CN1121713C - 管芯接合装置 - Google Patents

管芯接合装置 Download PDF

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CN1121713C
CN1121713C CN98120953A CN98120953A CN1121713C CN 1121713 C CN1121713 C CN 1121713C CN 98120953 A CN98120953 A CN 98120953A CN 98120953 A CN98120953 A CN 98120953A CN 1121713 C CN1121713 C CN 1121713C
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lead frame
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tube core
frame
wafer
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CN1230772A (zh
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金声峰
廉明圭
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Samsung Electronics Co Ltd
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Abstract

一种管芯接合装置，在把作为记忆元件的半导体芯片的晶片结合到引线框上时，只要简单地调节控制机能就能有选择地完成LOC管芯接合工序和标准管芯接合工序，提高装备的使用效率，大幅度降低装备成本。本发明的管芯接合装置包括引线框供给部、框输送部、框固定部、Ag环氧树脂供给部、用推片使由上述框输送部输送的引线框向预热部移动的移动部、晶片供给部、晶片装填部、管芯输送部、管芯接合部和自动加料器。

Description

管芯接合装置
本发明涉及管芯(die)接合装置，特别是涉及那种在把作为记忆元件的半导体芯片(chip)的晶片(wafer)接合到导线成一体接在其上的引线框上时，只要简单地调节控制机能后就能有选择地完成LOC(Lead On Chip芯片上引线)管芯接合工序和标准管芯接合工序、能提高装备的使用效率、能大幅度节省装备的成本的管芯接合装置。
现在下述已公认，即，认为半导体引线框(Lead Frame)是一个与晶片一起构成半导体组件的核心结构元件，它能起到连接半导体组件的内部和外部，即连接回路基板的导线(Lead)的作用，和支持半导体芯片的支持体(Frame)的作用。
而且，上述半导体引线框是把具有一定宽度的薄板坯料依次输送、用冲压模型装置形成规定形状的，或者是用化学药品、通过蚀刻工序而形成规定形状的。
把这样制作的半导体引线框与作为记忆元件的芯片等其他构件一起经过组装过程、譬如经过管芯接合(Die Bonding)或引线接合(Wire Bonding)等过程而形成半导体组件。
把多个单元引线框以纵横排列的状态形成在上述一个薄板坯料上，同时把用于搭载芯片的粘接带条熔接在它的底面上，形成单元引线框构件。
然后，用真空吸附方法在轨道上将上述熔接着粘接用带条的单元引线框构件排成序列之后，进行管芯接合工序。
在管芯接合工序、用例如喷嘴等吸附管芯、将其输送、放置到形成有多个单一元件的管芯的硅晶片的规定位置上后，输送到排列有其安放部位的引线框的下面、进行搭载后，用热压接机构等进行接合。
