CN112309939A - 盒盖打开装置 - Google Patents
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Abstract
一种用于配置为与晶片盒配合的洁净室设备的盒盖打开装置。该盒盖打开装置包括:壁结构,其具有分隔壁,分隔壁具有用于通过其传送晶片的壁开口;盒对接端口;以及设置到该壁结构的盖操纵器。盒对接端口布置在壁结构的第一侧,用于对接晶片盒。盖操纵器可相对于壁开口移动并配置成接合对接在盒对接端口中的晶片盒的盒盖。盒盖打开装置还包括鼓风机,该鼓风机具有细长的狭缝状的喷嘴,该喷嘴大致横跨壁开口的高度或宽度,并且配置成将净化气体的帘状射流吹入晶片盒的盒内部。
Description
技术领域
本发明总体上涉及一种用于洁净室设备的盒盖打开装置。
背景技术
晶片盒用于洁净室环境中,以将晶片往返于诸如立式批处理炉的洁净室设备进行传送。这种晶片盒的一示例是前开式晶体盒或FOUP,其用于传送300mm晶片。可以将晶片盒放置成抵靠盖打开装置,该盖打开装置可以布置在洁净室设备的壁中的开口处。壁中的开口可以通过门可关闭。壁可以例如分隔第一环境(例如,盒操纵空间)和第二环境(例如,晶片操纵空间)。盖打开装置可以被配置为打开晶片盒的盖和门,同时还防止颗粒/污染物进入晶片盒和/或第二环境。由于晶片盒不是气密的,它们可能会充满洁净室环境中存在的洁净室空气。当洁净室设备的第二环境使用诸如氮气(N2)的净化气体例如以减少第二环境内的O2/H2O含量时,优选晶片盒中的洁净室空气在门打开之前至少部分地被移除。
发明内容
提供本概述是为了以简化形式介绍一些概念。在下面的本公开的示例实施例的详细描述中进一步详细描述了这些概念。本概述既不旨在标识所要求保护的主题的关键特征或必要特征,也不旨在用于限制所要求保护的主题的范围。
一目的是在要花费最少的净化气体的情况下相对快速地获得晶片盒内净化气体的期望浓度水平。
为此,可以提供盒盖打开装置。更具体地,可以提供一种在洁净室设备中使用的盒盖打开装置,该洁净室设备配置成与晶片盒配合。晶片盒可以包括限定用于容纳晶片的盒内部并且可以具有盒开口的盒体,该盒开口可用盒盖关闭。盒盖打开装置可包括壁结构、盒对接端口和/或设置于壁结构的盖操纵器。壁结构可具有分隔壁,该分隔壁具有界定第一空间的第一侧面并且具有界定第二空间的相对的第二侧面。分隔壁可具有壁开口,其用于通过其传送晶片。盒对接端口可以布置在壁结构的第一侧,用于对接容纳在第一空间中的晶片盒。盖操纵器可以相对于壁开口移动,并且可以被配置为接合对接在盒对接端口中的晶片盒的盒盖。盖操纵器可以具有关闭位置,在该关闭位置中,接合的盒盖关闭盒体。盖操纵器可以具有打开位置,在该打开位置中,接合的盒盖与盒体间隔开。盒盖打开装置可进一步包括气压流发生器,例如鼓风机,其具有细长的、狭缝状的喷嘴,该喷嘴大致跨越壁开口的高度或宽度,并且可以配置成将净化气体的帘状射流在第一空间到盒内部中的方向上从分隔壁中吹出。
还可以提供用于洁净室设备的组件。该组件可以包括晶片盒,该晶片盒可以具有盒体和盒盖。盒体可以限定用于容纳晶片的盒内部并且可以具有盒开口。盒盖可以配置成关闭盒开口。该组件可以进一步包括根据说明书的盒盖打开装置。
本公开还可以提供一种用于打开和净化晶片盒的方法。该方法可以包括提供一种晶片盒,该晶片盒可以包括限定用于容纳晶片的盒内部并且可以具有盒开口的盒体。晶片盒可以进一步包括用于关闭盒开口的盒盖。该方法可以进一步包括将盒盖相对于盒体移动到打开位置以打开晶片盒,并且可以包括通过将净化气体的帘状射流吹入盒内部,同时沿盒开口的大致整个宽度或高度移动该帘状射流,来净化盒内部。
为了概述本发明以及与现有技术相比所实现的优点,在上文中已经描述了本发明的某些目的和优点。当然,应当理解,根据本发明的任何特定实施例,不一定可以实现所有这些目的或优点。因此,例如,本领域技术人员将认识到,本发明可以以实现或优化本文所教导或启示的一个或一组优点或一组优点的方式进行或实施,而不必实现本文所教导或启示的其他目的或优点。
