CN111447740A - 封装 - Google Patents
封装 Download PDFInfo
- Publication number
- CN111447740A CN111447740A CN202010053075.1A CN202010053075A CN111447740A CN 111447740 A CN111447740 A CN 111447740A CN 202010053075 A CN202010053075 A CN 202010053075A CN 111447740 A CN111447740 A CN 111447740A
- Authority
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- China
- Prior art keywords
- package
- electronic component
- package body
- mounting portion
- electrode pads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 229910052751 metal Inorganic materials 0.000 title description 7
- 239000002184 metal Substances 0.000 title description 7
- 239000004020 conductor Substances 0.000 claims abstract description 26
- 238000010030 laminating Methods 0.000 claims abstract description 6
- 238000005192 partition Methods 0.000 claims description 21
- 230000000630 rising effect Effects 0.000 claims 1
- 239000000919 ceramic Substances 0.000 abstract description 28
- 238000004806 packaging method and process Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 19
- 229910000679 solder Inorganic materials 0.000 description 14
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000007789 sealing Methods 0.000 description 6
- 239000002241 glass-ceramic Substances 0.000 description 4
- 238000001465 metallisation Methods 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 230000000149 penetrating effect Effects 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- -1 or the like Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
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- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
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- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Geometry (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Control And Other Processes For Unpacking Of Materials (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
