second direction on the surface relatively to the work-piece W, with the nozzle 13 jetting the jet-material M. The rotating mechanism 14 rotates the table 12 relatively with respect to the nozzle 13 with a rotation axis AX as an axis center, at a first rotation angle formed by the first direction and the second direction, between the first scanning processing and the second scanning processing.SELECTED DRAWING: Figure 2

Description

The present disclosure relates to a blasting apparatus and a blasting method.

Conventionally, a blasting method is known in which the surface of a work is machined by injecting an injection material from a nozzle toward the work. In such blasting, the nozzle scans the surface of the work by moving the nozzle relative to the work. As a result, the injection material is injected along the moving locus (see Patent Document 1 and Patent Document 2).

Japanese Unexamined Patent Publication No. 2007-176701 International Publication No. 2013/145348

When the nozzle is moved, the degree of bending of the hose for supplying the injection material to the nozzle and the hose for supplying the compressed air to the nozzle may change, which may affect the processing accuracy. When the nozzle is fixed and the work is moved, the degree of bending of the hose does not change, but there is room for improvement in order to process the work surface uniformly.

In this technical field, improvement of processing accuracy is desired.

The blasting apparatus according to one aspect of the present disclosure is an apparatus for processing a workpiece. This blasting device includes a table on which the work is placed, a nozzle that injects an injection material toward the surface of the work, and a moving mechanism that moves the nozzle relative to the table on a plane along the surface. A rotation mechanism for rotating the table relative to the nozzle with a rotation axis intersecting the plane as the axis is provided. The moving mechanism includes a first scanning process in which the nozzle moves the nozzle relative to the work in the first direction on the surface while the nozzle is injecting the injection material, and a state in which the nozzle injects the injection material. Then, the second scanning process of moving the nozzle relative to the work in the second direction on the surface intersecting the first direction is performed. In the rotation mechanism, between the first scanning process and the second scanning process, the table is set relative to the nozzle by the first rotation angle formed by the first direction and the second direction with the rotation axis as the axis. Rotate.

In this blasting apparatus, while the nozzle is injecting the injection material, a first scanning process is performed in which the nozzle is moved relative to the work in the first direction on the surface of the work, and then the first scanning process is performed. The table is rotated relative to the nozzle by the first rotation angle formed by the direction and the second direction with the rotation axis as the axis. Then, while the nozzle is injecting the injection material, a second scanning process is performed in which the nozzle is moved relative to the work in the second direction on the surface of the work. Even if processing spots occur on the work in the first scanning processing, the processing spots can be dispersed because the nozzles are moved in a direction different from that in the first scanning processing in the second scanning processing. As a result, the processing accuracy is made uniform, so that the processing accuracy can be improved.

In the first scanning process, the moving mechanism is a plurality of first feed lines connecting a plurality of first scanning lines extending in the first direction and two adjacent first scanning lines among the plurality of first scanning lines. The nozzle may be moved relative to the table so that the nozzle ejects the injection material along the first movement locus including, and in the second scanning process, a plurality of second extending in the second direction. The nozzle injects the injection material along the second movement locus including the two scanning lines and the plurality of second feeding lines connecting the two adjacent second scanning lines among the plurality of second scanning lines. As such, the nozzle may be moved relative to the table. In this case, the first scanning process can be performed only by moving the nozzle relative to the table along the first movement locus. Similarly, the second scanning process can be performed only by moving the nozzle relative to the table along the second movement locus.

Each of the plurality of first feed lines and the plurality of second feed lines may be provided at a position different from the surface of the work when viewed from the direction in which the rotation axis extends. In this case, in the first scanning process, the propellant is ejected onto the surface of the work along the plurality of first scanning lines, and in the second scanning process, the propellant is sprayed onto the surface of the work along the plurality of second scanning lines. Be jetted. Therefore, by appropriately setting the wiring intervals of the plurality of first scanning lines and the wiring intervals of the plurality of second scanning lines, it is possible to inject the injection material over the entire surface of the work.

The nozzle may continue to inject the injection material while moving along the first movement locus and the second movement locus. For example, when the injection of the injection material is stopped and then the injection of the injection material is restarted, it may take time to stabilize the injection pressure. On the other hand, by continuing to inject the injection material, the time required for stabilizing the injection pressure can be omitted, so that the processing time can be shortened.

The moving mechanism may further perform a third scanning process of moving the nozzle relative to the work in a third direction on the surface intersecting the second direction while the nozzle is injecting the propellant. .. In the rotation mechanism, between the second scanning process and the third scanning process, the table is set relative to the nozzle by the second rotation angle formed by the second direction and the third direction with the rotation axis as the axis. You may rotate it. The second rotation angle may be equal to the first rotation angle. In this case, each scanning process is performed each time the table is rotated by a constant rotation angle relative to the nozzle, so that the processing spots can be effectively dispersed. As a result, the machining accuracy is further made uniform, so that the machining accuracy can be further improved.

The rotation mechanism may rotate the table about the rotation axis. In this case, the scanning direction can be changed simply by rotating the table without changing the behavior of the nozzle. Therefore, it is possible to improve the processing accuracy without complicating the device configuration.

The moving mechanism may include a first moving mechanism for moving the table and a second moving mechanism for moving the nozzle. For example, the first moving mechanism moves the table only in the uniaxial direction, and the second moving mechanism moves the nozzle only in the uniaxial direction, whereby the above-mentioned blasting process can be performed. Therefore, it is possible to simplify the configuration of the moving mechanism.

The nozzle may be fixed. The moving mechanism may move the table. In this case, since the nozzle is fixed, the degree of bending of the hose for supplying the propellant or compressed air to the nozzle does not change. Therefore, since processing unevenness due to a change in the degree of bending of the hose does not occur, it is possible to further improve the processing accuracy.

The moving mechanism may move the nozzle. In this case, since it is not necessary to provide a moving mechanism on the table, it is possible to simplify the device configuration.

A blasting method according to another aspect of the present disclosure is a method of processing a workpiece. This blasting method is a first scanning process in which the nozzle is relatively moved in the first direction on the surface of the work with respect to the work placed on the table while the nozzle is injecting the injection material. After the first scanning process, the table is rotated relative to the nozzle by a predetermined rotation angle with the rotation axis intersecting the plane along the surface as the axis, and the nozzle injects the injection material. In this state, the work is provided with a second scanning process in which the nozzle is relatively moved in the second direction on the surface intersecting the first direction. The rotation angle is an angle formed by the first direction and the second direction.

