CN111936589B - 粘合片、使用其的导电构件层叠体、及图像显示装置 - Google Patents
粘合片、使用其的导电构件层叠体、及图像显示装置 Download PDFInfo
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- CN111936589B CN111936589B CN201980023279.6A CN201980023279A CN111936589B CN 111936589 B CN111936589 B CN 111936589B CN 201980023279 A CN201980023279 A CN 201980023279A CN 111936589 B CN111936589 B CN 111936589B
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- Prior art keywords
- adhesive sheet
- adhesive layer
- adhesive
- polyolefin
- polymer
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- 239000004820 Pressure-sensitive adhesive Substances 0.000 title abstract description 30
- 239000000853 adhesive Substances 0.000 claims abstract description 101
- 230000001070 adhesive effect Effects 0.000 claims abstract description 101
- 239000012790 adhesive layer Substances 0.000 claims abstract description 82
- 229920000098 polyolefin Polymers 0.000 claims abstract description 43
- 229920000058 polyacrylate Polymers 0.000 claims abstract description 34
- 150000001875 compounds Chemical class 0.000 claims abstract description 11
- 239000002344 surface layer Substances 0.000 claims abstract description 8
- 239000002356 single layer Substances 0.000 claims abstract description 6
- -1 nitrogen heterocyclic compound Chemical class 0.000 claims description 60
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 34
- 229910052757 nitrogen Inorganic materials 0.000 claims description 34
- 229920000642 polymer Polymers 0.000 claims description 25
- 229910052717 sulfur Inorganic materials 0.000 claims description 20
- 229910052801 chlorine Inorganic materials 0.000 claims description 17
- 239000005062 Polybutadiene Substances 0.000 claims description 15
- 229920002857 polybutadiene Polymers 0.000 claims description 15
- 229920002367 Polyisobutene Polymers 0.000 claims description 14
- 229920001083 polybutene Polymers 0.000 claims description 14
- 229920001195 polyisoprene Polymers 0.000 claims description 13
- 229910052740 iodine Inorganic materials 0.000 claims description 12
- 239000003431 cross linking reagent Substances 0.000 claims description 5
- 239000000178 monomer Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 229920001577 copolymer Polymers 0.000 claims description 4
- 150000004678 hydrides Chemical class 0.000 claims description 3
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 claims 2
- QNNALNZLUPVUBO-UHFFFAOYSA-N triaziridine Chemical compound N1NN1 QNNALNZLUPVUBO-UHFFFAOYSA-N 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 17
- 229910052802 copper Inorganic materials 0.000 abstract description 17
- 239000010949 copper Substances 0.000 abstract description 17
- 230000000694 effects Effects 0.000 abstract description 16
- 229910052709 silver Inorganic materials 0.000 abstract description 13
- 239000004332 silver Substances 0.000 abstract description 13
- 238000000034 method Methods 0.000 description 36
- 239000010408 film Substances 0.000 description 33
- 239000010410 layer Substances 0.000 description 31
- 239000003999 initiator Substances 0.000 description 26
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 22
- 239000000126 substance Substances 0.000 description 20
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 16
- 239000000460 chlorine Substances 0.000 description 16
- 238000005530 etching Methods 0.000 description 16
- 239000003505 polymerization initiator Substances 0.000 description 15
- 239000000523 sample Substances 0.000 description 14
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- 230000007797 corrosion Effects 0.000 description 12
- 238000005260 corrosion Methods 0.000 description 12
- 238000000465 moulding Methods 0.000 description 10
- 230000009477 glass transition Effects 0.000 description 9
- 238000000576 coating method Methods 0.000 description 8