本发明提供一种封装,即使将多个电极焊盘彼此相邻地配置于由多个绝缘层形成的封装主体的表面,在向所述表面所包含的搭载部安装要搭载的电子部件时,也不易在所述电极焊盘之间产生短路。封装(1a)具备:封装主体(2a),其是将多个陶瓷层(绝缘层)(c1、c2)层叠而成的,具有表面(3)、与该表面相对的背面(4)及位于表面与背面之间的侧面(5),该表面包含电子部件(7)的搭载部(6);一对凹部(10),它们彼此相邻且开口于该主体的表面;多个电极焊盘(12),它们分别配置于每个该凹部的底面,电极焊盘的表面处于比封装主体的表面低的位置,电极焊盘与在封装主体的背面和侧面形成的导体层(16、17)电连接。
Description
技术领域
本发明涉及一种封装,该封装在将多个绝缘层层叠而成的封装主体的表面具有电子部件的搭载部,在将所述电子部件的外部连接端子连接并安装于在所述表面彼此相邻地设置的多个电极焊盘时,不易在所述电极焊盘之间产生短路。
背景技术
例如,提出一种气密密封用封装,其中,借助贯穿下层侧的陶瓷层的多个导通线路将一对内部电极和多个外部电极分别连接起来,该一对内部电极设于将多个陶瓷层层叠而设为箱形状的封装基体的内侧(腔室)的底面,该多个外部电极设于所述封装基体的下侧面,利用高度为30μm以上、优选为50μm以上的软质金属(金、银等)来形成所述内部电极(例如参照专利文献1)。
采用上述气密密封用封装,能够利用上述内部电极吸收来自外部的应力传播,能够谋求减轻搭载在该内部电极之上的晶体元件的应变,并且不需要以往的保持支架,因此能够削减制造工时、降低成本,以及能够作为应对薄型化的产品进行提供。
但是,为了应对寻求所述封装的小型化的要求,在将高度为30μm以上的所述一对内部电极彼此相邻地配置于所述封装基体的内侧(腔室)的底面的情况下,由于跨该一对内部电极的上方地搭载电子部件,因此,配设在每个该内部电极之上的焊料等接合材料有可能相互接触而产生不慎的短路。
现有技术文献
专利文献
专利文献1:日本特开平10-41431号公报(第1页~第4页、图1~图6)
发明内容
发明要解决的问题
本发明的课题在于,解决在背景技术中说明的问题,提供如下一种封装:即使将多个电极焊盘彼此相邻地配置于将多个绝缘层层叠而成的封装主体的表面,在向所述表面所包含的搭载部安装随后要搭载的电子部件时,也不易在所述多个电极焊盘之间产生短路。
用于解决问题的方案
为了解决所述课题,想到了以下的方案从而完成了本发明,即:将多个电极焊盘相邻地配置于所述封装主体中的比包含供电子部件随后搭载的搭载部的表面低的位置。
即,本发明的封装(技术方案1)具备:封装主体,其是将多个绝缘层层叠而成的,具有表面、与该表面相对的背面、以及位于所述表面与背面之间的侧面,所述表面包含电子部件的搭载部;多个凹部,它们彼此相邻且开口于该封装主体的表面;以及多个电极焊盘,它们分别配置于该多个凹部的各个底面,该封装的特征在于,所述电极焊盘的表面处于比所述封装主体的表面低的位置,所述多个凹部隔着由构成所述封装主体的至少1个绝缘层形成的分隔壁地在俯视时彼此相邻,在所述分隔壁的位于表面侧的两边缘侧分别设有向上侧隆起的突堤,所述电极焊盘与在所述封装主体的背面和侧面形成的导体层中的至少一者电连接。
采用所述封装,能够获得以下的效果(1)、(2)。
(1)由于在彼此相邻且开口于所述封装主体的表面的多个所述凹部的各个底面分别配置的多个电极焊盘的表面处于比上述封装主体的表面低的位置,因此,在随后向所述搭载部安装电子部件的情况下,在借助焊料等将该电子部件的多个外部连接端子和上述多个电极焊盘的表面分别连接起来时,能够防止所述焊料彼此相互接触而产生不慎的短路。
(2)由于多个电极焊盘的表面处于比所述封装主体的表面低的每个所述凹部的底面侧,因此,在随后向所述搭载部安装电子部件时,能够使该电子部件的多个外部连接端子嵌入凹部,能够容易且准确地进行该外部连接端子的定位。
另外,根据所述封装,所述多个凹部隔着由构成所述封装主体的至少1个绝缘层形成的分隔壁地在俯视时彼此相邻,因此能够更可靠地得到所述效果(1)、(2)。
另外,位于所述相邻的两个凹部之间且由所述绝缘层形成的所述分隔壁的宽度为1mm以下,且其最小值为大约200μm。