In this blasting method, a first scanning process is performed in which the nozzle is relatively moved in the first direction on the surface of the work with respect to the work placed on the table while the nozzle is injecting the injection material. After that, the table is rotated relative to the nozzle by the rotation angle formed by the first direction and the second direction with the rotation axis as the axis. Then, while the nozzle is injecting the injection material, a second scanning process is performed in which the nozzle is relatively moved in the second direction on the surface of the work with respect to the work. Even if processing spots occur on the work in the first scanning processing, the processing spots can be dispersed because the nozzles are moved in a direction different from that in the first scanning processing in the second scanning processing. As a result, the processing accuracy is made uniform, so that the processing accuracy can be improved.

According to each aspect and each embodiment of the present disclosure, it is possible to provide a blasting apparatus and a blasting method capable of improving machining accuracy.

FIG. 1 is a diagram schematically showing a blasting system including a blasting apparatus according to an embodiment. FIG. 2 is a perspective view showing the configuration of the blasting apparatus of FIG. FIG. 3 is a cross-sectional view showing the configuration of the supply device of FIG. FIG. 4 is a flowchart showing a blasting method according to an embodiment. FIG. 5 is a flowchart showing the blasting process of FIG. 4 in detail. FIG. 6 is a diagram for explaining the blasting performed by the blasting apparatus of FIG. FIG. 7 is a diagram for explaining the relationship between the first scanning process and the second scanning process.

Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In the description of the drawings, the same elements are designated by the same reference numerals, and duplicate description is omitted.

FIG. 1 is a diagram schematically showing a blasting system including a blasting apparatus according to an embodiment. FIG. 2 is a perspective view showing the configuration of the blasting apparatus of FIG. FIG. 3 is a cross-sectional view showing the configuration of the supply device of FIG. The blasting system 1 shown in FIG. 1 includes a blasting device 10, a classification mechanism 20, a dust collector 30, a supply device 40, and a control device 50.

The blasting apparatus 10 is an apparatus for processing the work W by injecting the injection material M supplied from the supply device 40 toward the work W. The injection method of the blasting apparatus 10 is, for example, a suction type. Examples of the propellant M include alumina particles, silicon carbide particles, and glass beads. The work W is made of, for example, a hard and brittle material. Examples of hard and brittle materials include aluminum nitride, alumina, glass, lithium tantalate, silicon, and sapphire. Examples of processing include cutting processing, grooving processing, drilling processing, embossing pattern processing, and roughening processing. As the work W, a printed circuit board, a sapphire substrate of an LED (Light Emitting Diode), a glass substrate or a silicon substrate used for C-MOS (Complementary Metal-Oxide Semiconductor) or the like may be used.

The blasting apparatus 10 includes a housing 11, a table 12, and a nozzle 13. The housing 11 defines a blasting chamber R inside. The lower portion of the housing 11 defines a tapered recovery space V whose width becomes narrower toward the bottom. The table 12 is a table on which the work W is placed. The table 12 is provided in the blasting chamber R. The table 12 has a mounting surface 12a. The work W is placed and fixed on the mounting surface 12a. The mounting surface 12a may be a suction surface for sucking and fixing the work W.

The nozzle 13 injects the injection material M toward the surface (processed surface) of the work W. The nozzle 13 is provided in the blasting chamber R and is arranged above the table 12. An injection port 13a is provided at the tip of the nozzle 13. The nozzle 13 is provided in the blasting chamber R so that the injection port 13a faces the mounting surface 12a of the table 12. The nozzle 13 injects the injection material M together with the compressed air. The nozzle 13 is, for example, a suction type nozzle. The nozzle 13 may be a direct pressure type nozzle. One end of the hose 16 and one end of the hose 17 are connected to the nozzle 13. The nozzle 13 injects the injection material M supplied from the hose 16 together with the compressed air supplied from the hose 17 as a solid air two-phase flow.

As shown in FIG. 2, the blasting apparatus 10 further includes a rotating mechanism 14 and a moving mechanism 15. The rotation mechanism 14 is a mechanism for rotating the table 12 relative to the nozzle 13 on the XY plane with the rotation axis AX as the axis. Here, "rotating the table 12 relative to the nozzle 13 with the rotation axis AX as the axis" means that the nozzle 13 is fixed and only the table 12 is rotated with the rotation axis AX as the axis. This includes fixing the 12 and rotating only the nozzle 13 with the rotation axis AX as the axis, and rotating both the table 12 and the nozzle 13 with the rotation axis AX as the axis. The rotation axis AX extends in the Z-axis direction and intersects (orthogonally) the XY plane. The XY plane is a plane along the surface of the work W. In the present embodiment, the rotation mechanism 14 rotates the table 12 with the rotation axis AX as the axis. The rotation mechanism 14 is provided on the back surface of the table 12 opposite to the mounting surface 12a. The rotation mechanism 14 has a connection mechanism (shaft) that connects the table 12 to the rotation mechanism 14, and a motor that rotationally drives the connection mechanism. The rotation mechanism 14 rotates the table 12 on the XY plane by driving the motor.

The moving mechanism 15 is a mechanism for moving the nozzle 13 relative to the table 12 on the XY plane. Here, "moving the nozzle 13 relative to the table 12" means that the table 12 is fixed and only the nozzle 13 is moved, the nozzle 13 is fixed and only the table 12 is moved, and the like. , Includes moving both the table 12 and the nozzle 13. In the present embodiment, the moving mechanism 15 includes a moving mechanism 51 (first moving mechanism) for moving the table 12 and a moving mechanism 52 (second moving mechanism) for moving the nozzle 13.

The moving mechanism 51 is provided in the blasting chamber R and is arranged below the table 12. The moving mechanism 51 has a rail 51a extending in the Y-axis direction. The moving mechanism 51 further includes a connecting mechanism that movably connects the table 12 to the rail 51a together with the rotating mechanism 14, and a motor that drives the connecting mechanism. The moving mechanism 51 moves the table 12 in the Y-axis direction by driving a motor. The moving speed of the table 12 by the moving mechanism 51 is appropriately set according to the size, shape, and material of the work W, the pattern formed on the work W, and the like.

The moving mechanism 52 is provided in the blasting chamber R and is arranged above the nozzle 13. The moving mechanism 52 has a rail 52a extending in the X-axis direction. The moving mechanism 52 further includes a connecting mechanism that movably connects the nozzle 13 to the rail 52a, and a motor that drives the connecting mechanism. The moving mechanism 52 moves the nozzle 13 in the X-axis direction by driving the motor. The moving speed of the nozzle 13 by the moving mechanism 52 is appropriately set according to the size, shape, and material of the work W, the pattern formed on the work W, and the like.

The work W is machined in the blasting apparatus 10 having the above-described configuration. The details of the blasting process will be described later. The injection material M injected from the nozzle 13 toward the work W is collected in the collection space V of the housing 11. An opening 11a for supplying the recovered injection material M to the classification mechanism 20 is formed at the bottom of the housing 11. One end of the recovery pipe 21 is connected to the opening 11a. The other end of the recovery pipe 21 is connected to the classification mechanism 20.