将这样接合过的引线框输送到相邻的导线接合工序，在导线接合过程中用导电性优良的金或银等金属丝、将各条引线与管芯的回路相连接。
也即、以前通常使用图2A所示的结合LOC(Lead On Chip)管芯接合，它是如图1所示，进行缠带工序，把多个单元引线框1形成在一个薄板坯料上，再把搭接芯片用的粘接用带条2熔接到单元引线框1上，由此形成引线框构件，然后使经过缠带工序的引线框以上述粘接用带条2朝下的方式进行移动、同时使作为记忆元件的芯片那样的管芯3从下方附着之后，在下一步导线接合工序、用金属丝4接合引线框和管芯的结点。
而实际上如图2B所示的标准接合的方法因它的作业性较好也被普遍使用，这种方法是把属于粘接性涂料的Ag环氧树脂6涂敷在引线框5的上面之后，使管芯7从上方附着在其上之后，用金属丝8使管芯7的结点与引线框5相接合的。
也即、在管芯的尺寸较大的初期开发阶段，主要是使用能使整个组件尺寸缩小的LOC管芯接合，但在管芯的尺寸逐渐变小、没必要使整个组件的尺寸更进一步缩小的情况下，就形成从LOC管芯接合变成主要使用标准管芯接合方法。
但是，由于进行LOC管芯接合工序用的装置和进行标准管芯接合工序用的作业相互不同，因而要利用彼此不同的装置，上述以前的管芯接合装置必需追加设置生产设备；由于进行LOC管芯接合或标准管芯接合工序的装置不能用其他工序的方法进行生产，因而有所谓的使设备原封不动地搁置的缺点。
本发明是为了解决上述现有技术的缺点而作出的，其目的是提供一种管芯接合装置，这种管芯接合装置在把作为记忆元件的半导体芯片的晶片接合到导线成一体的引线框上时，只要简单地调节控制机能后就能有选择地完成LOC管芯接合工序和标准管芯接合工序、能提高装备的使用效率、能大幅度节省装备成本的。
为了达到上述目的而作出的本发明的管芯接合装置由下列构件构成，即、以装载箱的形式形成能层叠地收容多个引线框的引线框供给部；用真空吸附器把层叠在上述引线框供给部里的引线框把持并移动到Ag环氧树脂涂敷工作台后再输送到移动导轨的框输送部；用真空泵吸附由上述框输送部逐个移动的引线框、使其固定在Ag环氧树脂涂敷的工作台上、由马达使其前后移动的框固定部；每次将一定量Ag环氧树脂喷作为粘接性涂料涂敷到涂敷部位的上面的Ag环氧树脂供给部，上述涂敷部位是指被固定在上述框固定部的引线框上的与管芯相接的部位；在由上述Ag环氧树脂供给部涂敷过Ag环氧树脂的状态下、用推片使由上述框输送部的作用而移动的引线框在移动导轨上向前方的预热部移动的移动部；用预热器的料箱接受上述在移动部的移动导轨上向前方移动而供来的引线框，并进行预热，同时使其完成涂敷的预热部；把从外部人为供给的半导体芯片依次输送供给的晶片供给部；使通过上述晶片供给部依次提供的所述晶片以轴为中心回转，在回转途中将其输送到一定位置上的晶片装填部；把输送到上述晶片装填部一定位置上的半导体晶片(芯片)逐个把持输送到管芯接合作业位置的管芯输送部；通过输送导辊逐个接受从上述预热部传递来的引线框、同时把由上述管芯输送部逐个输送的管芯正确地压接而附着在引线框的熔接带条的位置的管芯接合部；在上述管芯接合部输送出稳定地附有半导体体元件的管芯的引线框时，使内部料箱上下移动并进行装载的自动加料器。
最好所述本发明的引线框供给部是以能收容多个引线框并进行装载的形式形成。
上述本发明的框输送部最好由下列构件构成，即、用来把层叠在引线框供给部里的引线框逐个把持的真空吸附器；使上述真空吸附器上下移动、同时将引线框提起、放下的上下移动器；使上述真空吸附器和上下移动器左右移动、同时输送到Ag环氧树脂涂敷工作台或再输送到移动导轨的左右移动器。
