TW201943153A - 具有跳線器的電氣裝置 - Google Patents
具有跳線器的電氣裝置 Download PDFInfo
- Publication number
- TW201943153A TW201943153A TW108111463A TW108111463A TW201943153A TW 201943153 A TW201943153 A TW 201943153A TW 108111463 A TW108111463 A TW 108111463A TW 108111463 A TW108111463 A TW 108111463A TW 201943153 A TW201943153 A TW 201943153A
- Authority
- TW
- Taiwan
- Prior art keywords
- electrical
- circuit system
- channel
- electrical contact
- electrical circuit
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 54
- 239000000463 material Substances 0.000 claims abstract description 49
- 238000000034 method Methods 0.000 claims abstract description 44
- 239000007788 liquid Substances 0.000 claims abstract description 43
- 238000003860 storage Methods 0.000 claims description 76
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 10
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims 1
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 claims 1
- 230000008569 process Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 70
- 238000001723 curing Methods 0.000 description 15
- 239000012530 fluid Substances 0.000 description 8
- 238000007639 printing Methods 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- -1 for example Substances 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000012776 electronic material Substances 0.000 description 2
- 229920002457 flexible plastic Polymers 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 229910001338 liquidmetal Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 150000003673 urethanes Chemical class 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- QSDSNNSKORVORL-UHFFFAOYSA-N acetic acid;silver Chemical compound [Ag].CC(O)=O QSDSNNSKORVORL-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000010616 electrical installation Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000000935 solvent evaporation Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4685—Manufacturing of cross-over conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0108—Male die used for patterning, punching or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Dispersion Chemistry (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862651432P | 2018-04-02 | 2018-04-02 | |
| US62/651,432 | 2018-04-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201943153A true TW201943153A (zh) | 2019-11-01 |
Family
ID=66397337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108111463A TW201943153A (zh) | 2018-04-02 | 2019-04-01 | 具有跳線器的電氣裝置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20210235586A1 (https=) |
| EP (1) | EP3777489A1 (https=) |
| JP (1) | JP2021520070A (https=) |
| CN (1) | CN111937499A (https=) |
| TW (1) | TW201943153A (https=) |
| WO (1) | WO2019193457A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115023807B (zh) | 2020-01-24 | 2026-01-30 | 3M创新有限公司 | 与嵌入式电子部件的电气连接 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050116387A1 (en) * | 2003-12-01 | 2005-06-02 | Davison Peter A. | Component packaging apparatus, systems, and methods |
| US20060027036A1 (en) * | 2004-08-05 | 2006-02-09 | Biggs Todd L | Methods and apparatuses for imprinting substrates |
| JP2006339366A (ja) * | 2005-06-01 | 2006-12-14 | Mitsui Mining & Smelting Co Ltd | 配線基板形成用モールドおよびその製造方法 |
| US7468330B2 (en) * | 2006-04-05 | 2008-12-23 | International Business Machines Corporation | Imprint process using polyhedral oligomeric silsesquioxane based imprint materials |
| US20110088573A1 (en) * | 2009-09-29 | 2011-04-21 | Jacobson Joseph M | Method and system for printing by capillary embossing |
| JP2014123652A (ja) * | 2012-12-21 | 2014-07-03 | Nippon Mektron Ltd | 配線基板、タッチパネルセンサシート、および配線基板製造方法 |
| US9215798B2 (en) * | 2013-03-05 | 2015-12-15 | Eastman Kodak Company | Imprinted multi-layer micro-structure method with multi-level stamp |
| US9167684B2 (en) * | 2013-05-24 | 2015-10-20 | Nokia Technologies Oy | Apparatus and method for forming printed circuit board using fluid reservoirs and connected fluid channels |
| JP2015026771A (ja) * | 2013-07-29 | 2015-02-05 | 株式会社フジクラ | 回路基板の製造方法 |
| JP2015088516A (ja) * | 2013-10-28 | 2015-05-07 | 東レエンジニアリング株式会社 | 配線基板の製造方法及びそれに使用されるインクジェット塗布装置 |
| US9401306B2 (en) | 2013-11-11 | 2016-07-26 | Regents Of The University Of Minnesota | Self-aligned capillarity-assisted microfabrication |
-
2019
- 2019-03-27 US US16/948,657 patent/US20210235586A1/en not_active Abandoned
- 2019-03-27 WO PCT/IB2019/052491 patent/WO2019193457A1/en not_active Ceased
- 2019-03-27 CN CN201980023512.0A patent/CN111937499A/zh not_active Withdrawn
- 2019-03-27 JP JP2020553645A patent/JP2021520070A/ja active Pending
- 2019-03-27 EP EP19721781.3A patent/EP3777489A1/en not_active Withdrawn
- 2019-04-01 TW TW108111463A patent/TW201943153A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019193457A1 (en) | 2019-10-10 |
| EP3777489A1 (en) | 2021-02-17 |
| CN111937499A (zh) | 2020-11-13 |
| JP2021520070A (ja) | 2021-08-12 |
| US20210235586A1 (en) | 2021-07-29 |
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