TW201906513A - 在金屬基材上使用表面安裝技術的系統、設備及方法 - Google Patents
在金屬基材上使用表面安裝技術的系統、設備及方法 Download PDFInfo
- Publication number
- TW201906513A TW201906513A TW107120537A TW107120537A TW201906513A TW 201906513 A TW201906513 A TW 201906513A TW 107120537 A TW107120537 A TW 107120537A TW 107120537 A TW107120537 A TW 107120537A TW 201906513 A TW201906513 A TW 201906513A
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- metal layer
- conductive
- metal
- pattern
- Prior art date
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 76
- 239000002184 metal Substances 0.000 title claims abstract description 76
- 239000000758 substrate Substances 0.000 title claims abstract description 70
- 238000000034 method Methods 0.000 title claims abstract description 47
- 238000005516 engineering process Methods 0.000 title claims description 28
- 239000010410 layer Substances 0.000 claims abstract description 119
- 238000002955 isolation Methods 0.000 claims abstract description 29
- 229910000679 solder Inorganic materials 0.000 claims abstract description 16
- 238000007772 electroless plating Methods 0.000 claims abstract description 6
- 239000011241 protective layer Substances 0.000 claims abstract description 5
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 9
- 238000007639 printing Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 238000009713 electroplating Methods 0.000 claims description 5
- 238000000608 laser ablation Methods 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 claims description 3
- -1 spray coating Substances 0.000 claims description 3
- 238000012546 transfer Methods 0.000 claims description 3
- 238000007649 pad printing Methods 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- 230000004913 activation Effects 0.000 abstract description 5
- 230000000873 masking effect Effects 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- 239000010949 copper Substances 0.000 description 12
- 229910052802 copper Inorganic materials 0.000 description 11
- 230000008569 process Effects 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000007689 inspection Methods 0.000 description 4