- 239000011254 layer-forming composition Substances 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000012488 sample solution Substances 0.000 description 8
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 7
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 7
- 239000006185 dispersion Substances 0.000 description 7
- 125000004433 nitrogen atom Chemical group N* 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- 239000011593 sulfur Substances 0.000 description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 6
- 125000004432 carbon atom Chemical group C* 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 5
- 125000005396 acrylic acid ester group Chemical group 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 238000009826 distribution Methods 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- 239000001257 hydrogen Substances 0.000 description 5
- 229910052739 hydrogen Inorganic materials 0.000 description 5
- 239000003112 inhibitor Substances 0.000 description 5
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 4
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 4
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 4
- 239000002042 Silver nanowire Substances 0.000 description 4
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 4
- 125000004429 atom Chemical group 0.000 description 4
- 150000004030 azacyclic compounds Chemical class 0.000 description 4
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 4
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 4
- 229910052794 bromium Inorganic materials 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000001723 curing Methods 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 230000003405 preventing effect Effects 0.000 description 4
- 238000012719 thermal polymerization Methods 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 3
- QWENRTYMTSOGBR-UHFFFAOYSA-N 1H-1,2,3-Triazole Chemical compound C=1C=NNN=1 QWENRTYMTSOGBR-UHFFFAOYSA-N 0.000 description 3
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 244000028419 Styrax benzoin Species 0.000 description 3
- 235000000126 Styrax benzoin Nutrition 0.000 description 3
- 235000008411 Sumatra benzointree Nutrition 0.000 description 3
- 150000001298 alcohols Chemical class 0.000 description 3
- 125000002723 alicyclic group Chemical group 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
- WURBFLDFSFBTLW-UHFFFAOYSA-N benzil Chemical compound C=1C=CC=CC=1C(=O)C(=O)C1=CC=CC=C1 WURBFLDFSFBTLW-UHFFFAOYSA-N 0.000 description 3
- 229960002130 benzoin Drugs 0.000 description 3
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 3
- 239000012965 benzophenone Substances 0.000 description 3
- 238000002485 combustion reaction Methods 0.000 description 3
- 238000005536 corrosion prevention Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 235000019382 gum benzoic Nutrition 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000011630 iodine Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- 150000003852 triazoles Chemical class 0.000 description 3
- WNWHHMBRJJOGFJ-UHFFFAOYSA-N 16-methylheptadecan-1-ol Chemical compound CC(C)CCCCCCCCCCCCCCCO WNWHHMBRJJOGFJ-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- NLGDWWCZQDIASO-UHFFFAOYSA-N 2-hydroxy-1-(7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-yl)-2-phenylethanone Chemical compound OC(C(=O)c1cccc2Oc12)c1ccccc1 NLGDWWCZQDIASO-UHFFFAOYSA-N 0.000 description 2
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical compound OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 description 2
- KDCGOANMDULRCW-UHFFFAOYSA-N 7H-purine Chemical compound N1=CNC2=NC=NC2=C1 KDCGOANMDULRCW-UHFFFAOYSA-N 0.000 description 2
- UJOBWOGCFQCDNV-UHFFFAOYSA-N 9H-carbazole Chemical compound C1=CC=C2C3=CC=CC=C3NC2=C1 UJOBWOGCFQCDNV-UHFFFAOYSA-N 0.000 description 2
