CN111153683B - 一种片式多层陶瓷电容器的制备方法 - Google Patents
一种片式多层陶瓷电容器的制备方法 Download PDFInfo
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Abstract
本公开提供了一种片式多层陶瓷电容器的制备方法,制备方法步骤为:1)制备陶瓷浆料;2)将陶瓷浆料利用制带机进行制带,获得料带;3)将料带进行裁剪,然后与PC板进行贴合,得到介质层料带;4)将内电极浆料在介质料带的PC板面连续印刷两次后进行烘烤,然后在其上方覆盖介质料带,进行压合,然后在覆盖的介质料带的PC板面连续印刷两次后进行烘烤,依次重复,得到带有内电极的介质料带叠层;5)将带有内电极的介质料带叠层进行真空静水均压;6)真空静水均压后再进行切割、排胶、烧结、倒角和端头涂银处理,最后形成片式多层陶瓷电容器。所述方法所制备的片式多层陶瓷电容器具有平整性好、无针孔、无龟裂、层间无气泡、无异物的优点。
Description
技术领域
本公开涉及电子材料与元器件技术领域,具体涉及一种片式多层陶瓷电容器的制备方法。
背景技术
多层片式陶瓷电容器MLCC(Multi-Layer Ceramic Capacitor)是由印好电极(内电极)的陶瓷介质膜片以错位的方式叠合起来,经过一次性高温烧结形成陶瓷芯片,再在芯片的两端封上金属层(外电极),从而形成一个类似独石的结构体,故也叫独石电容器。
在信息化产品趋求轻、薄、短、小及表面贴装技术(SMT)日益成熟的背景下,多层片式陶瓷电容器MLCC除有电容器“隔直通交”的通性特点外,因小型化、片式化、薄型化、大电容量、损失率低(高频应用时)、耐高电压和高热、运作温度范围广、易大量生产、低廉价格及高稳定性等特性,具有非常广阔的应用发展前景,现约占整个电容器总产值的42%,MLCC可广泛应用于信息、军工、移动通讯、航空和电子电器等行业中。与传统钽电解电容器或铝电解电容器相比,MLCC的等效电阻低、耐脉冲电流性能较好、外型尺寸小、绝缘电阻高、阻抗温度特性与频率特性较好,自密封性良好,内电机可有效防止被污染,飞弧电压和击穿电压大大提高。而且多层片式陶瓷电容器也向着超薄膜、高积层的方向发展。
目前利用现有的片式多层陶瓷电容器的制备工艺,所制备出的片式多层陶瓷电容器具有外观不平整,有起伏的现象出现,使得整体的效果不好的问题。
发明内容
本公开的目的是提供一种片式多层陶瓷电容器的制备方法,以达到提高片式多层陶瓷电容器平整性的目的。
为实现上述目的,技术方案如下:
一种片式多层陶瓷电容器的制备方法,所述制备方法的具体步骤为:
(1)制备陶瓷浆料;
(2)将制备好的陶瓷浆料利用制带机进行制带,获得料带;
(3)将获得的料带进行裁剪,然后将剪裁过的料带与PC板进行贴合,得到介质层料带;
(4)将内电极浆料在介质料带的PC板面上进行印刷后,进行烘烤,然后在印有内电极的PC板面上覆盖上介质料带,进行压合,在覆盖的介质料带的PC板面上进行内电极浆料的印刷,然后进行烘烤,依次重复多次,得到带有内电极的介质料带叠层;
(5)将带有内电极的介质料带叠层进行真空静水均压;
(6)真空静水均压后,对带有内电极的介质料带叠层再进行切割、排胶、烧结、倒角和端头涂银处理,最后形成片式多层陶瓷电容器。
所述陶瓷浆料的组分包括:陶瓷粉料、增塑剂、溶剂、分散剂、防沉剂和粘结剂。
所述陶瓷浆料各组分的添加的重量分数为:陶瓷粉料400-600份、增塑剂7-9份、溶剂80-96份、分散剂2-4份、防沉剂0.1-1份和粘结剂7-9份。
所述增塑剂为邻苯二甲酸二辛酯;优选地所述溶剂为异丁醇和醋酸正丙酯混合物,所述异丁醇和醋酸正丙酯添加的比例为(18-19):72;优选地所述分散剂为蓖麻油;优选地所述粘结剂为聚乙烯醇缩丁醛。
所述陶瓷浆料的制备方法为:首先将陶瓷粉料、增塑剂、溶剂、分散剂和防沉剂放入到制浆瓶中;然后加入氧化锆研磨介质进行第一次球磨;最后加入粘结剂进行第二次球磨,得到陶瓷浆料。
所述氧化锆研磨介质与陶瓷粉料的添加比例为3:1,所述氧化锆研磨介质为氧化锆球和氧化锆柱的混合,其中氧化锆球和氧化锆柱的添加比例为1:1。