另外,所述绝缘层由陶瓷或树脂形成,所述陶瓷是氧化铝等高温共烧陶瓷或玻璃-陶瓷等低温共烧陶瓷,作为上述树脂,例如例示环氧系树脂。
另外,所述导体层是背面(连接)端子或侧面导体,所述导体层与所述电极焊盘之间经由内层布线或通路导体电连接。
并且,在所述绝缘层是氧化铝等的情况下,所述电极焊盘、导体层等应用钨(以下,简记作W)或钼(以下,简记作Mo),在所述绝缘层是玻璃-陶瓷等的情况下,所述电极焊盘、导体层等应用铜(Cu)或银(Ag)。
另外,在所述电极焊盘和导体层这两者的向外部暴露的表面上,隔着镍层覆盖有金层。
并且,所述电极焊盘的表面至少比所述封装主体的表面低50μm以上。
另外,所述相邻是指,在所述封装主体的表面上,在俯视时多个凹部彼此相邻并接近。
并且,作为所述电子部件,例示晶体振荡器、发光二极管(LED)等发光元件、半导体元件等。
另外,作为所述电子部件的外部连接端子,例示板形形状的引线、引脚、或球端子等。
另外,所述凹部是通过对多个所述绝缘层中的1个绝缘性片(绝缘层)实施冲切加工或激光加工而形成通孔并在该绝缘性片的背面侧层叠平坦的绝缘性片(绝缘层)而形成的。
并且,在本发明中,还包括如下的封装(技术方案2),其中,在所述封装主体的表面上,所述多个凹部和所述电子部件的搭载部在俯视时相互分离或相互重叠。
其中,在上述多个凹部和电子部件的搭载部在俯视时相互分离的形态中,通过将自所述电子部件向斜下侧延伸的多个外部连接端子(例如引线)插入每个所述凹部的开口部,能够容易且精度良好地进行该电子部件的定位,因此能够更可靠地得到所述效果(2)。
另一方面,即使为所述多个凹部和电子部件的搭载部在俯视时相互重叠的形态,也能够与上述同样地进行定位,且还有助于封装主体的小型化和薄型化(以下,称作效果(3))。
另外,在本发明中,还包括如下的封装(技术方案3),其中,所述电极焊盘的至少一边具有向构成所述封装主体的绝缘层之间的内层面伸出的伸出部。
由此,在所述电极焊盘的至少一边向所述绝缘层之间的内层面伸出的伸出部所处的俯视时的所述封装主体的表面上的位置,形成有与所述伸出的边对应地隆起的突堤部,因此能够进一步显著地得到所述效果(1)。并且,利用因上述伸出部而产生的突堤部,还能够有效地抑制随后搭载的电子部件的外部连接端子自凹部偏移的情形,因此能够进一步显著地得到所述效果(2)。
另外,在所述电极焊盘在俯视时为矩形形状的情况下,也可以是,其相邻的两边、相对的两边、3边或全部4边具有伸出部。
另外,也可以是,在所述内层面形成有与所述电极焊盘电连接的内层布线。
并且,在本发明中,还包括如下的封装(技术方案4),其中,所述电极焊盘的表面与随后搭载于所述搭载部的电子部件的外部连接端子电连接、或经由接合线与所述电子部件电连接。
由此,在随后向所述搭载部搭载电子部件时,能够使该电子部件的多个外部连接端子经由每个所述凹部的开口部接触或接近每个所述电极焊盘的表面,因此能够可靠地得到所述效果(2)。
另一方面,在借助接合线将所述电极焊盘的表面和电子部件电连接时,能够通过图像处理等来准确且容易地识别俯视时的所述凹部的位置,因此,在搭载电子部件之后,能够精度良好地进行引线接合(以下,称作效果(4))。
另外,在本发明中,还包括如下的封装(技术方案5),其中,在所述封装主体的表面还具备呈沿着该表面的外周的框体形状的框构件,所述凹部和所述搭载部被所述框构件的内壁面包围。
由此,由于具有所述凹部和所述搭载部的封装主体的表面被所述框构件的内壁面包围,因此能够防护随后搭载的电子部件不受来自外部的影响、或将随后搭载的电子部件密封(以下,称作效果(5))。
另外,作为所述框构件,除了使用由与构成所述封装主体的绝缘层相同的绝缘材料形成的框构件之外,也可以使用金属制的框构件(金属环)。
另外,被所述框构件的内壁面包围的封装主体的表面还成为包含所述电子部件的搭载部且用于密封该电子部件的腔室的底面。
附图说明
图1(A)是表示本发明的一形态的封装的俯视图,图1(B)是沿着图1(A)中的B-B线向视的垂直剖视图,图1(C)是沿着图1(A)中的C-C线向视的垂直剖视图。
图2(A)是表示应用形态的封装的俯视图,图2(B)是沿着图2(A)中的B-B线向视的垂直剖视图,图2(C)是沿着图2(A)中的C-C线向视的垂直剖视图。
