CN111699760A - 用于在金属基底上利用表面安装技术的系统、装置和方法 - Google Patents
用于在金属基底上利用表面安装技术的系统、装置和方法 Download PDFInfo
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- CN111699760A CN111699760A CN201780092153.5A CN201780092153A CN111699760A CN 111699760 A CN111699760 A CN 111699760A CN 201780092153 A CN201780092153 A CN 201780092153A CN 111699760 A CN111699760 A CN 111699760A
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- 239000010410 layer Substances 0.000 claims abstract description 115
- 238000002955 isolation Methods 0.000 claims abstract description 24
- 229910000679 solder Inorganic materials 0.000 claims abstract description 15
- 238000007772 electroless plating Methods 0.000 claims abstract description 6
- 239000011241 protective layer Substances 0.000 claims abstract description 5
- 230000003213 activating effect Effects 0.000 claims abstract description 4
- 239000000615 nonconductor Substances 0.000 claims description 22
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 10
- 230000004913 activation Effects 0.000 claims description 8
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- 229910052802 copper Inorganic materials 0.000 description 10
- 239000000047 product Substances 0.000 description 7
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
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- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
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- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1827—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- H05K3/0017—Etching of the substrate by chemical or physical means
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- H05K3/24—Reinforcing the conductive pattern
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Abstract
一种用于在集成基底结构上形成电路图案的方法,该方法包括提供包括图案形成部分的绝缘表面。仅在所述图案形成部分上沉积活化油墨以形成非导体隔离层。第一金属层通过无电镀形成在所述非导体隔离层上。所述第一金属层的图案化部分与所述第一金属层的剩余部分隔离以形成所述电路图案。在所述第一金属层上施加非导体掩模层。在所述非导体掩模层上形成第二金属层。确定表面安装连接盘图案和焊盘配置。将焊接掩模层施加到所述图案化部分。施加保护层以保护未被所述焊接掩模层覆盖的焊盘区域。然后,可以将电气部件安装到(一个或多个)焊盘。
Description
技术领域
本公开一般涉及电子电路和电子设备的形成,并且具体地涉及在金属基底上使用表面安装技术的方法。
背景技术
随着电子和工艺设备的发展,对小型化和集成电子部件的需求不断增加。目前,许多常规设备部件使用焊接技术组装。对于这些技术,部件通常被焊接到刚性或柔性印刷电路基底上以形成印刷电路板组件(PCBA),其具有220至250℃或更高的典型无铅工艺温度范围,或180至220℃的典型锡铅工艺温度范围。一旦形成PCBA,然后将其附接或集成到设备、设备部分或产品机架中,例如以形成最终产品。