在从属权利要求中要求保护各种实施例,将参考附图中示出的示例进一步阐明这些实施例。这些实施例可以组合或可以彼此独立地应用。
所有这些实施例都旨在落入本文公开的本发明的范围内。通过参考附图对某些实施例的以下详细描述,这些和其他实施例对于本领域技术人员将变得显而易见,本发明不限于所公开的任何特定实施例。
附图说明
尽管说明书以特别指出并明确要求保护被认为是本发明的实施例的权利要求作为结尾,但是当结合附图阅读时,可以更容易地从本公开的实施例的特定示例的描述中确定本公开的实施例的优点,其中:
图1示出了根据说明书的组件的示例的俯视截面图;
图2示出图1的示例,其中盖操纵器处于壁开口的前面的打开位置,并且左侧的净化气体的射流尚未吹入盒内部;
图3示出了图1和2的示例,其中盖操纵器平行于分隔壁横向向右移动,并且射流在盒体的左侧吹入盒内部;
图4显示了图1-3的示例,其中盖操纵器更向右横向移动,射流也更向右吹入盒内部,净化气体的区域位于射流的左侧;
图5显示了图1-4的示例,其中盖操纵器甚至更向右横向移动,射流在盒体的右侧吹入盒内部,并且净化气体的区域完全占据了盒内部。
具体实施方式
在本申请中,相似或相应的特征由相似或相应的附图标记表示。各种实施例的描述不限于附图中示出的示例,并且在具体实施方式和权利要求中使用的附图标记不旨在限制实施例的描述,而是被包括以通过参照附图中所示的示例来阐明实施例。
尽管下面公开了特定实施例和示例,但是本领域技术人员将理解,本发明延伸超出了本发明的具体公开的实施例和/或用途及其明显的修改和等同。因此,意图是所公开的本发明的范围不应受到以下描述的特定公开的实施例的限制。本文呈现的图示并不意味着是任何特定材料、结构或装置的实际视图,而仅仅是用于描述本公开的实施例的理想化表示。
如本文所用,术语“晶片”可以指可以使用的任何一种或多种基底材料,或者可以在其上形成器件、电路或膜的材料。
以最一般的术语,本公开提供了一种在洁净室设备中使用的盒盖打开装置12,该洁净室设备配置成与晶片盒80配合。晶片盒80可包括限定用于容纳晶片的盒内部88的盒体82,并且可具有盒开口86,该盒开口86可用盒盖84关闭。盒盖打开装置12可包括壁结构14、盒对接端口28和设置到壁结构14的盖操纵器30。壁结构可具有分隔壁16,该分隔壁16具有界定第一空间22的第一侧面18并且具有界定第二空间24的相对的第二侧面20。分隔壁16可具有壁开口26,其用于通过其传送晶片。盒对接端口可以是布置在壁结构14的第一侧面18处的28,用于对接容纳在第一空间22中的晶片盒。盖操纵器30可以相对于壁开口26可移动,并且可以被配置为接合对接在盒对接端口28中的晶片盒80的盒盖84。盖操纵器30可具有关闭位置,在该关闭位置中,接合的盒盖84关闭盒体82。盖操纵器30可具有打开位置,在该打开位置中,接合的盒盖84与盒体82间隔开。盒盖打开装置12可进一步包括气压流发生器,例如鼓风机36,其具有细长的、狭缝状的喷嘴38,该喷嘴38大致跨越壁开口26的高度或宽度,并且可以配置成将净化气体的帘状射流40在第一空间22到盒内部88中的方向上从分隔壁16中吹出。
通过将气压流发生器或鼓风机36配置成将净化气体的帘状射流40吹入盒内部88,净化气体射流40形成将洁净室空气吹出的净化气体的前沿。因为射流是帘状射流40,所以它可以将盒的内部分成两个区域90、92,即,帘状射流的任一侧上的一个区域。因为鼓风机36的喷嘴38是细长的、狭缝状的喷嘴38,其大致跨越壁开口26的高度或宽度,所以射流40也可以从一端到另一端跨越盒内部88。因为射流40的侧面因此流过盒体82的侧面,所以盒内部88中的洁净室空气不能通过射流40的这些侧面,从而在帘状射流的两侧的区域90、92之间进行了明显的划分,其中没有空气从一个区域流向另一个区域。可以根据壁开口26的尺寸、高度或宽度以及盒内部88的深度来调节射流40吹入盒内部88的速度。这样,射流前沿可驱除洁净室空气,并用净化气体代替它。因为晶片通常在盒内部水平地取向,所以喷嘴38有利地跨过壁开口26的高度,即,在竖直取向的方向上跨过壁开口26。因为净化气体基本上不与洁净室空气混合,所以与基于用于净化气体“混合和稀释”晶片盒80中存在的洁净室空气的方法相比,需要更少的净化气体来代替晶片盒80中的空气。不仅需要较少的净化气体,而且可以减少净化时间。
