CN112062568A - 一种利用热应变诱导宽温区电卡效应plzst基薄膜的制备方法 - Google Patents
一种利用热应变诱导宽温区电卡效应plzst基薄膜的制备方法 Download PDFInfo
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Abstract
本发明涉及一种利用热应变诱导宽温区电卡效应PLZST基薄膜的制备方法,属于化学工程技术领域。一种利用热应变诱导宽温区电卡效应PLZST基薄膜的制备方法,包括以下步骤:将LaNiO3前驱体溶液旋涂于衬底上制得第一湿膜,将所得的第一湿膜干燥、热解,退火制得单层LaNiO3薄膜;重复以上步骤制得多层LaNiO3/Si(100)或LaNiO3/Pt(111)复合基底;将PLZST前驱体溶液旋涂于衬底上,制得第二湿膜;对所得的第二湿膜干燥、热解,制得单层PLZST薄膜;重复制得多层PLZST薄膜,其中在制备多层PLZST薄膜之前或之后还包括退火的步骤。本发明制备方法相对简单,可以通过改变衬底的种类和热处理方式来调控薄膜的结构和电卡性能。
Description
技术领域
本发明涉及一种利用热应变诱导宽温区电卡效应PLZST基薄膜的制备方法,属于化学工程技术领域。
背景技术
近年来,随着电子科技、信息和控制技术朝着微型化、高集成化方向的发展,以及高科技领域对于快速制冷的需求,基于铁电/反铁电薄膜/厚膜中电卡制冷的研究越来越多。与基于磁卡效应的磁制冷的快速发展相比,电卡制冷在过去很长一段时间里几乎没有进展,因为只能观察到较小的△T和△S,直至2006年才在反铁电PZT薄膜中发现了大的电卡效应(△T=12k,△S=8JK-1kg-1)。然而,实际商业应用中除了需要较大的△T值和高冷却效率外,还需要一个宽广的的操作温度范围。
发明内容
本发明的目的在于提供一种利用热应变诱导宽温区电卡效应PLZST基薄膜的制备方法。本发明通过利用具有宽温区、大的电卡效应铁电体材料PbxLa(1-x)(ZrySnzTi(1-y-z))O3(PLZST),是一种具有宽温区、大的电卡效应铁电体材料,通过溶胶凝胶合成法在不同基底上面、采用不同的热处理制备出的PLZST薄膜材料,可以通过改变衬底的种类和热处理方式来调控薄膜的电卡性能。
本发明的目的通过如下技术方案实现:
一种利用热应变诱导宽温区电卡效应PLZST基薄膜的制备方法,包括以下步骤:
1)将LaNiO3前驱体溶液旋涂于衬底上制得第一湿膜,所述衬底为Si(100)或Pt(111);
2)将步骤1)所得的第一湿膜干燥、热解,退火制得单层LaNiO3薄膜;
3)重复步骤1)和步骤2),制得多层LaNiO3/Si(100)或LaNiO3/Pt(111)复合基底;
4)将PLZST前驱体溶液旋涂于衬底上,制得第二湿膜,所述衬底为Pt(111)、步骤3)制得的多层LaNiO3/Si(100)复合基底、步骤3制得的LaNiO3/Pt(111)复合基底中的任一一种;
5)当衬底为Pt(111)或LaNiO3/Si(100)复合基底时,按照如下步骤进行处理制得一层PLZST薄膜,
5-1)、将第二湿膜干燥、热解、退火制得一层PLZST薄膜,
当衬底为LaNiO3/Pt(111)复合基底时,可按照以下任一步骤进行处理制得一层PLZST,
5-2)、将第二湿膜干燥、热解、退火制得一层PLZST薄膜,
5-3)、将第二湿膜干燥、热解制得一层PLZST薄膜;
6)按照如下任一步骤进行处理制备多层PLZST薄膜:
6-1)、重复步骤4)和步骤5-1)制得多层PLZST薄膜,