- 229910002012 Aerosil® Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- SIKJAQJRHWYJAI-UHFFFAOYSA-N Indole Chemical compound C1=CC=C2NC=CC2=C1 SIKJAQJRHWYJAI-UHFFFAOYSA-N 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- KYQCOXFCLRTKLS-UHFFFAOYSA-N Pyrazine Chemical compound C1=CN=CC=N1 KYQCOXFCLRTKLS-UHFFFAOYSA-N 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- ISAKRJDGNUQOIC-UHFFFAOYSA-N Uracil Chemical compound O=C1C=CNC(=O)N1 ISAKRJDGNUQOIC-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- DZBUGLKDJFMEHC-UHFFFAOYSA-N acridine Chemical compound C1=CC=CC2=CC3=CC=CC=C3N=C21 DZBUGLKDJFMEHC-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 125000003158 alcohol group Chemical group 0.000 description 2
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 2
- 239000013556 antirust agent Substances 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000012964 benzotriazole Substances 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
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- OPTASPLRGRRNAP-UHFFFAOYSA-N cytosine Chemical compound NC=1C=CNC(=O)N=1 OPTASPLRGRRNAP-UHFFFAOYSA-N 0.000 description 2
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- 229920001971 elastomer Polymers 0.000 description 2
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- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical group OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- UYTPUPDQBNUYGX-UHFFFAOYSA-N guanine Chemical compound O=C1NC(N)=NC2=C1N=CN2 UYTPUPDQBNUYGX-UHFFFAOYSA-N 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 238000009616 inductively coupled plasma Methods 0.000 description 2
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- 238000004255 ion exchange chromatography Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- AWJUIBRHMBBTKR-UHFFFAOYSA-N isoquinoline Chemical compound C1=NC=CC2=CC=CC=C21 AWJUIBRHMBBTKR-UHFFFAOYSA-N 0.000 description 2
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- 229910052760 oxygen Inorganic materials 0.000 description 2
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- 150000002978 peroxides Chemical class 0.000 description 2
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- 238000011002 quantification Methods 0.000 description 2
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- XSCHRSMBECNVNS-UHFFFAOYSA-N quinoxaline Chemical compound N1=CC=NC2=CC=CC=C21 XSCHRSMBECNVNS-UHFFFAOYSA-N 0.000 description 2
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- YBBRCQOCSYXUOC-UHFFFAOYSA-N sulfuryl dichloride Chemical compound ClS(Cl)(=O)=O YBBRCQOCSYXUOC-UHFFFAOYSA-N 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- RWQNBRDOKXIBIV-UHFFFAOYSA-N thymine Chemical compound CC1=CNC(=O)NC1=O RWQNBRDOKXIBIV-UHFFFAOYSA-N 0.000 description 2
- 238000005011 time of flight secondary ion mass spectroscopy Methods 0.000 description 2
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- 239000013598 vector Substances 0.000 description 2
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- 239000011701 zinc Substances 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- RQHGZNBWBKINOY-PLNGDYQASA-N (z)-4-tert-butylperoxy-4-oxobut-2-enoic acid Chemical compound CC(C)(C)OOC(=O)\C=C/C(O)=O RQHGZNBWBKINOY-PLNGDYQASA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- QWQFVUQPHUKAMY-UHFFFAOYSA-N 1,2-diphenyl-2-propoxyethanone Chemical compound C=1C=CC=CC=1C(OCCC)C(=O)C1=CC=CC=C1 QWQFVUQPHUKAMY-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- RDLGTRBJUAWSAF-UHFFFAOYSA-N 1-(6-hydroxy-6-methylcyclohexa-2,4-dien-1-yl)propan-2-one Chemical compound CC(=O)CC1C=CC=CC1(C)O RDLGTRBJUAWSAF-UHFFFAOYSA-N 0.000 description 1
- PWMWNFMRSKOCEY-UHFFFAOYSA-N 1-Phenyl-1,2-ethanediol Chemical compound OCC(O)C1=CC=CC=C1 PWMWNFMRSKOCEY-UHFFFAOYSA-N 0.000 description 1