所述第一次球磨的时间为7-9h,所述第二次球磨的时间为13-16h。
所述步骤(4)中印刷的方法为干法印刷;优选地所述印刷的次数为两次;优选地所述步骤(4)中烘烤的温度为65-80℃,烘烤的时间为15-25min。
所述真空静水均压的空压为0.4-0.6MPa,所述真空静水均压的水压为3600-4000psi。
所述步骤(6)中端头涂银处理所使用的端浆为5178A端浆,优选地所述5178A端浆的烧银温度为800-850℃。
本公开的有益效果是:提供了一种片式多层陶瓷电容器的制备方法,所述方法中将制备的料带与PC板贴合使得陶瓷层表面更加的平整,且在均压时利用真空静水均压的方式,使得叠层在均压时受力更加均匀,层与层之间无气泡,所以利用本公开所述方法所制备的片式多层陶瓷电容器具有平整性好、无针孔、无龟裂、层间无气泡、无异物。利用干法印刷法所印刷的的内电极图形完整、无漏印、边缘线条平滑清晰、无扩散、无严重缺损、锯齿边和空洞、各部位线条颜色深浅均匀一致,且所述方法还具有投资小、生产效率高、节约时间、产品一致性好和电性能更加稳定的优点。
附图说明
图1为实施例1所制备片式多层陶瓷电容器电镜图。
具体实施方式
以下各步骤仅用以说明本公开的技术方案,而非对其限制;尽管参照前述各步骤对本公开进行了详细的说明,但本领域的普通技术人员应当理解:其依然可以对前述各步骤所记载的技术方案进行修改,或者对其中部分或者全部技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本公开各步骤技术方案的范围。
实施例1
陶瓷浆料配方:Ferro-100陶瓷粉料500份、邻苯二甲酸二辛酯8.5份、异丁醇19份、醋酸正丙酯72份、蓖麻油2.5份、防沉剂0.5份和聚乙烯醇缩丁醛8.5份。
一种片式多层陶瓷电容器的制备方法,所述制备方法的具体步骤为:
S1.制备陶瓷浆料,将上述陶瓷浆料配方中的陶瓷粉料Ferro-100、邻苯二甲酸二辛酯、异丁醇、醋酸正丙酯、蓖麻油和防沉剂按照质量份数放入到制浆瓶中;然后加入氧化锆球和氧化锆柱进行球磨8h;最后加入聚乙烯醇缩丁醛进行再次球磨14h,得到陶瓷浆料。
S2.将制备好的陶瓷浆料静置1h左右,利用制带机进行制带,获得料带,其中制带机的参数为表1所示,其中制带机的制带速度为400±50rpm,料带的厚度为70±2μm。
表1制带机参数
S3.将获得的料带进行裁剪(长*宽为16.5±0.5*16.0±0.5cm),然后将剪裁过的料带与PC板进行贴合,得到介质层料带。
S4.将内电极浆料在介质料带的PC板面连续印刷两次,然后进行烘烤,然后在其上方覆盖介质料带,盖住印刷的内电极区域,但四周中预留切割线,然后利用压合机进行压合,然后再次在覆盖的介质料带的PC板面连续印刷两次后进行烘烤,依次重复进行直到达到组数要求,得到带有印刷内电极浆料的介质料带叠层,其中内电极浆料的型号为Ag90Pd10,粘度为20000-24000,印刷的网板为MLCC2012-C-Q-1-325S5L,烘烤的温度和时间如表2所示,所述压合机的参数如表3所示。
表2烘烤温度与时间
表3压合机参数
压合设定值 | 120kg/cm<sup>2</sup> |
实际压力控制范围 | 100-150kg/cm<sup>2</sup> |
压合时间 | 30±1s |
设定压合温度 | 50℃ |
实际显示温度 | 50±5℃ |
S5.将带有印刷内电极浆料的介质料带叠层装进袋子中密封,抽真空,然后进行真空静水均压,真空静水均压两次后冷却,再真空静水均压两次,其中真空静水均压的条件如表4所示。
表4真空静水均压条件
S6.真空静水均压后,真空静水均压后,对带有印刷内电极浆料的介质料带叠层再进行切割、排胶、烧结、倒角和端头涂银处理,最后形成片式多层陶瓷电容器。其中具体操作如下:
1)对带有印刷内电极浆料的介质料带叠层再进行切割,在切割后确保无明显毛刺,易打散,其中切割中切割机的作业参数如表5所示;
表5切割机作业参数
2)然后再进行排胶,在排胶前要把切割后的带有印刷内电极浆料的介质料带叠层压散布于匣钵中,器件不能重叠,不能堆积,其中排胶条件为:60℃,2h;110℃,5h;130℃,6h;220℃,15h;270℃,11h;最后自然冷却;
