JP2021520070A - ジャンパを有する電気デバイス - Google Patents

ジャンパを有する電気デバイス Download PDF

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Publication number
JP2021520070A
JP2021520070A JP2020553645A JP2020553645A JP2021520070A JP 2021520070 A JP2021520070 A JP 2021520070A JP 2020553645 A JP2020553645 A JP 2020553645A JP 2020553645 A JP2020553645 A JP 2020553645A JP 2021520070 A JP2021520070 A JP 2021520070A
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JP
Japan
Prior art keywords
electrical
reservoir
channel
stamp
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2020553645A
Other languages
English (en)
Japanese (ja)
Other versions
JP2021520070A5 (https=
Inventor
エム． ゲデール，テレサ
エム． ゲデール，テレサ
マハジャン，アンキット
エル． ペクロフスキー，ミカイル
エル． ペクロフスキー，ミカイル
ジェイ． メッツラー，トーマス
ジェイ． メッツラー，トーマス
エー． シャー，セーガー
エー． シャー，セーガー
エー． メイヤー，カラ
エー． メイヤー，カラ
ダブリュ． ケムリング，ジョナサン
ダブリュ． ケムリング，ジョナサン
ケー． ラーセン，ジェレミー
ケー． ラーセン，ジェレミー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2021520070A publication Critical patent/JP2021520070A/ja
Publication of JP2021520070A5 publication Critical patent/JP2021520070A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Dispersion Chemistry (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2020553645A 2018-04-02 2019-03-27 ジャンパを有する電気デバイス Pending JP2021520070A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862651432P 2018-04-02 2018-04-02
US62/651,432 2018-04-02
PCT/IB2019/052491 WO2019193457A1 (en) 2018-04-02 2019-03-27 Electrical device having jumper

Publications (2)

Publication Number Publication Date
JP2021520070A true JP2021520070A (ja) 2021-08-12
JP2021520070A5 JP2021520070A5 (https=) 2022-04-01

Family

ID=66397337

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020553645A Pending JP2021520070A (ja) 2018-04-02 2019-03-27 ジャンパを有する電気デバイス

Country Status (6)

Country Link
US (1) US20210235586A1 (https=)
EP (1) EP3777489A1 (https=)
JP (1) JP2021520070A (https=)
CN (1) CN111937499A (https=)
TW (1) TW201943153A (https=)
WO (1) WO2019193457A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115023807B (zh) 2020-01-24 2026-01-30 3M创新有限公司 与嵌入式电子部件的电气连接

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006339366A (ja) * 2005-06-01 2006-12-14 Mitsui Mining & Smelting Co Ltd 配線基板形成用モールドおよびその製造方法
US20070238317A1 (en) * 2006-04-05 2007-10-11 International Business Machines Corporation Polyhedral oligomeric silsesquioxane based imprint materials and imprint process using polyhedral oligomeric silsesquioxane based imprint materials
US20080023817A1 (en) * 2003-12-01 2008-01-31 Intel Corporation Component packaging apparatus, systems, and methods
JP2014123652A (ja) * 2012-12-21 2014-07-03 Nippon Mektron Ltd 配線基板、タッチパネルセンサシート、および配線基板製造方法
JP2015026771A (ja) * 2013-07-29 2015-02-05 株式会社フジクラ 回路基板の製造方法
US20150060111A1 (en) * 2013-03-05 2015-03-05 Ronald Steven Cok Imprinted multi-layer micro-structure
JP2015088516A (ja) * 2013-10-28 2015-05-07 東レエンジニアリング株式会社 配線基板の製造方法及びそれに使用されるインクジェット塗布装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060027036A1 (en) * 2004-08-05 2006-02-09 Biggs Todd L Methods and apparatuses for imprinting substrates
US20110088573A1 (en) * 2009-09-29 2011-04-21 Jacobson Joseph M Method and system for printing by capillary embossing
US9167684B2 (en) * 2013-05-24 2015-10-20 Nokia Technologies Oy Apparatus and method for forming printed circuit board using fluid reservoirs and connected fluid channels
US9401306B2 (en) 2013-11-11 2016-07-26 Regents Of The University Of Minnesota Self-aligned capillarity-assisted microfabrication

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080023817A1 (en) * 2003-12-01 2008-01-31 Intel Corporation Component packaging apparatus, systems, and methods
JP2006339366A (ja) * 2005-06-01 2006-12-14 Mitsui Mining & Smelting Co Ltd 配線基板形成用モールドおよびその製造方法
US20070238317A1 (en) * 2006-04-05 2007-10-11 International Business Machines Corporation Polyhedral oligomeric silsesquioxane based imprint materials and imprint process using polyhedral oligomeric silsesquioxane based imprint materials
JP2014123652A (ja) * 2012-12-21 2014-07-03 Nippon Mektron Ltd 配線基板、タッチパネルセンサシート、および配線基板製造方法
US20150060111A1 (en) * 2013-03-05 2015-03-05 Ronald Steven Cok Imprinted multi-layer micro-structure
JP2015026771A (ja) * 2013-07-29 2015-02-05 株式会社フジクラ 回路基板の製造方法
JP2015088516A (ja) * 2013-10-28 2015-05-07 東レエンジニアリング株式会社 配線基板の製造方法及びそれに使用されるインクジェット塗布装置

Also Published As

Publication number Publication date
WO2019193457A1 (en) 2019-10-10
EP3777489A1 (en) 2021-02-17
TW201943153A (zh) 2019-11-01
CN111937499A (zh) 2020-11-13
US20210235586A1 (en) 2021-07-29

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