The classification mechanism 20 sucks the powder or granular material containing the propellant M injected from the nozzle 13 onto the work W, and the reusable propellant M and other powder or granular material dust (work generated by blasting). It is a mechanism that separates W cutting powder and injection material M, etc., which has become a non-reusable size). The classification mechanism 20 is, for example, a cyclone type classifier. One end of the conduit 31 is connected to the classification mechanism 20. The other end of the conduit 31 is connected to the dust collector 30.

The dust collector 30 is a device that collects fragments of the injection material M and cutting powder of the work W. The dust collector 30 sucks the conduit 31 and generates an air flow from the opening 11a of the housing 11 through the collection pipe 21, the classification mechanism 20, and the conduit 31 toward the dust collector 30. By this air flow, the powder or granular material containing the used propellant M collected in the collection space V of the housing 11 is conveyed to the classification mechanism 20. Due to the operation of the dust collector 30, a swirling airflow is generated inside the classification mechanism 20, and the heavy powder or granular material (reusable propellant M) falls downward. On the other hand, the light-mass powder or granular material (dust) is sucked into the dust collector 30 via the conduit 31. The dust sucked by the dust collector 30 is captured by using a filter.

The supply device 40 is a device for supplying the injection material M to the blasting device 10. The supply device 40 is provided below the classification mechanism 20. As shown in FIG. 3, the supply device 40 includes a hopper 41, a valve body 42, a vibrator 43, and a transfer mechanism 44.

The hopper 41 is a container for storing the injection material M. The hopper 41 has a shape in which the area of the cross section decreases as it goes downward. The cross-sectional shape of the hopper 41 may be circular or polygonal.

The valve body 42 is provided at the connecting portion between the classification mechanism 20 and the hopper 41, and has a function of communicating or closing the space of the classification mechanism 20 and the space of the hopper 41. When a predetermined amount of the reusable injection material M is deposited on the lower part of the classification mechanism 20, the valve body 42 is opened, so that the predetermined amount of the injection material M falls on the hopper 41. After that, when the valve body 42 is closed, the space of the classification mechanism 20 and the space of the hopper 41 are closed. The timing of opening and closing the valve body 42 may be controlled by the amount of the reusable propellant M deposited, or may be controlled by the time.

The valve body 42 is a mechanism provided when the classification mechanism 20 and the hopper 41 are in communication with each other and the accumulated reusable injection material M may fly up on the airflow toward the dust collector 30. Therefore, if there is no such possibility, the valve body 42 may be omitted.

The vibrator 43 is a device that vibrates the hopper 41. Examples of the vibrator 43 include an air vibrator, a piston type vibrator, and a rotary type vibrator. The vibrator 43 is attached to the side wall of the hopper 41, for example. The vibrator 43 vibrates the hopper 41 to suppress uneven distribution (blitching) or residue of the injection material M in the hopper 41, whereby the injection material M is smoothly supplied from the hopper 41 to the transport mechanism 44. By providing the vibrator 43 near the lower end of the hopper 41, uneven distribution or residue of the injection material M in the hopper 41 is further suppressed, and the supply of the injection material M is facilitated.

The transport mechanism 44 takes out a certain amount of the injection material M from the hopper 41, and supplies the taken-out injection material M to the nozzle 13 via the hose 16. The transport mechanism 44 includes a trough 45, a transport screw 46, a motor 47, and a regulation plate 48. The trough 45 has a cylindrical shape with both ends closed. One end 45a of the trough 45 is located below the hopper 41, and a supply port 45c is formed on the upper surface thereof. The supply port 45c is connected to the lower end of the hopper 41. A discharge port 45d is formed on the lower surface of the other end 45b of the trough 45.

The transport screw 46 is housed in a trough 45. The transport screw 46 includes a transport shaft 46a and blades 46b. The transport shaft 46a penetrates the side wall that closes the end portion 45a and is connected to the motor 47. The blades 46b are spirally fixed to the outer peripheral surface of the transport shaft 46a so that two blades 46b adjacent to each other are lined up at predetermined intervals. The motor 47 rotationally drives the transport screw 46.

The regulation plate 48 is a member for increasing the bulk density (filling rate) of the injection material M in the trough 45. The regulation plate 48 has a shape that partitions the internal space of the trough 45. In the present embodiment, the regulation plate 48 is a circular plate-shaped member. The regulation plate 48 is provided at the tip of the transport shaft 46a and is fixed to the tip of the transport shaft 46a. The peripheral edge of the regulating plate 48 may be fixed to the inner wall of the trough 45. The regulation plate 48 is provided with a through hole through which the injection material M can pass. The through hole penetrates the regulation plate 48 in the direction in which the transport shaft 46a extends. The aperture ratio of the regulation plate 48 is set according to the particle size of the injection material M, the desired bulk density, and the like. The aperture ratio of the regulation plate 48 is the ratio of the area occupied by the through hole to the area surrounded by the outer circumference of the regulation plate 48 when the regulation plate 48 is viewed from the direction in which the transport shaft 46a extends.

A certain amount of the injection material M stored in the hopper 41 is introduced into the trough 45 from the supply port 45c, and the rotation of the transport screw 46 causes a constant speed from the end 45a to the end 45b. Move forward with. Then, when the injection material M reaches the regulation plate 48, the injection material M is compressed by the regulation plate 48, so that the air between the injection materials M is removed and the bulk density of the injection material M is increased. As a result, the bulk density of the injection material M reaches a predetermined density in front of the regulation plate 48, and becomes a large lump. When this mass passes through the through hole, it is crushed and the injection material M reaches the end portion 45b. Since the transport shaft 46a is not arranged at the end portion 45b, the injection material M that has passed through the regulation plate 48 is discharged to the outside from the discharge port 45d without adhering to the transport shaft 46a. In this way, the supply device 40 supplies the injection material M to the blasting device 10 in a fixed amount at a time.

The control device 50 is a controller for controlling the blasting system 1 in an integrated manner. The control device 50 includes, for example, a processor such as a CPU (Central Processing Unit), a memory such as a RAM (Random Access Memory) and a ROM (Read Only Memory), an input device such as a touch panel, a mouse and a keyboard, a display and the like. It is configured as a computer system including an output device and a communication device such as a network card. The function of the control device 50 is realized by operating each hardware under the control of the processor based on the computer program stored in the memory.