图3(A)是表示不同形态的封装的俯视图,图3(B)是沿着图3(A)中的B-B线向视的垂直剖视图,图3(C)是表示上述封装的应用形态的与图3(B)同样的垂直剖视图。
附图标记说明
1a~1d、封装;2a~2d、封装主体;2n、内层面;3、表面;4、背面;5、侧面;6、搭载部;7、电子部件;8、引线(外部连接端子);10、凹部;11、分隔壁;12、电极焊盘;13、伸出部;16、侧面导体(导体层);17、24、背面端子(导体层);19、内壁面;21、引脚(外部连接端子);26、球端子(外部连接端子);c1、c2、陶瓷层(绝缘层);c3、框构件。
具体实施方式
以下,说明用于实施本发明的形态。
图1(A)是表示本发明的一形态的封装1a的俯视图,图1(B)是沿着图1(A)中的B-B线向视的垂直剖视图,图1(C)是沿着图1(A)中的C-C线向视的垂直剖视图。
如图1(A)~图1(C)所示,上述封装1a具备:封装主体2a,其整体为板形形状;一对(多个)凹部10,它们在该封装主体2a的表面3开口且在俯视时彼此相邻;以及一对电极焊盘12,它们分别配置于每个该凹部10的底面。
上述封装主体2a是将上下两层陶瓷层(绝缘层)c1、c2两层叠而成的,具有:表面3,其在俯视时为长方形形状(矩形形状);背面4,其与该表面3相对;以及四边的侧面5,其位于所述表面3与背面4之间。
另外,上述陶瓷层c1、c2例如由氧化铝等高温共烧陶瓷形成。
在所述封装主体2a的表面3设有:搭载部6,其供电子部件(例如半导体元件)7随后搭载,是俯视时为矩形形状的区域;所述一对凹部10,它们形成于上述表面3的在俯视时与该搭载部6分离的部分;以及所述一对电极焊盘12,它们分别配置于所述一对凹部10的底面侧。另外,所述一对凹部10彼此之间被由上层侧的所述陶瓷层c2的局部形成的、俯视时为直线(矩形)状的分隔壁11相互隔离。
另外,上述凹部10的开口部与电极焊盘12的表面之间的深度d为至少50μm以上,上述分隔壁11的宽度w为200μm以上。
如图1(A)~图1(C)所示,上述一对电极焊盘12在俯视时呈矩形形状地形成于所述陶瓷层c1、c2之间的内层面2n,上述一对电极焊盘12的彼此相邻的一边各自具有向重叠有分隔壁11的位置处的所述内层面2n伸出的伸出部13。与该伸出部13相对应地,在所述分隔壁11的位于表面3侧的两边缘侧设有向上侧隆起的突堤(日文:突堤)11a。
并且,如图1(A)、图1(B)所示,在所述封装主体2a的相对的一对短边的侧面5各一对地垂直地形成有俯视时为半圆形形状的凹槽15,并沿着每个该凹槽15的内壁面形成有俯视时为圆弧形状的侧面导体(导体层)16。至少在图示中位于左侧的一对侧面导体16经由沿着内层面2n形成的连接布线14与所述电极焊盘12分别电连接。另外,在上述图示中位于右侧的一对侧面导体16也可以与上述情况同样地与电极焊盘12分别连接。
上述4个侧面导体16与相互分离地形成于封装主体2a的背面4的多个背面端子(导体层)17分别连接。
另外,所述电极焊盘12、连接布线14、侧面导体16、以及背面端子17主要由W或Mo形成。
另外,如图1(B)所示,在向所述封装主体2a的表面3的所述搭载部6上随后安装并搭载箱形状的电子部件7的情况下,通过将自该电子部件7的一侧面向斜下侧突出的一对引线(外部连接端子)8的顶端片插入每个所述凹部10的开口部,从而进行该电子部件7的定位,所述一对引线在侧视时为曲柄形状且相互平行。接下来,在使一对引线8的顶端片接触于每个所述电极焊盘12的表面的状态下,在上述电子部件7的底面与所述搭载部6之间配设未图示的接合材料并将该电子部件7搭载于搭载部6上。并且,通过将焊料(例如金-锡系合金)9呈大致圆锥形状地配设在每个上述引线8的顶端片的周围,从而将上述电子部件7和一对电极焊盘12电连接(安装)。
在该安装时,通过位于一对凹部10之间的包含所述突堤11a的分隔壁11来阻止上述焊料9相互接触。
在以上说明的封装1a中,在所述封装主体2a的表面3上彼此相邻地开口的一对所述凹部10各自的底面分别配置的一对电极焊盘12的表面处于比上述封装主体2a的包含所述搭载部6的表面3低的位置。因此,在随后向所述搭载部6安装电子部件7的情况下,在借助焊料9将该电子部件7的一对引线8和每个上述电极焊盘12的表面分别连接起来时,能够消除所述焊料9彼此相互接触而产生的不慎的短路。