随着3维(3D)打印和结构电子产品的出现,正在制造各种和/或独特形状、尺寸和/或维度的设备或产品(通常是相对微型的),并且这些独特的设备和产品通常需要专用的腔、空间和/或区域来容纳上述PCBA电路。在各种缺点中(例如大多数常规PCBA电路布置的至少部分不灵活的性质),将电子产品设备插入到这些设备可能带来空间要求方面的显著成本,这是非常不期望的,因为这些产品和设备的所提及的独特且通常微型的性质。
发明内容
本文描述了一种用于将表面安装技术部件直接放置到具有电路图案的金属基底上的系统和方法。用于在金属基底结构上形成电路图案的方法包括提供具有绝缘表面的金属基底结构,该绝缘表面包括图案形成部分。仅在绝缘表面的图案形成部分上沉积(即,印刷和其它类似技术)活化油墨,以在绝缘表面的图案形成部分上形成非导体(non-conductive)隔离层。第一金属层通过无电镀形成在非导体隔离层上。第一金属层的图案化部分与第一金属层的剩余部分隔离以形成电路图案。在第一金属层上施加非导体掩模层。在非导体掩模层上形成第二金属层。确定表面安装连接盘(land)图案和焊盘配置。将焊接掩模层施加到所述图案化部分以保护电路图案。施加保护层以保护未被所述焊接掩模层覆盖的焊盘区域。
附图说明
在以下参照附图对示例性实施例的详细描述中,本公开的其它特征和优点将变得显而易见,其中:
图1是示出根据某些实施方式的用于将表面安装技术组件放置在具有电路图案的金属基底上的方法的流程图;
图2是根据某些实施方式的示例金属基底;
图3是根据某些实施方式的用于制备绝缘金属基底的流程图;
图4是示出根据某些实施方式在绝缘金属基底上的绝缘表面的部分上形成活化层或电路层的示意图;
图5是根据某些实施方式的用于放置表面安装技术部件的焊盘结构;
图6A和6B是示出根据某些实施方式的安装在具有电路图案的金属基底上的表面安装技术部件的示意图;
图7是根据某些实施方式的焊接到具有电路图案的金属基底上的焊盘结构的表面安装技术部件引线的示例照片;
图8是根据某些实施方式的焊接到具有电路图案的金属基底上的焊盘结构的表面安装技术部件引线的示例照片;
图9是印刷电路板上的表面安装技术部件然后被安装在金属基底上的常规布置的热图;以及
图10是根据某些实施方式的具有电路图案的金属基底上的表面安装技术部件的热图。
具体实施方式
本文提供的附图和描述可能已经被简化以说明与清楚理解本文描述的装置、系统和方法相关的方面,同时为了清楚起见,消除了可以在典型的类似装置、系统和方法中发现的其它方面。因此,本领域技术人员可以认识到,其他元件和/或操作对于实现本文描述的设备、系统和方法可能是期望的和/或必要的。但是因为这样的元件和操作在本领域中是已知的,并且因为它们不会促进对本公开的更好理解,所以在此可能不提供对这样的元件和操作的讨论。然而,本公开被认为仍然包括本领域普通技术人员已知的对所描述的方面的所有这样的元件、变化和修改。
在全文中提供了示例性实施例,使得本公开充分彻底并且向本领域技术人员完全传达所公开的实施例的范围。阐述了许多具体细节,例如具体部件、设备和方法的示例,以提供对本公开的实施例的透彻理解。
然而,对于本领域技术人员来说显而易见的是,不需要采用具体公开的细节,并且可以以不同的形式来实现示例性实施例。因此,示例性实施例不应被解释为限制本公开的范围。在一些示例性实施例中,可以不详细描述公知的工艺、公知的设备结构和公知的技术。
本文所用的术语仅是为了描述特定的示例性实施例,而不是为了限制。如本文所使用的,单数形式"一"、"一个"和"该"也可以旨在包括复数形式,除非上下文另外清楚地指示。术语"包括"、"包含"、和"具有"是包含性的,因此指定了所陈述的特征、整数、步骤、操作、元件和/或部件的存在,但不排除一个或多个其他特征、整数、步骤、操作、元件、部件和/或其组合的存在或添加。这里描述的步骤、过程和操作不应被解释为必须要求它们以所讨论或示出的特定顺序执行,除非被具体地标识为优选或要求的执行顺序。还应理解,可采用额外或替代步骤来代替所公开的方面或与所公开的方面结合。
当元件或层被称为在另一元件或层"上"、"接合到"、"连接到"或"耦合到"另一元件或层时,其可以直接在另一元件或层上、接合到、连接到或耦合到另一元件或层,或者可以存在中间元件或层。相反,当元件被称为"直接在另一元件或层上"、"直接接合到"、"直接连接到"或"直接耦合到"另一元件或层时,可以不存在中间元件或层。用于描述元件之间的关系的其它词语应当以类似的方式解释(例如,"之间"对"直接之间"、"相邻"对"直接相邻"等)。如本文所使用的,术语"和/或"包括一个或多个相关联的所列项目的任何和所有组合。
尽管术语第一、第二、第三等可以在这里用于描述各种元件、部件、区域、层和/或部分,但是这些元件、部件、区域、层和/或部分不应当被这些术语限制。这些术语仅用于将一个元件、部件、区域、层或部分与另一个元件、部件、区域、层或部分区分开。除非上下文清楚地指出,否则诸如"第一"、"第二"和其它数字术语的术语在本文使用时不暗示顺序或次序。因此,在不脱离示例性实施例的教导的情况下,下面讨论的第一元件、部件、区域、层或部分可以被称为第二元件、部件、区域、层或部分。
本文描述了一种用于将表面安装技术(SMT)直接放置到具有电路图案的金属基底或类似基底上的系统和方法。仅出于说明的目的,集成基底可以包括由电介质薄层和铜层覆盖的金属基底。