- 230000010354 integration Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000003550 marker Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 230000002335 preservative effect Effects 0.000 description 1
- 239000012925 reference material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1827—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09363—Conductive planes wherein only contours around conductors are removed for insulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0709—Catalytic ink or adhesive for electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
一種用於形成電路圖案於集成基材結構上的方法,其包括:提供包括一圖案形成部的一絕緣表面。只在該圖案形成部上沉積一活化油墨以形成一不傳導隔離層。用無電鍍法在該不傳導隔離層上形成第一金屬層。隔離該第一金屬層的圖案化部份與該第一金屬層的其餘部份以形成電路圖案。施加一不傳導遮罩層於該第一金屬層上。形成第二金屬層於該不傳導遮罩層上。判定一表面安裝焊盤圖案及接墊組態。施加一防焊膜層於該圖案化部份。施加一保護層以保護不被該防焊膜層覆蓋的接墊區域。然後,電氣組件可安裝至該(等)接墊。
Description
本揭示內容大體有關於電子電路及電子裝置的形成,且尤其是,有關於在金屬基材上使用表面安裝技術的方法。
隨著電子及處理裝置的演進,微型化及集成電子組件的需求在遞增。當前許多習知裝置組件係使用焊接技術來組裝。關於此類技術,組件通常以220至250℃或更多之典型無鉛加工溫度範圍或以180至220℃之典型錫鉛加工溫度範圍焊在剛性或軟性印刷電路基材上以形成印刷電路板總成(PCBA)。一旦PCBA形成,則附接或整合成裝置、裝置部份或產品底座,以便形成成品。
隨著3維(3D)列印及構造電子產品的出現,常以微型尺度製成有各種及/或獨特形狀、大小及/或尺寸的裝置或產品,且這些獨特裝置及產品常需要專屬腔室、空間及/或區域以容納前述PCBA電路。在各種缺點中,例如大部份習知PCBA電路配置至少部份缺乏彈性的本質,插入電子產品於這些裝置在空間要求可能帶來高度不合意的重大成本,因為這些產品及裝置有參見互照獨特性與時常微型化的本質。
在此描述一種用於佈置表面安裝技術組件直接於有電路圖案之金屬基材上的系統及方法。用於形成電路圖案於金屬基材結構上的方法包括:提供有包括一圖案形成部之一絕緣表面的金屬基材結構。只在該絕緣表面之該圖案形成部上沉積(亦即,印刷或其他類似技術)一活化油墨(activation ink)以在該絕緣表面之該圖案形成部上形成一不傳導隔離層。用無電鍍法形成一第一金屬層於該不傳導隔離層上。隔離該第一金屬層的一圖案化部份與該第一金屬層的一其餘部份以形成該電路圖案。施加一不傳導遮罩層於該第一金屬層上。形成一第二金屬層於該不傳導遮罩層上。判定一表面安裝焊盤圖案及接墊組態。施加一防焊膜層(solder mask layer)至該圖案化部份以保護該電路圖案。施加一保護層以保護不被防焊膜層保護的接墊區域。
本文中所提供之圖及說明可已經簡化以圖解說明與清楚地理解本文中所闡述之裝置、系統及方法相關的方面,同時出於清晰目的,剔除可在典型類似裝置、系統及方法中找到的其他方面。本技藝一般技術人員因此可認識到,其他元件及/或運作可為合意的及/或需要實施本文中所闡述之該等裝置、系統及方法。但是,由於此類元件及運作為本技術所習知,且由於無助於更好地了解本揭示內容,因此本文不提供此類元件及運作的論述。不過,本揭示內容被視為包括本技藝一般技術人員所已知之所描述方面的所有此類元件、變更及修改。
提供數個示範具體實施例使得本揭示內容充分徹底完整地傳輸揭露具體實施例的範圍給熟諳此藝者。提出許多特定細節,例如特定組件、裝置及方法的實施例,以供徹底了解本揭示內容的具體實施例。
儘管如此,熟諳此藝者會明白,可需要運用特定的揭露細節,且可用不同的形式來體現示範具體實施例。照此,該等示範具體實施例不應被視為要限制本揭示內容的範疇。在一些示範具體實施例中,可詳述眾所周知的製程、眾所周知的裝置結構、及眾所周知的技術。
術語使用於本文的目的只是用來描述特別的示範具體實施例而非旨在限制。如本文所使用的,單數形式「一(a)」、「一(an)」、與「該(the)」可旨在也包括複數個形式,除非上下文另有明示。用語「包含(comprises、comprising)」、「包括(including)」及「具有(having)」是含括用語且因此具體規定所陳述之特徵、整數、步驟、運作、元件及/或組件的存在,但不排除一或多個其他特徵、整數、步驟、運作、元件、組件及/或彼等之群組的存在或添加。描述於本文的步驟、製程及運作不應被視為必定要求它們各自在論及或圖示特定順序中的表現,除非具體指明為較佳或必要的表現順序。也應瞭解,可運用取代揭露方面或與其結合的附加或替代步驟。