6-2)、重复步骤4)和步骤5-2)制得多层PLZST薄膜;
6-3)、重复步骤4)和步骤5-3)制得未退火的PLZST薄膜,退火制得完全退火的多层PLZST薄膜。
优选的是,步骤1)所述的LaNiO3前驱体溶液浓度为0.2-0.3M。
优选的是,步骤1)所述旋涂转速为4000-6000rpm,旋涂时间为30-60s。
优选的是,步骤2)所述干燥温度为120-250℃,干燥时间为3-5min,所述热解温度为400-550℃,热解时间为3-5min,所述退火温度为700-800℃,退火时间为3-5min,退火环境为空气氛围。
优选的是,步骤3)制得6层LaNiO3薄膜。
优选的是,步骤4)所述的PLZST通式为PbxLa(1-x)(ZrySnzTi(1-y-z))O3,其中0<x<1,0<y<1,0<z<1,所述的PLZST前驱体溶液浓度为0.2-0.3M。
优选的是,步骤4)所述旋涂转速为4000-6000rpm,旋涂时间为30-60s。
优选的是,步骤5-1)、步骤5-2)和步骤5-3)所述干燥温度均为120-250℃,干燥时间均为3-5min,所述热解温度均为400-550℃,热解时间均为3-5min,步骤5-1)和步骤5-2)所述退火温度均为700-800℃,退火时间均为3-5min,退火环境均为空气氛围。
优选的是,步骤6-1)、步骤6-2)、步骤6-3)重复次数均为8次。
优选的是,步骤6-3)所述退火温度为700-800℃,退火时间为30-60min,退火环境为空气氛围。
本发明的有益效果是:获得具有纯度高、致密性好、平均晶粒尺寸小、电场击穿强度大、电卡效应大、操作温度范围广等优点的薄膜;本发明制备方法相对简单,可以通过改变衬底的种类和热处理方式来调控薄膜的结构和电卡性能,是一种方便快捷的制备技术。
附图说明
图1为本发明实施例1得到的PLZST薄膜的电卡性能;
图2为本发明实施例2得到的PLZST薄膜的电卡性能;
图3为本发明实施例3得到的PLZST薄膜的电卡性能;
图4为本发明实施例4得到的PLZST薄膜的电卡性能。
具体实施方式
下面结合具体实施例,对本发明作进一步详细的阐述,但本发明的实施方式并不局限于实施例表示的范围。这些实施例仅用于说明本发明,而非用于限制本发明的范围。此外,在阅读本发明的内容后,本领域的技术人员可以对本发明作各种修改,这些等价变化同样落于本发明所附权利要求书所限定的范围。
实施例1
(1)按照摩尔比(1.05×0.5):0.2:0.5:0.1:0.7分别称取5%过量Pb的Pb(CH3COO)3、Sn(CH3COO)4、La(OC2H5)3、Zr(OC3H7)4和Ti(OCH(CH3)2)4制备Pb0.5La0.5(Zr0.1Sn0.2Ti0.7)O3前驱体溶液。
将过量Pb的Pb(CH3COO)3、Sn(CH3COO)4和La(OC2H5)3于100℃溶解在冰醋酸中得到Pb/Sn/La溶液,同时将Zr(OC3H7)4和Ti(OCH(CH3)2)4于室温溶解在冰醋酸和CH3COCH2COCH3的混合溶液中得到Zr/Ti溶液,然后将Pb/Sn/La溶液和Zr/Ti溶液混合并于50℃下搅拌30min,接着在混合Pb/Sn/La/Zr/Ti溶液中加入适当的添加剂(乳酸、1-丙醇和水)并放置20h,最后得到浓度为0.2M的Pb0.5La0.5(Zr0.1Sn0.2Ti0.7)O3前驱体溶液;
(2)将步骤(1)得到的PLZST前驱体溶液使用匀胶机以4000rpm的转速分别旋涂30s在Pt(111)衬底上面,得到湿膜;