The control device 50 is communicably connected to, for example, a rotation mechanism 14, a movement mechanism 15, a classification mechanism 20, a dust collector 30, and a supply device 40. The control device 50 sends a control signal to the rotation mechanism 14, the movement mechanism 15, the classification mechanism 20, the dust collector 30, and the supply device 40. The movement direction, movement speed, rotation direction, and rotation angle of the table 12, the movement direction and movement speed of the nozzle 13, the operation and stop of the classification mechanism 20, the operation of the dust collector 30, and the operation of the dust collector 30 are performed by the control signal transmitted from the control device 50. The operation stop, and the operation and stop of the supply device 40 are controlled.

Next, a series of processes of the blast processing method carried out by the blast processing apparatus 10 will be described. FIG. 4 is a flowchart showing a blasting method according to an embodiment. FIG. 5 is a flowchart showing the blasting process of FIG. 4 in detail. FIG. 6 is a diagram for explaining the blasting performed by the blasting apparatus of FIG. In FIG. 6, a virtual reference position Pref is shown on the work W in order to clarify the direction (rotation angle) of the work W on the XY plane.

As shown in FIG. 4, first, the work W preparation step (step S1) is performed. In step S1, a mask pattern is formed on the surface of the work W. Specifically, the work W is heated, and a mask material is attached to (the surface of) the heated work W by a laminating machine. Then, the work W to which the mask material is attached is placed in the exposure machine. In the exposure machine, the position of the pattern original plate is adjusted to the work W by using a CCD (Charge Coupled Device) camera, and the exposure is performed. After that, the exposed work W is placed in the developing machine. In the developing machine, a mask pattern is formed by spraying a developing solution while rotating the work W.

Subsequently, a preparatory step for blasting (step S2) is performed. In step S2, the operation patterns of the rotation mechanism 14 and the movement mechanism 15 are set in the control device 50. The operation pattern includes the movement locus and movement speed of the nozzle 13, the rotation angle of the table 12, the number of scans, and the like. The setting information indicating the operation pattern is stored in the memory of the control device 50. Then, the injection material M is charged into the hopper 41 of the supply device 40. An amount of injection material M corresponding to the injection amount is charged. Then, compressed air is supplied to the nozzle 13 via the hose 17, and the injection pressure of the injection material M is adjusted to a predetermined pressure by operating the pressure valve. At this time, the injection material M may be supplied to the nozzle 13 via the hose 16, and the injection material M may be injected from the nozzle 13. After adjusting the injection pressure, the supply of compressed air is stopped.

Subsequently, the blasting step (step S3) is performed. Each process of step S3 is carried out under the control of the control device 50, but for the sake of simplicity, the description of the control signal transmitted from the control device 50 to each element will be omitted. In step S3, as shown in FIG. 5, the work W is first set (step S31). Specifically, the door (not shown) of the housing 11 is opened, and the work W is placed on the mounting surface 12a of the table 12 by the transfer robot. After the work W is placed on the mounting surface 12a, the door of the housing 11 is closed.

Subsequently, the operation of each device of the blasting system 1 is started (step S32). For example, after the operation of the dust collector 30 is started, compressed air is supplied to the nozzle 13 via the hose 17. After that, the operation of the supply device 40 is started, and the injection material M is supplied to the nozzle 13 via the hose 16.

Subsequently, the first scanning process is performed (step S33). As shown in FIG. 6, the moving mechanism 15 makes the nozzle 13 relative to the work W in the direction D1 (first direction) on the surface of the work W in a state where the nozzle 13 is injecting the injection material M. (1st scanning process). The direction D1 is a direction set on the surface of the work W, and is a direction when the work W is fixed. That is, when the work W rotates by the rotation angle θ, the direction D1 also rotates in the same direction by the rotation angle θ. Specifically, the moving mechanism 15 makes the nozzle 13 relative to the table 12 so that the nozzle 13 injects the injection material M along the moving locus MP1 (first moving locus) in the first scanning process. Move.

The movement locus MP1 has a zigzag shape and includes a plurality of scanning lines SL1 (first scanning line) and a plurality of feeding lines PL1 (first feeding line). The scanning line SL1 is a line segment extending in the direction D1 on the surface of the work W. The plurality of scanning lines SL1 have the same length as each other and are arranged in parallel with each other at equal intervals. A part of the plurality of scanning lines SL1 is provided on the surface of the work W. The feed line PL1 is a line segment extending in a direction intersecting (orthogonal) with the direction D1. The plurality of feed lines PL1 have the same length as each other. Each of the plurality of feed lines PL1 connects two scanning lines SL1 adjacent to each other among the plurality of scanning lines SL1. Each of the plurality of feed lines PL1 is provided at a position different from the surface of the work W (outside the surface of the work W) when viewed from the direction in which the rotation axis AX extends (Z-axis direction).

In the present embodiment, the moving mechanism 52 moves the nozzle 13 in the X-axis direction, and the moving mechanism 51 moves the table 12 in the Y-axis direction. Therefore, the rotation angle of the table 12 is adjusted so that the extending direction of the scanning line SL1 coincides with the X-axis direction and the extending direction of the feed line PL1 coincides with the Y-axis direction. Then, the positions of the table 12 and the nozzle 13 are adjusted so that the nozzle 13 is located above one end of the movement locus MP1. Then, the moving mechanism 52 moves the nozzle 13 from one end of the moving locus MP1 in the positive direction of the X-axis, so that the nozzle 13 injects the injection material M along the first scanning line SL1. Then, in response to the nozzle 13 reaching the end of the first scanning line SL1, the moving mechanism 51 moves the table 12 in the positive direction of the Y axis by one pitch. At this time, since the nozzle 13 continues to inject the injection material M, the injection material M is injected along the first feed line PL1.

Then, in response to the table 12 moving by one pitch, the moving mechanism 52 moves the nozzle 13 in the negative direction of the X-axis, so that the nozzle 13 injects the injection material M along the second scanning line SL1. .. When the nozzle 13 reaches the end of the second scanning line SL1, the moving mechanism 51 moves the table 12 in the positive direction of the Y axis by one pitch. By repeating the above operation, the nozzle 13 injects the injection material M along the movement locus MP1 from one end to the other end of the movement locus MP1. Then, when the nozzle 13 reaches the other end of the movement locus MP1, the movement mechanism 15 injects the injection material M along the movement locus MP1 from the other end of the movement locus MP1 toward one end. The nozzle 13 is moved relative to the table 12. The nozzle 13 continues to inject the injection material M while moving along the movement locus MP1.

Subsequently, when the nozzle 13 reaches one end of the movement locus MP1, the rotation mechanism 14 rotates the table 12 relative to the nozzle 13 by the rotation angle θ (first rotation angle) with the rotation axis AX as the axis. (Step S34). That is, the rotation mechanism 14 rotates the table 12 relative to the nozzle 13 with the rotation axis AX as the axis between the first scanning process and the second scanning process described later by the rotation angle θ. Here, the rotation mechanism 14 rotates the table 12 with the rotation axis AX as the axis by the rotation angle θ. The rotation angle θ is set, for example, in the range of 22.5 degrees or more and 120 degrees or less. The rotation angle θ is set to, for example, a divisor of 360 degrees and smaller than 360 degrees. In this embodiment, the rotation angle θ is 90 degrees.