上述本发明的框固定部最好由下列构件构成，即、将由框输送部逐个输送的引线框吸附在Ag环氧树脂涂敷工作台的正确位置的下面而使其固定的真空吸盘；使上述引线框前后移动的马达。
上述本发明的Ag环氧树脂供给部最好由下列构件构成，即、在Ag环氧树脂涂敷工作台上所固定的引线框的与管芯相接的涂敷部位，每次将一定量的Ag环氧树脂喷出到引线框的上面、同时加以涂敷的喷嘴；与上述喷嘴的上部相连接、用适当压力每次压入一定量的Ag环氧树脂的注入器；位于上述注入器的上端、同时监视喷嘴把Ag环氧树脂喷出到正确部位上的照相机；使上述喷嘴、注入器和照相机上下移动、同时使引线框容易移动并且可涂敷Ag环氧树脂的z轴驱动器；使上述z轴驱动器左右移动、同时能使Ag环氧树脂涂敷到横向排列的引线框的部位上的x轴驱动器。
本发明的移动部最好用推片构成，它是使上述由Ag环氧树脂供给部涂敷过Ag环氧树脂的、由框输送部输送到移动导轨的正确位置上的引线框向前方移动的。
本发明的预热部最好由下列构件构成，即、把移动导轨上的由推片使其移动到前方的引线框收集到上下形成多个层叠凹沟的内部的料箱；使上述料箱上下移动、同时将供来的引线框依次用多层接受到内部的层叠凹沟里或使其排出的升降器；把层叠在上述料箱里的引线框逐个排出的排出器；由加热器使上述料箱所处的预热器的内部保持适当温度，并使附着在引线框上的粘接用带条预热的加热器，本发明的预热部最好是使附着有粘接用带条的引线框预热、并排出、同时使涂敷过Ag环氧树脂的引线框保持原状地输送。
上述本发明的晶片装填部最好由下列构件构成，即、使通过晶片供给部的供给通路而供给的晶片处在一定范围内的圆形环；设置在上述圆形环的底面上、使管芯在晶片上容易各个分离地推压的升降销驱动器。
上述本发明的管芯输送部最好由下列构件构成，即、用来把连续地输送到上述晶片装填部的圆形环的一定位置上的半导体元件的管芯逐个把持并使其附着在引线框的一定位置上的真空吸盘；使上述真空吸盘在一定轨道上往复移动、同时使其输送到管芯接合作业位置的驱动器。
上述本发明的管芯接合部最好由下列构件构成，即、逐个地接受从上述预热部传递来的涂敷了的引线框的输送导轨；从引线框的下端支着由上述真空吸盘传递的半导体元件的管芯的管芯附着器；接受从加热器传来的由其发生的热、同时从上部加压上述管芯附着器支着的管芯而使其压接的头部。
上述本发明的自动加料器最好由下列构件构成，即、为了逐个地接受从上述管芯接合部传递来的附着有半导体元件的管芯的引线框、并通过抽出器使其层叠、同时进行贮藏而上下形成层叠凹沟的多个自动加料器之料箱；为了把上述料箱移动到输送组件上而进行推压的供给器；在移动上述自动加料器料箱时使其前后或上下移动、同时将自动加料器之料箱整齐地置于容易移动的层叠板上的输送组件。
而上述输送组件最好在由垂直驱动器上下输送的途中，由水平驱动器前后输送，在用层叠板、由抽出器整理、集中之后，由料箱排出器使其排出到外部。
图1是表示把带条熔接到引线框的下表面上的状态的示意图。
图2A、图2B是表示LOC和标准管芯接合状态的示意图。
图3是表示本发明的整体结构的示意图。
图4是本发明的俯视图。
图5是表示本发明的涂敷Ag环氧树脂的状态的侧视图。
图6A、图6B是表示本发明的分别进行LOC和标准管芯接合的管芯接合部的结构的正视图。
图7是表示本发明的预热部的料箱结构的斜视图。
图8是表示本发明的自动加料器结构的侧视图。
下面，参照附图、对本发明进行详细的说明。
