CN111937499A - 具有跳线的电气装置 - Google Patents

具有跳线的电气装置 Download PDF

Info

Publication number
CN111937499A
CN111937499A CN201980023512.0A CN201980023512A CN111937499A CN 111937499 A CN111937499 A CN 111937499A CN 201980023512 A CN201980023512 A CN 201980023512A CN 111937499 A CN111937499 A CN 111937499A
Authority
CN
China
Prior art keywords
electrical
channel
reservoir
substrate
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201980023512.0A
Other languages
English (en)
Chinese (zh)
Inventor
特雷莎·M·格代尔
安基特·马哈詹
米哈伊尔·L·佩库罗夫斯基
托马斯·J·梅茨勒
撒格尔·A·沙
卡拉·A·迈耶斯
乔纳森·W·肯灵
杰里米·K·拉森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of CN111937499A publication Critical patent/CN111937499A/zh
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Dispersion Chemistry (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN201980023512.0A 2018-04-02 2019-03-27 具有跳线的电气装置 Withdrawn CN111937499A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862651432P 2018-04-02 2018-04-02
US62/651,432 2018-04-02
PCT/IB2019/052491 WO2019193457A1 (en) 2018-04-02 2019-03-27 Electrical device having jumper

Publications (1)

Publication Number Publication Date
CN111937499A true CN111937499A (zh) 2020-11-13

Family

ID=66397337

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980023512.0A Withdrawn CN111937499A (zh) 2018-04-02 2019-03-27 具有跳线的电气装置

Country Status (6)

Country Link
US (1) US20210235586A1 (https=)
EP (1) EP3777489A1 (https=)
JP (1) JP2021520070A (https=)
CN (1) CN111937499A (https=)
TW (1) TW201943153A (https=)
WO (1) WO2019193457A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115023807B (zh) 2020-01-24 2026-01-30 3M创新有限公司 与嵌入式电子部件的电气连接

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050116387A1 (en) * 2003-12-01 2005-06-02 Davison Peter A. Component packaging apparatus, systems, and methods
US20060027036A1 (en) * 2004-08-05 2006-02-09 Biggs Todd L Methods and apparatuses for imprinting substrates
JP2006339366A (ja) * 2005-06-01 2006-12-14 Mitsui Mining & Smelting Co Ltd 配線基板形成用モールドおよびその製造方法
US7468330B2 (en) * 2006-04-05 2008-12-23 International Business Machines Corporation Imprint process using polyhedral oligomeric silsesquioxane based imprint materials
US20110088573A1 (en) * 2009-09-29 2011-04-21 Jacobson Joseph M Method and system for printing by capillary embossing
JP2014123652A (ja) * 2012-12-21 2014-07-03 Nippon Mektron Ltd 配線基板、タッチパネルセンサシート、および配線基板製造方法
US9215798B2 (en) * 2013-03-05 2015-12-15 Eastman Kodak Company Imprinted multi-layer micro-structure method with multi-level stamp
US9167684B2 (en) * 2013-05-24 2015-10-20 Nokia Technologies Oy Apparatus and method for forming printed circuit board using fluid reservoirs and connected fluid channels
JP2015026771A (ja) * 2013-07-29 2015-02-05 株式会社フジクラ 回路基板の製造方法
JP2015088516A (ja) * 2013-10-28 2015-05-07 東レエンジニアリング株式会社 配線基板の製造方法及びそれに使用されるインクジェット塗布装置
US9401306B2 (en) 2013-11-11 2016-07-26 Regents Of The University Of Minnesota Self-aligned capillarity-assisted microfabrication

Also Published As

Publication number Publication date
WO2019193457A1 (en) 2019-10-10
EP3777489A1 (en) 2021-02-17
TW201943153A (zh) 2019-11-01
JP2021520070A (ja) 2021-08-12
US20210235586A1 (en) 2021-07-29

Similar Documents

Publication Publication Date Title
EP3148298B1 (en) Manufacturing method of printing circuit board with micro-radiators
CN101785101B (zh) 微电子封装元件及其制备方法
CN108417559A (zh) 半导体封装装置及其制造方法
JP2005142523A (ja) 埋設抵抗を有する印刷回路基板の製造方法
JP2014524671A (ja) 回路基板
JP2007142406A (ja) エンベデッド印刷回路基板の製作方法
CN102725804B (zh) 用于高功率耗散的带有端子的表面安装电阻及其制造方法
TW201306061A (zh) 具有軟性材料層之微電阻元件及其製造方法
US7353600B2 (en) Circuit board fabrication method and circuit board
JP4720462B2 (ja) フレキシブル回路基板およびその製造方法
CN111937499A (zh) 具有跳线的电气装置
CN106356351B (zh) 基板结构及其制作方法
JP2009016791A (ja) チップ抵抗器およびその製造方法
CN102903467B (zh) 具有软性材料层的微电阻元件及其制造方法
US20140029223A1 (en) Circuit board with reduced adhesive overflow and circuit structure thereof
CN112154539A (zh) 包括电路管芯的超薄且柔性的装置
JP3523418B2 (ja) 配線基板
JP2002270726A (ja) 半導体装置およびその製造方法
KR101376750B1 (ko) 연성 인쇄회로기판 및 그 제조방법
KR101023950B1 (ko) 전도성 폴리머 범프를 갖는 칩 및 그 제조방법과, 칩을 구비한 전자부품 및 그 제조방법
JP2010258301A (ja) インターポーザ及び半導体装置
CN118215236A (zh) 封装基板及其制作方法
JP6001475B2 (ja) 配線基板
TWI440410B (zh) 具有埋入零件之組合式電路板結構及其製造方法
JP5307704B2 (ja) 配線板および配線板の製造法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WW01 Invention patent application withdrawn after publication

Application publication date: 20201113

WW01 Invention patent application withdrawn after publication