Subsequently, the second scanning process is performed (step S35). As shown in FIG. 6, the moving mechanism 15 makes the nozzle 13 relative to the work W in the direction D2 (second direction) on the surface of the work W in a state where the nozzle 13 is injecting the injection material M. (Second scanning process). The direction D2 is a direction set on the surface of the work W, and is a direction when the work W is fixed. That is, when the work W rotates by the rotation angle θ, the direction D2 also rotates in the same direction by the rotation angle θ. The direction D2 intersects the direction D1, and the angle formed by the direction D1 and the direction D2 is the rotation angle θ.

Specifically, the moving mechanism 15 makes the nozzle 13 relative to the table 12 so that the nozzle 13 injects the injection material M along the moving locus MP2 (second moving locus) in the second scanning process. Move it. When the work W is used as a reference, the movement locus MP2 is obtained by rotating the movement locus MP1 in the direction opposite to the rotation direction of the table 12 by a rotation angle θ. Here, since the work W rotates by the rotation angle θ, the movement locus MP2 is the same as the movement locus MP1 in the XY plane. That is, the extending direction of the scanning line SL2 coincides with the X-axis direction, and the extending direction of the feed line PL2 coincides with the Y-axis direction.

The movement locus MP2 has the same shape as the movement locus MP1, and includes a plurality of scanning lines SL2 (second scanning line) and a plurality of feed lines PL2 (second feed line). The scanning line SL2 is a line segment extending in the direction D2 on the surface of the work W. The plurality of scanning lines SL2 have the same length as each other and are arranged in parallel with each other at equal intervals. A part of the plurality of scanning lines SL2 is provided on the surface of the work W. The feed line PL2 is a line segment extending in a direction intersecting (orthogonal) with the direction D2. The plurality of feed lines PL2 have the same length as each other. Each of the plurality of feed lines PL2 connects two scanning lines SL2 adjacent to each other among the plurality of scanning lines SL2. Each of the plurality of feed lines PL2 is provided at a position different from the surface of the work W (outside the surface of the work W) when viewed from the direction in which the rotation axis AX extends (Z-axis direction).

Similar to the first scanning process, the moving mechanism 52 moves the nozzle 13 from one end of the moving locus MP2 in the positive direction of the X-axis, so that the nozzle 13 injects the injection material M along the first scanning line SL2. .. Then, in response to the nozzle 13 reaching the end of the first scanning line SL2, the moving mechanism 51 moves the table 12 in the positive direction of the Y axis by one pitch. At this time, since the nozzle 13 continues to inject the injection material M, the injection material M is injected along the first feed line PL2. Then, in response to the table 12 moving by one pitch, the moving mechanism 52 moves the nozzle 13 in the negative direction of the X-axis, so that the nozzle 13 injects the injection material M along the second scanning line SL2. .. When the nozzle 13 reaches the end of the second scanning line SL2, the moving mechanism 51 moves the table 12 in the positive direction of the Y axis by one pitch.

By repeating the above operation, the nozzle 13 injects the injection material M along the movement locus MP2 from one end to the other end of the movement locus MP2. Then, when the nozzle 13 reaches the other end of the movement locus MP2, the movement mechanism 15 injects the injection material M along the movement locus MP2 from the other end of the movement locus MP2 toward one end. The nozzle 13 is moved relative to the table 12. The nozzle 13 continues to inject the injection material M while moving along the movement locus MP2.

Subsequently, when the nozzle 13 reaches one end of the movement locus MP2, the control device 50 determines whether or not the rotation has been performed a predetermined number of times (step S36). The predetermined number of times is represented by (360 / θ) × N-1 times using the number of rotations N that rotates the work W 360 degrees. The predetermined number of times is 43 times when the rotation angle θ is 90 degrees and the rotation speed N is 11. Here, since only one rotation is performed, the control device 50 determines that the rotation has not been performed a predetermined number of times (step S36; NO), and the rotation mechanism 14 further rotates the rotation angle θ (second). The table 12 is rotated relative to the nozzle 13 by the rotation angle) with the rotation axis AX as the axis (step S34). That is, the rotation mechanism 14 rotates the table 12 relative to the nozzle 13 with the rotation axis AX as the axis between the second scanning process and the third scanning process described later by the rotation angle θ. Here, the rotation mechanism 14 rotates the table 12 with the rotation axis AX as the axis by the rotation angle θ.

Subsequently, the third scanning process is performed (step S35). As shown in FIG. 6, the moving mechanism 15 makes the nozzle 13 relative to the work W in the direction D3 (third direction) on the surface of the work W in a state where the nozzle 13 is injecting the injection material M. (Third scanning process). The direction D3 is a direction set on the surface of the work W, and is a direction when the work W is fixed. That is, when the work W rotates by the rotation angle θ, the direction D3 also rotates in the same direction by the rotation angle θ. The direction D3 intersects the direction D2, and the angle formed by the direction D2 and the direction D3 is the rotation angle θ. In the present embodiment, since the rotation angle θ is 90 degrees, the direction D3 is the same as the direction D1.

Specifically, the moving mechanism 15 moves the nozzle 13 relative to the table 12 so that the nozzle 13 injects the injection material M along the movement locus MP3 in the third scanning process. When the work W is used as a reference, the movement locus MP3 is obtained by rotating the movement locus MP2 in the direction opposite to the rotation direction of the table 12 by a rotation angle θ. Here, since the work W rotates by the rotation angle θ, the movement locus MP3 is the same as each of the movement loci MP1 and MP2 in the XY plane. That is, the extending direction of the scanning line SL3 coincides with the X-axis direction, and the extending direction of the feed line PL3 coincides with the Y-axis direction.

The movement locus MP3 has the same shape as the movement locus MP2, and includes a plurality of scanning lines SL3 and a plurality of feed lines PL3. The scanning line SL3 is a line segment extending in the direction D3. The plurality of scanning lines SL3 have the same length as each other and are arranged in parallel with each other at equal intervals. A part of the plurality of scanning lines SL3 is provided on the surface of the work W. The feed line PL3 is a line segment extending in a direction intersecting (orthogonal) with the direction D3. The plurality of feed lines PL3 have the same length as each other. Each of the plurality of feed lines PL3 connects two scanning lines SL3 adjacent to each other among the plurality of scanning lines SL3. Each of the plurality of feed lines PL3 is provided at a position different from the surface of the work W (outside the surface of the work W) when viewed from the direction in which the rotation axis AX extends (Z-axis direction).