- IQDDSZGPEUBKEM-UHFFFAOYSA-N 1-[4-(2-hydroxyethyl)phenyl]-2-methylpropan-1-one Chemical compound CC(C)C(=O)C1=CC=C(CCO)C=C1 IQDDSZGPEUBKEM-UHFFFAOYSA-N 0.000 description 1
- CTOHEPRICOKHIV-UHFFFAOYSA-N 1-dodecylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2CCCCCCCCCCCC CTOHEPRICOKHIV-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- YIKSHDNOAYSSPX-UHFFFAOYSA-N 1-propan-2-ylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C(C)C YIKSHDNOAYSSPX-UHFFFAOYSA-N 0.000 description 1
- RHNJVKIVSXGYBD-UHFFFAOYSA-N 10-prop-2-enoyloxydecyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCCCCCOC(=O)C=C RHNJVKIVSXGYBD-UHFFFAOYSA-N 0.000 description 1
- STFXXRRQKFUYEU-UHFFFAOYSA-N 16-methylheptadecyl prop-2-enoate Chemical compound CC(C)CCCCCCCCCCCCCCCOC(=O)C=C STFXXRRQKFUYEU-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical class C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- BRKORVYTKKLNKX-UHFFFAOYSA-N 2,4-di(propan-2-yl)thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC(C(C)C)=C3SC2=C1 BRKORVYTKKLNKX-UHFFFAOYSA-N 0.000 description 1
- LCHAFMWSFCONOO-UHFFFAOYSA-N 2,4-dimethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC(C)=C3SC2=C1 LCHAFMWSFCONOO-UHFFFAOYSA-N 0.000 description 1
- IMSODMZESSGVBE-UHFFFAOYSA-N 2-Oxazoline Chemical compound C1CN=CO1 IMSODMZESSGVBE-UHFFFAOYSA-N 0.000 description 1
- FGTYTUFKXYPTML-UHFFFAOYSA-N 2-benzoylbenzoic acid Chemical compound OC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 FGTYTUFKXYPTML-UHFFFAOYSA-N 0.000 description 1
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Abstract
提供:即使对银、铜也能充分发挥防腐蚀效果,能够减小相对介电常数及其温度依赖性的新的粘合片。提出了:由含有聚烯烃、丙烯酸类聚合物和氮杂环化合物的粘合层构成的单层的粘合片;或具备该粘合层作为表面层的层叠构成的粘合片。
Description
技术领域
本发明涉及含有防锈剂的粘合片、使用其的导电构件层叠体及图像显示装置。
背景技术
近年来,在各种领域广泛使用液晶显示器(LCD)、有机EL显示器(OLED)等显示装置、触摸面板等输入装置。这些显示装置、输入装置的制造等中,为了贴合光学构件而使用透明粘合(OCA)片。例如,触摸面板等的各种显示装置中的光学构件的贴合通常使用丙烯酸类透明粘合片。
这些显示装置、输入装置存在透明粘合片中含有的腐蚀成分、从外部环境侵入到内部的腐蚀成分腐蚀金属布线、透明电极的问题。进而,伴随近年的传感器的大型化、窄边框化,具备铜布线、银网电极、银纳米线透明电极等更加容易腐蚀的金属构件的显示装置、输入装置增加。
因此,提出了在为了贴合光学构件而使用的透明粘合片中配混防锈剂来防止腐蚀的方法。
例如专利文献1中提出了含有丙烯酸类聚合物(特别是含羟基丙烯酸类聚合物)和交联剂和羧基苯并三唑、和/或1,2,4-三唑化合物的粘合剂层,显示了在对铜的接触试验中能够防止粘合剂层的变色等。
专利文献2中示出了:通过在不含含酸性基团单体的无酸丙烯酸类聚合物中含有苯并三唑系化合物,能够稍微抑制铜电极的电阻值上升。
现有技术文献
专利文献
专利文献1:日本特开2012-46681号公报
专利文献2:WO2014/125914国际公开小册子
发明内容
发明要解决的问题
如上述专利文献1所述,对于在丙烯酸类聚合物中仅添加防锈剂的透明粘合片,对于银、铜之类容易腐蚀的金属难以表现长期的防腐蚀性能。特别是在银纳米线电极的附近配置如前所述的透明粘合片时,环境试验中观察到电阻值上升的现象,也可能触摸面板传感器的耐久性变得不充分。
另外,如专利文献2所述,即使在不含含酸性基团单体的丙烯酸类聚合物中添加防锈剂的情况下,也无法确认到对银、铜等充分的改善效果,触摸面板传感器的耐久性可能变得不充分。
进而,含有防锈剂的透明粘合片的相对介电常数和其温度依赖性变得过高,从而也可能牵连到触摸面板传感器的防误操作。
因此,本发明的目的在于提供一种新的粘合片,其即使对于银、铜之类的容易腐蚀的金属也能长期发挥充分的防腐蚀效果,进而能够减小相对介电常数及其温度依赖性。
用于解决问题的方案
本发明提出了一种单层的粘合片,其由含有聚烯烃、丙烯酸类聚合物和氮杂环化合物的粘合层构成。
本发明还提供一种层叠构成的粘合片,其具备含有聚烯烃、丙烯酸类聚合物和氮杂环化合物的粘合层,且具备该粘合层作为表面层。
发明的效果
对于本发明提出的粘合片,通过粘合层含有聚烯烃、丙烯酸类聚合物和氮杂环化合物,能够减小相对介电常数和其温度依赖性,并且能够获得防腐蚀效果。此时,通过使粘合片含有的氯、溴、碘及硫的总含量为一定值以下,能够进一步提高防腐蚀,因此,优选使氯、溴、碘及硫的总含量为一定值以下。
此外,前述粘合层通过含有聚烯烃和丙烯酸类聚合物,与不含聚烯烃的粘合层相比,容易使防锈剂不均匀存在于粘合层的表面,因此,将粘合片层叠于电极时,具有防腐蚀功能的氮杂环化合物能够迅速地保护金属表面,即使对于容易腐蚀的银、铜也能充分发挥防腐蚀效果。因此,能够长时间维持例如由容易腐蚀的银、铜等形成的电极的初始电阻值。
另外,在该粘合层层叠脱模薄膜时,不均匀存在于粘合层表面的氮杂环化合物向脱模薄膜迁移,因此也有助于防止脱模薄膜的变色。
由此,根据本发明提出的粘合片,能够得到低介电常数、透明性、及防腐蚀效果,因此,能够高度保持触摸面板传感器等的防误操作、以及透明性,并且有助于银纳米线、铜布线等金属布线的防腐蚀。
附图说明
图1为一边进行氩蚀刻,一边用X射线光电子能谱法每100秒扫描40次碳、氮、氧、硅,在取此时的氩蚀刻时间(秒后)为横轴、氮原子浓度除以氧原子浓度所得的N/C为纵轴的坐标中,对实施例4和比较例1的结果制图所得的图表。
图2表示实施例1~5及比较例1~2的耐腐蚀性评价所使用的试样的构成的示意图,(A)为俯视图,(B)为侧截面图。
具体实施方式
接着,基于实施方式例说明本发明。但是,本发明不限定于以下说明的实施方式。
[本粘合片]
本发明的实施方式的一例的粘合片(称为“本粘合片”)为:由至少含有聚烯烃、丙烯酸类聚合物和氮杂环化合物的粘合层构成的单层的粘合片、或具备该粘合层作为表面层的层叠构成的粘合片。
即,本粘合片的一个方式为由至少含有聚烯烃、丙烯酸类聚合物和氮杂环化合物的粘合层构成的单层的粘合片。
另外,本粘合片的另一方式为具备至少含有聚烯烃、丙烯酸类聚合物和氮杂环化合物的粘合层作为表面层的层叠构成的粘合片。
本粘合片可以为本粘合片的正面和背面两面均为粘合层表面的双面粘合片,也可以为仅单面为粘合层表面的单面粘合片。其中,从将2个构件彼此贴合的观点出发,优选为前述双面粘合片。另外,如果为具备粘合层作为至少一侧的表面层的构成,则另一侧也可以具备其他层,另外,也可以为其他层的正面和背面两侧具备粘合层的构成。此时,作为其他层,可以举出支撑层。
需要说明的是,本说明书中称为“粘合片”的情况下,也包括带状的情况、即“粘合带”。
另外,本说明书中,有时将粘合剂层表面称为“粘合面”。
<丙烯酸类聚合物>