當一元件或層被稱為在另一元件或層「上」、「接合至」、「連接至」或「耦合至」時,它可直接在其上、接合、連接或耦合至該另一元件或層,或可存在中介元件或層。相比之下,當一元件被稱為「直接在其上」、「直接接合至」、「直接連接至」或「直接耦合至」另一元件或層時,則不存在中介元件或層。其他用來描述元件間關係的用詞應用相似的方式解釋(例如,「之間」與「直接在…之間」、「鄰接」與「直接鄰接」等等)。如本文所使用的,用語「及/或」包括相關列舉項目中之一或多個的任一或所有組合。
儘管用語第一、第二、第三等等在本文可用來描述各種元件、組件、區域、層及/或區段,然而這些元件、組件、區域、層及/或區段應不受限於這些用語。這些用語可以只用來區別一元件、組件、區域、層或區段與另一元件、組件、區域、層或區段。例如「第一」、「第二」的用語及其他數字表示用語在用於本文時不指示序列或順序,除非上下文另有明示。因此,把在第一元件、組件、區域、層或區段以後要討論命名為第二元件、組件、區域、層或區段而不脫離該等示範具體實施例的教導。
在此描述一種用於佈置表面安裝技術(SMT)組件直接於有電路圖案之金屬基材或類似基材上的系統及方法。只為了圖解說明,集成基材可包括被電介質薄層及銅層覆蓋的金屬底板。
圖1的組裝方法流程或流程圖100圖示用於佈置表面安裝技術組件於有電路圖案之金屬基材上的方法。提供可予以加工以便佈置SMT組件的集成基材結構(區塊102)。該集成基材結構可為2維、2.5維或3維結構以用於電子裝置及系統。該集成基材結構可使用本技藝一般技術人員所習知的各種技術形成,例如其中之一為由ON Semiconductor公司所開發的絕緣金屬基材技術(IMST®)。示範金屬基材散熱片200圖示於圖2。
使用印刷雷射選擇電鍍(PLSP),加工根據圖3的集成基材結構,其描述於在2015年12月23日申請的美國專利申請案公開號:2016/0186327,其全部內容併入本文作為參考資料。特別是,圖3為用於形成電路圖案於金屬結構上的示意方法或流程圖300。圖3的描述與圖2、圖4及圖5結合。圖4圖示示意已加工集成基材結構400而圖5圖示示意接墊結構500。
如上述,提供集成基材結構(在此也被稱為基材)(區塊305)。例如,該集成基材結構可為使用散熱片200之產品的一部份,例如手機、觸控面板、手錶、眼鏡等等。此時也參考圖4,該集成基材結構被示意圖示為層405,它可為金屬、電介質及銅結構。在需要絕緣層410的情形下,可用噴塗、網版印刷、轉印或其類似者形成,且可由絕緣塗料或油墨製成(區塊310)。絕緣表面410不限於平面,亦即,絕緣表面410可遵循集成基材結構的結構。
將活化油墨印刷於絕緣表面410的一部份415(圖案形成區)上以便形成不傳導隔離層或活化層420於絕緣表面410的部份415上(區塊315)。應注意,在描述於本文的加工之前,不傳導隔離層420初始與部份415有相同的尺寸。在某些具體實施例中,不傳導隔離層420可包括催化劑金屬元素,其係選自由下列元素組成的群組:鈀、銠、鉑、銀及彼等之組合。在某些具體實施例中,不傳導隔離層420可由不導電的金屬氧化物化合物製成。活化油墨印刷可用以下技術實施:數位印刷、網版印刷、移印(pad printing)、轉印、塗層、噴塗、或粉末塗層技術。這些技術為示意性且無限定性。活化油墨可包括但不限於:N-甲基-2-吡咯啶酮(N-methyl-2-pyrrolidone,NMP),它在施加於絕緣表面410上可輕度蝕刻絕緣表面410。照此,可省略粗化絕緣表面410以增加活化層420與絕緣表面410之鍵合強度的習知步驟。
用無電鍍法在活化層420上形成第一金屬層425(區塊320)。在某些具體實施例中,這可藉由把有不傳導隔離層420的基材放在無電鍍溶液中持續一段預定時間以便進行無電鍍反應來實施。在某些具體實施例中,第一金屬層425可具有0.1微米至0.25微米的厚度。在某些具體實施例中,第一金屬層425可由鎳製成,但是不限於此。例如,在某些具體實施例中,第一金屬層425可由銅製成。
使圖案化部份422(也習稱電路或跡線圖案)與其餘部份423隔離(區塊325),在此部份415等於圖案化部份422加上其餘部份423。在某些具體實施例中,這可包括移除第一金屬層425的一部份以便形成沿著圖案化部份422之外周的間隙(未圖示)以隔離第一金屬層425的圖案化部份422。第一金屬層425之該部份的移除可用雷射剝蝕法實施。在某些具體實施例中,第一金屬層425的圖案化部份422可被第一金屬層425的其餘部份423包圍。在某些具體實施例中,例如,用雷射剝蝕法,可隔離不傳導隔離層420的圖案化部份,在此不傳導隔離層420的圖案化部份位置對應至第一金屬層425的圖案化部份422,如本文所述。在某些具體實施例中,在活化層420不導電時,考慮到後續的電鍍製程,而不需要伸入不傳導隔離層420的間隙。