图1是示出了用于将表面安装技术部件放置在具有电路图案的金属基底上的方法的组装工艺流程或流程图100。提供了一种集成的基底结构,其可以被处理以用于SMT部件的放置(框102)。集成基底结构可以是2维、2.5维或3维的,以用于电子设备和系统。集成基底结构可以使用本领域普通技术人员已知的各种技术来形成,例如由ON半导体开发的绝缘金属基底技术之一。图2中示出了示例性金属基底散热器200。
根据图3使用印刷激光选择性电镀(PLSP)(其在2015年12月23日提交的美国专利申请公开2016/0186327中被描述,并且其通过引用而被并入本文,如同完全记载一样)处理集成基底结构。特别地,图3是用于在金属结构上形成电路图案的示例性方法或流程图300。结合图2、4和5描述图3。图4示出了示例性的处理集成基底结构400,图5示出了示例性的焊盘结构500。
如上所述,提供集成基底结构(在此也称为基底)(框305)。例如,集成基底结构可以是使用散热器200的产品(诸如蜂窝电话、触摸面板、手表、眼镜等)的部分。现在还参照图4,集成基底结构示意性地示出为层405,其可以是金属、电介质和铜结构。在需要绝缘层410的情况下,这可以通过喷涂、丝网印刷、转印等形成,并且可以由绝缘涂料或油墨制成(框310)。绝缘表面410不限于平面的,即绝缘表面410可以遵循集成基底结构的结构。
在绝缘表面410的部分415(图案形成区域)上印刷活化油墨,以便在绝缘表面410的部分415上形成非导体隔离层或活化层420(框315)。注意,在本文所述的处理之前,非导体隔离层420最初与部分415具有相同的尺寸。在某些实施例中,非导体隔离层420可以包括催化剂金属元素,其选自由钯、铑、铂、银及其组合组成的组。在某些实施例中,非导体隔离层420可由非导电的金属氧化物化合物制成。活化油墨印刷可通过数字印刷、丝网印刷、移印、转印、涂布、喷涂或粉末涂布技术进行。这些技术是说明性的而非限制性的。活化油墨可以包括但不限于N-甲基-2-吡咯烷酮(NMP),当NMP被施加到绝缘表面410上时,NMP可以轻微地蚀刻绝缘表面410。这样,可以省略粗糙化绝缘表面410以增加活化层420和绝缘表面410之间的结合强度的常规步骤。
通过无电镀在活化层420上形成第一金属层425(框320)。在某些实施例中,这可通过将具有非导体隔离层420的基底置于无电镀溶液中达预定时间段以便执行无电镀反应来进行。在某些实施例中,第一金属层425可具有范围从0.1μm到0.25μm的厚度。在某些实施例中,第一金属层425可由镍制成,但不限于此。例如,在某些实施例中,第一金属层425可以由铜制成。
图案化部分422(也称为电路或迹线图案)与剩余部分423隔离(框325),其中部分415等于图案化部分422加上剩余部分423。在某些实施例中,该方法可以包括去除第一金属层425的一部分,以便沿着图案化部分422的外围形成间隙(未示出),以隔离第一金属层425的图案化部分422。可以通过激光烧蚀来进行第一金属层425的部分的去除。在某些实施例中,第一金属层425的图案化部分422可以被第一金属层425的剩余部分423围绕。在某些实施例中,非导体隔离层420的图案化部分可以例如通过激光烧蚀来隔离,其中非导体隔离层420的图案化部分在位置上对应于如本文所述的第一金属层425的图案化部分422。在某些实施例中,在活化层420为非导电的情况下,考虑到后续电镀工艺,间隙不需要延伸到非导体隔离层420中。
通过电镀在第一金属层425的图案化部分422上形成第二金属层430(方框330)。在某些实施例中,第二金属层430可由铜制成,即,在电镀工艺期间使用含铜电镀溶液与铜电极。在某些实施例中,第二金属层430可具有范围从0.2μm到0.5μm的厚度。由于第一金属层425的图案化部分422与剩余部分423隔离,因此在电镀工艺期间,第二金属层430可以仅形成在第一金属层425的图案化部分422上。
在某些实施例中,该方法还可以包括去除第一金属层425的剩余部分423的步骤。根据本公开,这种步骤可以通过湿法蚀刻技术或激光烧蚀来执行,并且不限于此。
在某些实施例中,该方法还可以包括去除位于图案化部分422外部的非导体隔离层420的部分的步骤。这一步骤可以通过将剥离溶液(stripping solution)施加到基底上来进行,例如通过将剥离溶液喷涂到基底上或通过将基底浸入剥离溶液中。这样,非导体隔离层420由于剥离溶液而软化,并且非导体隔离层420和基底的绝缘表面410之间的结合被减弱,从而允许其从基底的绝缘表面410被去除。在某些实施例中,去除非导体隔离层420的步骤可通过激光烧蚀来进行。
确定用于焊接的表面安装连接盘图案(一个或多个),随后确定用于所确定的图案的焊盘配置(方框335)。为了提供期望的连接性并增加表面安装部件的附接的可靠性,集成基底结构上的特定焊盘布局可以被设计成增加和/或最大化集成基底结构和焊盘表面区域接触的量。这种结构应通过机械和化学结合促进更强的结合,并且还可帮助吸收由迹线、基底、互连材料和部件端子之间的CTE的潜在失配所产生的至少一些力。图5示出了示例性的焊盘配置500,具体地,集成基底结构505具有焊盘510和安装在焊盘510上的部件515。本领域技术人员应当理解,在本公开中可以设想其它焊盘配置/几何形状,以允许对接触焊盘和集成基底结构的焊接应用。