本粘合片中的粘合层含有包含(甲基)丙烯酸酯单元的丙烯酸类聚合物。优选含有含(甲基)丙烯酰基的成分发生聚合反应而成的丙烯酸类聚合物。
通过粘合层含有丙烯酸类聚合物,从而能够抑制粘合层的低温流动。
作为前述含(甲基)丙烯酰基的成分,从与聚烯烃的相容性的观点出发,可以举出脂肪族(甲基)丙烯酸酯、脂环式(甲基)丙烯酸酯、(甲基)丙烯酰基改性聚烯烃、或它们的组合等。
作为上述脂肪族(甲基)丙烯酸酯,只要为直链和/或支链醇的(甲基)丙烯酸酯,则可以为单官能的(甲基)丙烯酸酯,也可以为2官能以上的(甲基)丙烯酸酯。
其中,优选碳数为10~30的醇的丙烯酸酯,更优选碳数12~24的醇的丙烯酸酯,特别优选碳数12~碳数20的醇的丙烯酸酯。
如果是碳数为10以上的醇的丙烯酸酯,则与聚烯烃的溶解性参数之差小,能够减小相分离、渗出的影响。另外,如果是碳数为30以下的醇的丙烯酸酯,则能够抑制由丙烯酸酯的结晶化导致的透明性恶化,能够将粘合层的玻璃化转变温度(Tg)调整到作为粘合剂适合的常温以下。
作为上述脂肪族(甲基)丙烯酸酯,例如可列举出(甲基)丙烯酸异硬脂酯、(甲基)丙烯酸异十六烷基酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸十六烷基酯、(甲基)丙烯酸异十四烷基酯、(甲基)丙烯酸十四烷基酯、(甲基)丙烯酸异十二烷基酯、(甲基)丙烯酸十二烷基酯、(甲基)丙烯酸异癸酯等。
作为脂环式(甲基)丙烯酸酯,例如可以举出(甲基)丙烯酸二环戊烯氧基乙酯、(甲基)丙烯酸二环戊酯、三环癸烷二甲醇二丙烯酸酯、(甲基)丙烯酸异冰片酯、环己烷二甲醇单(甲基)丙烯酸酯等。
作为(甲基)丙烯酰基改性聚烯烃,可以举出在聚丁二烯的末端具有丙烯酰基者(例如,日本曹达株式会社制NISSO-PBTE系列)、在聚异戊二烯侧链具有丙烯酰基者(例如,KURARAY CO.,LTD制Kuraprene UC-102M、UC-203M)、聚丁二烯末端氨基甲酸酯丙烯酸酯(例如ARKEMA公司制CN9014NS)等。
通过使用这种(甲基)丙烯酰基改性聚烯烃,可以形成与聚烯烃相容、透明的粘合层。
上述粘合层中,丙烯酸类聚合物优选形成上述含(甲基)丙烯酰基的成分进行交联而成的三维网络结构。
为了使丙烯酸类聚合物形成三维网络结构,优选后述那样在形成粘合层时配混聚合引发剂,使含(甲基)丙烯酰基的成分进行聚合反应(交联)。
上述粘合层中,对于丙烯酸类聚合物是否发生交联而形成三维网络结构,可以如下判定:测定粘合层或粘合片的凝胶率,判定该凝胶率是否为5%以上、更可靠为10%以上、尤其更可靠为20%以上。
需要说明的是,后述的实施例中,由于使可以形成三维网络结构的含(甲基)丙烯酰基的成分进行聚合反应(交联),所以无需测定凝胶率,粘合层中的丙烯酸类聚合物发生交联而形成三维网络结构。
本粘合片的粘合层中的丙烯酸类聚合物的含量优选为30质量%以上、更优选为40质量%以上。另一方面,关于其上限,优选为70质量%以下、进一步优选为60质量%以下。
通过使丙烯酸类聚合物的含量为上述范围,能够减少粘合层的流动,提高高温下的可靠性。
<聚烯烃>
本粘合片中的粘合层优选以聚烯烃作为必需成分。
通过在该粘合层中含有规定的聚烯烃,能够减小相对介电常数,并且与不含聚烯烃的情况相比,能够减少氯、溴、碘及硫的含量。不仅如此,还能够使氮杂环化合物在粘合层的表面附近以高浓度不均匀存在,能够在与金属的接触时迅速地由三唑化合物保护金属表面,因此,即使对于例如由银、铜等极易腐蚀的金属形成的电极,也能充分发挥防腐蚀效果。
另外,作为上述聚烯烃,为了表现作为粘合剂所需的柔软性,优选玻璃化转变温度(Tg)为20℃以下,尤其进一步优选为-60℃以上或15℃以下、尤其进一步优选为-55℃以上或10℃以下。
从以上的观点出发,作为上述聚烯烃,例如可以举出聚异丁烯、聚丁烯、聚丁二烯及聚异戊二烯中的任一种聚合物;聚异丁烯、聚丁烯、聚丁二烯及聚异戊二烯中的任意者的氢化物聚合物;以聚异丁烯、聚丁烯、聚丁二烯及聚异戊二烯中的任意聚合物或所述氢化物聚合物作为主链的聚合物;由构成聚异丁烯、聚丁烯、聚丁二烯及聚异戊二烯中的任意二种以上聚合物或任意二种以上所述氢化物聚合物的单体的组合形成的共聚物;或,由下述任意二种以上物质的组合形成的混合树脂,所述物质如下:聚异丁烯、聚丁烯、聚丁二烯及聚异戊二烯中的任一种聚合物;聚异丁烯、聚丁烯、聚丁二烯及聚异戊二烯中的任意者的氢化物聚合物;以聚异丁烯、聚丁烯、聚丁二烯及聚异戊二烯中的任意聚合物或所述氢化物聚合物作为主链的聚合物;由构成聚异丁烯、聚丁烯、聚丁二烯及聚异戊二烯中的任意二种以上聚合物或任意二种以上所述氢化物聚合物的单体的组合形成的共聚物。另外,也优选作为烯烃系弹性体(TPO)已知的各种弹性体。
作为这种聚烯烃,可以举出OPPANOL(BASF公司商品名)、TETRAX(JXTG公司商品名)、Nisseki Polybutene(JXTG公司商品名)、TAFMER BL(三井化学株式会社商品名)等。
作为本粘合片的粘合层中的聚烯烃的含量,优选为30质量%以上、更优选为40质量%以上。另一方面,关于其上限,优选为70质量%以下、进一步优选为60质量%以下。
通过使聚烯烃的含量为上述范围,从而能够减少粘合层的吸湿,抑制由丙烯酸类聚合物的水解引起的腐蚀成分的产生。另外,通过使本粘合片的粘合层中的聚烯烃的含量为上述范围,能够降低相对介电常数,也能够减少温度依赖性。进而,通过相对减少丙烯酸类聚合物,能够减少丙烯酸类聚合物、尤其是丙烯酸酯等中以杂质的形式包含的Cl、Br、I及S的总含量。
从能够减少氯、溴、碘及硫的含量、使氮杂环化合物高浓度地不均匀存在于粘合层的表面附近的观点出发,相对于丙烯酸类聚合物的含量,优选使聚烯烃的含量为50~200%的质量比例,尤其进一步优选为60%以上或180%以下,尤其进一步优选为70%以上或160%以下的质量比例。
另外,从使氮杂环化合物高浓度地不均匀存在于粘合层的表面附近的观点出发,相对于氮杂环化合物的含有质量,优选使聚烯烃的含量为50~500倍的含有质量,尤其进一步优选为75倍以上或450倍以下,尤其进一步优选为100倍以上或400倍以下的含有质量。
<氮杂环化合物>
本粘合片的粘合层优选以对金属具有防锈功能的氮杂环化合物作为必需成分。
氮杂环化合物是指包含含有氮元素的三元环以上的饱和或不饱和环结构的化合物的总称,作为其环结构的例子,可以举出咪唑、吡唑、噁唑啉、咪唑啉、吗啉、三唑、四唑、哒嗪、嘧啶、吡嗪、吲哚、异吲哚、苯并咪唑、嘌呤、喹啉、异喹啉、喹唑啉、喹喔啉、噌啉、蝶啶、吖啶、咔唑、腺嘌呤、鸟嘌呤、胞嘧啶、胸腺嘧啶、尿嘧啶等。
已知这些氮杂环化合物作为对金属的锈(さび)、腐蚀的抑制剂而起作用,其中,从能够廉价地获得、防锈效果高、与前述聚烯烃或丙烯酸类聚合物的相容性及透明性的方面、以及在添加后使含(甲基)丙烯酰基的成分反应的情况下不易阻碍反应(交联、聚合)的方面出发,优选三唑化合物、吡唑化合物、咪唑啉化合物、咪唑化合物、四唑化合物,进一步优选三唑化合物。
上述三唑化合物只要为具有三唑骨架的化合物,就没有特别限制。例如除了三唑类之外,也可以举出苯并三唑类等。
作为苯并三唑,例如可以举出1,2,3-三唑、1,2,4-三唑、1,2,3-苯并三唑、1-[N,N-双(2-乙基己基)氨基甲基]苯并三唑、1-[N,N-双(2-乙基己基)氨基甲基]甲基苯并三唑、2,2’-[[(甲基-1H-苯并三唑-1-基)甲基]亚氨基]双乙醇、3,5-二甲基-1,2,4-三唑、3,5-二氨基-1,2,4-三唑等。
其中,从防止在粘合层内的析出的观点出发,优选液态的1,2,3-三唑。
另外,氮杂环化合物可以单独使用1种或组合使用多种。
氮杂环化合物的含量没有特别限定。其中,相对于粘合层100质量份,优选包含0.01~10质量份,尤其进一步优选包含0.02质量份以上或8质量份以下、尤其进一步优选包含0.05质量份以上或5质量份以下。
若氮杂环化合物的含量为0.01质量份以上,则容易得到良好的防腐蚀性能,因而优选。另一方面,若上述含量为10质量份以下,则易于确保透明性,另外,易于确保耐发泡剥离性等粘接可靠性,是优选的。
在控制本粘合片的粘合层中的氮杂环化合物的不均匀存在的方面,可以利用汉森溶解度参数(HSP)。
即,氮杂环化合物与聚烯烃的HSP距离优选相距18.0以上,更优选相距20.0以上,进一步优选相距25.0以上。通过相距18.0以上,氮杂环化合物易于不均匀存在于粘合层的表面,例如,将粘合片层叠于电极时,氮杂环化合物可以比腐蚀原因物质先作用于电极。另一方面,上限没有特别限定,通常为30.0以下。
“汉森溶解度参数(HSP)”是表示某物质在其他某物质中溶解多少的溶解性的指标。
HSP如下:将由希尔德布兰德(Hildebrand)导入的溶解度参数分为色散项δD、极性项δP、氢键项δH这3成分,示于三维空间。色散项δD表示基于色散力的效果,极性项δP表示基于偶极子间力的效果,氢键项δH表示基于氢键力的效果,标记为:
δD:源自分子间的色散力的能量
δP:源自分子间的极性力的能量
δH:源自分子间的氢键力的能量
(此处,各自的单位为MPa0.5。)