用電鍍法,在第一金屬層425的圖案化部份422上形成第二金屬層430(區塊330)。在某些具體實施例中,第二金屬層430可由銅製成,亦即,在電鍍製程期間使用含銅電鍍溶液與銅電極。在某些具體實施例中,第二金屬層430可具有0.2微米至0.5微米的厚度。由於第一金屬層425的圖案化部份422與其餘部份423隔離,第二金屬層430在電鍍製程期間可以只形成第一金屬層425的圖案化部份422上。
在某些具體實施例中,該方法可進一步包括:移除第一金屬層425之其餘部份423的步驟。根據本揭示內容,此一步驟可用濕蝕刻技術或雷射剝蝕法實施且不受限於此。
在某些具體實施例中,該方法可進一步包括:移除不傳導隔離層420中位在圖案化部份422外之部份的步驟。實施此一步驟可藉由施塗剝離溶液(stripping solution)於基材上,例如,藉由噴塗剝離溶液於基材上或藉由沉浸基材於剝離溶液中。照此,不傳導隔離層420由於剝離溶液而軟化,且不傳導隔離層420與基材的絕緣表面410之間的鍵合減弱,從而允許從基材的絕緣表面410移除它。在某些具體實施例中,移除不傳導隔離層420的步驟可用雷射剝蝕法實施。
判定焊接用的表面安裝焊盤圖案(s),接著是用於判定圖案的接墊組態(區塊335)。為了提供所欲連接性以及增加表面安裝組件的附接可靠性,可設計集成基材結構上的特定接墊佈局以增加及/或最大化集成基材結構與接墊表面積接觸的數量。此一組態應通過機械鍵及化學鍵促進較強的鍵合,而且也可有助於吸收由跡線、基材、互連材料及組件端子之潛在CTE失配產生的至少一些力。示範接墊組態500圖示於圖5。特別是,集成基材結構505有接墊510與裝在接墊510上的組件515。熟諳此藝者應瞭解,本揭示內容可想到其他的接墊組態/幾何以允許應用於接墊與集成基材結構之接觸的焊接。
可施加防焊膜層以覆蓋銅跡線(例如,圖案化部份422)以免受害於腐蝕、電氣短路,避免氧化及環境影響(區塊340)。如果不施加防焊膜,則可重新考慮接墊組態設計。至於焊墊,可能需要或不需要測試點及基準標記。此外,絲網可作為用於集成基材結構之各SMT組件的參考標志符及針標(pin marker)。示範防焊膜圖示於圖6B。
施加保護層以保護不被防焊膜層覆蓋的接墊區域且防止氧化(區塊345)。例如,可施加表面拋光/鍍覆層,它可為有複數個金屬層的樹脂,除其他材料外,可包括銅(Cu)、鎳(Ni)及/或金(Au)。有機保焊膜(Organic Solderability Preservative,OSP)可使用於高溫/常溫集成基材結構組態。較佳地,應使用平滑的光面鍍層而不是冰銅表面拋光(matte surface finish),因為粗糙鍍層表面可能形成不一致的金屬間化合物厚度而可能影響鍵合可靠性效能。
請再參考圖1,用手或者是通過利用機器視覺技術執行材料檢驗及測量(區塊104)。一旦成功完成檢驗,就將SMT組件放在集成基材結構的接墊上(區塊106)。在例如用於2D結構的一示範具體實施例中,習知SMT機器可運用典型的SMT拾取製程。至於2.5D或3D結構,可運用能夠3D佈置的特殊機器。在一示範具體實施例中,焊錫或類似鍵合材料用來使SMT組件附著於集成基材結構上。特別是,焊錫膏材料及線上回焊技術可使用於組件-基材鍵合製程。
一旦判定SMT組件佈置,(必要時)執行回焊及/或固化製程(在區塊108),接著是電氣測試(區塊110)及檢驗(區塊112)。檢驗可手動或自動地發生,例如使用機器視覺技術。
如上述,圖2為根據某些實作之裸露金屬結構的實施例。圖6A及圖6B為集成基材結構在經歷如圖1及圖3所述之方法之後的實施例。圖6A圖示有數個表面安裝組件610的密集集成基材結構600。圖6B的展開圖圖示隔離層615(參考,區塊315)、銅層620(參考,區塊330)、防焊膜625(參考,區塊340)、例如LED 630及連接器635的表面安裝組件。
圖7的示範照片圖示根據某些實作焊接至在集成基材結構700上之接墊結構710的表面安裝技術組件引線705。圖8的示範照片圖示根據某些實作焊接至在集成基材結構上之接墊結構810的表面安裝技術組件引線805。
圖9圖示傳統將表面安裝技術組件佈置於隨後會裝在金屬基材上之印刷電路板上的熱圖。圖10根據某些實作圖示表面安裝技術組件在集成基材結構上的熱圖。由該等熱圖表明,根據描述於本文之方法加工的集成基材結構有較大且甚至更大的熱耗散。為了讓高功率產品應用有更好的散熱,可能要求在早期階段需要評估銅厚度及尺寸以滿足製成品特殊應用要求,例如較厚及較大的銅尺寸。
使用者能夠組裝SMT組件直接於3D結構上以形成成品且致能將機械及電子功能集成為單一裝置。其他優點包括但不限於:致能裝置最小化,集成,合理化與特徵提升;提供可縮短流程鏈(process chain)的形狀彈性與混合組態;提供較大設計彈性以進一步改善可攜性及機能;且通過集成減少部件及基材的個數和總組裝時間。有廣泛多樣的工業應用,包括但不限於:汽車照明應用,消費者應用(例如,無線充電器、動力傳動裝置觸控感測器、攝影模組等等),工業應用(例如,感測器、電源控制器、電池容器、切換模組、OLED等等),以及微電子產品,電力電子產品應用,特別是有高度散熱要求的,亦即,LED照明燈,電力轉換,馬達驅動器和半導體模擬軟體等等。至於集成基材結構上的焊線,應考慮軟表面拋光/鍍層,亦即ENEPIG。
