CN112123063A - 被加工物的加工方法 - Google Patents

被加工物的加工方法 Download PDF

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Publication number
CN112123063A
CN112123063A CN202010577921.XA CN202010577921A CN112123063A CN 112123063 A CN112123063 A CN 112123063A CN 202010577921 A CN202010577921 A CN 202010577921A CN 112123063 A CN112123063 A CN 112123063A
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CN
China
Prior art keywords
grinding
workpiece
thickness
chuck table
control unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202010577921.XA
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English (en)
Chinese (zh)
Other versions
CN112123063B (zh
Inventor
松原壮一
久保徹雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
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Disco Corp
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Publication of CN112123063A publication Critical patent/CN112123063A/zh
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Publication of CN112123063B publication Critical patent/CN112123063B/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/40—Caliper-like sensors
    • G01B2210/42—Caliper-like sensors with one or more detectors on a single side of the object to be measured and with a backing surface of support or reference on the other side
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/40—Caliper-like sensors
    • G01B2210/48—Caliper-like sensors for measurement of a wafer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
    • G01B5/02—Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness
    • G01B5/06—Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness for measuring thickness

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
CN202010577921.XA 2019-06-24 2020-06-23 被加工物的加工方法 Active CN112123063B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019116599A JP7242141B2 (ja) 2019-06-24 2019-06-24 被加工物の加工方法
JP2019-116599 2019-06-24

Publications (2)

Publication Number Publication Date
CN112123063A true CN112123063A (zh) 2020-12-25
CN112123063B CN112123063B (zh) 2024-07-12

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010577921.XA Active CN112123063B (zh) 2019-06-24 2020-06-23 被加工物的加工方法

Country Status (5)

Country Link
US (1) US20200398400A1 (ja)
JP (1) JP7242141B2 (ja)
CN (1) CN112123063B (ja)
CZ (1) CZ2020362A3 (ja)
DE (1) DE102020207765A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022168720A (ja) * 2021-04-26 2022-11-08 株式会社ディスコ 加工方法
CN114288999B (zh) * 2021-12-27 2024-06-07 东莞市鹏锦机械科技有限公司 一种特异性吸水复合材料及其制备方法和在高水分低nmp含量废气处理中的应用

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5315789A (en) * 1987-08-24 1994-05-31 Kabushiki Kaisha Toshiba Numerically controlled machine tool and method of controlling grinding operation thereof
US20010024097A1 (en) * 2000-03-16 2001-09-27 Takashi Kunugi Numerical control apparatus for roll grinding machine
JP2004078895A (ja) * 2002-06-17 2004-03-11 Sanyo Electric Co Ltd 分散制御システムおよび分散制御方法
JP2006021264A (ja) * 2004-07-07 2006-01-26 Disco Abrasive Syst Ltd 研削装置
JP2007245315A (ja) * 2006-03-17 2007-09-27 Taiwa Seisakusho:Kk 非導通性被加工物の研削加工方法およびその装置
JP2007335458A (ja) * 2006-06-12 2007-12-27 Disco Abrasive Syst Ltd ウエーハ研削装置
JP2010017787A (ja) * 2008-07-09 2010-01-28 Disco Abrasive Syst Ltd 研削装置
JP2010173009A (ja) * 2009-01-29 2010-08-12 Mat:Kk 半導体チップの薄片化の加工装置及びその加工方法
JP2011200960A (ja) * 2010-03-25 2011-10-13 Disco Corp 研削装置
JP2013046939A (ja) * 2011-08-29 2013-03-07 Disco Corp 研削装置
JP2015116637A (ja) * 2013-12-18 2015-06-25 株式会社ディスコ 研削方法
JP2016002598A (ja) * 2014-06-13 2016-01-12 株式会社ディスコ 研削方法
US20170095902A1 (en) * 2015-10-06 2017-04-06 Disco Corporation Grinding method

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JP2003209080A (ja) * 2002-01-11 2003-07-25 Disco Abrasive Syst Ltd 半導体ウェーハ保護部材及び半導体ウェーハの研削方法
JP2003300155A (ja) * 2002-04-10 2003-10-21 Disco Abrasive Syst Ltd 研削方法及び研削装置
JP4763478B2 (ja) * 2006-02-23 2011-08-31 株式会社ディスコ 研削装置
WO2008003129A1 (en) * 2006-07-03 2008-01-10 Anca Pty Ltd Probe emulation and spatial property measurement in machine tools
JP5276823B2 (ja) * 2007-10-04 2013-08-28 株式会社ディスコ ウェーハの研削加工装置
JP5335245B2 (ja) * 2008-01-09 2013-11-06 株式会社ディスコ ウェーハの研削方法および研削加工装置
JP5219569B2 (ja) * 2008-03-21 2013-06-26 株式会社東京精密 ウェーハ研削装置における加工良否判定方法およびウェーハ研削装置
US9180559B2 (en) * 2012-08-16 2015-11-10 Nsk Americas, Inc. Apparatus and method for measuring bearing dimension
JP6251614B2 (ja) * 2014-03-18 2017-12-20 株式会社ディスコ 被加工物の研削方法
JP6803171B2 (ja) * 2016-08-18 2020-12-23 株式会社ディスコ 研削装置及び加工装置
JP6909598B2 (ja) * 2017-03-13 2021-07-28 光洋機械工業株式会社 平面研削方法及び平面研削装置
WO2018179368A1 (ja) * 2017-03-31 2018-10-04 三菱電機株式会社 制御装置およびモータ制御システム

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5315789A (en) * 1987-08-24 1994-05-31 Kabushiki Kaisha Toshiba Numerically controlled machine tool and method of controlling grinding operation thereof
US20010024097A1 (en) * 2000-03-16 2001-09-27 Takashi Kunugi Numerical control apparatus for roll grinding machine
JP2004078895A (ja) * 2002-06-17 2004-03-11 Sanyo Electric Co Ltd 分散制御システムおよび分散制御方法
JP2006021264A (ja) * 2004-07-07 2006-01-26 Disco Abrasive Syst Ltd 研削装置
JP2007245315A (ja) * 2006-03-17 2007-09-27 Taiwa Seisakusho:Kk 非導通性被加工物の研削加工方法およびその装置
JP2007335458A (ja) * 2006-06-12 2007-12-27 Disco Abrasive Syst Ltd ウエーハ研削装置
JP2010017787A (ja) * 2008-07-09 2010-01-28 Disco Abrasive Syst Ltd 研削装置
JP2010173009A (ja) * 2009-01-29 2010-08-12 Mat:Kk 半導体チップの薄片化の加工装置及びその加工方法
JP2011200960A (ja) * 2010-03-25 2011-10-13 Disco Corp 研削装置
JP2013046939A (ja) * 2011-08-29 2013-03-07 Disco Corp 研削装置
JP2015116637A (ja) * 2013-12-18 2015-06-25 株式会社ディスコ 研削方法
JP2016002598A (ja) * 2014-06-13 2016-01-12 株式会社ディスコ 研削方法
US20170095902A1 (en) * 2015-10-06 2017-04-06 Disco Corporation Grinding method

Also Published As

Publication number Publication date
JP7242141B2 (ja) 2023-03-20
US20200398400A1 (en) 2020-12-24
DE102020207765A1 (de) 2020-12-24
CN112123063B (zh) 2024-07-12
CZ2020362A3 (cs) 2021-01-06
JP2021000711A (ja) 2021-01-07

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