HSP的定义和计算记载于下述文献。
Charles M.Hansen著,Hansen Solubility Parameters:A Users Handbook(CRC出版社,2007年)。
色散项反映范德华力,极性项反映偶极矩,氢键项反映基于水、醇等的作用。而且,可以判断基于HSP的向量相似的物质之间的溶解性高,向量的类似度可以用汉森溶解度参数的距离(HSP距离)来判断。另外,汉森溶解度参数不仅可以进行溶解性的判断,而且可以作为判断某物质在其他某物质中容易以何种程度存在、即分散性为何种程度为宜的指标。
本发明中,HSP[δD、δP、δH]例如可以通过使用计算机软件Hansen SolubilityParameters in Practice(HSPiP),由其化学结构简便地推算。具体而言,是通过安装于HSPiP的Y-MB法并根据化学结构求出的。另外,化学结构未知的情况下,根据使用多种溶剂的溶解测试的结果、通过安装于HSPiP的球面法而求出。
HSP距离(Ra)可以如下算出:例如将溶质(例如氮杂环化合物)的HSP设为(δD1,δP1,δH1),将溶剂(例如聚烯烃)的HSP设为(δD2,δP2,δH2)时,通过下式算出。
HSP距离(Ra)={4×(δD1-δD2)2+(δP1-δP2)2+(δH1-δH2)2}0.5
HSP距离可以通过分别选择使用的氮杂环化合物、和聚烯烃来进行调整。
<其他成分>
上述粘合层根据需要可以添加交联剂、增塑剂、UV吸收剂、HALS、硅烷偶联剂、Aerosil、纳米填料等其他成分。
<厚度>
本粘合片的厚度没有特别限制。在包含触摸面板的显示器用途中,厚度优选为5μm以上且1000μm以下,尤其进一步优选为10μm以上或500μm以下。
本粘合片的厚度如果为5μm以上,则能够表现实用的防金属腐蚀效果,如果厚度为1000μm以下,则透明性、操作性良好。
[本粘合片的特征]
本粘合片可以具有如下的特征。
<粘合层中的Cl、Br、I、S的总含量>
对于本粘合片,Cl、Br、I及S的总含量(质量)优选为100ppm以下,其中特别优选为80ppm以下,尤其特别优选为50ppm以下。
进而,Cl、Br、I及S的总含量(质量)以上述粘合层的浓度计优选为100ppm以下,其中特别优选为80ppm以下,其中特别优选为50ppm以下。
通过使Cl、Br、I、S的总含量为上述范围,从而由于与防锈剂的协同效果,能够进一步有效地抑制铜、银的腐蚀。
作为将本粘合片中Cl、Br、I及S的总含量调整为上述范围的方法,可以举出调整含(甲基)丙烯酰基的成分的制造方法来调整这些元素含量、或清洗含(甲基)丙烯酰基的成分来调整其条件的方法。其中,不限定于这些方法。
例如,利用酯交换法制造含(甲基)丙烯酰基的成分时,与利用脱水酯法相比,至少能减少S含量。
需要说明的是、Cl、Br及S的含量可以通过如下定量方法进行测定。
用试样燃烧装置(AQF-200M;Mitsubishi Chemical Analytech Co.,Ltd.制)将试样燃烧分解,将产生的气体回收至吸收液中而制成试样溶液。用离子色谱(ICS-1600;Thermo Fisher Scientific K.K..制)、通过标准曲线法对试样溶液中的Cl、Br、S进行定量。
另一方面,I的含量可以通过如下定量方法进行测定。
用试样燃烧装置(AQF-200M;Mitsubishi Chemical Analytech Co.,Ltd.制)将试样燃烧分解,将产生的气体回收到吸收液中而制成试样溶液。用电感耦合等离子体质谱仪(Agilent7500;Agilent Technologies Ltd.制)、通过标准曲线法对试样溶液中的I进行定量。
<氮杂环化合物的不均匀存在>
本粘合片中的粘合层中,前述氮杂环化合物优选与粘合层内部相比更多地不均匀存在于粘合层表面。换言之,对于前述氮杂环化合物的浓度,粘合层表面比粘合层内部高。
本粘合片中的粘合层除了丙烯酸类聚合物之外还含有聚烯烃,因此,与不含该聚烯烃的粘合层相比,可以使氮杂环化合物更多地不均匀存在于粘合层的表面。通过这样使具有防腐蚀功能的氮杂环化合物不均匀存在于粘合层的表面,从而例如使本粘合片层叠于电极时,能够使该氮杂环化合物比腐蚀原因物质先作用于电极,因此,能够更有效地实现防腐蚀。
对于氮杂环化合物是否不均匀存在于粘合层表面,例如可以通过以下方法来确认。
使用三唑化合物作为氮杂环化合物时,用于本粘合片的三唑化合物在分子中包含较多的氮原子,因此,通过X射线光电子能谱法(称为ESCA或XPS)测定氮原子浓度时,可知三唑化合物在粘合层中的不均匀存在的有无、及浓度分布。特别是通过观察边进行氩(Ar)蚀刻边扫描而得到的各原子的深度方向分布(深度分布),可知表面和内部的原子的浓度梯度。
作为X射线光电子能谱仪,可以使用Thermo Fisher Scientific K.K..(株)制的K-Alpha等,边进行Ar蚀刻边每100秒扫描40次以上,由此可以得到良好的深度分布。
优选至少扫描碳、氧、硅、氮这四种,氮原子的浓度以与碳原子的相对量来评价时是正确的。由此,优选用将氮原子浓度除以碳原子浓度所得的值(N/C)作为纵轴、蚀刻时间作为横轴的图表来确认。
用这种图表确认时,本发明的粘合片的氮原子浓度在表面侧与内部侧存在梯度。即,对三唑化合物观察到浓度梯度。
特别地,Ar蚀刻后100秒后的最表面的N/C与Ar蚀刻4000秒后的N/C相比,优选大0.01以上,更优选大0.015以上。通过大于0.01,三唑化合物能够更有效地保护金属表面。图1示出分析结果的例子。
具体而言,例如在以下的蚀刻条件下进行蚀刻时,以100秒测定距离表面几nm(纳米)左右、以4000秒测定距离表面0.8μm左右的N/C。
<测定条件>
·测定区域:Φ400μm
·通能:50eV
·扫描次数:5次
<蚀刻条件>
·离子能量:1000eV
·光栅尺寸:Φ2mm
另外,存在三唑化合物的氮源时,可以用飞行时间型二次离子质谱法(TOF-SIMS)等替代。
<雾度>
本粘合片的雾度(根据JIS K7136)没有特别限定。其中,该雾度优选为1.0%以下,更优选为0.8%以下。雾度为1.0%以下时,能够得到优异的透明性、优异的外观,是优选的。
需要说明的是,上述雾度可以如下测定:例如将粘合片在常态(23℃、50%RH)下静置至少24小时后,在具有分隔件时将其剥离,贴合于载玻片(例如,总透光率91.8%、雾度0.4%),将其作为试样,使用雾度计(株式会社村上色彩技术研究所制、商品名“HM-150”)进行测定。
<总透光率>
对于本粘合片的总透光率,考虑到应用于显示器用途的用途时,从透明性的观点出发,优选为90%以上,进一步优选为91%以上。
<相对介电常数>
本粘合片在频率100kHz下的相对介电常数优选为3.8以下、进一步优选为3.0以下。
通过使相对介电常数为上述范围,能够降低作为绝缘层的静电电容,能够防止由高频噪声导致的触摸面板式输入输出装置的误操作。另外,能够减薄粘合层,也能够有助于图像显示装置的省空间化、弯折对应。
相对介电常数可以通过调整使用的粘合片中包含的聚烯烃的量比而调整到上述范围。但是,不限定于该方法。
<玻璃化转变温度>
本粘合片优选其玻璃化转变温度(Tg)处于-30~30℃的范围内。通过处于-30~30℃的范围内,能够形成具有良好的粘接性、保持力的粘合片。
为了将本粘合片的玻璃化转变温度(Tg)调整为上述范围,可以采用选择后述的聚烯烃及含(甲基)丙烯酰基的成分的种类、以及它们的混合比的方法。另外,通过加入增粘剂,也可以将玻璃化转变温度调整到-30~30℃的范围内。但是,不限定于这种方法。
此处,“玻璃化转变温度”是指出现损耗角正切(tanδ)的主分散的峰的温度。
<本粘合片的制造方法>
接着,针对本粘合片的制造方法进行说明。
但是,以下的说明是制造本粘合片的方法的一例,本粘合片不限定于通过所述制造方法制造的粘合片。
本粘合片可以如下得到:将含有聚烯烃、含(甲基)丙烯酰基的成分、氮杂环化合物、根据需要的裂解型光聚合引发剂、和根据需要的其他材料的粘合层形成组合物(称为“本粘合层形成组合物”)成形为未固化片后,使前述含(甲基)丙烯酰基的成分进行聚合反应,由此进行固化而得到。但是,不限定于该方法。
作为将本粘合层形成组合物成形为未固化片的方法,可以采用公知的方法、例如干式层压、使用T模头的挤出铸造法、挤出层压法、压延法、吹胀法等。其中,从操作性、生产率等的方面出发,优选进行熔融成形的方法、例如挤出铸造法及挤出层压法。
选择不使用溶剂的熔融成形时,作为用于进行熔融成形的本粘合层形成组合物,优选未固化状态下的频率1Hz的剪切中的储能模量(G’)在20℃下为50,000Pa以上、在160℃下为10,000Pa以下。若20℃下的G’为上述范围,则在成形后在常温下能够维持形状。另外,若160℃下的G’为上述范围,则能够在不引入气泡的情况下成形。
各种温度下的弹性模量(储能模量)G’和粘性率(损耗弹性模量)G”及tanδ=G”/G’可以使用应变流变仪进行测定。
熔融成形时的成形温度可以通过流动特性、制膜性等适当调整。