儘管已結合被視為示範的具體實施例來描述本揭示內容,然而應瞭解,本揭示內容不限於所揭露的具體實施例反而旨在涵蓋包括在最廣泛解釋之精神及範疇內的各種配置以便涵蓋所有此類修改及等效配置。
100‧‧‧組裝方法流程或流程圖
102-112‧‧‧區塊
200‧‧‧示範金屬基材散熱片
300‧‧‧示意方法或流程圖
305-345‧‧‧區塊
400‧‧‧示意已加工集成基材結構
405‧‧‧層
410‧‧‧絕緣層
415‧‧‧部份
420‧‧‧不傳導隔離層/活化層
422‧‧‧圖案化部份
423‧‧‧其餘部份
425‧‧‧第一金屬層
430‧‧‧第二金屬層
500‧‧‧示意接墊結構
505‧‧‧集成基材結構
510‧‧‧接墊
515‧‧‧組件
600‧‧‧密集集成基材結構
610‧‧‧表面安裝組件
615‧‧‧隔離層
620‧‧‧銅層
625‧‧‧防焊膜
630‧‧‧表面安裝組件
635‧‧‧連接器
700‧‧‧集成基材結構
705‧‧‧表面安裝技術組件引線
710‧‧‧接墊結構
805‧‧‧表面安裝技術組件引線
810‧‧‧接墊結構
由以下示範具體實施例參考附圖的詳細說明可明白本揭示內容的其他特徵及優點,其中:
圖1的流程圖根據某些實作圖示用於佈置表面安裝技術組件於有電路圖案之金屬基材上的方法;
圖2根據某些實作圖示一示範金屬基材;
圖3根據某些實作圖示用於製備絕緣金屬基材的流程圖;
圖4的示意圖根據某些實作圖示形成活化或電路層於在絕緣金屬基材上的絕緣表面之一部份上;
圖5根據某些實作圖示用以佈置表面安裝技術組件的接墊結構;
圖6A及圖6B的示意圖根據某些實作圖示裝在有電路圖案之金屬基材上的表面安裝技術組件;
圖7的示範照片根據某些實作圖示焊接至在有電路圖案之金屬基材上之接墊結構的表面安裝技術組件引線;
圖8的示範照片根據某些實作圖示焊接至在有電路圖案之金屬基材上之接墊結構的表面安裝技術組件引線;
圖9圖示傳統將表面安裝技術組件佈置於隨後會裝在金屬基材上之印刷電路板上的熱圖(heat diagram);與
圖10根據某些實作圖示表面安裝技術組件在有電路圖案之金屬基材上的熱圖。
Claims (20)
- 一種用於在一基材上形成一電路圖案的方法,其包含下列步驟: 提供一基材,其具有包括一圖案形成部的一絕緣表面; 只在該絕緣表面之該圖案形成部上用一活化油墨印刷,以在該絕緣表面之該圖案形成部上形成一不傳導隔離層; 用無電鍍法在該不傳導隔離層上,形成一第一金屬層;且 隔離該第一金屬層的一圖案化部份與該第一金屬層的一其餘部份,以形成該電路圖案。
- 如請求項1之方法,其中用該活化油墨印刷的步驟用下列技術中之一者實施:數位印刷、網版印刷、移印、轉印、塗層、噴塗、與粉末塗層。
- 如請求項1之方法,其中隔離該第一金屬層之該圖案化部份的步驟用雷射剝蝕來實施。
- 如請求項3之方法,其中隔離該第一金屬層之該圖案化部份的步驟包括:移除該第一金屬層沿著該圖案化部份之一外周的一部份,以隔離該第一金屬層之該圖案化部份。
- 如請求項3之方法,其進一步包含以下步驟:隔離該不傳導隔離層的一圖案化部份,該圖案化部份係形成於該圖案形成區域中且係位於對應至該第一金屬層之該圖案化部份。
- 如請求項1之方法,其中該不傳導隔離層係不導電。
- 如請求項1之方法,其中該基材包括一金屬基底層,及形成於該金屬基底層上以提供該絕緣表面的一絕緣層。
- 如請求項1之方法,其進一步包含以下步驟:用電鍍法於該第一金屬層之該圖案化部份上,形成一第二金屬層。
- 如請求項1之方法,其中該第一金屬層之該圖案化部份被該第一金屬層之該其餘部份包圍。
- 如請求項1之方法,其中該活化油墨包括N-甲基-2-吡咯啶酮。
- 如請求項1之方法,其進一步包含: 判定一表面安裝焊盤圖案及接墊組態; 施加一防焊膜層以覆蓋該圖案化部份;及, 施加一保護層以保護不被該防焊膜層覆蓋的接墊區域。
- 如請求項1之方法,其進一步包含: 將數個表面安裝技術(STM)組件焊接至位在該基材上的數個接墊。
- 一種電子電路,其包含: 包含一或多個導電跡線的一集成基材結構,該一或多個導電跡線包含在該集成基材結構之一經雷射蝕刻之不傳導隔離部上界定各導電跡線的鍍層; 在該一或多個導電跡線上之一或多個預定位置處的一或多個導電接墊;及 用互連及鍵合材料而表面安裝至該至少一導電接墊的一電氣組件。
- 如請求項13之電子電路,其中在一經雷射蝕刻之不傳導隔離部上的該鍍層係包含: 一不傳導隔離層部份,其具有印在該集成基材結構之一絕緣表面的一圖案形成區域中的一活化油墨; 形成於該不傳導隔離層上的一第一金屬層;及 形成於該第一金屬層上的一第二金屬層。
- 如請求項14之電子電路,其中在一經雷射蝕刻之不傳導隔離部上的該鍍層係藉由移除該第一金屬層沿著該一或多個導電跡線之一外周的一部份而形成,以隔離該第一金屬層的該一或多個導電跡線。
- 如請求項13之電子電路,其中該不傳導隔離部係不導電。
- 如請求項14之電子電路,其中該集成基材結構包括一金屬基底層,及形成於該金屬基底層上以提供一絕緣表面的一絕緣層。
- 如請求項14之電子電路,其中該活化油墨包括N-甲基-2-吡咯啶酮。
- 如請求項14之電子電路,其進一步包含一防焊膜層以覆蓋該一或多個導電跡線。