可以施加焊接掩模层以覆盖铜迹线(例如,图案化部分422),以防止腐蚀与电短路,避免氧化和环境影响(方框340)。如果不施加焊接掩模,则可以重新考虑焊盘配置设计。对于接合焊盘,可能需要或不需要测试点和基准标记。此外,可以应用丝网作为参考指示符和用于为集成基底结构设计的每个SMT元件的引脚标记符。图6B中示出了示例性的焊接掩模。
施加保护层以保护未被焊接掩模层覆盖的焊盘区域并防止氧化(方框345)。例如,可以施加表面精加工/镀层,其可以是层叠有多种金属分层的树脂,所述金属可以包括铜(Cu)、镍(Ni)和/或金(Au)等。有机可焊性保护剂(OSP)可以用于高温/常规温度集成基底结构配置。优选地,应使用光滑、有光泽的镀层代替无光泽(matte)的表面保护层(finishes),因为粗糙的镀层表面可形成不一致的金属间化合物厚度,这可影响结合可靠性性能。
返回参考图1,手动地或通过使用机器视觉技术来执行材料检查和测量(框104)。一旦成功地完成检查,SMT元件就被放置在集成基底结构的焊盘上(方框106)。在一个示例性实施例中,例如对于2D结构,传统的SMT机器可以采用典型的SMT拾取和放置工艺。对于2.5D或3D结构,可以采用特殊的3D功能放置机器。在一个示例性实施例中,焊料或类似的结合材料被用于将SMT部件附接到集成基底结构上。特别地,焊膏材料和在线回流技术可以用于部件-基底接合工艺。
一旦确定了SMT的布局,就执行回流和/或固化工艺(如果需要)(在框108中),随后进行电气测试(框110)和检查(框112)。检查可以手动或自动进行,例如使用机器视觉技术。
如上所述,图2是根据某些实施方式的裸金属结构的示例。图6A和6B是在采用关于图1和3所描述的方法之后的集成基底结构的示例,图6A示出了填充有表面安装部件610的集成基底结构600。图6B示出了分解图,其示出了隔离层615(参见框315)、铜层620(参见框330)、焊接掩模625(参见框340)、诸如LED630的表面安装部件和连接器635。
图7是根据某些实施方式的焊接到集成基底结构700上的焊盘结构710的表面安装技术部件引线705的示例性照片。图8是根据某些实施方式的焊接到集成基底结构上的焊盘结构810的表面安装技术部件引线805的示例性照片。
图9是表面安装技术部件在被安装在金属基板上的印刷电路板上的常规布置的热图。图10是根据某些实施方式的集成基底结构上的表面安装技术部件的热图。从热图中明显看出,在根据本文所述方法处理的集成基底结构中存在更大且更均匀的热耗散。需要从早期阶段评估铜的厚度和尺寸以满足最终产品的特定应用要求,例如,对于高功率产品应用,可能需要更厚和更大的铜尺寸以获得更好的热耗散。
用户能够将SMT部件直接组装到3D结构上以形成最终产品,并且能够将机械和电子功能集成到单个设备中。其它优点包括但不限于,实现设备小型化、集成、合理化和特征进步;提供形状灵活性和可缩短工艺链的混合配置;提供更大的设计灵活性以进一步改进便携性和功能性;通过集成减少了部件和基底的数量以及总的组装时间。存在各种各样的工业应用,包括但不限于汽车照明应用、消费应用(例如,无线充电器、电力传输触摸传感器、相机模块等)、工业应用(例如,传感器、电源控制器、电池容器、开关模块、OLED等)和微电子、尤其具有高散热要求的电力电子产品应用,即,LED照明、电力转换、电机驱动和半导体模块等。
虽然已经结合被认为是示例性实施例的内容描述了本公开,但是应当理解,本公开不限于所公开的实施例,而是意图覆盖包括在最广泛的解释的精神和范围内的各种布置,以便涵盖所有这样的修改和等效布置。
Claims (20)
1.一种用于在基底上形成电路图案的方法,该方法包括以下步骤:
提供具有包括图案形成部分的绝缘表面的基底;
使用活化油墨仅在所述绝缘表面的所述图案形成部分上印刷,以在所述绝缘表面的所述图案形成部分上形成非导体隔离层;
通过无电镀在所述非导体隔离层上形成第一金属层;以及
将所述第一金属层的图案化部分与所述第一金属层的剩余部分隔离以形成所述电路图案。
2.根据权利要求1所述的方法,其中,通过数字印刷、丝网印刷、移印、转印、涂布、喷涂和粉末涂布中的一者来执行使用所述活化油墨印刷的步骤。
3.根据权利要求1所述的方法,其中通过激光烧蚀来执行隔离所述第一金属层的所述图案化部分的步骤。
4.根据权利要求3所述的方法,其中隔离所述第一金属层的所述图案化部分的步骤包括:沿着所述图案化部分的外围去除所述第一金属层的部分以隔离所述第一金属层的所述图案化部分。
5.根据权利要求3所述的方法,该方法还包括隔离所述非导体隔离层的图案化部分的步骤,所述非导体隔离层的所述图案化部分形成在所述图案形成区域中并且在位置上对应于所述第一金属层的所述图案化部分。
6.根据权利要求1所述的方法,其中所述非导体隔离层是非导电的。
7.根据权利要求1所述的方法,其中所述基底包括:金属基层和形成于所述金属基层上以提供所述绝缘表面的绝缘层。
8.根据权利要求1所述的方法,该方法还包括通过电镀在所述第一金属层的所述图案化部分上形成第二金属层的步骤。
9.根据权利要求1所述的方法,其中所述第一金属层的所述图案化部分被所述第一金属层的所述剩余部分围绕。
10.根据权利要求1所述的方法,其中所述活化油墨包括N-甲基-2-吡咯烷酮。
11.根据权利要求1所述的方法,该方法还包括:
确定表面安装连接盘图案和焊盘配置;
施加焊接掩模层以覆盖所述图案化部分;以及
