JP2022500874A5 - - Google Patents
Info
- Publication number
- JP2022500874A5 JP2022500874A5 JP2021514577A JP2021514577A JP2022500874A5 JP 2022500874 A5 JP2022500874 A5 JP 2022500874A5 JP 2021514577 A JP2021514577 A JP 2021514577A JP 2021514577 A JP2021514577 A JP 2021514577A JP 2022500874 A5 JP2022500874 A5 JP 2022500874A5
- Authority
- JP
- Japan
- Prior art keywords
- channels
- flexible substrate
- circuit die
- channel
- alignment region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862732280P | 2018-09-17 | 2018-09-17 | |
| US62/732,280 | 2018-09-17 | ||
| US201862783551P | 2018-12-21 | 2018-12-21 | |
| US62/783,551 | 2018-12-21 | ||
| PCT/IB2019/057719 WO2020058815A1 (en) | 2018-09-17 | 2019-09-12 | Flexible device including conductive traces with enhanced stretchability |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022500874A JP2022500874A (ja) | 2022-01-04 |
| JP2022500874A5 true JP2022500874A5 (https=) | 2022-09-20 |
| JP7641893B2 JP7641893B2 (ja) | 2025-03-07 |
Family
ID=69888417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021514577A Active JP7641893B2 (ja) | 2018-09-17 | 2019-09-12 | 伸縮性が向上した導電性トレースを含むフレキシブルデバイス |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US11503720B2 (https=) |
| EP (1) | EP3853894A4 (https=) |
| JP (1) | JP7641893B2 (https=) |
| CN (1) | CN112673471A (https=) |
| WO (1) | WO2020058815A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7762209B2 (ja) * | 2022-07-08 | 2025-10-29 | 積水化学工業株式会社 | 導電ペースト、ｒｆｉｄインレイ、ｒｆｉｄインレイの製造方法、チップを接着するための導電ペーストの使用、及びｒｆｉｄインレイを得るための導電ペーストの使用 |
| CN116011494A (zh) * | 2022-09-06 | 2023-04-25 | 中国科学院软件研究所 | 一种基于微流控技术的多芯片rfid传感装置 |
| CN115665994B (zh) * | 2022-10-28 | 2024-12-31 | 哈尔滨工业大学 | 一种柔性多层电路板的制备方法 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07122827A (ja) * | 1993-10-26 | 1995-05-12 | Sony Corp | 電子部品実装用基板 |
| JP3129960B2 (ja) * | 1996-02-27 | 2001-01-31 | シャープ株式会社 | Ｆｐｃ上のベアチップｉｃの樹脂封止構造およびその製造方法 |
| JP4649983B2 (ja) | 2004-12-27 | 2011-03-16 | 株式会社村田製作所 | 回路基板の製造方法 |
| JP2006332615A (ja) * | 2005-04-25 | 2006-12-07 | Brother Ind Ltd | パターン形成方法 |
| KR101450441B1 (ko) * | 2013-04-04 | 2014-10-13 | 홍익대학교 산학협력단 | 기판분리 층이 구비된 돌기 삽입형 신축성 기판과 그 제조방법 및 그 신축성 기판을 이용하여 이루어지는 신축성 전자소자 패키지와 그 제조방법 |
| US9167684B2 (en) | 2013-05-24 | 2015-10-20 | Nokia Technologies Oy | Apparatus and method for forming printed circuit board using fluid reservoirs and connected fluid channels |
| US9401306B2 (en) | 2013-11-11 | 2016-07-26 | Regents Of The University Of Minnesota | Self-aligned capillarity-assisted microfabrication |
| JP2015135901A (ja) | 2014-01-17 | 2015-07-27 | ＡｇＩＣ株式会社 | 組み替え回路装置、回路部品ユニットおよび印刷用画像データのデータ構造 |
| KR101984453B1 (ko) | 2014-05-28 | 2019-05-30 | 인텔 코포레이션 | 만곡 및 신축 가능한 장치를 위한 조립체와 그 제조 방법 |
| US9756702B2 (en) * | 2015-04-29 | 2017-09-05 | Samsung Electronics Co., Ltd. | Display device with adjustable rigidity |
| US20180352659A1 (en) * | 2015-12-11 | 2018-12-06 | Dic Corporation | Thermosetting material used for reinforcing flexible printed circuit board, reinforced flexible printed circuit board, method for producing the reinforced flexible printed circuit board, and electronic device |
| US9872390B1 (en) | 2016-08-17 | 2018-01-16 | Microsoft Technology Licensing, Llc | Flexible interconnect |
| JP7190430B2 (ja) | 2016-11-21 | 2022-12-15 | スリーエム イノベイティブ プロパティズ カンパニー | 回路ダイと相互接続部との間の自動位置合せ |
| CN111819686A (zh) | 2018-03-06 | 2020-10-23 | 3M创新有限公司 | 电路管芯和互连件之间的自动对准 |
-
2019
- 2019-09-12 US US17/270,912 patent/US11503720B2/en active Active
- 2019-09-12 WO PCT/IB2019/057719 patent/WO2020058815A1/en not_active Ceased
- 2019-09-12 CN CN201980059465.5A patent/CN112673471A/zh not_active Withdrawn
- 2019-09-12 JP JP2021514577A patent/JP7641893B2/ja active Active
- 2019-09-12 EP EP19862813.3A patent/EP3853894A4/en not_active Withdrawn
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