JP7237532B2 - 配線基板 - Google Patents
配線基板 Download PDFInfo
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- JP7237532B2 JP7237532B2 JP2018207462A JP2018207462A JP7237532B2 JP 7237532 B2 JP7237532 B2 JP 7237532B2 JP 2018207462 A JP2018207462 A JP 2018207462A JP 2018207462 A JP2018207462 A JP 2018207462A JP 7237532 B2 JP7237532 B2 JP 7237532B2
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- Prior art keywords
- metal layer
- wiring board
- insulating layer
- less
- thickness
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/061—Two dimensional planar arrays
- H01Q21/065—Patch antenna array
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H01Q13/08—Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/29—Combinations of different interacting antenna units for giving a desired directional characteristic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0263—Details about a collection of particles
- H05K2201/0269—Non-uniform distribution or concentration of particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Waveguide Aerials (AREA)
- Structure Of Printed Boards (AREA)
- Details Of Aerials (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
Description
きが90°回転した向きとなっている。図4に示した配線基板Cにおけるアンテナパターン10cを形成している線状導体13の長手方向の向きはX方向である。これに対し、図5に示した配線基板Dでは、アンテナパターン10cを形成している線状導体13の長手方向はY方向である。つまり、図5に示した配線基板Dは、絶縁層1上にアンテナパターン10が複数配置されたときに、そのうちの少なくとも一つのアンテナパターン10(この場合、符号10c)が他のアンテナパターン10とは異なる方向に向く配置となっている。本開示は、絶縁層1上に複数のアンテナパターン10が形成されたときに、そのうちの少なくとも一つのアンテナパターン10(この場合、符号10c)が他のアンテナパターン10とは異なる方向に向く配置となっている場合にも配線基板の反りを小さくすることができる。この場合、絶縁層1上に形成された複数のアンテナパターン10の中で、他のアンテナパターン10とは異なる向きになるように配置されたアンテナパターン10の割合は、アンテナパターンの全面積を100%としたときに、20%以上45%以下の範囲であると良い。
0からの放射特性を高めることができる。
以下の範囲とし、第1金属層の厚みを1.5μm以上10μm以下、その被覆率を5%以上25%以下とし、第2金属層の厚みを3μm以上10μm以下または25μm以上100μm以下とし、その被覆率を85%以上の範囲とし、さらに、第1金属層が配された側の絶縁層の表面部が第2金属層が配された側の絶縁層の表面部よりも有機樹脂の割合を高くした配線基板(試料No.I-53~I-243、I-306~I-311およびI-313)は、いずれの試料も反りの値が2mm以下であった。また、第2金属層を2層構造に形成した試料は第2金属層の厚みが同じである場合に、第2金属層が1層構造である試料に比べて高い屈曲性を示した。
1・・・・・・・・・・・・・・・・・・・絶縁層
1a・・・・・・・・・・・・・・・・・・第1面
1b・・・・・・・・・・・・・・・・・・第2面
1c、1d・・・・・・・・・・・・・・・表面部
3・・・・・・・・・・・・・・・・・・・金属層
3a・・・・・・・・・・・・・・・・・・第1金属層
3b・・・・・・・・・・・・・・・・・・第2金属層
10、10a、10b、10c・・・・・・アンテナパターン
11・・・・・・・・・・・・・・・・・・パッチ導体
13・・・・・・・・・・・・・・・・・・線状導体
15・・・・・・・・・・・・・・・・・・給電部
17・・・・・・・・・・・・・・・・・・グラウンド導体
18・・・・・・・・・・・・・・・・・・貫通ビア
19・・・・・・・・・・・・・・・・・・貫通孔
19a・・・・・・・・・・・・・・・・・内壁
21・・・・・・・・・・・・・・・・・・第3金属層
Claims (6)
- 有機樹脂を主成分とし、無機粒子を含み、第1面と該第1面の反対側の第2面とを両面として有する1層の絶縁層と、該絶縁層の前記第1面に配置された第1金属層と、前記第2面に配置された第2金属層とを有しており、
前記第1金属層が設けられた前記第1面側の前記絶縁層の表面部は、前記第2金属層が設けられた前記第2面側の前記絶縁層の表面部よりも有機樹脂の割合が高い、配線基板。 - 前記絶縁層は、厚みが75μm以上1000μm以下、貯蔵弾性率が4GPa以上7GPa以下であり、
前記第1金属層は、厚みが1.5μm以上10μm以下、被覆率が5%以上25%以下であり、
前記第2金属層は、厚みが3μm以上10μm以下、または25μm以上100μm以下、被覆率が85%以上である、
請求項1に記載の配線基板。 - 前記第1金属層が、パッチ導体と線状導体とを備えた複数のアンテナパターンを有しており、前記第1面が矩形状であり、該第1面の1つの辺に対して直角で、前記第1面の中央に仮想線を設定したときに、前記複数のアンテナパターンは、前記仮想線を挟む2つの領域間で、数、面積および向きのうちの少なくとも1つが異なる、請求項1または2に記載の配線基板。