施加保护层以保护未被所述焊接掩模层覆盖的焊盘区域。
12.根据权利要求1所述的方法,该方法还包括:
将表面安装技术(STM)部件焊接到所述基底上的焊盘。
13.一种电子电路,该电子电路包括:
集成基底结构,该集成基底结构包括一个或多个导电迹线,所述导电迹线包括在所述集成基底结构的激光蚀刻的非导体隔离部分上的限定每个导电迹线的镀层;
一个或多个导电焊盘,所述一个或多个导电焊盘位于沿着所述一个或多个导电迹线的一个或多个预定位置处;以及
电气部件,所述电气部件利用互连和接合材料表面安装到所述至少一个导电焊盘。
14.根据权利要求13所述的电子电路,其中在激光蚀刻的非导体隔离部分上的所述镀层包括:
非导体隔离层部分,该非导体隔离层部分具有印刷在所述集成基底结构的绝缘表面的图案形成区域中的活化油墨;
形成在所述非导体隔离层上的第一金属层;以及
形成在所述第一金属层上的第二金属层。
15.根据权利要求14所述的电子电路,其中激光蚀刻的非导体隔离部分上的所述镀层通过沿着所述一个或多个导电迹线的外围去除所述第一金属层的部分以隔离所述第一金属层的所述一个或多个导电迹线而形成。
16.根据权利要求13所述的电子电路,其中所述非导体隔离部分是非导电的。
17.根据权利要求14所述的电子电路,其中所述集成基底结构包括:金属基层和形成在所述金属基层上以提供绝缘表面的绝缘层。
18.根据权利要求14所述的电子电路,其中所述活化油墨包括N-甲基-2-吡咯烷酮。
19.根据权利要求14所述的电子电路,该电子电路还包括:
焊接掩模层,所述焊接掩模层覆盖所述一个或多个导电迹线。
20.根据权利要求19所述的电子电路,该电子电路还包括:
保护层,该保护层覆盖未被所述焊接掩模层覆盖的焊盘区域。
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Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001267724A (ja) * | 2000-03-23 | 2001-09-28 | Victor Co Of Japan Ltd | プリント基板及びその製造方法 |
US20020179692A1 (en) * | 2001-06-04 | 2002-12-05 | I-Chung Tung | Pin attachment by a surface mounting method for fabricating organic pin grid array packages |
US20050241949A1 (en) * | 2004-04-30 | 2005-11-03 | Kenneth Crouse | Selective catalytic activation of non-conductive substrates |
KR20120130642A (ko) * | 2011-05-23 | 2012-12-03 | 주식회사 아모그린텍 | 메탈 코어 인쇄회로기판 및 그 제조방법 |
US20130256023A1 (en) * | 2012-03-30 | 2013-10-03 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and method of manufacturing the same |
US20140102773A1 (en) * | 2012-10-16 | 2014-04-17 | Sumitomo Metal Mining Co., Ltd. | Adhesiveless copper clad laminates and printed circuit board having adhesiveless copper clad laminates as base material |
CN103999559A (zh) * | 2011-11-28 | 2014-08-20 | 绿点高新科技股份有限公司 | 导电迹线结构的制备方法及具有导电迹线结构的基材 |
JP2015211092A (ja) * | 2014-04-25 | 2015-11-24 | 四国計測工業株式会社 | 配線基板および半導体装置 |
JP2016058545A (ja) * | 2014-09-09 | 2016-04-21 | 住友電気工業株式会社 | プリント配線板用基板、プリント配線板及びプリント配線板用基板の製造方法 |
US20160186327A1 (en) * | 2014-12-24 | 2016-06-30 | Taiwan Green Point Enterprises Co., Ltd. | Method for forming a circuit pattern on a substrate |
US20170079139A1 (en) * | 2015-09-16 | 2017-03-16 | Jabil Circuit, Inc. | System, apparatus and method for utilizing surface mount technology on plastic substrates |