并且,由于一对所述电极焊盘12的表面处于所述封装主体2a的比所述表面3低的每个所述凹部10的底面侧,因此,在随后向所述搭载部6安装电子部件7时,通过将一对引线8的顶端侧部位分别插入凹部10内,也能够容易且准确地进行该电子部件7的定位。
因而,采用所述封装1a,能够可靠地发挥所述效果(1)、(2)。
另外,也可以借助未图示的接合线对所述电子部件7与每个所述电极焊盘12的表面之间进行电连接,在设为该形态的情况下,取代所述效果(2),能够得到所述效果(4)。
图2(A)是表示作为所述封装1a的应用形态的封装1b的俯视图,图2(B)是沿着图2(A)中的B-B线向视的垂直剖视图,图2(C)是沿着图2(A)中的C-C线向视的垂直剖视图。
如图2(A)~图2(C)所示,上述封装1b具备:封装主体2b,其包含由上述那样的陶瓷层c1、c2形成的所述封装主体2a,该封装主体2b是通过沿着所述封装主体2a的表面3的外周进一步层叠俯视时为矩形框状的框构件c3而成的;上述那样的搭载部6,其位于成为被所述框构件c3的内壁面19包围的凹坑(腔室)20的底面的上述表面3;一对凹部10,它们在俯视时与该搭载部6重叠且在搭载部6的内侧彼此相邻地开口;以及一对电极焊盘12,它们配置于每个该凹部10的底面侧,在俯视时为矩形形状。
所述框构件c3也由氧化铝等陶瓷形成,是对成为制造时的原材料的陶瓷生坯片进行冲切加工或激光加工而得到的。
另外,所述一对电极焊盘12的四边具有以相同的宽度向所述陶瓷层c1、c2之间的内层面2n伸出的伸出部13。因此,如图2(C)所示,沿着包含所述分隔壁11的两边缘侧在内的每个凹部10的开口部的整周形成有向上侧隆起的突堤11a。因而,能够遍布凹部10的开口部的整周地获得所述效果(1)、(2)。
如图2(B)、图2(C)所示,上述一对电极焊盘12借助贯穿陶瓷层c1的通路导体22与形成于封装主体2b的背面4的多个背面端子(导体层)24分别电连接。另外,图2(B)中的右侧的背面端子24是电独立的虚设端子。但是,也可以是,对于图2(B)中的右侧的背面端子24,也设置贯穿陶瓷层c1的通路导体22,并与上述一对电极焊盘12分别连接。
另外,上述通路导体22、所述背面端子24也主要由W或Mo形成。
并且,在形成所述凹坑20的框构件c3的矩形框状的上表面18,也可以形成与该上表面18相似形状的未图示的金属化层。该金属化层是为了接合将所述凹坑20的开口部密封的金属盖而使用的。
另外,如图2(B)所示,在所述封装主体2b的凹坑20的底面即表面3的所述搭载部6上随后安装并搭载板形形状的电子部件7的情况下,能够在将自该电子部件7的底面垂直地向下方突出的一对引脚(外部连接端子)21分别插入每个所述凹部10的内侧且使每个所述引脚21的顶端部分别接近或接触每个所述电极焊盘12的表面的状态下进行该电子部件7的定位。在该状态下,将预先配设于电子部件7的底面的接合材料接合于上述表面3,且将在每个上述电极焊盘12的表面或在每个上述引脚21的顶端侧配设的焊料9配置于接合对象之间,由此能够进行上述电子部件7的安装和搭载。
在上述的封装1b中,与所述封装1a同样地能够预防电子部件7的安装时的短路、能够实现该电子部件7的定位,此外,还能够在使电子部件7的搭载部6和一对凹部10在俯视时重叠且将该电子部件7的各引脚21分别插入每个所述凹部10的姿势下,精度良好且容易地进行该电子部件7的安装和搭载。
并且,还容易利用所述框构件c3防护搭载在上述搭载部6上的电子部件7不受来自外部的影响、或将搭载在上述搭载部6上的电子部件7密封。
因而,采用所述封装1b,不仅能够发挥所述效果(1)、(2),而且还能够发挥所述效果(3)、(5)。
另外,向所述电极焊盘12的内层面2n伸出的伸出部13的位置也可以如所述封装1a的情况那样仅为靠分隔壁11侧的一边。
图3(A)是表示不同形态的封装1c的俯视图,图3(B)是沿着图3(A)中的B-B线向视的垂直剖视图。
如图3(A)、图3(B)所示,上述封装1c具备:封装主体2c,其整体为板形形状;4个(多个)凹部10,它们在该封装主体2c的表面3的俯视时的中央侧彼此相邻且呈格子状,并且开口;以及4个电极焊盘12,它们分别配置于每个该凹部10的底面侧。
上述封装主体2c是将上下两层陶瓷层(绝缘层)c1、c2层叠而成的,具有俯视时为正方形(矩形形状)的表面3、与该表面3相对的背面4、以及位于所述表面3与背面4之间的四边的侧面5。