- 前記線状導体は、隣接する2つの前記パッチ導体の間で曲がっている、請求項3に記載の配線基板。
- 前記第2金属層の厚みが25μm以上100μm以下であるとき、前記第2金属層は、層状を成している、請求項2乃至4のうちいずれかに記載の配線基板。
- 前記絶縁層、前記第1金属層および前記第2金属層は、厚み方向に貫く貫通孔を有しており、該貫通孔は、前記絶縁層が露出した内壁に第3金属層を有しており、該第3金属層は、前記内壁から延びて、前記絶縁層上において、前記第1金属層および前記第2金属層とそれぞれ層状を成している、請求項1乃至5のうちいずれかに記載の配線基板。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018207462A JP7237532B2 (ja) | 2018-11-02 | 2018-11-02 | 配線基板 |
US17/289,769 US20210400809A1 (en) | 2018-11-02 | 2019-10-23 | Wiring board |
PCT/JP2019/041523 WO2020090583A1 (ja) | 2018-11-02 | 2019-10-23 | 配線基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018207462A JP7237532B2 (ja) | 2018-11-02 | 2018-11-02 | 配線基板 |
Publications (2)
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JP2020072235A JP2020072235A (ja) | 2020-05-07 |
JP7237532B2 true JP7237532B2 (ja) | 2023-03-13 |
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JP2018207462A Active JP7237532B2 (ja) | 2018-11-02 | 2018-11-02 | 配線基板 |
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US (1) | US20210400809A1 (ja) |
JP (1) | JP7237532B2 (ja) |
WO (1) | WO2020090583A1 (ja) |
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JP2021111739A (ja) * | 2020-01-15 | 2021-08-02 | 株式会社東芝 | 電子機器 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001111328A (ja) | 1999-10-06 | 2001-04-20 | Mitsubishi Electric Corp | マイクロストリップアンテナ及びその設計方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH088639A (ja) * | 1994-06-20 | 1996-01-12 | Toshiba Corp | セルフダイプレキシングアレーアンテナ |
JPH08307147A (ja) * | 1995-05-08 | 1996-11-22 | Mitsubishi Electric Corp | アンテナ装置 |
US20130134227A1 (en) * | 2010-06-18 | 2013-05-30 | Linxens Holding | Multi-Layered Flexible Printed Circuit and Method of Manufacture |
KR20150047879A (ko) * | 2013-10-25 | 2015-05-06 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
JP2017183653A (ja) * | 2016-03-31 | 2017-10-05 | スナップトラック・インコーポレーテッド | 高周波用多層配線基板とその製造方法 |
JP7068638B2 (ja) * | 2017-05-19 | 2022-05-17 | 大日本印刷株式会社 | 配線基板及び実装基板 |
WO2019004223A1 (ja) * | 2017-06-27 | 2019-01-03 | 京セラ株式会社 | 有機絶縁体、金属張積層板および配線基板 |
KR102645236B1 (ko) * | 2017-12-14 | 2024-03-07 | 미츠비시 가스 가가쿠 가부시키가이샤 | 절연성 수지층이 형성된 동박 |
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2018
- 2018-11-02 JP JP2018207462A patent/JP7237532B2/ja active Active
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2019
- 2019-10-23 WO PCT/JP2019/041523 patent/WO2020090583A1/ja active Application Filing
- 2019-10-23 US US17/289,769 patent/US20210400809A1/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001111328A (ja) | 1999-10-06 | 2001-04-20 | Mitsubishi Electric Corp | マイクロストリップアンテナ及びその設計方法 |
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Publication number | Publication date |
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WO2020090583A1 (ja) | 2020-05-07 |
US20210400809A1 (en) | 2021-12-23 |
JP2020072235A (ja) | 2020-05-07 |
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