US20170142834A1 (en) * | 2015-11-16 | 2017-05-18 | Sunasic Technologies, Inc. | Printed circuit board assembly forming enhanced biometric module and manufacturing method thereof |
CN107004752A (zh) * | 2014-12-08 | 2017-08-01 | 夏普株式会社 | 发光装置用基板以及发光装置用基板的制造方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09135062A (ja) * | 1995-11-08 | 1997-05-20 | Kobe Hatsuka Kk | プリント基板のマーキング処理方法 |
TWI244150B (en) * | 2004-12-09 | 2005-11-21 | Siliconware Precision Industries Co Ltd | Flash preventing substrate and fabrication method thereof |
US7768075B2 (en) * | 2006-04-06 | 2010-08-03 | Fairchild Semiconductor Corporation | Semiconductor die packages using thin dies and metal substrates |
JP5168863B2 (ja) * | 2006-09-20 | 2013-03-27 | 日本電気株式会社 | プリント配線板製造方法 |
JP5209938B2 (ja) * | 2007-11-01 | 2013-06-12 | 上村工業株式会社 | 回路形成方法 |
KR20110038457A (ko) | 2009-10-08 | 2011-04-14 | 삼성전기주식회사 | 무전해 니켈 도금층을 갖는 금속배선 구조 및 그 제조방법 |
US20120273261A1 (en) * | 2010-10-20 | 2012-11-01 | Taiwan Green Point Enterprises Co., Ltd. | Circuit substrate having a circuit pattern and method for making the same |
US8621749B2 (en) | 2010-03-12 | 2014-01-07 | Taiwan Green Point Enterprises Co., Ltd | Non-deleterious technique for creating continuous conductive circuits |
US9310766B2 (en) * | 2010-09-29 | 2016-04-12 | Basf Se | Security element |
KR101181173B1 (ko) | 2010-10-11 | 2012-09-18 | 엘지이노텍 주식회사 | 방열회로기판, 그의 제조 방법 및 그를 포함하는 발열소자 패키지 |
DE102014213535A1 (de) * | 2014-07-11 | 2016-01-14 | Siemens Aktiengesellschaft | Verfahren zum Herstellen einer elektronischen Baugruppe und elektronische Baugruppe, wobei in dem Substrat der Baugruppe eine Heizeinrichtung vorgesehen ist |
TW201616699A (zh) | 2014-10-30 | 2016-05-01 | 新世紀光電股份有限公司 | 驅動覆晶發光晶片之電路板及包含其之發光模組 |
US9502397B1 (en) * | 2015-04-29 | 2016-11-22 | Deca Technologies, Inc. | 3D interconnect component for fully molded packages |
-
2017
- 2017-06-15 EP EP17913604.9A patent/EP3639634A4/en active Pending
- 2017-06-15 WO PCT/MY2017/050027 patent/WO2018231045A1/en unknown
- 2017-06-15 CN CN202310540436.9A patent/CN116634667A/zh active Pending
- 2017-06-15 CN CN201780092153.5A patent/CN111699760A/zh active Pending
- 2017-06-15 US US16/622,381 patent/US20200205295A1/en not_active Abandoned
-
2018
- 2018-06-14 TW TW107120537A patent/TWI771433B/zh active
