CN111937167A - 热电转换装置 - Google Patents

热电转换装置 Download PDF

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Publication number
CN111937167A
CN111937167A CN201980017658.4A CN201980017658A CN111937167A CN 111937167 A CN111937167 A CN 111937167A CN 201980017658 A CN201980017658 A CN 201980017658A CN 111937167 A CN111937167 A CN 111937167A
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CN
China
Prior art keywords
thermoelectric
metal
interconnect
thermoelectric element
active
Prior art date
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Pending
Application number
CN201980017658.4A
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English (en)
Chinese (zh)
Inventor
A·G·肖尼克
P-Y·毕盛
W·G·A·范·斯海克
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RGS Development BV Petten
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RGS Development BV Petten
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Publication date
Application filed by RGS Development BV Petten filed Critical RGS Development BV Petten
Publication of CN111937167A publication Critical patent/CN111937167A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H10N10/8556—Thermoelectric active materials comprising inorganic compositions comprising compounds containing germanium or silicon

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  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Silicon Compounds (AREA)
  • Powder Metallurgy (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN201980017658.4A 2018-03-07 2019-03-07 热电转换装置 Pending CN111937167A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
NL2020545A NL2020545B1 (en) 2018-03-07 2018-03-07 Thermoelectric conversion device
NL2020545 2018-03-07
PCT/EP2019/055759 WO2019170826A1 (en) 2018-03-07 2019-03-07 Thermoelectric conversion device and method for manufacturing the same

Publications (1)

Publication Number Publication Date
CN111937167A true CN111937167A (zh) 2020-11-13

Family

ID=62090002

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980017658.4A Pending CN111937167A (zh) 2018-03-07 2019-03-07 热电转换装置

Country Status (6)

Country Link
US (1) US11621385B2 (https=)
EP (1) EP3762978A1 (https=)
JP (1) JP7596152B2 (https=)
CN (1) CN111937167A (https=)
NL (1) NL2020545B1 (https=)
WO (1) WO2019170826A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116904916A (zh) * 2023-06-21 2023-10-20 武汉理工大学 一种高温液相渗硅制备高硅硅钢片的方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7592282B2 (ja) * 2020-09-16 2024-12-02 株式会社テックスイージー 熱電素子及びその製造方法
JP7841404B2 (ja) * 2022-10-13 2026-04-07 住友電気工業株式会社 熱電変換材料、熱電変換素子および熱電変換モジュール

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08148726A (ja) * 1994-09-22 1996-06-07 Ngk Spark Plug Co Ltd 熱電変換素子及びその製造方法
JPH1168172A (ja) * 1997-08-11 1999-03-09 Ngk Insulators Ltd シリコン−ゲルマニウム系材料の接合方法および熱電変換モジュールの製造方法ならびに熱電変換モジュール
CN1251689A (zh) * 1997-12-27 2000-04-26 住友特殊金属株式会社 热电转换元件
JP2005317834A (ja) * 2004-04-30 2005-11-10 Hitachi Powdered Metals Co Ltd 熱電変換モジュール及びその製造方法
CN103000798A (zh) * 2011-09-08 2013-03-27 日立化成工业株式会社 热电转换模块及其制造方法
JP2014049713A (ja) * 2012-09-04 2014-03-17 Hitachi Chemical Co Ltd 熱電変換モジュールおよびその製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02128425A (ja) * 1988-11-07 1990-05-16 Ricoh Co Ltd 半導体装置の製造方法
JPH09100166A (ja) * 1995-10-06 1997-04-15 Tokuyama Corp 複合焼結体
JPH1022530A (ja) * 1996-07-01 1998-01-23 Sumitomo Special Metals Co Ltd 熱電変換素子
DE10030354A1 (de) * 2000-06-21 2002-01-10 Bosch Gmbh Robert Thermoelektrisches Bauelement
JP2002094131A (ja) * 2000-09-13 2002-03-29 Sumitomo Special Metals Co Ltd 熱電変換素子
US8309844B2 (en) * 2007-08-29 2012-11-13 Ferro Corporation Thick film pastes for fire through applications in solar cells
JP5881066B2 (ja) 2010-11-30 2016-03-09 学校法人東京理科大学 熱電変換素子及び熱電変換モジュール
US8841539B2 (en) * 2012-03-25 2014-09-23 Fayetteville State University High efficiency thermoelectric device
JP2013201382A (ja) 2012-03-26 2013-10-03 Nagoya Univ 熱電変換モジュール及びその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08148726A (ja) * 1994-09-22 1996-06-07 Ngk Spark Plug Co Ltd 熱電変換素子及びその製造方法
JPH1168172A (ja) * 1997-08-11 1999-03-09 Ngk Insulators Ltd シリコン−ゲルマニウム系材料の接合方法および熱電変換モジュールの製造方法ならびに熱電変換モジュール
CN1251689A (zh) * 1997-12-27 2000-04-26 住友特殊金属株式会社 热电转换元件
JP2005317834A (ja) * 2004-04-30 2005-11-10 Hitachi Powdered Metals Co Ltd 熱電変換モジュール及びその製造方法
CN103000798A (zh) * 2011-09-08 2013-03-27 日立化成工业株式会社 热电转换模块及其制造方法
JP2014049713A (ja) * 2012-09-04 2014-03-17 Hitachi Chemical Co Ltd 熱電変換モジュールおよびその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116904916A (zh) * 2023-06-21 2023-10-20 武汉理工大学 一种高温液相渗硅制备高硅硅钢片的方法
CN116904916B (zh) * 2023-06-21 2024-01-02 武汉理工大学 一种高温液相渗硅制备高硅硅钢片的方法

Also Published As

Publication number Publication date
JP7596152B2 (ja) 2024-12-09
US11621385B2 (en) 2023-04-04
NL2020545B1 (en) 2019-09-13
US20200411741A1 (en) 2020-12-31
EP3762978A1 (en) 2021-01-13
JP2021517366A (ja) 2021-07-15
WO2019170826A1 (en) 2019-09-12
RU2020132751A (ru) 2022-04-07

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Application publication date: 20201113