CN111465496B - 带绝缘性树脂层的铜箔 - Google Patents

带绝缘性树脂层的铜箔 Download PDF

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Publication number
CN111465496B
CN111465496B CN201880080384.9A CN201880080384A CN111465496B CN 111465496 B CN111465496 B CN 111465496B CN 201880080384 A CN201880080384 A CN 201880080384A CN 111465496 B CN111465496 B CN 111465496B
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China
Prior art keywords
copper foil
resin layer
insulating resin
mass
parts
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CN201880080384.9A
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English (en)
Chinese (zh)
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CN111465496A (zh
Inventor
川下和晃
加藤祯启
杉本宪明
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Mitsubishi Gas Chemical Co Inc
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Mitsubishi Gas Chemical Co Inc
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Publication of CN111465496A publication Critical patent/CN111465496A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
CN201880080384.9A 2017-12-14 2018-11-30 带绝缘性树脂层的铜箔 Active CN111465496B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017-239467 2017-12-14
JP2017239467 2017-12-14
PCT/JP2018/044142 WO2019116927A1 (ja) 2017-12-14 2018-11-30 絶縁性樹脂層付き銅箔

Publications (2)

Publication Number Publication Date
CN111465496A CN111465496A (zh) 2020-07-28
CN111465496B true CN111465496B (zh) 2022-03-01

Family

ID=66820435

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880080384.9A Active CN111465496B (zh) 2017-12-14 2018-11-30 带绝缘性树脂层的铜箔

Country Status (5)

Country Link
JP (1) JP7153242B2 (ja)
KR (1) KR102645236B1 (ja)
CN (1) CN111465496B (ja)
TW (1) TWI775996B (ja)
WO (1) WO2019116927A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7237532B2 (ja) * 2018-11-02 2023-03-13 京セラ株式会社 配線基板
CN110493962B (zh) * 2019-08-26 2020-09-11 胜宏科技（惠州）股份有限公司 一种cob线路板制作工艺
WO2021166847A1 (ja) * 2020-02-18 2021-08-26 パナソニックＩｐマネジメント株式会社 熱硬化性樹脂組成物、樹脂シート、樹脂付き金属箔、金属張積層板及びプリント配線板

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63254122A (ja) * 1987-04-10 1988-10-20 Toshiba Corp エポキシ樹脂組成物
CN104093764A (zh) * 2012-01-31 2014-10-08 三菱瓦斯化学株式会社 印刷电路板材料用树脂组合物、以及使用了其的预浸料、树脂片、覆金属箔层叠板和印刷电路板
JP2017039878A (ja) * 2015-08-21 2017-02-23 東洋紡株式会社 無機強化熱可塑性ポリエステル樹脂組成物
JPWO2017057138A1 (ja) * 2015-09-30 2017-10-05 住友ベークライト株式会社 構造体、配線基板および配線基板の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1222574A (en) 1982-03-04 1987-06-02 Economics Laboratory, Inc. Method and apparatus for manufacturing multi layer printed circuit boards
JPS6173722A (ja) * 1984-09-19 1986-04-15 Toshiba Corp 注型用エポキシ樹脂組成物の製造方法
KR101817498B1 (ko) * 2008-12-26 2018-01-11 미츠비시 가스 가가쿠 가부시키가이샤 수지 복합 동박
JP6156020B2 (ja) 2013-09-26 2017-07-05 味の素株式会社 樹脂組成物
JP6623632B2 (ja) * 2015-09-11 2019-12-25 日立化成株式会社 絶縁樹脂フィルム及び多層プリント配線板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63254122A (ja) * 1987-04-10 1988-10-20 Toshiba Corp エポキシ樹脂組成物
CN104093764A (zh) * 2012-01-31 2014-10-08 三菱瓦斯化学株式会社 印刷电路板材料用树脂组合物、以及使用了其的预浸料、树脂片、覆金属箔层叠板和印刷电路板
JP2017039878A (ja) * 2015-08-21 2017-02-23 東洋紡株式会社 無機強化熱可塑性ポリエステル樹脂組成物
JPWO2017057138A1 (ja) * 2015-09-30 2017-10-05 住友ベークライト株式会社 構造体、配線基板および配線基板の製造方法

Also Published As

Publication number Publication date
TW201930075A (zh) 2019-08-01
KR20200097698A (ko) 2020-08-19
JP7153242B2 (ja) 2022-10-14
TWI775996B (zh) 2022-09-01
JPWO2019116927A1 (ja) 2020-12-17
WO2019116927A1 (ja) 2019-06-20
CN111465496A (zh) 2020-07-28
KR102645236B1 (ko) 2024-03-07

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