- 2018-06-14 TW TW111123249A patent/TW202315477A/zh unknown
-
2022
- 2022-07-05 US US17/857,664 patent/US20220408565A1/en active Pending
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001267724A (ja) * | 2000-03-23 | 2001-09-28 | Victor Co Of Japan Ltd | プリント基板及びその製造方法 |
US20020179692A1 (en) * | 2001-06-04 | 2002-12-05 | I-Chung Tung | Pin attachment by a surface mounting method for fabricating organic pin grid array packages |
US20050241949A1 (en) * | 2004-04-30 | 2005-11-03 | Kenneth Crouse | Selective catalytic activation of non-conductive substrates |
KR20120130642A (ko) * | 2011-05-23 | 2012-12-03 | 주식회사 아모그린텍 | 메탈 코어 인쇄회로기판 및 그 제조방법 |
CN103999559A (zh) * | 2011-11-28 | 2014-08-20 | 绿点高新科技股份有限公司 | 导电迹线结构的制备方法及具有导电迹线结构的基材 |
US20130256023A1 (en) * | 2012-03-30 | 2013-10-03 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and method of manufacturing the same |
US20140102773A1 (en) * | 2012-10-16 | 2014-04-17 | Sumitomo Metal Mining Co., Ltd. | Adhesiveless copper clad laminates and printed circuit board having adhesiveless copper clad laminates as base material |
JP2015211092A (ja) * | 2014-04-25 | 2015-11-24 | 四国計測工業株式会社 | 配線基板および半導体装置 |
JP2016058545A (ja) * | 2014-09-09 | 2016-04-21 | 住友電気工業株式会社 | プリント配線板用基板、プリント配線板及びプリント配線板用基板の製造方法 |
CN107004752A (zh) * | 2014-12-08 | 2017-08-01 | 夏普株式会社 | 发光装置用基板以及发光装置用基板的制造方法 |
US20160186327A1 (en) * | 2014-12-24 | 2016-06-30 | Taiwan Green Point Enterprises Co., Ltd. | Method for forming a circuit pattern on a substrate |
US20170079139A1 (en) * | 2015-09-16 | 2017-03-16 | Jabil Circuit, Inc. | System, apparatus and method for utilizing surface mount technology on plastic substrates |
US20170142834A1 (en) * | 2015-11-16 | 2017-05-18 | Sunasic Technologies, Inc. | Printed circuit board assembly forming enhanced biometric module and manufacturing method thereof |
Also Published As
Publication number | Publication date |
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TW201906513A (zh) | 2019-02-01 |
EP3639634A1 (en) | 2020-04-22 |
US20200205295A1 (en) | 2020-06-25 |
CN116634667A (zh) | 2023-08-22 |
US20220408565A1 (en) | 2022-12-22 |
TWI771433B (zh) | 2022-07-21 |
EP3639634A4 (en) | 2021-07-14 |
WO2018231045A1 (en) | 2018-12-20 |
TW202315477A (zh) | 2023-04-01 |
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