在一实施例中,鼓风机36可被构造和布置成可大致沿盒开口86的整个宽度或高度移动,并且可配置成吹入盒内部88。盖操纵器30可配置成平行于分隔壁16横向地移动接合的盒盖84。鼓风机36可以连接到盖操纵器30,并且可以配置成吹过接合的盒盖84到盒内部88中。
通过将鼓风机36连接到可横向移动的盖操纵器30,射流可以与盖操纵器30一起横向移动。这确保了射流前沿可以从盒内部88的一侧移动到相对的另一侧,从而驱除并推开盒内部88中的洁净室空气。图2-5中示出了这如何起作用的示例。假设例如盒内部88由具有底壁、顶壁和两个侧壁的正方形或矩形形式界定。然后,帘状射流40可以从底壁到顶壁跨越盒内部88,从而将盒内部88划分为左侧区域90和右侧区域92。如图2所示,在净化开始时,整个盒内部88充满了洁净室空气。然后,净化开始于沿盒内部88的左侧壁或右侧壁吹动的射流40。假设射流最初是在盒内部88的左侧壁吹过的,如图3所示。洁净室空气随后被限制于在射流40右侧的区域92。盖操纵器30以及因此射流40可以随后向右行进。这样一来,射流40右侧充满了洁净室空气的区域92会逐渐变小,同时射流40左侧的区域90会逐渐变大,如图4所示。最终,射流40将到达盒内部88的右侧壁,并且所有洁净室空气将被驱除盒内部,如图5所示。
在一实施例中,鼓风机36可包括凸表面42。细长的狭缝状喷嘴38可配置成将射流40吹到凸表面42之上。盒盖打开装置12还可以设置有第二净化气体源44,该第二净化气体源44在凸表面42的周围供应第二净化气体,使得由于康达效应,至少一部分所供应的第二净化气体被吹到凸表面42之上的净化气体的射流40夹带。
康达效应是射流40保持附着在凸表面42上的趋势。当吹到凸表面42之上时,康达效应在射流40相对于凸表面42的相对侧产生负压。由于该负压,环境气体被夹带到射流40。由于这种夹带,鼓风机36的作用被放大,并且产生射流40的非常均匀的流动。因此,射流40在其上吹过的凸表面42形成具有均匀流出的理想喷射器。
在一实施例中,鼓风机36可配置成横跨盒体82的大致整个深度吹动净化气体的帘状射流40。
通过确保射流40被横跨盒体82的整个深度吹动,射流40将到达盒体82的与盒开口86相对的远端。因此,防止了洁净室空气在该远端处绕过射流40,以到达已净化的盒内部88中的区域90。
在一实施例中,壁结构14可包括排气端口46。当盖操纵器30从关闭位置移动到打开位置时以及当盖操纵器30处于打开位置时,排气端口46可以配置成从盒内部88移除气体。排气端口46可包括文丘里管。
排气端口46防止气体在盒内部88中积聚。排气端口46优选放置在射流40朝向其驱动洁净室空气的位置。在附图所示的示例中,这靠近盒体82的右侧壁。
在一实施例中,盒盖打开装置12还可包括门48和门操纵器50。门48可配置成关闭分隔壁16中的壁开口26,并且可相对于壁开口26移动。门操纵器50可以连接到门48。门操纵器50可以配置成将门48移动到关闭位置和打开位置,在关闭位置门48关闭壁开口26,在打开位置,门48从壁开口26横向移开。
在一实施例中,门操纵器50可以连接到盖操纵器30,以便一起横向移动。
因为射流40吹走或驱除盒内部88中的洁净室空气,所以防止了该洁净室空气到达分隔壁16和门48的相对侧上的第二空间24。因此,直到所有洁净室空气从盒内部88净化出后,门48才需要保持关闭。在净化期间门48可以已经打开,并且门48可以与盖操纵器30一起移动。因为门48的打开不是在盖操纵器30移动之后发生,而是同时发生,所以节省了时间。这可以对盒盖打开装置可以是其一部分的洁净室设备的通量产生积极影响。
在一实施例中,第二空间24可以是洁净室设备的小型环境。