(3)将步骤(2)制得的湿膜首先在120℃干燥3min,然后在400℃热解3min,最后在700℃于空气氛围中退火3min,得到一层PLZST薄膜;
(4)重复步骤(2)和步骤(3)8次,得到8层PLZST薄膜。
实施例2
(1)按照摩尔比1:1分别称取原料Ni(CH3COO)2、La(NO3)3于室温溶解在冰醋酸、水和甲酰胺的混合溶液中。然后将溶液放置20h,最后得到浓度为0.2M的LaNiO3前驱体溶液;
(2)将步骤(1)得到的LaNiO3前驱体溶液使用匀胶机以4000rpm的转速旋涂30s在Si(100)衬底上面,得到第一湿膜;
(3)将步骤(2)制得的湿膜首先在120℃干燥3min,然后在400℃热解3min,最后在700℃于空气氛围中退火3min,得到一层LaNiO3薄膜;
(4)重复步骤(2)和步骤(3)6次,得到具有6层LaNiO3的LaNiO3/Si(100)复合基底;
(5)按照摩尔比(1.05×0.5):0.2:0.5:0.1:0.7分别称取5%过量Pb的Pb(CH3COO)3、Sn(CH3COO)4、La(OC2H5)3、Zr(OC3H7)4和Ti(OCH(CH3)2)4制备Pb0.5La0.5(Zr0.1Sn0.2Ti0.7)O3前驱体溶液。
将过量Pb的Pb(CH3COO)3、Sn(CH3COO)4和La(OC2H5)3于120℃溶解在冰醋酸中得到Pb/Sn/La溶液,同时将Zr(OC3H7)4和Ti(OCH(CH3)2)4于室温溶解在冰醋酸和CH3COCH2COCH3的混合溶液中得到Zr/Ti溶液,然后将Pb/Sn/La溶液和Zr/Ti溶液混合并于50℃下搅拌30min,接着在混合Pb/Sn/La/Zr/Ti溶液中加入适当的添加剂(乳酸、1-丙醇和水)并放置20h,最后得到浓度为0.2M的Pb0.5La0.5(Zr0.1Sn0.2Ti0.7)O3前驱体溶液前驱体溶液;
(6)将步骤(5)得到的PLZST前驱体溶液使用匀胶机以4000rpm的转速旋涂30s在步骤(4)得到的LaNiO3/Si(100)复合基底上面,得到第二湿膜;
(7)将步骤(6)制得的湿膜首先在120℃干燥3min,然后在400℃热解3min,最后在700℃于空气氛围中退火3min,得到一层PLZST薄膜;
(8)重复步骤(6)和步骤(7)8次,得到8层PLZST薄膜。
实施例3
(1)按照摩尔比1:1分别称取原料Ni(CH3COO)2、La(NO3)3于室温溶解在冰醋酸、水和甲酰胺的混合溶液中。然后将溶液放置25h,最后得到浓度为0.25M的LaNiO3前驱体溶液;
(2)将步骤(1)得到的LaNiO3前驱体溶液使用匀胶机以5000rpm的转速旋涂40s在Pt(111)衬底上面,得到第一湿膜;
(3)将步骤(2)制得的湿膜首先在200℃干燥4min,然后在450℃热解4min,最后在750℃于空气氛围中退火4min,得到一层LaNiO3薄膜;
(4)重复步骤(2)和步骤(3)6次,得到具有6层LaNiO3的LaNiO3/Pt(111)复合基底;
(5)按照摩尔比(1.05×0.1):0.3:0.9:0.2:0.5分别称取5%过量Pb的Pb(CH3COO)3、Sn(CH3COO)4、La(OC2H5)3、Zr(OC3H7)4和Ti(OCH(CH3)2)4制备Pb0.1La0.9(Zr0.2Sn0.3Ti0.5)O3前驱体溶液。