3)然后进行烧结,在烧结前要把带有印刷内电极浆料的介质料带叠层均压散布于匣钵中,器件不能重叠,不能堆积,每个匣钵对角交叉排列,确保温度均匀稳定,其中烧结的条件为:180℃,2h;360℃,9h;960℃,8h,然后以5℃/min的速度降温;
4)然后倒角,目的是研磨瓷片棱角,保证后段涂银质量,将烧结后的带有印刷内电极浆料的介质料带叠层在行星球磨机上倒角,转速为40Hz,时间30min,直至棱角圆滑,后续涂银不会露瓷,无刮伤感;
5)最后进行端头涂银处理,将端电极银浆利用325涂银机涂在倒角后带有印刷内电极浆料的介质料带叠层的两端,其中端电极银浆采用端浆5178A,然后利用烘银干燥机进行烘银,然后在800℃下进行烧银,得到片式多层陶瓷电容器,如图1所示,可以看出利用本公开所述方法所制备的片式多层陶瓷电容器平整性好、无针孔、无龟裂、层间无气泡、无异物。
Claims (13)
1.一种片式多层陶瓷电容器的制备方法,其特征在于,所述制备方法的具体步骤为:
(1)制备陶瓷浆料;
(2)将制备好的陶瓷浆料利用制带机进行制带,获得料带;
(3)将获得的料带进行裁剪,然后将剪裁过的料带与PC板进行贴合,得到多个介质层料带;
(4)将内电极浆料在介质料带的PC板面上进行印刷后,进行烘烤,然后在印有内电极的PC板面上覆盖上介质料带,进行压合,在覆盖的介质料带的PC板面上进行内电极浆料的印刷,然后进行烘烤,依次重复多次,得到带有内电极的介质料带叠层;
(5)将带有内电极的介质料带叠层进行真空静水均压;
(6)真空静水均压后,对带有内电极的介质料带叠层再进行切割、排胶、烧结、倒角和端头涂银处理,最后形成片式多层陶瓷电容器;
所述步骤(4)中印刷的方法为干法印刷;所述印刷的次数为两次;所述步骤(4)中烘烤的温度为65-80℃,烘烤的时间为15-25min。
2.根据权利要求1所述的片式多层陶瓷电容器的制备方法,其特征在于,所述陶瓷浆料的组分包括:陶瓷粉料、增塑剂、溶剂、分散剂、防沉剂和粘结剂。
3.根据权利要求2所述的片式多层陶瓷电容器的制备方法,其特征在于,所述陶瓷浆料各组分的添加的重量分数为:陶瓷粉料400-600份、增塑剂7-9份、溶剂80-96份、分散剂2-4份、防沉剂0.1-1份和粘结剂7-9份。
4.根据权利要求2所述的片式多层陶瓷电容器的制备方法,其特征在于,所述增塑剂为邻苯二甲酸二辛酯。
5.根据权利要求4所述的片式多层陶瓷电容器的制备方法,其特征在于,所述溶剂为异丁醇和醋酸正丙酯混合物,所述异丁醇和醋酸正丙酯添加的比例为(18-19):72。
6.根据权利要求4所述的片式多层陶瓷电容器的制备方法,其特征在于,所述分散剂为蓖麻油。
7.根据权利要求4所述的片式多层陶瓷电容器的制备方法,其特征在于,所述粘结剂为聚乙烯醇缩丁醛。
8.根据权利要求2所述的片式多层陶瓷电容器的制备方法,其特征在于,所述陶瓷浆料的制备方法为:首先将陶瓷粉料、增塑剂、溶剂、分散剂和防沉剂放入到制浆瓶中;然后加入氧化锆研磨介质进行第一次球磨;最后加入粘结剂进行第二次球磨,得到陶瓷浆料。
9.根据权利要求8所述的片式多层陶瓷电容器的制备方法,其特征在于,所述氧化锆研磨介质与陶瓷粉料的添加比例为3:1,所述氧化锆研磨介质为氧化锆球和氧化锆柱的混合,其中氧化锆球和氧化锆柱的添加比例为1:1。
10.根据权利要求8所述的片式多层陶瓷电容器的制备方法,其特征在于,所述第一次球磨的时间为7-9h,所述第二次球磨的时间为13-16h。
11.根据权利要求1所述的片式多层陶瓷电容器的制备方法,其特征在于,所述真空静水均压的空压为0.4-0.6MPa,所述真空静水均压的水压为3600-4000psi。
12.根据权利要求1所述的片式多层陶瓷电容器的制备方法,其特征在于,所述步骤(6)中端头涂银处理所使用的端浆为5178A端浆。
13.根据权利要求12所述的片式多层陶瓷电容器的制备方法,其特征在于,所述5178A端浆的烧银温度为800-850℃。
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