本公开还提供一种用于洁净室设备的组件10,其示例在图1-5中示出。组件10可以包括晶片盒80。晶片盒80可包括盒体82和盒盖84。盒体82可以限定用于容纳晶片的盒内部88,并且可以具有盒开口86。盒盖84可以配置成关闭盒开口86。组件10可进一步包括根据说明书的盒盖打开装置12。
组件10的效果和优点类似于上述关于盒盖打开装置描述的的优点,并且这些效果和优点通过引用插入此处。
在一实施例中,晶片盒80可以包括前开式晶片盒(FOUP)。FOUP的尺寸根据标准设置,并且适用于300mm晶片。这可以提高与不同制造商的晶片盒一起使用的盒盖打开装置的可更换性。还可以增加用于不同制造商的洁净室设备的盒盖打开装置的可更换性。
本公开还可以公开一种用于打开和净化晶片盒80的方法。该方法可以包括提供具有盒体82的晶片盒80,该盒体82限定用于容纳晶片的盒内部88,并且具有盒开口86。晶片盒80还可以包括用于关闭盒开口86的盒盖84。该方法可以进一步包括将盒盖84相对于盒体82移动到打开位置以打开晶片盒80,并且可以包括通过将净化气体的帘状射流40吹入盒内部88,同时沿盒开口86的大致整个宽度或高度移动该帘状射流40,来净化盒内部88。
该方法的效果和优点类似于参考盖打开装置所述的那些效果和优点,在此通过引用并入。
在一实施例中,净化可以至少在盒盖84的移动期间进行。帘状射流40沿盒开口86的大致整个宽度或高度的移动和盒盖84的移动可以是联动的移动。
可以通过根据说明书的盒盖打开装置12来进行净化。相对于装置12描述了在盒盖84的移动期间净化盒内部88的效果,其特征在于,盖操纵器30可以配置成平行于分隔壁16横向地移动接合的盒盖84。此处提到的相同效果和优点也适用于方法的该实施例。
尽管上面已经部分地参考附图描述了本发明的说明性实施例,但是应当理解,本发明不限于这些实施例。通过研究附图、公开内容和所附权利要求,本领域技术人员在实践所要求保护的发明时可以理解和实现所公开的实施例的变型。
在整个说明书中,对“一个实施例”或“一实施例”的引用是指结合该实施例描述的特定特征、结构或特性包括在本发明的至少一个实施例中。因此,在整个说明书中各处出现的短语“在一个实施例中”或“在一实施例中”不一定都指的是同一实施例。
此外,应注意,上文描述的各种实施例中的一个或多个的特定特征、结构或特性可以彼此独立地实施,并且可以以任何合适的方式组合以形成新的、未明确描述的实施例。在详细描述和权利要求中使用的附图标记不限制实施例的描述,也不限制权利要求。附图标记仅用于澄清。
图例
10 组件
12 盒盖打开装置
14 壁结构
16 分隔壁
18 第一侧面
20 第二侧面
22 第一空间
24 第二空间
26 壁开口
28 盒对接端口
30 盖操纵器
36 鼓风机
38 喷嘴
40 射流
42 凸表面
44 第二净化气体源
46 排气端口
48 门
50 门操纵器
80 晶片盒
82 盒体
84 盒盖
86 盒开口
88 盒内部
90 充满净化气体的区域
92 充满洁净室空气的区域
Claims (15)
1.一种用于洁净室设备的盒盖打开装置(12),所述洁净室设备配置为与晶片盒(80)配合,其中,所述晶片盒(80)包括盒体(82),所述盒体(82)限定用于容纳晶片的盒内部(88)并具有可通过盒盖(84)关闭的盒开口(86),其中,所述盒盖打开装置(12)包括:
-具有分隔壁(16)的壁结构(14),所述分隔壁(16)具有限定第一空间(22)的第一侧面(18)并且具有限定第二空间(24)的相对的第二侧面(20),所述分隔壁(16)具有用于通过其传送晶片的壁开口(26);
-布置在壁结构(14)的第一侧面(18)的盒对接端口(28),所述盒对接端口(28)用于对接容纳在所述第一空间(22)中的晶片盒;以及
-设置到壁结构(14)的盖操纵器(30),所述盖操纵器(30)可相对于壁开口(26)移动并且配置成接合对接在所述盒对接端口(28)中的晶片盒(80)的盒盖(84),所述盖操纵器(30)具有关闭位置和打开位置,在所述关闭位置,被接合的盒盖(84)关闭盒体(82),在所述打开位置,被接合的盒盖(84)与盒体(82)间隔开,