Similar to the first and second scanning processes, the moving mechanism 52 moves the nozzle 13 from one end of the moving locus MP3 in the positive direction of the X axis, so that the nozzle 13 moves the injection material M along the first scanning line SL3. Inject. Then, in response to the nozzle 13 reaching the end of the first scanning line SL3, the moving mechanism 51 moves the table 12 in the positive direction of the Y axis by one pitch. At this time, since the nozzle 13 continues to inject the injection material M, the injection material M is injected along the first feed line PL3. Then, in response to the table 12 moving by one pitch, the moving mechanism 52 moves the nozzle 13 in the negative direction of the X-axis, so that the nozzle 13 injects the injection material M along the second scanning line SL3. .. When the nozzle 13 reaches the end of the second scanning line SL3, the moving mechanism 51 moves the table 12 in the positive direction of the Y axis by one pitch.

By repeating the above operation, the nozzle 13 injects the injection material M along the movement locus MP3 from one end to the other end of the movement locus MP3. Then, when the nozzle 13 reaches the other end of the movement locus MP3, the movement mechanism 15 injects the injection material M along the movement locus MP3 from the other end of the movement locus MP3 toward one end. The nozzle 13 is moved relative to the table 12. The nozzle 13 continues to inject the injection material M while moving along the movement locus MP3.

Subsequently, when the nozzle 13 reaches one end of the movement locus MP3, the control device 50 determines whether or not the rotation has been performed a predetermined number of times (step S36). Here, since only two rotations have been performed, the control device 50 determines that the rotations have not been performed a predetermined number of times (step S36; NO), and the rotation mechanism 14 further rotates the table 12 by the rotation angle θ. Is rotated relative to the nozzle 13 with the rotation axis AX as the axis (step S34). That is, the rotation mechanism 14 rotates the table 12 relative to the nozzle 13 with the rotation axis AX as the axis between the third scanning process and the fourth scanning process described later by the rotation angle θ. Here, the rotation mechanism 14 rotates the table 12 with the rotation axis AX as the axis by the rotation angle θ.

Subsequently, the fourth scanning process is performed (step S35). As shown in FIG. 6, the moving mechanism 15 moves the nozzle 13 relative to the work W in the direction D4 on the surface of the work W while the nozzle 13 is injecting the injection material M (as shown in FIG. 6). Fourth scanning process). The direction D4 is a direction set on the surface of the work W, and is a direction when the work W is fixed. That is, when the work W rotates by the rotation angle θ, the direction D4 also rotates in the same direction by the rotation angle θ. The direction D4 intersects the direction D3, and the angle formed by the direction D3 and the direction D4 is the rotation angle θ. In the present embodiment, since the rotation angle θ is 90 degrees, the direction D4 is the same as the direction D2.

Specifically, the moving mechanism 15 moves the nozzle 13 relative to the table 12 so that the nozzle 13 injects the injection material M along the moving locus MP4 in the fourth scanning process. When the work W is used as a reference, the movement locus MP4 is obtained by rotating the movement locus MP3 in the direction opposite to the rotation direction of the table 12 by a rotation angle θ. Here, since the work W rotates by the rotation angle θ, the movement locus MP4 is the same as each of the movement loci MP1, MP2, and MP3 in the XY plane. That is, the extending direction of the scanning line SL4 coincides with the X-axis direction, and the extending direction of the feed line PL4 coincides with the Y-axis direction.

The movement locus MP4 has the same shape as the movement locus MP3, and includes a plurality of scanning lines SL4 and a plurality of feed lines PL4. The scanning line SL4 is a line segment extending in the direction D4. The plurality of scanning lines SL4 have the same length as each other and are arranged in parallel with each other at equal intervals. A part of the plurality of scanning lines SL4 is provided on the surface of the work W. The feed line PL4 is a line segment extending in a direction intersecting (orthogonal) with the direction D4. The plurality of feed lines PL4 have the same length as each other. Each of the plurality of feed lines PL4 connects two scanning lines SL4 adjacent to each other among the plurality of scanning lines SL4. Each of the plurality of feed lines PL4 is provided at a position different from the surface of the work W (outside the surface of the work W) when viewed from the direction in which the rotation axis AX extends (Z-axis direction).

Similar to the 1st to 3rd scanning processes, the moving mechanism 52 moves the nozzle 13 from one end of the moving locus MP4 in the positive direction of the X axis, so that the nozzle 13 moves the injection material M along the first scanning line SL4. Inject. Then, in response to the nozzle 13 reaching the end of the first scanning line SL4, the moving mechanism 51 moves the table 12 in the positive direction of the Y axis by one pitch. At this time, since the nozzle 13 continues to inject the injection material M, the injection material M is injected along the first feed line PL4. Then, in response to the table 12 moving by one pitch, the moving mechanism 52 moves the nozzle 13 in the negative direction of the X-axis, so that the nozzle 13 injects the injection material M along the second scanning line SL4. .. When the nozzle 13 reaches the end of the second scanning line SL4, the moving mechanism 51 moves the table 12 in the positive direction of the Y axis by one pitch.

By repeating the above operation, the nozzle 13 injects the injection material M along the movement locus MP4 from one end to the other end of the movement locus MP4. Then, when the nozzle 13 reaches the other end of the movement locus MP4, the movement mechanism 15 injects the injection material M along the movement locus MP4 from the other end of the movement locus MP4 toward one end. The nozzle 13 is moved relative to the table 12. The nozzle 13 continues to inject the injection material M while moving along the movement locus MP4.

Subsequently, when the nozzle 13 reaches one end of the movement locus MP4, the control device 50 determines whether or not the rotation has been performed a predetermined number of times (step S36). Here, since only three rotations have been performed, the control device 50 determines that the rotations have not been performed a predetermined number of times (step S36; NO), and the rotation mechanism 14 further rotates the table 12 by the rotation angle θ. Is rotated relative to the nozzle 13 with the rotation axis AX as the axis (step S34). Here, the rotation mechanism 14 rotates the table 12 with the rotation axis AX as the axis by the rotation angle θ. As a result, the work W is rotated 360 degrees, so that the above-mentioned first scanning process to fourth scanning process are repeated in order.

Then, in step S36, when the control device 50 determines that the rotation has been performed a predetermined number of times (step S36; YES), each device of the blasting system 1 is stopped (step S37). In step S37, for example, after the supply device 40 is stopped, the supply of compressed air is stopped.