将过量Pb的Pb(CH3COO)3、Sn(CH3COO)4和La(OC2H5)3于110℃溶解在冰醋酸中得到Pb/Sn/La溶液,同时将Zr(OC3H7)4和Ti(OCH(CH3)2)4于室温溶解在冰醋酸和CH3COCH2COCH3的混合溶液中得到Zr/Ti溶液,然后将Pb/Sn/La溶液和Zr/Ti溶液混合并于80℃下搅拌35min,接着在混合Pb/Sn/La/Zr/Ti溶液中加入适当的添加剂(乳酸、1-丙醇和水)并放置25h,最后得到浓度为0.25M的Pb0.1La0.9(Zr0.2Sn0.3Ti0.5)O3前驱体溶液;
(6)将步骤(5)得到的PLZST前驱体溶液使用匀胶机以5000rpm的转速旋涂35s在步骤(4)得到的LaNiO3/Pt(111)复合基底上面,得到第二湿膜;
(7)将步骤(6)制得的湿膜首先在200℃干燥4min,然后在450℃热解4min,最后在750℃于空气氛围中退火4min,得到一层PLZST薄膜;
(8)重复步骤(6)和步骤(7)8次,得到8层PLZST薄膜。
实施例4
(1)按照摩尔比1:1分别称取原料Ni(CH3COO)2、La(NO3)3于室温溶解在冰醋酸、水和甲酰胺的混合溶液中。然后将溶液放置30h,最后得到浓度为0.3M的LaNiO3前驱体溶液;
(2)将步骤(1)得到的LaNiO3前驱体溶液使用匀胶机以6000rpm的转速旋涂60s在Pt(111)衬底上面,得到第一湿膜;
(3)将步骤(2)制得的湿膜首先在250℃干燥5min,然后在550℃热解5min,最后在800℃于空气氛围中退火5min,得到一层LaNiO3薄膜;
(4)重复步骤(2)和步骤(3)6次,得到具有6层LaNiO3的LaNiO3/Pt(111)复合基底;
(5)按照摩尔比(1.05×0.1):0.3:0.9:0.2:0.5分别称取5%过量Pb的Pb(CH3COO)3、Sn(CH3COO)4、La(OC2H5)3、Zr(OC3H7)4和Ti(OCH(CH3)2)4制备Pb0.1La0.9(Zr0.2Sn0.3Ti0.5)O3前驱体溶液。
将过量Pb的Pb(CH3COO)3、Sn(CH3COO)4和La(OC2H5)3于120℃溶解在冰醋酸中得到Pb/Sn/La溶液,同时将Zr(OC3H7)4和Ti(OCH(CH3)2)4于室温溶解在冰醋酸和CH3COCH2COCH3的混合溶液中得到Zr/Ti溶液,然后将Pb/Sn/La溶液和Zr/Ti溶液混合并于100℃下搅拌45min,接着在混合Pb/Sn/La/Zr/Ti溶液中加入适当的添加剂(乳酸、1-丙醇和水)并放置30h,最后得到浓度为0.3M的Pb0.1La0.9(Zr0.2Sn0.3Ti0.5)O3前驱体溶液;
(6)将步骤(5)得到的PLZST前驱体溶液使用匀胶机以6000rpm的转速旋涂60s在步骤(4)得到的LaNiO3/Pt(111)复合基底上面,得到第二湿膜;
(7)将步骤(6)得到的湿膜首先在250℃干燥5min,然后在550℃热解5min,得到一层未退火的PLZST薄膜;
(8)重复步骤(6)和步骤(7)8次,得到8层未退火的PLZST薄膜;
(9)将步骤(8)得到的未退火的PLZST薄膜在800℃于空气氛围中退火60min,得到完全退火的PLZST薄膜。
实施例5
采用与实施例3相同的方法制备PLZST薄膜,不同的是,步骤(7)的退火温度为800℃,退火时间为5min。
实施例6
采用与实施例4相同的方法制备PLZST薄膜,不同的是,步骤(9)的退火温度为700℃,退火时间为30min。
本发明制备方法相对简单,适合推广使用,制备所得的薄膜性能良好,满足使用要求。
Claims (10)
1.一种利用热应变诱导宽温区电卡效应PLZST基薄膜的制备方法,其特征在于,所述方法包括以下步骤:
1)将LaNiO3前驱体溶液旋涂于衬底上制得第一湿膜,所述衬底为Si(100)或Pt(111);