- 如請求項19之電子電路,其進一步包含一保護層,其覆蓋不被該防焊膜層覆蓋的接墊區域。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
??PCT/MY2017/050027 | 2017-06-15 | ||
PCT/MY2017/050027 WO2018231045A1 (en) | 2017-06-15 | 2017-06-15 | System, apparatus and method for utilizing surface mount technology on metal substrates |
WOPCT/MY2017/050027 | 2017-06-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201906513A true TW201906513A (zh) | 2019-02-01 |
TWI771433B TWI771433B (zh) | 2022-07-21 |
Family
ID=64660424
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111123249A TW202315477A (zh) | 2017-06-15 | 2018-06-14 | 用於在基材上形成電路圖案的方法及電子電路 |
TW107120537A TWI771433B (zh) | 2017-06-15 | 2018-06-14 | 用於在基材上形成電路圖案的方法及電子電路 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111123249A TW202315477A (zh) | 2017-06-15 | 2018-06-14 | 用於在基材上形成電路圖案的方法及電子電路 |
Country Status (5)
Country | Link |
---|---|
US (2) | US20200205295A1 (zh) |
EP (1) | EP3639634A4 (zh) |
CN (2) | CN116634667A (zh) |
TW (2) | TW202315477A (zh) |
WO (1) | WO2018231045A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020121689A1 (ja) | 2018-12-10 | 2020-06-18 | アルプスアルパイン株式会社 | 入力装置 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09135062A (ja) * | 1995-11-08 | 1997-05-20 | Kobe Hatsuka Kk | プリント基板のマーキング処理方法 |
JP2001267724A (ja) * | 2000-03-23 | 2001-09-28 | Victor Co Of Japan Ltd | プリント基板及びその製造方法 |
US6543676B2 (en) * | 2001-06-04 | 2003-04-08 | Phoenix Precision Technology Corporation | Pin attachment by a surface mounting method for fabricating organic pin grid array packages |
US7255782B2 (en) * | 2004-04-30 | 2007-08-14 | Kenneth Crouse | Selective catalytic activation of non-conductive substrates |
TWI244150B (en) * | 2004-12-09 | 2005-11-21 | Siliconware Precision Industries Co Ltd | Flash preventing substrate and fabrication method thereof |
US7768075B2 (en) * | 2006-04-06 | 2010-08-03 | Fairchild Semiconductor Corporation | Semiconductor die packages using thin dies and metal substrates |
JP5168863B2 (ja) * | 2006-09-20 | 2013-03-27 | 日本電気株式会社 | プリント配線板製造方法 |
JP5209938B2 (ja) * | 2007-11-01 | 2013-06-12 | 上村工業株式会社 | 回路形成方法 |
KR20110038457A (ko) * | 2009-10-08 | 2011-04-14 | 삼성전기주식회사 | 무전해 니켈 도금층을 갖는 금속배선 구조 및 그 제조방법 |
