JP2021520070A5 - - Google Patents
Info
- Publication number
- JP2021520070A5 JP2021520070A5 JP2020553645A JP2020553645A JP2021520070A5 JP 2021520070 A5 JP2021520070 A5 JP 2021520070A5 JP 2020553645 A JP2020553645 A JP 2020553645A JP 2020553645 A JP2020553645 A JP 2020553645A JP 2021520070 A5 JP2021520070 A5 JP 2021520070A5
- Authority
- JP
- Japan
- Prior art keywords
- electrical
- electrical contact
- main surface
- stamp
- reservoir
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862651432P | 2018-04-02 | 2018-04-02 | |
| US62/651,432 | 2018-04-02 | ||
| PCT/IB2019/052491 WO2019193457A1 (en) | 2018-04-02 | 2019-03-27 | Electrical device having jumper |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2021520070A JP2021520070A (ja) | 2021-08-12 |
| JP2021520070A5 true JP2021520070A5 (https=) | 2022-04-01 |
Family
ID=66397337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020553645A Pending JP2021520070A (ja) | 2018-04-02 | 2019-03-27 | ジャンパを有する電気デバイス |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20210235586A1 (https=) |
| EP (1) | EP3777489A1 (https=) |
| JP (1) | JP2021520070A (https=) |
| CN (1) | CN111937499A (https=) |
| TW (1) | TW201943153A (https=) |
| WO (1) | WO2019193457A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115023807B (zh) | 2020-01-24 | 2026-01-30 | 3M创新有限公司 | 与嵌入式电子部件的电气连接 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050116387A1 (en) * | 2003-12-01 | 2005-06-02 | Davison Peter A. | Component packaging apparatus, systems, and methods |
| US20060027036A1 (en) * | 2004-08-05 | 2006-02-09 | Biggs Todd L | Methods and apparatuses for imprinting substrates |
| JP2006339366A (ja) * | 2005-06-01 | 2006-12-14 | Mitsui Mining & Smelting Co Ltd | 配線基板形成用モールドおよびその製造方法 |
| US7468330B2 (en) * | 2006-04-05 | 2008-12-23 | International Business Machines Corporation | Imprint process using polyhedral oligomeric silsesquioxane based imprint materials |
| US20110088573A1 (en) * | 2009-09-29 | 2011-04-21 | Jacobson Joseph M | Method and system for printing by capillary embossing |
| JP2014123652A (ja) * | 2012-12-21 | 2014-07-03 | Nippon Mektron Ltd | 配線基板、タッチパネルセンサシート、および配線基板製造方法 |
| US9215798B2 (en) * | 2013-03-05 | 2015-12-15 | Eastman Kodak Company | Imprinted multi-layer micro-structure method with multi-level stamp |
| US9167684B2 (en) * | 2013-05-24 | 2015-10-20 | Nokia Technologies Oy | Apparatus and method for forming printed circuit board using fluid reservoirs and connected fluid channels |
| JP2015026771A (ja) * | 2013-07-29 | 2015-02-05 | 株式会社フジクラ | 回路基板の製造方法 |
| JP2015088516A (ja) * | 2013-10-28 | 2015-05-07 | 東レエンジニアリング株式会社 | 配線基板の製造方法及びそれに使用されるインクジェット塗布装置 |
| US9401306B2 (en) | 2013-11-11 | 2016-07-26 | Regents Of The University Of Minnesota | Self-aligned capillarity-assisted microfabrication |
-
2019
- 2019-03-27 US US16/948,657 patent/US20210235586A1/en not_active Abandoned
- 2019-03-27 WO PCT/IB2019/052491 patent/WO2019193457A1/en not_active Ceased
- 2019-03-27 CN CN201980023512.0A patent/CN111937499A/zh not_active Withdrawn
- 2019-03-27 JP JP2020553645A patent/JP2021520070A/ja active Pending
- 2019-03-27 EP EP19721781.3A patent/EP3777489A1/en not_active Withdrawn
- 2019-04-01 TW TW108111463A patent/TW201943153A/zh unknown
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