2)将步骤1)所得的第一湿膜干燥、热解,退火制得单层LaNiO3薄膜;
3)重复步骤1)和步骤2),制得多层LaNiO3/Si(100)或LaNiO3/Pt(111)复合基底;
4)将PLZST前驱体溶液旋涂于衬底上,制得第二湿膜,所述衬底为Pt(111)、步骤3)制得的多层LaNiO3/Si(100)复合基底、步骤3制得的LaNiO3/Pt(111)复合基底中的任一一种;
5)当衬底为Pt(111)或LaNiO3/Si(100)复合基底时,按照如下步骤进行处理制得一层PLZST薄膜,
步骤5-1)、将第二湿膜干燥、热解、退火制得一层PLZST薄膜,
当衬底为LaNiO3/Pt(111)复合基底时,可按照以下任一步骤进行处理制得一层PLZST,
5-2)、将第二湿膜干燥、热解、退火制得一层PLZST薄膜,
5-3)、将第二湿膜干燥、热解制得一层PLZST薄膜;
6)按照如下任一步骤进行处理制备多层PLZST薄膜:
6-1)、重复步骤4)和步骤5-1)制得多层PLZST薄膜,
6-2)、重复步骤4)和步骤5-2)制得多层PLZST薄膜,
6-3)、重复步骤4)和步骤5-3)制得未退火的PLZST薄膜,退火制得完全退火的多层PLZST薄膜。
2.根据权利要求1所述的利用热应变诱导宽温区电卡效应PLZST基薄膜的制备方法,其特征在于,步骤1)所述的LaNiO3前驱体溶液浓度为0.2-0.3M。
3.根据权利要求1所述的利用热应变诱导宽温区电卡效应PLZST基薄膜的制备方法,其特征在于,步骤1)所述旋涂转速为4000-6000rpm,旋涂时间为30-60s。
4.根据权利要求1所述的利用热应变诱导宽温区电卡效应PLZST基薄膜的制备方法,其特征在于,步骤2)所述干燥温度为120-250℃,干燥时间为3-5min,所述热解温度为400-550℃,热解时间为3-5min,所述退火温度为700-800℃,退火时间为3-5min,退火环境为空气氛围。
5.根据权利要求1所述的利用热应变诱导宽温区电卡效应PLZST基薄膜的制备方法,其特征在于,步骤3)制得6层LaNiO3薄膜。
6.根据权利要求1所述的利用热应变诱导宽温区电卡效应PLZST基薄膜的制备方法,其特征在于,步骤4)所述的PLZST通式为PbxLa(1-x)(ZrySnzTi(1-y-z))O3,其中0<x<1,0<y<1,0<z<1,所述的PLZST前驱体溶液浓度为0.2-0.3M。
7.根据权利要求1所述的利用热应变诱导宽温区电卡效应PLZST基薄膜的制备方法,其特征在于,步骤4)所述旋涂转速为4000-6000rpm,旋涂时间为30-60s。
8.根据权利要求1所述的利用热应变诱导宽温区电卡效应PLZST基薄膜的制备方法,其特征在于,步骤5-1)、步骤5-2)和步骤5-3)所述干燥温度均为120-250℃,干燥时间均为3-5min,所述热解温度均为400-550℃,热解时间均为3-5min,步骤5-1)和步骤5-2)所述退火温度均为700-800℃,退火时间均为3-5min,退火环境均为空气氛围。
9.根据权利要求1所述的利用热应变诱导宽温区电卡效应PLZST基薄膜的制备方法,其特征在于,步骤6-1)、步骤6-2)、步骤6-3)重复次数均为8次。
10.根据权利要求1所述的利用热应变诱导宽温区电卡效应PLZST基薄膜的制备方法,其特征在于,步骤6-3)所述退火温度为700-800℃,退火时间为30-60min,退火环境为空气氛围。
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