US8621749B2 (en) * | 2010-03-12 | 2014-01-07 | Taiwan Green Point Enterprises Co., Ltd | Non-deleterious technique for creating continuous conductive circuits |
US20120273261A1 (en) * | 2010-10-20 | 2012-11-01 | Taiwan Green Point Enterprises Co., Ltd. | Circuit substrate having a circuit pattern and method for making the same |
MX344784B (es) * | 2010-09-29 | 2017-01-06 | Basf Se | Elemento de seguridad. |
KR101181173B1 (ko) * | 2010-10-11 | 2012-09-18 | 엘지이노텍 주식회사 | 방열회로기판, 그의 제조 방법 및 그를 포함하는 발열소자 패키지 |
KR20120130642A (ko) * | 2011-05-23 | 2012-12-03 | 주식회사 아모그린텍 | 메탈 코어 인쇄회로기판 및 그 제조방법 |
TW201729654A (zh) * | 2011-11-28 | 2017-08-16 | 綠點高新科技股份有限公司 | 導電線路的製備方法 |
KR20130110966A (ko) * | 2012-03-30 | 2013-10-10 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
JP5706386B2 (ja) * | 2012-10-16 | 2015-04-22 | 住友金属鉱山株式会社 | 2層フレキシブル基板、並びに2層フレキシブル基板を基材としたプリント配線板 |
JP6309335B2 (ja) * | 2014-04-25 | 2018-04-11 | 四国計測工業株式会社 | 配線基板および半導体装置 |
DE102014213535A1 (de) * | 2014-07-11 | 2016-01-14 | Siemens Aktiengesellschaft | Verfahren zum Herstellen einer elektronischen Baugruppe und elektronische Baugruppe, wobei in dem Substrat der Baugruppe eine Heizeinrichtung vorgesehen ist |
JP6466110B2 (ja) * | 2014-09-09 | 2019-02-06 | 住友電気工業株式会社 | プリント配線板用基板、プリント配線板及びプリント配線板用基板の製造方法 |
TW201616699A (zh) * | 2014-10-30 | 2016-05-01 | 新世紀光電股份有限公司 | 驅動覆晶發光晶片之電路板及包含其之發光模組 |
CN107004752B (zh) * | 2014-12-08 | 2019-04-26 | 夏普株式会社 | 发光装置用基板、发光装置以及照明装置 |
TWI577257B (zh) | 2014-12-24 | 2017-04-01 | 綠點高新科技股份有限公司 | 於基材絕緣表面形成導電線路的方法 |
US9502397B1 (en) * | 2015-04-29 | 2016-11-22 | Deca Technologies, Inc. | 3D interconnect component for fully molded packages |
US10383233B2 (en) * | 2015-09-16 | 2019-08-13 | Jabil Inc. | Method for utilizing surface mount technology on plastic substrates |
US10068936B2 (en) * | 2015-11-16 | 2018-09-04 | Sunasic Technologies, Inc. | Printed circuit board assembly forming enhanced biometric module and manufacturing method thereof |
-
2017
- 2017-06-15 US US16/622,381 patent/US20200205295A1/en not_active Abandoned
- 2017-06-15 CN CN202310540436.9A patent/CN116634667A/zh active Pending
- 2017-06-15 CN CN201780092153.5A patent/CN111699760A/zh active Pending
- 2017-06-15 EP EP17913604.9A patent/EP3639634A4/en active Pending