所述盒盖打开装置(12)还包括鼓风机(36),所述鼓风机(36)具有细长的狭缝状喷嘴(38),所述喷嘴(38)大致跨越所述壁开口(26)的高度或宽度并且配置成将净化气体的帘状射流(40)在所述第一空间(22)到所述盒内部(88)的方向上从分隔壁(16)吹出。
2.根据权利要求1所述的盒盖打开装置,其中,所述鼓风机(36)被构造和布置成可沿所述盒开口(86)的大致整个宽度或高度移动,并且配置成吹入所述盒内部(88)。
3.根据权利要求1或2所述的盒盖打开装置,其中,所述盖操作器(30)构成为使被接合的盒盖(84)平行于分隔壁(16)横向地移动,并且其中,所述鼓风机(36)被连接到盖操纵器(30)并被配置成吹过被接合的盒盖(84)到盒内部(88)中。
4.根据前述权利要求中任一项所述的盒盖打开装置,其中,所述鼓风机(36)包括凸表面(42),并且其中,所述细长的狭缝状喷嘴(38)配置成将所述射流(40)吹到所述凸表面(42)之上。
5.根据权利要求4所述的盒盖打开装置,还设置有第二净化气体源(44),所述第二净化气体源(44)在所述凸表面(42)的周围供应第二净化气体,使得由于康达效应,至少一部分所供应的第二净化气体被吹到所述凸表面(42)之上的净化气体的射流40夹带。
6.根据前述权利要求中任一项所述的盒盖打开装置,其中,所述鼓风机(36)配置成吹动净化气体的帘状射流(40)横跨所述盒体(82)的大致整个深度。
7.根据前述权利要求中的任一项所述的盒盖打开装置,其中,所述壁结构(14)包括排气端口(46),所述排气端口(46)配置成当所述盖操纵器(30)从所述关闭位置移动到所述打开位置或处于所述打开位置时从所述盒内部(88)移除气体。
8.根据权利要求7所述的盒盖打开装置,其中,所述排气端口(46)包括文丘里管。
9.根据前述权利要求中任一项所述的盒盖打开装置,还包括:
-门(48),其被配置成关闭所述分隔壁(16)中的所述壁开口(26)并且相对于所述壁开口(26)可移动;
-门操纵器(50),其连接到所述门(48)并配置为将所述门(48)移动到:
·关闭位置,在所述关闭位置,所述门(48)关闭所述壁开口(26);和
·打开位置,在所述打开位置,所述门从所述壁开口(26)横向移开。
10.根据权利要求9所述的盒盖打开装置,其中,所述门操纵器(50)连接到所述盖操纵器(30),从而一起横向移动。
11.根据前述权利要求中任一项所述的盒盖打开装置,其中,所述第二空间(24)是所述洁净室设备的小型环境。
12.一种用于洁净室设备的组件(10),包括:
-晶片盒(80),包括:
·盒体(82),其限定用于容纳晶片的盒内部(88)并具有盒开口(86);和
·盒盖(84),其配置成关闭所述盒开口(86);和
-根据前述权利要求中任一项所述的盒盖打开装置(12)。
13.根据权利要求12所述的组件,其中,所述晶片盒(80)包括FOUP。
14.一种用于打开和净化晶片盒(80)的方法,包括:
-提供晶片盒(80),所述晶片盒(80)包括限定用于容纳晶片的盒内部(88)并具有盒开口(86)的盒体(82),所述晶片盒(80)还包括用于关闭盒开口(86)的盒盖(84);
-相对于所述盒体(82)移动所述盒盖(84)到打开位置以打开所述晶片盒(80);和
-通过将净化气体的帘状射流(40)吹入盒内部(88),同时沿所述盒开口(86)的大致整个宽度和高度移动所述帘状射流(40),来净化所述盒内部(88)。
15.根据权利要求14所述的方法,其中,所述净化至少在所述盒盖(84)的移动期间进行,其中,所述帘状射流(40)沿着所述盒开口(86)的大致整个宽度或高度的移动和所述盒盖(84)的移动是联动的移动。
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-
2020
- 2020-07-22 US US16/935,297 patent/US20210035842A1/en active Pending
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