图3表示本发明一个实施例的整体结构。由图3可见，本发明由下列构件构成，即、以装载箱11的形式形成能层叠地收容多个引线框12的引线框供给部10；用真空吸附器21把层叠在上述引线框供给部10里的引线框12逐个把持地输送到涂敷Ag环氧树脂工作台31之后、再输送到移动导轨41的框输送部20；用真空泵32吸附由上述框输送部20的真空吸附器21逐个输送的引线框12、使其固定在Ag环氧树脂涂敷工作台31上、或由马达33的驱动而使其前后移动的框固定部30；通过喷嘴每次将一定量Ag环氧树脂喷出到上述固定在框固定部30的Ag环氧树脂涂敷工作台31上的引线框12的与管芯相接的涂敷部位的上面的Ag环氧树脂供给部50；在由上述Ag环氧树脂供给部50将Ag环氧树脂涂敷在上面的状态下、用推片42使上述框输送部20的真空吸附器21输送的引线框12、在移动导轨41上向前方移动的移动部40；把在上述移动部40的移动导轨41上向前方移动的引线框12直接输送到管芯接合部或者使预热器61的料箱62上下移动、同时以多层结构接受供来的引线框并使其预热后进行输送的预热部60；把从外部人为供给的半导体元件的晶片依次输送、供给的晶片供给部70；使通过上述晶片供给部70依次供给的所述晶片回转、在回转途中将其输送到一定位置上的晶片装填部80；把由上述晶片装填部80输送到一定位置上的半导体元件的管芯逐个把持、输送到管芯接合作业位置上的管芯输送部90；通过输送导轨101逐个接受从上述预热部60传送来的引线框、同时根据引线框是LOC还是标准的、把由上述管芯输送部90逐个输送的管芯正确地压接在引线框的带条粘接位置上或正确地涂敷过Ag环氧树脂的部位上的管芯接合部100；上述管芯接合部100输送出稳定地附着有半导体元件的管芯的引线框12时、使自动加料器的料箱111上下移动、同时进行装载的自动加料器110。
图4～图8是表示本发明实施例的详细结构的示意图。上述本发明的框输送部20由下列构件构成，即、用来把层叠在引线框供给部10的装载箱13里的引线框逐个把持的真空吸附器21；在将上述真空吸附器21设置在构架24上的状态下、通过气缸23使其上下移动、同时将引线框提起或放下的上下移动器22；在将上述真空吸附器21和上下移动器22设置在构架24上的状态下、通过皮带26使其左右移动、同时输送到框固定部30的Ag环氧树脂涂敷工作台31、或再输送到移动部40的移动导轨41的左右移动器25。
上述本发明的框固定部30在把由框输送部20的真空吸附器21逐个输送的引线框输送到Ag环氧树脂涂敷工作台31的正确位置上之后，由下面的真空泵32吸附、使其临时固定，同时根据涂敷状态、由马达33的驱动而使引线框前后移动。
上述本发明的Ag环氧树脂供给部50由下列构件构成，即、每次把一定量的Ag环氧树脂排出到Ag环氧树脂涂敷工作台31上所固定的引线框的与管芯相接的涂敷部位上，同时进行涂敷的喷嘴51；与上述喷嘴51的上部相连接、在达到涂敷部位之后、以一定时间适当的压力、每次将一定量的Ag环氧树脂压入并排出到上述涂敷部位的注入器52；位于上述注入器52的上端、进行监视以使喷嘴51将Ag环氧树脂排出到引线框的正确涂敷部位上的照相机53；能使设置着上述喷嘴51、注入器52和照相机53的构架54上下移动、同时能使引线框移动，或者能在引线框的正上方涂敷Ag环氧树脂6的z轴驱动器55；能使包含有上述z轴驱动器55的构架56左右移动、同时能把Ag环氧树脂6涂敷到横向排列的引线框的粘接部位上的x轴驱动器57。
上述本发明的移动部40能把由上述Ag环氧树脂供给部50正确地涂敷过Ag环氧树脂的引线框把持在上述框输送部20的真空吸附器21上，在将引线框输送到移动导轨41的正确位置上时，能使推片42动作而使引线框向前方移动以适时地供到预热部60的料箱62里，与此同时使马达43运转，通过传递齿轮44使上述移动导轨41回转、同时使引线框顺畅地移动。