- 2017-06-15 WO PCT/MY2017/050027 patent/WO2018231045A1/en unknown
-
2018
- 2018-06-14 TW TW111123249A patent/TW202315477A/zh unknown
- 2018-06-14 TW TW107120537A patent/TWI771433B/zh active
-
2022
- 2022-07-05 US US17/857,664 patent/US20220408565A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
TWI771433B (zh) | 2022-07-21 |
EP3639634A1 (en) | 2020-04-22 |
TW202315477A (zh) | 2023-04-01 |
US20200205295A1 (en) | 2020-06-25 |
EP3639634A4 (en) | 2021-07-14 |
WO2018231045A1 (en) | 2018-12-20 |
CN116634667A (zh) | 2023-08-22 |
CN111699760A (zh) | 2020-09-22 |
US20220408565A1 (en) | 2022-12-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8099865B2 (en) | Method for manufacturing a circuit board having an embedded component therein | |
CN104105350A (zh) | 选择性电镍金的方法及pcb板、装置 | |
JP2018014381A (ja) | 基板及び電子機器 | |
JP2004193404A (ja) | 回路モジュール、及びその製造方法 | |
US20220408565A1 (en) | System, Apparatus and Method for Utilizing Surface Mount Technology on Metal Substrates | |
JP2001339140A (ja) | 配線基板及び配線基板の製造方法 | |
EP3119169A1 (en) | Printed circuit board and method of fabricating the same | |
JP2016012702A (ja) | ソルダコートの濡れ性と耐食性を両立させたプリント基板およびその製造方法 | |
US20170215289A1 (en) | Method For Producing A Foil Arrangement And Corresponding Foil Arrangement | |
US9474162B2 (en) | Circuit substrate and method of manufacturing same | |
US8359740B2 (en) | Process for the wafer-scale fabrication of electronic modules for surface mounting | |
US20140144682A1 (en) | Surface finish for conductive features on substrates | |
KR101504011B1 (ko) | 복합 직접회로소자 패키지 제조방법 | |
TWI630767B (zh) | 印刷基板之製造方法及導電性構件之接合方法 | |
CN104124180B (zh) | 芯片封装结构的制作方法 | |
CN109618487B (zh) | 带有内埋电路的立体基件及其制备方法 | |
JP5351830B2 (ja) | 配線回路基板およびその製造方法 | |
KR101510625B1 (ko) | 임베디드 연성회로기판의 제조방법 | |
KR101154352B1 (ko) | 임베디드 인쇄회로기판용 부재 및 그 제조 방법 및 임베디드 인쇄회로기판용 부재를 이용한 임베디드 인쇄회로기판 제조 방법 | |
KR101118878B1 (ko) | 회로 기판 및 그 제조 방법, 그리고 상기 회로 기판을 구비하는 반도체 패키지 및 그 제조 방법 | |
KR101475080B1 (ko) | 인쇄회로 기판 조립체 및 그 제조 방법 | |
KR20200096285A (ko) | 전력 부품과 회로 캐리어의 금속 층 간의 열 전도성 연결부 형성 방법 | |
US8318411B2 (en) | Method for fabricating an interposer | |
KR101008422B1 (ko) | 인쇄회로기판 제조방법 | |
KR20100134907A (ko) | 연성 인쇄 회로 기판 및 그 제조방법 |