优选为20~230℃、更优选为20~160℃。进一步优选为20~130℃。
熔融成形的情况下,片的厚度可以通过T模头的唇间隙、片的牵拉速度等适当调整。
可以对本粘合层形成组合物照射热和/或活性能量射线,使含(甲基)丙烯酰基的成分进行聚合反应而固化。例如,可以对于将本粘合层形成组合物进行片成形而得者,通过热和/或活性能量射线照射从而使本粘合片固化。
此处,作为照射的活性能量射线,可以举出α射线、β射线、γ射线、中子束、电子束等电离性辐射线、紫外线、可见光线等,其中,从对光学装置构成构件的损伤抑制、反应控制的观点出发,紫外线是适合的。
另外,关于活性能量射线的照射能量、照射时间、照射方法等,没有特别限定,使聚合引发剂活化从而能够使含(甲基)丙烯酰基的成分聚合即可。
另外,作为本粘合片的制造方法的其他实施方式,也可以使后述的本粘合层形成组合物溶解于适当的溶剂,使用各种涂布方法实施。但是,该实施方式中,需要考虑溶剂回收等制造成本的方面。
使用涂布方法时,除了上述活性能量射线照射固化之外,也可以通过进行热固化而得到本粘合片。
选择利用涂布方法的成形时,除了活性能量射线固化之外,通过热固化进行固化也是有效的。该情况下,优选选择具有比溶剂的干燥温度高的分解温度的热聚合引发剂。
涂布时,片的厚度可以通过涂覆厚度和涂覆液的固体成分浓度来调整。
另外,根据需要,可以进行压花加工、各种凹凸(圆锥、角锥形状、半球形状等)加工。另外,出于提高对各种被粘构件的粘接性的目的,可以对表面进行电晕处理、等离子体处理及底漆处理等各种表面处理。
(聚合引发剂)
对于形成上述粘合层时的聚合反应,如上所述,根据聚合反应的种类,可以使用热聚合引发剂、光聚合引发剂(光引发剂)等聚合引发剂。聚合引发剂可以单独使用或组合使用2种以上。
作为上述光聚合引发剂,不特别限定其种类。例如可以举出苯偶姻醚系光聚合引发剂、苯乙酮系光聚合引发剂、α-酮醇系光聚合引发剂、芳香族磺酰氯系光聚合引发剂、光活性肟系光聚合引发剂、苯偶姻系光聚合引发剂、苯偶酰系光聚合引发剂、二苯甲酮系光聚合引发剂、缩酮系光聚合引发剂、噻吨酮系光聚合引发剂等。需要说明的是,光聚合引发剂可以单独使用或组合使用2种以上。
作为上述苯偶姻醚系光聚合引发剂,例如可以举出苯偶姻甲基醚、苯偶姻乙基醚、苯偶姻丙基醚、苯偶姻异丙基醚、苯偶姻异丁基醚、2,2-二甲氧基-1,2-二苯基乙烷-1-酮、茴香醚甲基醚等。
作为上述苯乙酮系光聚合引发剂,例如可以举出2,2-二乙氧基苯乙酮、2,2-二甲氧基-2-苯基苯乙酮、1-羟基环己基苯基酮、4-苯氧基二氯苯乙酮、4-(叔丁基)二氯苯乙酮等。作为上述α-酮醇系光聚合引发剂,例如可以举出2-甲基-2-羟基苯丙酮、1-[4-(2-羟基乙基)苯基]-2-甲基丙烷-1-酮等。
作为上述芳香族磺酰氯系光聚合引发剂,例如可以举出2-萘磺酰氯等。
作为上述光活性肟系光聚合引发剂,例如可以举出1-苯基-1,1-丙二酮-2-(o-乙氧基羰基)-肟等。
作为上述苯偶姻系光聚合引发剂,例如可以举出苯偶姻等。
作为上述苯偶酰系光聚合引发剂,例如可以举出苯偶酰等。作为上述二苯甲酮系光聚合引发剂,例如可以举出二苯甲酮、苯甲酰苯甲酸、3,3’-二甲基-4-甲氧基二苯甲酮、聚乙烯基二苯甲酮、α-羟基环己基苯基酮等。
作为上述缩酮系光聚合引发剂,例如可以举出苯偶酰二甲基缩酮等。
作为上述噻吨酮系光聚合引发剂,例如可以举出噻吨酮、2-氯噻吨酮、2-甲基噻吨酮、2,4-二甲基噻吨酮、异丙基噻吨酮、2,4-二异丙基噻吨酮、十二烷基噻吨酮等。
上述光聚合引发剂的用量没有特别限定。例如,相对于粘合层100质量份,优选0.001~2质量份,更优选为0.01~1质量份。
另外,上述热聚合引发剂的种类没有特别限定。例如可以举出偶氮系聚合引发剂、过氧化物系聚合引发剂(例如,二苯甲酰过氧化物、过氧化马来酸叔丁酯等)、氧化还原系聚合引发剂等。
上述热聚合引发剂的用量没有特别限定。例如,上述过氧化物系聚合引发剂的情况下,相对于粘合层100质量份,优选0.05~0.5质量份,更优选0.1~0.3质量份。
<其他成分>
上述粘合层形成组合物中根据需要可以添加增塑剂、UV吸收剂、HALS、硅烷偶联剂、Aerosil、丙烯酰胺、纳米填料等、其他成分。
[本粘合片的用途]
本粘合片例如可以作为具备在本粘合片的至少单面或两面层叠脱模薄膜而成的构成的层叠片而使用。
另外,也可以作为具备在本粘合片的至少一侧单面层叠支撑薄膜、在另一侧单面层叠脱模薄膜而成的构成的层叠片而使用。
此时,通过热和/或照射活性能量射线进行固化处理,也能得到在本粘合片的至少单面层叠脱模薄膜而成的构成的上述层叠片。
如此,通过在本粘合片的至少单面层叠脱模薄膜,能够防止粘连、或防止异物的附着。
如此,通过维持在本粘合片的至少单面层叠脱模薄膜的状态进行保管,从而粘合片中的氮杂环化合物向脱模薄膜进行迁移,其结果,能够得到在脱模薄膜中的层叠有粘合片的面具有前述氮杂环化合物的层叠片。该层叠片中的脱模薄膜由于包含氮杂环化合物,因此能够有助于防止脱模薄膜的变色。
<导电构件层叠体>
也可以作为具备本粘合片和导电构件的导电构件层叠体(称为“本导电构件层叠体”)而使用。
作为上述导电构件,例如可以举出透明导电层,通过在该透明导电层的导电层面贴合本粘合片,能够得到本导电构件层叠体。此时,本导电构件层叠体只要具有将本粘合片的任一个粘合层面与前述透明导电层的导电层面贴合而成的构成即可。另外,本粘合片为双面粘合片时,可以具有将本粘合片的两个粘接剂层面与透明导电层的导电层面贴合而成的构成。
另外,上述透明导电层可以以覆盖其导电膜的导电层面的方式形成有基于烯烃系聚合物、氨基甲酸酯系聚合物、环氧系聚合物、丙烯酸类聚合物、有机硅系聚合物、或者无机玻璃等的绝缘保护膜。
与导电层面贴合而得到的本导电构件层叠体例如可以适合用于触摸面板。
作为该触摸面板,可以举出电阻膜方式、静电电容方式、电磁感应方式等方式的触摸面板,优选为静电电容方式。
作为上述透明导电层,只要至少单面的表层具有导电层即可,可以举出在透明基材的表层通过蒸镀、溅射、或涂布等而设置有导电物质的透明导电层。
作为透明导电层的导电层所使用的导电物质,例如可以举出铟氧化物、铟·镓·锌复合氧化物、氧化铟锡(ITO)、氧化锌、氧化镓、钛氧化物等金属氧化物、以及银、铜、钼、铝等金属材料。其中,优选透明性优异的氧化铟锡(ITO)及铟·镓·锌复合氧化物。另外,从导电性优异的观点出发,也可以适宜使用铜、银。
透明导电层中,作为导电物质形成图案的基材,没有特别限定,例如可以举出玻璃、树脂薄膜等。
上述透明导电层典型而言优选在至少片面的表层具有导电层。典型而言,在透明导电层以围绕周边部的方式形成有以铜为主成分的导体图案(布线图案)。
本粘合片对于具备由包含铜的金属材料形成的导体图案的导电构件可以特别适宜使用。
<图像显示装置>
上述本导电构件层叠体可以构成例如具备图像显示面板及表面保护面板的图像显示装置(称为“本图像显示装置”)。
例如可以举出使将本粘合片与透明导电层的导电层面贴合而得到的本导电构件层叠体插入图像显示面板与表面保护面板之间的构成的图像显示装置。此时,在图像显示面板侧也可以使用本粘合片。
作为上述表面保护面板的材质,可以为玻璃、以及丙烯酸类树脂、聚碳酸酯系树脂、环烯烃聚合物等脂环式聚烯烃系树脂、苯乙烯系树脂、聚碳酸酯系树脂、酚系树脂、三聚氰胺系树脂、环氧系树脂等塑料。
图像显示面板由偏光薄膜、以及相位差薄膜等光学薄膜、液晶材料及背光面板构成,通过液晶材料的控制方式,有STN方式、VA方式、IPS方式等,可以为任意方式。
<语句的说明等>
通常“片”是指JIS中的定义上薄、且其厚度在长度和宽度上均较小的平坦的制品,通常“薄膜”是指厚度与长度及宽度相比非常小、最大厚度任意限定的薄且平坦的制品,通常以卷的形式供给(日本工业标准JISK6900)。但是,片和薄膜的边界不确定,本发明中无需在语言上区分两者,因此,本发明中,称为“薄膜”时,也包括“片”,称为“片”时,也包括“薄膜”。
另外,如图像显示面板、保护面板等那样,表述为“面板”时,包含板体、片及薄膜。
本说明书中,记载为“X~Y”(X、Y为任意的数字)时,除非另有说明,与“X以上且Y以下”的含义同样地,也包含“优选比X大”或“优选比Y小”的含义。
另外,记载为“X以上”(X为任意的数字)时,除非另有说明,包含“优选比X大”的含义,记载为“Y以下”(Y为任意的数字)时,除非另有说明,也包含“优选比Y小”的含义。
实施例
通过以下的实施例进一步说明本发明。但是,本发明不限定解释于下述所示的实施例。
实施例1~5及比较例1~2中,制作以表1所示的质量比配混的粘合层形成组合物,在经有机硅脱模处理的厚度100μm的脱模薄膜(三菱化学株式会社制PET薄膜)上以粘合层的厚度成为100μm的方式展开。
接着,关于实施例1~5及比较例2,进一步从粘合层上层叠经有机硅脱模处理的厚度75μm脱模薄膜(三菱化学株式会社制PET薄膜)而形成层叠体,使用金属卤化物灯照射装置(Ushio Inc.、UVC-0516S1、lamp UVL-8001M3-N),以波长365nm的照射量成为2000mJ/cm2的方式对前述层叠体进行光照射,得到在粘合层的正面和背面两侧层叠有脱模薄膜的粘合片层叠体。