上述本发明的预热部60由下列构件构成，即、把由移动部40的推片42移动到前方的引线框收集到上下形成多个层叠凹沟63的内部之料箱62；使上述料箱62每次一级地上下移动、同时将供来的引线框依次装到内部的层叠凹沟63里或使其排出的升降器64；把层叠在上述料箱62里的引线框逐个把持并排出到外部的排出器65；将上述料箱62所处的预热器61的内部温度保持成适当温度、使附着在引线框上的粘接用带条预热的加热器66，预热部60能使带有粘接用带条的引线框预热后排出，同时使涂敷过Ag环氧树脂的引线框仍按原样输送。
上述本发明的晶片供给部70由人为地接受从外部供来的半导体晶片的、上面开着口的盒状供给箱71；设置在上述供给箱71的底面上、由马达73的驱动而上下移动、将内部的晶片保持在晶片供给通路74上的晶片装载/卸载器72构成。
上述本发明的晶片装填部80由下列构件构成，即、使通过上述晶片供给部70的供给通路74供给的晶片处在一定范围内的、上面开口的圆筒状圆形环81；设置在上述圆形环81的底面上、以轴83为中心地低速回转、将管芯在供给到内部的晶片上逐个分离地压上的升降销驱动器82。
上述本发明的管芯输送部90由下列构件构成，即、从上述晶片装填部80的圆形环81连续地输送到一定位置的为用动作片92逐个地把持半导体元件的管芯、使其附着到引线框的设定位置上而移动的真空吸盘91；使上述真空吸盘91在一定轨道94上往复移动、同时使其输送到作为管芯接合作业位置的引线框下面的驱动器93。
上述本发明的管芯接合部100由下列构件构成，即、逐个接受由上述预热部60传递来的预热过的引线框并使其移动的输送导轨101；从沿着上述输送导轨101传递的引线框的下面将管芯支起的管芯附着器102；使上述加热器103和管芯附着器102上下移动的第一上下移动器104；在接受从内部的加热器103供来的由其产生的热量的状态下、把由上述管芯附着器102支着的管芯、在输送导轨101的上部、由第二上下移动器106使其升降、同时进行压接的头部105；在吸附着从真空吸盘91供来的管芯的状态下，使其附着在引线框的上面的吸附头107。
上述管芯接合部100是根据沿上述输送导轨101传递的引线框是LOC管芯接合用或者标准管芯接合用等不同、把由上述真空吸盘91传递而供来的半导体元件的管芯接受到下方的管芯附着器102或者上方的吸附头107上，从引线框的下方或上方使其附着的。
上述本发明的自动加料器110由下列构件构成，即、为了逐个地接受从上述管芯接合部100传来的附有半导体元件的管芯的引线框并进行层叠、贮藏而上下形成层叠凹沟112的多个自动加料器之料箱111；将上述引线框依次推入到自动加料器之料箱111的层叠凹沟112里的抽出器113；为了把上述自动加料器之料箱111移动到输送组件115而推压的供给器114；在移动上述自动加料器之料箱111时，使其前后或上下移动，同时将其在容易移动的层叠板116上排齐的移送组件115。
上述输送组件115在由垂直驱动器117作用而上下移动的途中、能由水平驱动器118作用而前后移送，在层叠板116上由料箱抽出器加以整理和集中后、由料箱排出器排出到外部。
具有上述结构的本发明管芯接合装置在人为地使Ag环氧树脂加工用的引线框5层叠在引线框供给部10的装载箱11里之后、设定用于涂敷Ag环氧树脂的控制时，用识别该控制的控制器、由框输送部20的真空吸附器21将引线框逐个把持、在设置在构架24的状态下，由传递上下移动器22的动力的气缸23、使其向上方移动之后，由接受左右移动器25的动力的皮带26使其移动到框固定部30的Ag环氧树脂涂敷工作台31的上方，再由传递上下移动器22的动力的气缸23、使其向下方移动而安放在Ag环氧树脂涂敷工作台31上。
由上述框输送部20的真空吸附器21逐个输送的引线框5被输送到Ag环氧树脂涂敷工作台31的正确位置上之后，由设置在下面的真空泵32的吸附力将其临时固定。