Subsequently, the work W is collected (step S38). Specifically, the door of the housing 11 is opened, and dust adhering to the surface of the work W is removed by an air blow (not shown). Then, the work W is conveyed to the outside from the mounting surface 12a of the table 12 by the transfer robot, and the work W is collected. After the work W is collected, another work W is placed on the mounting surface 12a of the table 12 by the transfer robot, and after the work W is placed on the mounting surface 12a, the door of the housing 11 is placed. May be closed. In this case, steps S32 to S38 are carried out again. When another work W is not processed, the dust collector 30 may be stopped.

As described above, a series of processing of the blasting method carried out by the blasting apparatus 10 is completed.

Here, the relationship between the first scanning process and the second scanning process will be described. FIG. 7 is a diagram for explaining the relationship between the first scanning process and the second scanning process. In the example shown in FIG. 7, the rotation angle θ is 60 degrees. In FIG. 7, for convenience of explanation, only the scanning line SL1 and the scanning line SL2 passing through the center of the surface of the work W are shown.

As described above, in the first scanning process of step S33, the injection material M is injected along the scanning line SL1 extending in the direction D1 on the surface of the work W. Subsequently, in step S34, the table 12 is rotated by the rotation angle θ (60 degrees) with the rotation axis AX (see FIG. 2) as the axis. Subsequently, in the second scanning process of step S35, the injection material M is injected along the scanning line SL2 extending in the direction D2 on the surface of the work W. As shown in FIG. 7, the angle formed by the scanning line SL1 and the scanning line SL2 is the same as the rotation angle θ. That is, the angle formed by the direction D1 and the direction D2 is the same as the rotation angle θ. Similarly, the angle formed by the scanning line (direction of the scanning line) used in the preceding scanning process and the scanning line (direction of the scanning line) used in the subsequent scanning process in the two consecutive scanning processes is also the rotation angle θ. Is the same as.

The operation and effect of the blasting apparatus 10 and the blasting method described above will be described. When the injection material M is injected while moving the nozzle 13 with respect to the surface of the work W, the flow of the injection material or the compressed air changes due to the change in the degree of bending of the hoses 16 and 17, and the injection pressure may change. Further, on the surface of the work W, the region where the injection material is injected along one scanning line and the region where the injection material is injected along another scanning line partially overlap, so that the processing unevenness is formed. (Muscle spots) may occur. As described above, the processing depth may vary due to the scanning direction (the direction of movement of the nozzle 13 relative to the work W).

On the other hand, in the blasting apparatus 10 and the blasting method, the nozzle 13 is moved relative to the work W in the direction D1 on the surface of the work W while the nozzle 13 is injecting the injection material M. The first scanning process is performed, and then the table 12 is rotated relative to the nozzle 13 by the rotation angle θ with the rotation axis AX as the axis. Then, while the nozzle 13 is injecting the injection material M, a second scanning process is performed in which the nozzle 13 is moved relative to the work W in the direction D2 on the surface of the work W. Further, the table 12 is rotated relative to the nozzle 13 by the rotation angle θ with the rotation axis AX as the axis, and the nozzle 13 is injected with respect to the work W while the nozzle 13 is injecting the injection material M. A third scanning process is performed to move the work W relative to the direction D3 on the surface. Further, the table 12 is rotated relative to the nozzle 13 by the rotation angle θ with the rotation axis AX as the axis, and the nozzle 13 is injected with respect to the work W while the nozzle 13 is injecting the injection material M. A fourth scanning process is performed to move the work W relative to the direction D4 on the surface. Therefore, even if processing unevenness occurs on the work in the first scanning process, the nozzles are moved in a direction different from that in the first scanning process in the second scanning process, the third scanning process, and the fourth scanning process. Processing spots can be dispersed. As a result, the processing accuracy is made uniform, so that the processing accuracy can be improved.

Since each scanning process is performed each time the table 12 is rotated by a rotation angle θ that is relatively constant with respect to the nozzle 13, the processing spots can be effectively dispersed. As a result, the machining accuracy is further made uniform, so that the machining accuracy can be further improved.

Only the nozzle 13 moves relative to the table 12 along the movement loci MP1, MP2, MP3, MP4, and the first scanning process, the second scanning process, the third scanning process, and the fourth scanning process are performed, respectively. It can be carried out.

Each of the feed lines PL1, PL2, PL3, and PL4 is provided on the outside of the surface of the work W (position different from the surface of the work W) when viewed from the direction in which the rotation axis AX extends. That is, the feed lines PL1, PL2, PL3, PL4 are not provided on the surface of the work W. Therefore, in the first scanning process, the injection material M is injected onto the surface of the work W along the plurality of scanning lines SL1, and in the second scanning process, the injection material is injected onto the surface of the work W along the plurality of scanning lines SL2. M is injected, and in the third scanning process, the injection material M is injected onto the surface of the work W along the plurality of scanning lines SL3, and in the fourth scanning process, the injection material M is injected onto the surface of the work W along the plurality of scanning lines SL4. The injection material M is injected. Therefore, by appropriately setting the wiring interval of the scanning line SL1, the wiring interval of the scanning line SL2, the wiring interval of the scanning line SL3, and the wiring interval of the scanning line SL4, the injection material M is injected onto the entire surface of the work W. be able to.

The nozzle 13 continues to inject the injection material M while moving along the movement loci MP1, MP2, MP3, MP4. For example, when the injection of the injection material M is stopped and then the injection of the injection material M is restarted, it may take time to stabilize the injection pressure. On the other hand, by continuing to inject the injection material M, the time required for stabilizing the injection pressure can be omitted, so that the processing time can be shortened.

The rotation mechanism 14 rotates the table 12 with the rotation axis AX as the axis. Therefore, the scanning direction can be changed only by rotating the table 12 without changing the behavior of the nozzle 13. Therefore, it is possible to improve the machining accuracy without complicating the apparatus configuration of the blasting apparatus 10.

The moving mechanism 15 includes a moving mechanism 51 for moving the table 12 and a moving mechanism 52 for moving the nozzle 13. In the present embodiment, the moving mechanism 51 moves the table only in the Y-axis direction, and the moving mechanism 52 moves the nozzle 13 only in the X-axis direction, whereby the above-mentioned blasting process can be performed. Therefore, since a uniaxial moving type moving mechanism can be used as the moving mechanisms 51 and 52, the configuration of the moving mechanism 15 can be simplified.

In the above embodiment, the work W is made of a hard and brittle material. When such a work W is blasted, the surface (processed surface) of the work W is slightly broken to scrape the surface of the work W, so that the work W is easily affected by fluctuations in injection pressure.

The blasting apparatus and blasting method according to the present disclosure are not limited to the above embodiments.

The material for forming the work W is not limited to a hard and brittle material, but may be a metal material, a resin material, or the like.

The movement loci MP1, MP2, MP3, and MP4 do not have to include the feed lines PL1, PL2, PL3, and PL4, respectively.