[表1]
需要说明的是,表1中,
A-1为OPPANOL N50SF(BASF公司制、聚异丁烯、数均分子量(Mn)235,400、质均分子量(Mw)565,000、HSP:δD=15.1、δP=0、δH=0、Tg:-30℃);
A-2为TETRAX3T(JXTG公司制、聚异丁烯、数均分子量(Mn)21,400、质均分子量(Mw)49,000、HSP:δD=15.1、δP=0、δH=0、Tg:-30℃);
A-3为IP solvent 2835(出光株式会社制、C16-C24的异链烷烃100质量%、质均分子量(Mw):300以下、HSP:δD=15.1、δP=0、δH=0、Tg:不可测定);
A-4为聚丁烯(异丁烯-正丁烯共聚物、正丁烯量4%、数均分子量:1660、质均分子量:3718、HSP:δD=15.1、δP=0、δH=0.1、Tg:-35℃);
A-5为TAFMER BL2481M(三井化学株式会社制、1-丁烯·α-烯烃共聚物、Tg:-14℃);
B-1为由异硬脂醇用脱水酯法制备的、由下述化学式表示的具有支链结构的丙烯酸异硬脂酯,硫分为302ppm;
B-2是将B-1的硫分减少至18ppm而得到者;
B-3是用脱水酯法制造的丙烯酸十六烷基酯(丙烯酸鲸蜡酯);
B-4为A-DOD-N(新中村化学株式会社制、1,10-癸二醇二丙烯酸酯);
B-5为CN9014NS(ARKEMA公司制、氢化聚丁二烯的两末端氨基甲酸酯丙烯酸酯);
C-1为1,2,3-三唑(大塚化学株式会社制、HSP:δD=20.1、δP=16.2、δH=13.7);
C-2为1,2,3-苯并三唑(城北化学工业株式会社制、HSP:δD=20.9、δP=12.4、δH=9.0);
Omnirad 651为(BASF公司制、光聚合引发剂);
Omnirad TPO-G为(BASF公司制、光聚合引发剂);
Quinton R100为(Zeon Corporation制、二环戊二烯系C5馏分石油树脂);
Irganox 1076为(BASF公司制、受阻酚系抗氧化剂);
“丙烯酸类粘合剂-1”表示如下物质:将丙烯酸丁酯(BA)60质量份、丙烯酸月桂酯40质量份、丙烯酸4-羟基丁酯(HBA)1质量份、作为聚合引发剂的2,2’-偶氮双异丁腈0.1质量份与乙酸乙酯200质量份一起投入,边搅拌边导入氮气,进行1小时氮置换后,将烧瓶内的液温保持为55℃附近,进行10小时聚合反应,制备聚合物溶液。接着,在上述得到的聚合物溶液中配混相对于聚合物的固体成分100质量份为0.5质量份的作为交联剂的苯二甲基二异氰酸酯的三羟甲基丙烷加成物(三井化学株式会社制,商品名D110N),并进行干燥而得到的物质(HSP:δD16.5、δP2.7、δH3.9)。
<各种评价>
用下述的方法对从实施例·比较例中得到的粘合片层叠体剥离脱模薄膜而得到的粘合片(样品)进行各种评价。结果示于表2。
(Cl、Br、I、S的总含量)
用下述方法对粘合片(样品)中的Cl、Br、I及S的各自含有质量进行定量,对含量进行合计。
Cl、Br及S的定量方法如下:在试样燃烧装置(AQF-200M;Mitsubishi ChemicalAnalytech Co.,Ltd.制)中将粘合片(样品)燃烧分解,将产生的气体回收到吸收液中制成试样溶液。用离子色谱(ICS-1600;Thermo Fisher Scientific K.K..制)以标准曲线法对试样溶液中的Cl、Br及S的量进行定量。
另一方面,I的定量方法如下:在试样燃烧装置(AQF-200M;Mitsubishi ChemicalAnalytech Co.,Ltd.制)中将粘合片(样品)燃烧分解,将产生的气体回收到吸收液中制成试样溶液,用电感耦合等离子体质谱仪(Agilent7500;Agilent Technologies Ltd.制)以标准曲线法对该试样溶液中的I量进行定量。
(三唑化合物的不均匀存在的确认)
以下述条件、使用X射线光电子能谱仪(Thermo Fisher Scientific K.K..(株)制的K-Alpha)对粘合片(样品)进行Ar蚀刻,同时对碳、氧、硅、氮这4种原子每100秒扫描40次以上,由此得到各原子的厚度方向的原子浓度分布。根据得到的数据,制作以将氮原子浓度除以碳原子浓度而得的值(N/C)作为纵轴、以蚀刻时间为横轴的图表。将该图表的例子示于图1。
根据图表,求出蚀刻100秒后的(N/C)与蚀刻4000秒后的(N/C)之差,0.01以上时,设为有三唑化合物的不均匀存在而评价为“○”、不足0.01时,设为没有三唑化合物的不均匀存在而评价为“×”。
需要说明的是,图1中最初的扫描(蚀刻前)的N/C低是因为分隔件的有机硅脱模转印的影响。
<测定条件>
·测定区域:Φ400μm
·通能:50eV
·扫描次数:5次
<蚀刻条件>
·离子能量:1000eV
·光栅尺寸:Φ2mm
(耐腐蚀可靠性)
将银纳米线涂布液(C3nano公司制)涂覆到50μm的PET薄膜上,得到50Ω/□的透明电极薄膜。将得到的透明电极薄膜切出宽度9mm的长条状,将5片长条状的透明电极薄膜以导电面朝上的方式排列在玻璃基板上,用胶带固定端部。进而,在透明电极薄膜上于两端涂布银糊,制作电阻值测定用的接点。从其上使用手压辊将切成宽度50mm的粘合片(样品)以粘合层直接接触透明电极面的方式贴合在透明电极面上。将测定方法示于图2。
将贴合的层叠体在65℃、90%Rh的环境中保管,记录透明电极的电阻值(kΩ)如何变化。
1200小时的保管中,将未超过1.5kΩ的情况评价为“○”,将超过1.5kΩ的情况评价为“×”。
(雾度)
在粘合片(样品)的两面贴合玻璃的状态下,使用雾度计(日本电色工业株式会社制、NDH5000),根据JIS K7361-1测定总透光率,根据JIS K7136测定雾度。
(相对介电常数)
将粘合片(样品)层叠多片而得到厚度500μm的片。将该片调整为宽度25mm×长度25mm后,使用阻抗测定装置(日本HP株式会社制:4291B)以频率100MHz测定介电常数。
(玻璃化转变温度)
将粘合片(样品)层叠多片,制作厚度约2mm的片。将得到的片冲裁为直径20mm的圆形,使用流变仪(英弘精机株式会社制、MARS)在粘合夹具:Φ20mm平行板、应变:0.1%、频率:1Hz、温度:-50~150℃、升温速度:3℃/分钟的条件下对其进行测定,将损耗角正切的峰温度设为玻璃化转变温度(Tg)。
(将针对各得到的树脂组合物的结果示于表2。)
[表2]
(考察)
根据上述实施例的结果及本发明人至今为止进行的试验结果等,可以确认:通过使粘合片的粘合剂层含有聚烯烃、丙烯酸类聚合物和作为氮杂环化合物的三唑化合物,能够减小相对介电常数和其温度可靠性,并且能够发挥防腐蚀效果。
进而,也可以确认:通过使粘合片含有的卤素元素及硫的总含量为一定值以下,能够进一步提高防腐蚀效果。
此外,也可以确认:通过使粘合层含有聚烯烃和丙烯酸类聚合物,从而与不含聚烯烃的粘合层相比,防锈剂变得不均匀存在于粘合层的表面,因此,即使对于容易腐蚀的银、铜也能长期充分地发挥防腐蚀效果。
Claims (10)
1.一种单层的粘合片,其由含有聚烯烃、丙烯酸类聚合物和氮杂环化合物的粘合层构成,其中不包括由含有氮丙啶或双氮丙啶交联剂作为氮杂环化合物的粘合层构成的单层的粘合片在内。
2.一种层叠构成的粘合片,其具备含有聚烯烃、丙烯酸类聚合物和氮杂环化合物的粘合层,且具备该粘合层作为表面层,其中不包括具备含有氮丙啶或双氮丙啶交联剂作为氮杂环化合物的粘合层的层叠构成的粘合片在内。
3.根据权利要求1或2所述的粘合片,其特征在于,所述氮杂环化合物与粘合层内部相比更多地不均匀存在于粘合层表面。
4.根据权利要求1或2所述的粘合片,其中,Cl、Br、I及S的总含量为100ppm以下。
5.根据权利要求1或2所述的粘合片,其特征在于,频率100kHz下的相对介电常数为3.8以下。
6.根据权利要求1或2所述的粘合片,其中,所述聚烯烃为下述物质或者由下述任意二种以上物质的组合形成的混合树脂:聚异丁烯、聚丁烯、聚丁二烯及聚异戊二烯中的任一种聚合物;聚异丁烯、聚丁烯、聚丁二烯及聚异戊二烯中的任意者的氢化物聚合物;以聚异丁烯、聚丁烯、聚丁二烯及聚异戊二烯中的任意聚合物或所述氢化物聚合物作为主链的聚合物;由构成聚异丁烯、聚丁烯、聚丁二烯及聚异戊二烯中的任意二种以上聚合物或任意二种以上所述氢化物聚合物的单体的组合形成的共聚物。
7.根据权利要求1或2所述的粘合片,其中,雾度为1.0%以下。
8.一种导电构件层叠体,其具备权利要求1~7中任一项所述的粘合片和导电构件。
9.一种触摸面板,其具备权利要求8所述的导电构件层叠体。
10.一种图像显示装置,其具备权利要求8所述的导电构件层叠体、图像显示面板及表面保护面板。
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