CN111954454A - 部件安装装置 - Google Patents

部件安装装置 Download PDF

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Publication number
CN111954454A
CN111954454A CN202010352925.8A CN202010352925A CN111954454A CN 111954454 A CN111954454 A CN 111954454A CN 202010352925 A CN202010352925 A CN 202010352925A CN 111954454 A CN111954454 A CN 111954454A
Authority
CN
China
Prior art keywords
electronic component
component
camera
nozzle
head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010352925.8A
Other languages
English (en)
Chinese (zh)
Inventor
山本邦雄
松尾诚一
小仓环树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Publication of CN111954454A publication Critical patent/CN111954454A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0406—Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
CN202010352925.8A 2019-05-17 2020-04-28 部件安装装置 Pending CN111954454A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019093456A JP7300580B2 (ja) 2019-05-17 2019-05-17 部品実装装置
JP2019-093456 2019-05-17

Publications (1)

Publication Number Publication Date
CN111954454A true CN111954454A (zh) 2020-11-17

Family

ID=73222490

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010352925.8A Pending CN111954454A (zh) 2019-05-17 2020-04-28 部件安装装置

Country Status (2)

Country Link
JP (1) JP7300580B2 (ja)
CN (1) CN111954454A (ja)

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0449481A1 (en) * 1990-03-19 1991-10-02 Hitachi, Ltd. Component transporting apparatus and method
JP2003133799A (ja) * 2001-10-29 2003-05-09 Matsushita Electric Ind Co Ltd 電子部品実装装置
JP2005050887A (ja) * 2003-07-30 2005-02-24 Juki Corp 電子部品実装装置
US20080045797A1 (en) * 2004-07-02 2008-02-21 Osaka University Endoscope Attachment And Endoscope
JP2011086847A (ja) * 2009-10-19 2011-04-28 Juki Corp 電子部品実装装置
CN103108114A (zh) * 2011-11-10 2013-05-15 特拉华资本构造公司 用于对准印刷电路板的元件的相机系统
WO2014174598A1 (ja) * 2013-04-24 2014-10-30 株式会社日立製作所 部品実装装置、実装ヘッド、および制御装置
CN104869801A (zh) * 2014-02-26 2015-08-26 Juki株式会社 电子部件安装装置以及电子部件安装方法
US20160150689A1 (en) * 2013-07-08 2016-05-26 Fuji Machine Mfg. Co., Ltd. Component holding state detection method and component mounting machine
US20160309630A1 (en) * 2013-12-02 2016-10-20 Fuji Machine Mfg. Co., Ltd. Assembling machine
JP2017220544A (ja) * 2016-06-07 2017-12-14 富士機械製造株式会社 部品実装機
CN107787178A (zh) * 2016-08-24 2018-03-09 Juki株式会社 安装头、安装装置、安装方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005274309A (ja) 2004-03-24 2005-10-06 Matsushita Electric Ind Co Ltd 三次元物体の検査方法および検査装置
JP4997124B2 (ja) 2008-01-21 2012-08-08 株式会社日立ハイテクインスツルメンツ 電子部品装着ヘッド及び電子部品装着装置
US11357148B2 (en) 2015-10-15 2022-06-07 Yamaha Hatsudoki Kabushiki Kaisha Component mounting device

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0449481A1 (en) * 1990-03-19 1991-10-02 Hitachi, Ltd. Component transporting apparatus and method
JP2003133799A (ja) * 2001-10-29 2003-05-09 Matsushita Electric Ind Co Ltd 電子部品実装装置
JP2005050887A (ja) * 2003-07-30 2005-02-24 Juki Corp 電子部品実装装置
US20080045797A1 (en) * 2004-07-02 2008-02-21 Osaka University Endoscope Attachment And Endoscope
JP2011086847A (ja) * 2009-10-19 2011-04-28 Juki Corp 電子部品実装装置
CN103108114A (zh) * 2011-11-10 2013-05-15 特拉华资本构造公司 用于对准印刷电路板的元件的相机系统
WO2014174598A1 (ja) * 2013-04-24 2014-10-30 株式会社日立製作所 部品実装装置、実装ヘッド、および制御装置
US20160150689A1 (en) * 2013-07-08 2016-05-26 Fuji Machine Mfg. Co., Ltd. Component holding state detection method and component mounting machine
US20160309630A1 (en) * 2013-12-02 2016-10-20 Fuji Machine Mfg. Co., Ltd. Assembling machine
CN104869801A (zh) * 2014-02-26 2015-08-26 Juki株式会社 电子部件安装装置以及电子部件安装方法
JP2017220544A (ja) * 2016-06-07 2017-12-14 富士機械製造株式会社 部品実装機
CN107787178A (zh) * 2016-08-24 2018-03-09 Juki株式会社 安装头、安装装置、安装方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
李洋;刘今越;郭志红;刘秀丽;戴士杰;: "SMT模板检测系统及误差校正方法", 电子测量与仪器学报, no. 10, 15 October 2016 (2016-10-15) *

Also Published As

Publication number Publication date
JP2020188221A (ja) 2020-11-19
JP7300580B2 (ja) 2023-06-30

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