在把引线框5固定后、在Ag环氧树脂供给部50上、用照相机53监视，在正确涂敷位置上涂敷Ag环氧树脂6。
然后驱动上述框固定部30的马达33，同时使吸附在真空泵32上的引线框5前后移动，在全部涂敷部位都进行涂敷。
这时，使z轴驱动器55动作，从而使设有喷嘴51、注入器52和照相机53的构架54上下移动，同时在引线框5的正上方、形成管芯和喷嘴51相接的状态。
在引线框上形成2个以上管芯的附着部位时，在Ag环氧树脂供给部50使x轴驱动器57动作，使包含z轴驱动器55的构架56左右移动，就能同时把Ag环氧树脂6涂敷到横向排列的引线框的粘接部位上。
此后，每次以同一时间将适当的压力加到与喷嘴51上部相连的注入器52上，将一定量Ag环氧树脂6排出到引线框5的结合部位上并进行涂敷。
接着，若引线框5的涂敷作业结束、则由框输送部20的真空吸附器21把持、在设置在构架24的状态下、由传递上下移动器22的动力的气缸23使其移动到上方之后，由接受左右移动器25的动力的皮带26将其移动到移动部40的移动导轨41的上方、再由传递上下移动器22的动力的气缸23将其移动到下方、安放在移动导轨41上。
这样，在把涂敷过Ag环氧树脂6的引线框5输送到移动导轨41上后，能使推片42动作，使其向前方移动适时地提供到预热部60的料箱62里。
上述预热部60不预热由推片42移动到前方的涂过Ag环氧树脂的引线框5，而是由排出器65直接将其排出。
如果操作者把半导体元件的管芯人为地供给到晶片供给部70的上面开口的盒状供给箱71里，则由晶片装载/卸载器72使晶片保持在晶片供给通路74上。
通过上述晶片供给部70的供给通路74供来的晶片被输送到晶片装填部80的上面开口的圆筒形的圆形环81里、使这些供来的晶片安放在圆形环81的内部，圆形环81由设置在底面上的升降销驱动器82使其以轴83为中心、低速地回转。
将安放在上述晶片装填部80的圆形环81里的半导体元件的管芯逐个地把持在动作片92里，输送并最终附着到引线框的设定位置上，动作片92由管芯输送部90的真空吸盘91的作用而动作。
上述真空吸盘91由驱动器93的作用而在轨道94上往复移动，同时将管芯传递到处于管芯接合作业位置即管芯接合部100的吸附头107上。
这时，管芯接合部100如图6B所示地、使吸附头107进到输送导轨101的上面、能利用标准管芯接合使管芯附着在引线框5上。
把由排出器65从上述预热部60逐个供给的引线框5放置在输送导轨101上面而移动，与此同时、把由上述管芯输送部90的真空吸盘91传递来的半导体元件的管芯、从引线框5的下面、由管芯附着器102支持，同时通过上端的头部105而使其附着。
在通过输送导轨101、从上述管芯接合部100逐个地传递带有半导体元件的管芯的引线框5时，由抽出器113将其把持、层叠在自动加料器之料箱111的上下形成的多个层叠凹沟112里，同时加以贮藏。
在把一定量的自动加料器之料箱111移动到上述输送组件115上时，在由垂直驱动器117使其上下输送的途中、能由水平驱动器118将其前后输送，同时将自动加料器之料箱111在容易移动的层叠板116上排列整齐，然后由料箱排出器将其移出到外部。
另一方面，在供给的底面上粘接着粘接用带条2的LOC管芯接合用引线框、同时进行标准管芯接合的场合下，用识别该操作的控制器、用框输送部20的真空吸附器21逐个地加以把持，在设置在构架24上的状态下，由传递上下移动器22的动力的气缸23使其移动到上方之后，由接受左右移动器25的动力的皮带26使其移动到移动部40的移动导轨41的上方，再由传递上下移动器22的动力的气缸23使其向下方移动，使其安放在移动导轨41上。
