CN112602158B - 导电性糊剂 - Google Patents

导电性糊剂 Download PDF

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Publication number
CN112602158B
CN112602158B CN201980055269.0A CN201980055269A CN112602158B CN 112602158 B CN112602158 B CN 112602158B CN 201980055269 A CN201980055269 A CN 201980055269A CN 112602158 B CN112602158 B CN 112602158B
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CN
China
Prior art keywords
metal powder
conductive paste
sulfur
glass composition
mass
Prior art date
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Active
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CN201980055269.0A
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English (en)
Chinese (zh)
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CN112602158A (zh
Inventor
江崎聪一郎
立野隼人
西冈信夫
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Shoei Chemical Inc
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Shoei Chemical Inc
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Publication of CN112602158A publication Critical patent/CN112602158A/zh
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Coils Or Transformers For Communication (AREA)
CN201980055269.0A 2018-08-23 2019-08-20 导电性糊剂 Active CN112602158B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018156627 2018-08-23
JP2018-156627 2018-08-23
PCT/JP2019/032446 WO2020040138A1 (ja) 2018-08-23 2019-08-20 導電性ペースト

Publications (2)

Publication Number Publication Date
CN112602158A CN112602158A (zh) 2021-04-02
CN112602158B true CN112602158B (zh) 2023-11-28

Family

ID=69593293

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980055269.0A Active CN112602158B (zh) 2018-08-23 2019-08-20 导电性糊剂

Country Status (6)

Country Link
JP (1) JP6950833B2 (ko)
KR (1) KR102441705B1 (ko)
CN (1) CN112602158B (ko)
MY (1) MY193375A (ko)
TW (1) TWI772671B (ko)
WO (1) WO2020040138A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102545056B1 (ko) * 2021-07-13 2023-06-21 (주)창성 가지형 분말을 적용한 구리페이스트 조성물 및 이를 이용한 세라믹제품
JP7434407B2 (ja) 2022-04-25 2024-02-20 株式会社ノリタケカンパニーリミテド 外部電極用ペースト

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4873022A (en) * 1987-01-09 1989-10-10 Hitachi, Ltd. Electrically conductive paste, electronic circuit component and method for producing same
JPH05242725A (ja) * 1992-02-27 1993-09-21 Taiyo Yuden Co Ltd 導電性ペースト
CN1200967A (zh) * 1997-06-02 1998-12-09 昭荣化学工业株式会社 金属粉末及其制备方法
JP2004179182A (ja) * 2002-11-22 2004-06-24 Kyocera Corp セラミック積層体及びその製法
CN101264523A (zh) * 2007-03-12 2008-09-17 昭荣化学工业株式会社 镍粉及其制法、导体糊及使用该糊的多层陶瓷电子元件
JP2011018898A (ja) * 2009-06-08 2011-01-27 Daiken Chemical Co Ltd チタン酸バリウム粉末、ニッケルペースト、製法及び積層セラミックコンデンサ
CN103515459A (zh) * 2012-06-26 2014-01-15 株式会社则武 太阳能电池电极用糊组合物
CN103797584A (zh) * 2011-07-29 2014-05-14 株式会社则武 太阳能电池用导电性糊组合物
CN105702322A (zh) * 2014-12-11 2016-06-22 株式会社村田制作所 导电性糊剂和陶瓷电子部件
CN106024095A (zh) * 2016-05-25 2016-10-12 苏州晶银新材料股份有限公司 一种太阳能电池无氧玻璃导电浆料
CN108137388A (zh) * 2015-10-01 2018-06-08 昭荣化学工业株式会社 导电性糊及叠层陶瓷部件的端电极形成方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4291857B2 (ja) * 2007-01-24 2009-07-08 三ツ星ベルト株式会社 銅導体ペースト、導体回路板及び電子部品
JP2013072091A (ja) * 2011-09-26 2013-04-22 Hitachi Cable Ltd 金属微粒子およびその製造方法、金属微粒子を含む金属ペースト、並びに金属ペーストから形成される金属被膜
JP5958749B2 (ja) 2012-06-22 2016-08-02 株式会社村田製作所 金属粉末の製造方法
JP6324253B2 (ja) 2014-07-30 2018-05-16 Jx金属株式会社 導電性ペースト及びその製造方法

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4873022A (en) * 1987-01-09 1989-10-10 Hitachi, Ltd. Electrically conductive paste, electronic circuit component and method for producing same
JPH05242725A (ja) * 1992-02-27 1993-09-21 Taiyo Yuden Co Ltd 導電性ペースト
CN1200967A (zh) * 1997-06-02 1998-12-09 昭荣化学工业株式会社 金属粉末及其制备方法
JP2004179182A (ja) * 2002-11-22 2004-06-24 Kyocera Corp セラミック積層体及びその製法
CN101264523A (zh) * 2007-03-12 2008-09-17 昭荣化学工业株式会社 镍粉及其制法、导体糊及使用该糊的多层陶瓷电子元件
JP2011018898A (ja) * 2009-06-08 2011-01-27 Daiken Chemical Co Ltd チタン酸バリウム粉末、ニッケルペースト、製法及び積層セラミックコンデンサ
CN103797584A (zh) * 2011-07-29 2014-05-14 株式会社则武 太阳能电池用导电性糊组合物
CN103515459A (zh) * 2012-06-26 2014-01-15 株式会社则武 太阳能电池电极用糊组合物
CN105702322A (zh) * 2014-12-11 2016-06-22 株式会社村田制作所 导电性糊剂和陶瓷电子部件
CN108137388A (zh) * 2015-10-01 2018-06-08 昭荣化学工业株式会社 导电性糊及叠层陶瓷部件的端电极形成方法
CN106024095A (zh) * 2016-05-25 2016-10-12 苏州晶银新材料股份有限公司 一种太阳能电池无氧玻璃导电浆料

Also Published As

Publication number Publication date
KR102441705B1 (ko) 2022-09-07
KR20210048503A (ko) 2021-05-03
TW202020895A (zh) 2020-06-01
MY193375A (en) 2022-10-07
TWI772671B (zh) 2022-08-01
JPWO2020040138A1 (ja) 2021-06-03
WO2020040138A1 (ja) 2020-02-27
JP6950833B2 (ja) 2021-10-13
CN112602158A (zh) 2021-04-02

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