In the above embodiment, the nozzle 13 reciprocates along the movement loci MP1, MP2, MP3, and MP4 in one scanning process, but the nozzle 13 reciprocates along each of the movement loci MP1, MP2, MP3, and MP4. You may move one way. The nozzle 13 may move each of the movement loci MP1, MP2, MP3, and MP4 three times or more in one scanning process. When the nozzle 13 reciprocates along the movement loci MP1, MP2, MP3, and MP4, the positional relationship between the table 12 and the nozzle 13 at the end of the scanning process is changed to the table 12 and the nozzle 13 at the start of the scanning process. Can be the same as the positional relationship of.

In the above embodiment, the rotation angle θ is 90 degrees, but it may be another angle. The number of movement loci is changed according to the rotation angle θ. In the above embodiment, the rotation mechanism 14 rotates the table 12 at a constant rotation angle θ for each scanning process, but the table 12 may be rotated at a different rotation angle.

In the above embodiment, the nozzle 13 continues to inject the injection material M while moving along the movement loci MP1, MP2, MP3, MP4, but along the feed lines PL1, PL2, PL3, PL4. The injection of the injection material M may be stopped while moving. The nozzle 13 may stop the injection of the injection material M while moving along the portion of the scanning lines SL1, SL2, SL3, SL4 that is not provided on the surface of the work W.

In the above embodiment, the rotation mechanism 14 rotates the table 12 with the rotation axis AX as the axis, but the configuration of the rotation mechanism 14 is not limited to this. The rotation mechanism 14 may rotate the nozzle 13 with the rotation axis AX as the axis. In this case, the rotation mechanism 14 rotates the movement mechanism 15 together with the nozzle 13 at a rotation angle θ, for example.

In the above embodiment, the moving mechanism 15 includes a moving mechanism 51 that moves the table 12 in the Y-axis direction and a moving mechanism 52 that moves the nozzle 13 in the X-axis direction. Not limited to this.

The nozzle 13 may be fixed, and the moving mechanism 15 may move the table 12 in the X-axis direction and the Y-axis direction. The moving mechanism 15 is, for example, an XY stage. In this case, since the nozzle 13 is fixed, the degree of bending of the hoses 16 and 17 does not change. Therefore, since the processing unevenness due to the change in the bending degree of the hoses 16 and 17 does not occur, the processing accuracy can be further improved.

The moving mechanism 15 may move the nozzle 13 in the X-axis direction and the Y-axis direction without moving the table 12. The moving mechanism 15 is, for example, an XY stage. In this case, since it is not necessary to provide the moving mechanism on the table 12, it is possible to simplify the apparatus configuration of the blasting apparatus 10. Further, since it is not necessary to secure a space for the table 12 to move, it is possible to prevent the blasting apparatus 10 from becoming large.

1 ... Blasting system, 10 ... Blasting device, 12 ... Table, 13 ... Nozzle, 14 ... Rotating mechanism, 15 ... Moving mechanism, 51 ... Moving mechanism (first moving mechanism), 52 ... Moving mechanism (second moving mechanism) ), AX ... rotation axis, D1 ... direction (first direction), D2 ... direction (second direction), D3 ... direction (third direction), D4 ... direction, M ... injection material, MP1 ... movement locus (first direction) (Movement locus), MP2 ... Movement locus (second movement locus), MP3 ... Movement locus, MP4 ... Movement locus, PL1 ... Feed line (first feed line), PL2 ... Feed line (second feed line), PL3 ... Feed Line, PL4 ... Feed line, SL1 ... Scan line (first scan line), SL2 ... Scan line (second scan line), SL3 ... Scan line, SL4 ... Scan line, W ... Work.

Claims (10)

A blasting device that processes workpieces
A table on which the work is placed and
A nozzle that injects the injection material toward the surface of the work, and
A moving mechanism that moves the nozzle relative to the table on a plane along the surface.
A rotation mechanism that rotates the table relative to the nozzle about a rotation axis that intersects the plane.
With
The moving mechanism
A first scanning process in which the nozzle moves the nozzle relative to the work in the first direction on the surface while the nozzle is injecting the injection material.
With the nozzle injecting the injection material, a second scanning process of moving the nozzle relative to the work in a second direction on the surface intersecting the first direction is performed. ,
The rotation mechanism rotates the table with respect to the nozzle by a first rotation angle formed by the first direction and the second direction between the first scanning process and the second scanning process. A blasting device that rotates relative to the axis. The moving mechanism
In the first scanning process, a plurality of first scanning lines extending in the first direction and a plurality of first feed lines connecting two adjacent first scanning lines among the plurality of first scanning lines. The nozzle is moved relative to the table so that the nozzle injects the injection material along the first movement locus including.
In the second scanning process, a plurality of second scanning lines extending in the second direction and a plurality of second feed lines connecting two adjacent second scanning lines among the plurality of second scanning lines are used. The blasting apparatus according to claim 1, wherein the nozzle is moved relative to the table so that the nozzle injects the injection material along a second movement locus including. The blasting apparatus according to claim 2, wherein each of the plurality of first feed lines and the plurality of second feed lines is provided at a position different from the surface when viewed from the direction in which the rotation axis extends. The blasting apparatus according to claim 2, wherein the nozzle continues to inject the injection material while moving along the first movement locus and the second movement locus. The moving mechanism is a third scan that moves the nozzle relative to the work in a third direction on the surface intersecting the second direction while the nozzle is injecting the injection material. Do more processing,
The rotation mechanism rotates the table with respect to the nozzle by a second rotation angle formed by the second direction and the third direction between the second scanning process and the third scanning process. Rotate relative to the axis as the axis,
The blasting apparatus according to any one of claims 1 to 4, wherein the second rotation angle is equal to the first rotation angle. The blasting apparatus according to any one of claims 1 to 5, wherein the rotation mechanism rotates the table around the rotation axis. The blasting apparatus according to any one of claims 1 to 6, wherein the moving mechanism includes a first moving mechanism for moving the table and a second moving mechanism for moving the nozzle. The nozzle is fixed and
The blasting apparatus according to any one of claims 1 to 6, wherein the moving mechanism moves the table. The blasting apparatus according to any one of claims 1 to 6, wherein the moving mechanism moves the nozzle. It is a blasting method for processing workpieces.
While the nozzle is injecting the injection material, the first scanning process of moving the nozzle relative to the work placed on the table in the first direction on the surface of the work is performed. ,
After the first scanning process, the table is rotated relative to the nozzle by a predetermined rotation angle about a rotation axis intersecting a plane along the surface.
In a state where the nozzle is injecting the injection material, a second scanning process of moving the nozzle relative to the work in a second direction on the surface intersecting the first direction is performed. ,
With
The blasting method, wherein the rotation angle is an angle formed by the first direction and the second direction.

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