这样，在把底面上粘接着粘接用带条2的引线框1移动到移动导轨41上时，使推片42动作，从而使引线框向前方移动，能将其适时地供到预热部60的料箱62里。
在预热部60，把由推片42移动到前方的引线框1收集到料箱62里的形成多个的层叠凹沟63里，但它是通过升降器64使上述料箱62逐级向上或向下移动，把供来的引线框1依次接受到内部的层叠凹沟63里。
在上述料箱62所处的预热器61的内部，使加热器66发热，从而将预热器61内部保持适当温度，使粘接在引线框1上的带条稍微预热后，由排出器65逐个排出。
这样，上述管芯输送部90的真空吸盘90由驱动器93的作用而在轨道94上往复移动、同时将管芯逐个传递到作为管芯接合作业位置的管芯附着器102上。
在逐个地接受从上述预热部60的排出器65传递来的引线框1的管芯接合部100上，如图6A所示，从放置在输送导轨101上面而移动的引线框1的下方，用管芯附着器102支着由上述管芯输送部90的真空吸盘91传递来的半导体元件的管芯、同时用内部的加热器103生成的热量，短时间里压接到上端头部105上，使其熔接而附着。
因此，本发明的管芯接合装置在把作为记忆元件的半导体芯片的晶片接合到导线成一体的引线框上时，只要简单地调整控制机能后就能有选择地完成LOC管芯接合工序和标准管芯接合工序，能提高装备的使用效率，能大幅度节省装备的成本。

Claims (2)

1.一种管芯接合装置，其特征在于：它是由下列构件构成，即、以装载箱的形式形成的能层叠地收容多个引线框的引线框供给部；用真空吸附器把持层叠在上述引线框供给部里的引线框并向Ag环氧树脂涂敷工作台或移动导轨输送的框输送部；用真空泵吸附由上述框输送部逐个输送的引线框，使其固定在Ag环氧树脂涂敷工作台上，同时由马达的驱动而使其前后移动的框固定部；通过喷嘴每次将一定量Ag环氧树脂喷出到涂敷部位上面的Ag环氧树脂供给部，上述涂敷部位是指被固定在上述框固定部上的引线框的与管芯相接的部位；在由上述Ag环氧树脂供给部涂敷过Ag环氧树脂的状态下、使由上述框输送部的作用而输送的引线框在移动导轨上向前方移动的移动部；用预热器的料箱接受上述在移动部的移动导轨上向前方移动而供来的引线框，并进行预热，同时使其完成涂敷的预热部；把从外部人为供给的半导体元件的晶片依次输送地供给的晶片供给部；使通过上述晶片供给部依次提供的上述晶片回转、在回转途中将其输送到一定位置上的晶片装填部；把上述晶片装填部输送到一定位置上的半导体元件的管芯逐个把持地输送到管芯接合作业位置的管芯输送部；通过输送导轨逐个接受从上述预热部传递来的涂敷好的引线框、同时根据引线框是LOC还是标准的、把由上述管芯输送部逐个输送的管芯正确地粘接在引线框的带条粘接位置上或使其正确地压接而附着在涂敷过Ag环氧树脂的部位上的管芯接合部；在上述管芯接合部稳定地附着半导体元件的管芯的引线框被输送时、将其装载在内部的料箱里的自动加料器。
2.如权利要求1所述的管芯接合装置，其特征在于：上述管芯接合部由下列构件构成，即、逐个地接受从上述预热部传递来的经过预热的引线框并使其移动的输送导轨；从上述输送导轨传递的引线框的下面支持管芯的管芯附着器；使上述加热器和管芯附着器上下地移动的第一上下移动器；在接受从内部的加热器供来的、由其生成的热的状态下，在输送导轨的上部、由第二上下移动器使由上述管芯附着器支持的管芯升降、同时使其压接的头部；在吸附从上述真空吸盘供来的管芯的状态下、从引线框的上面使其附着的吸附头部；根据引线框是LOC还是标准的、把由上述管芯输送部逐个输送的管芯正确地压接而附着在引线框的粘接着带条的下方或涂敷过Ag环氧树脂的上方。
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