另外,上述陶瓷层c1、c2也是由氧化铝等形成的陶瓷层(绝缘层)。
在所述封装主体2c的表面3的中央侧,在俯视时在横纵方向上相邻地设有:搭载部6,其俯视时为正方形,供电子部件7随后搭载;所述4个凹部10,它们在俯视时与该搭载部6重叠,并且在搭载部6的内侧的表面3上彼此相邻,且整体为矩形形状且呈格子状排列;以及所述4个电极焊盘12,它们分别配置于每个该凹部10的底面侧。另外,所述4个凹部10彼此之间被分隔壁11相互隔离,分隔壁11由上层侧的所述陶瓷层c2的局部形成,并在俯视时自中央沿纵横延伸。
所述4个电极焊盘12形成于所述陶瓷层c1、c2之间的内层面2n且在俯视时为矩形形状,所述4个电极焊盘12的彼此相邻的两边各自具有向重叠有分隔壁11的位置处的所述内层面2n伸出的伸出部13。与该伸出部13相对应地,在所述分隔壁11的位于表面3侧的图示的横纵方向上的两边缘侧都形成有隆起的突堤11a,突堤11a在俯视时呈4个L字形状。
并且,如图3(A)、图3(B)所示,所述4个电极焊盘12经由分别贯穿陶瓷层c1的4个通路导体22与在封装主体2c的背面4的四个角侧分别形成的4个背面端子24分别电连接。另外,上述通路导体22和背面端子24也主要由W或Mo形成。
另外,如图3(B)所示,在所述封装主体2c的表面3的所述搭载部6上随后安装并搭载电子部件7的情况下,能够在将自该电子部件7的底面垂直地向下方突出的4个球端子(外部连接端子)26插入每个所述凹部10的内侧且使每个所述球端子26的顶端部分别接近或接触每个所述电极焊盘12的表面的状态下进行该电子部件7的定位。在该状态下,将预先配设于上述电子部件7的底面的接合材料(未图示)接合于上述表面3,且将在每个上述电极焊盘12的表面或在每个上述球端子26的顶端侧配设的焊料9配置于接合对象之间,或者使所述球端子26本身由焊料球形成并使该焊料球熔融固化,由此能够进行上述电子部件7的安装和搭载。
在上述的封装1c中,与所述封装1a、1b同样地能够预防电子部件7的安装时的短路、能够实现该电子部件7的定位,此外,还能够在使电子部件7的搭载部6和4个凹部10在俯视时重叠且将该电子部件7的各球端子26分别插入每个所述凹部10的定位状态下,精度良好且容易地进行该电子部件7的安装和搭载。
因而,采用所述封装1c,不仅能够发挥所述效果(1)、(2),而且还能够发挥所述效果(3)。
另外,所述电极焊盘12的内层面2n的伸出部13的位置也可以如所述封装1b的情况那样为作为俯视时的整周的四边。
图3(C)是表示所述封装1c的应用形态即封装1d的上述那样的垂直剖视图。
如图3(C)所示,上述封装1d具备:封装主体2d,其包含由上述那样的陶瓷层c1、c2形成的所述封装主体2c,该封装主体2d是通过沿着所述封装主体2c的表面3的外周进一步层叠俯视时为矩形框状的上述那样的框构件c3而成的;上述那样的搭载部6,其位于成为被所述框构件c3的内壁面19包围的凹坑(腔室)20的底面的上述表面3;4个凹部10,它们在俯视时与该搭载部6重叠且在搭载部6的内侧彼此相邻地开口;以及4个电极焊盘12,它们配置于每个该凹部10的底面侧,在俯视时为矩形形状。
另外,在形成有所述凹坑20的框构件c3的矩形框状的上表面18,也可以形成与该上表面18相似形状的未图示的金属化层。
另外,如图3(C)所示,在所述封装主体2d的表面3的所述搭载部6上随后安装并搭载电子部件7时,能够在将自该电子部件7的底面突出的4个球端子26分别插入每个所述凹部10的内侧且使每个所述球端子26的顶端部分别接近或接触每个所述电极焊盘12的表面的状态下,进行该电子部件7的定位。在该状态下,使预先配设于上述电子部件7的底面的接合材料接合于上述表面3,且将在每个上述电极焊盘12的表面或在每个上述球端子26的顶端侧配设的焊料9配置于接合对象之间,或者使所述球端子26本身由焊料球形成并使该焊料球熔融固化,由此能够进行上述电子部件7的安装和搭载。
另外,也可以是,利用焊接或钎焊等使未图示的金属盖接合于在所述框构件c3的上表面18形成的未图示的金属化层之上,将所述凹坑(腔室)20的开口部自外部密封。
在上述的封装1d中,与所述封装1c同样地能够预防电子部件7的安装时的短路、能够实现该电子部件7的定位,此外,还能够在使所述电子部件7的搭载部6和4个凹部10在俯视时重叠且将该电子部件7的各球端子26分别插入每个所述凹部10的定位状态(姿势)下,精度良好且容易地进行该电子部件7的安装和搭载。
