CN112673471A - 包括具有增强拉伸性的导电迹线的柔性装置 - Google Patents

包括具有增强拉伸性的导电迹线的柔性装置 Download PDF

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Publication number
CN112673471A
CN112673471A CN201980059465.5A CN201980059465A CN112673471A CN 112673471 A CN112673471 A CN 112673471A CN 201980059465 A CN201980059465 A CN 201980059465A CN 112673471 A CN112673471 A CN 112673471A
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China
Prior art keywords
channel
circuit die
flexible substrate
liquid
polymer
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CN201980059465.5A
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Chinese (zh)
Inventor
撒格尔·A·沙
米哈伊尔·L·佩库罗夫斯基
安基特·马哈詹
柳德米拉·A·佩库罗夫斯基
杰西卡·丘
杰里米·K·拉森
卡拉·A·迈耶斯
特雷莎·M·格代尔
托马斯·J·梅茨勒
乔纳森·W·肯灵
理查德·J·波科尔尼
本杰明·R·库恩斯
沙达·M·阿姆巴
托马斯·P·克伦
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication of CN112673471A publication Critical patent/CN112673471A/zh
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    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
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    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Structure Of Printed Boards (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
CN201980059465.5A 2018-09-17 2019-09-12 包括具有增强拉伸性的导电迹线的柔性装置 Withdrawn CN112673471A (zh)

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US201862783551P 2018-12-21 2018-12-21
US62/783,551 2018-12-21
PCT/IB2019/057719 WO2020058815A1 (en) 2018-09-17 2019-09-12 Flexible device including conductive traces with enhanced stretchability

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CN115665994B (zh) * 2022-10-28 2024-12-31 哈尔滨工业大学 一种柔性多层电路板的制备方法

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US20210212216A1 (en) 2021-07-08
US11503720B2 (en) 2022-11-15
WO2020058815A1 (en) 2020-03-26
JP7641893B2 (ja) 2025-03-07

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