并且,还容易利用所述框构件c3防护搭载在上述搭载部6上的电子部件7不受来自外部的影响、或将搭载在上述搭载部6上的电子部件7密封。
因而,通过所述封装1d,不仅能够发挥所述效果(1)、(2),而且还能够发挥所述效果(3)、(5)。
本发明并不限定于在以上说明的各形态。
例如,构成所述封装主体2a、2c的陶瓷层c1、c2并不限于所述氧化铝,也可以为多铝红柱石、氮化铝等高温共烧陶瓷或者玻璃-陶瓷等低温共烧陶瓷。或者,也可以是,替代由陶瓷层形成的绝缘层,例如,设为由环氧系等树脂形成的绝缘层。在设为该树脂制、上述玻璃-陶瓷等的情况下,作为所述电极焊盘、侧面导体、通路导体、连接布线、背面端子等的材料,主要应用铜或银。
另外,构成所述封装主体2a、2c的绝缘层也可以为3层以上。
并且,所述凹部也可以为俯视时呈五边形以上的正多边形或它们的变形多边形的形态、或者俯视时呈圆形、腰圆形、椭圆形等的形态。但是,关于位于所述凹部之间的所述分隔壁的宽度,需要两个相邻的凹部最相互接近的位置的距离具有所述最小限度的宽度。
并且,所述电极焊盘若能够在俯视时至少覆盖所述凹部的整个底面,则其俯视时的形状并未特别限定。
另外,可以设为如下形态,即,在所述封装主体2a~所述封装主体2d的表面3上,在俯视时1个搭载部6的范围内,相互分离地配置有多组彼此相邻的多个凹部10的组合,或者,也可以设为使在俯视时彼此相邻的多个凹部10整体的外形与1个搭载部6大致重叠的形态。
并且,也可以设为如下形态:在所述封装主体2a、2c的表面3上,配置两处以上的搭载部6,与每个该搭载部6相对应地配置多个所述凹部,并且在每个该凹部的底面配置所述电极焊盘。
另外,所述封装1a~所述封装1d也可以是由在俯视时所述封装1a~所述封装1d纵横都相邻地并列设置的多个组合的形态,并且,可以在所述电子部件的安装和搭载之前或之后分割为多个。
产业上的可利用性
采用本发明,能够提供如下一种封装:即使将多个电极焊盘彼此相邻地配置于将多个绝缘层层叠而成的封装主体的表面,在向所述表面所包含的搭载部安装随后要搭载的电子部件时,也不易在所述多个电极焊盘之间产生短路。
Claims (5)
1.一种封装,其具备:封装主体,其是将多个绝缘层层叠而成的,具有表面、与该表面相对的背面、以及位于所述表面与背面之间的侧面,所述表面包含电子部件的搭载部;多个凹部,它们彼此相邻且开口于所述封装主体的表面;多个电极焊盘,它们分别配置于所述多个凹部的各个底面;以及分隔壁,该分隔壁由构成所述封装主体的至少1个绝缘层形成,该分隔壁在分隔壁的位于表面侧的两边缘侧具有向上侧隆起的突堤,
该封装的特征在于,
所述电极焊盘的表面处于比所述封装主体的表面低的位置,
所述多个凹部隔着所述分隔壁地在俯视时彼此相邻,
所述电极焊盘与在所述封装主体的背面或侧面、或者背面和侧面形成的导体层电连接。
2.根据权利要求1所述的封装,其特征在于,
在所述封装主体的表面上,所述多个凹部和所述电子部件的搭载部在俯视时相互分离或相互重叠。
3.根据权利要求1或2所述的封装,其特征在于,
所述电极焊盘的至少一边具有向构成所述封装主体的绝缘层之间的内层面伸出的伸出部。
4.根据权利要求1至3中任一项所述的封装,其特征在于,
所述电极焊盘的表面与搭载于所述搭载部的电子部件的外部连接端子电连接、或经由接合线与所述电子部件电连接。
5.根据权利要求1至4中任一项所述的封装,其特征在于,
在所述封装主体的表面还具备呈沿着该表面的外周的框体形状的框构件,所述凹部和所述搭载部被所述框构件的内壁面包围。
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KR102425194B1 (ko) | 2022-07-25 |
KR20200089615A (ko) | 2020-07-27 |
EP3683830A1 (en) | 2020-07-22 |
JP2020113722A (ja) | 2020-07-27 |
US20200235019A1 (en) | 2020-07-23 |
US11551984B2 (en) | 2023-01-10 |
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