CN111048442B - 基板清洗部件及基板清洗装置 - Google Patents

基板清洗部件及基板清洗装置 Download PDF

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Publication number
CN111048442B
CN111048442B CN201910964641.1A CN201910964641A CN111048442B CN 111048442 B CN111048442 B CN 111048442B CN 201910964641 A CN201910964641 A CN 201910964641A CN 111048442 B CN111048442 B CN 111048442B
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CN
China
Prior art keywords
substrate
cleaning
cleaning member
diameter portion
large diameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201910964641.1A
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English (en)
Chinese (zh)
Other versions
CN111048442A (zh
Inventor
石桥知淳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of CN111048442A publication Critical patent/CN111048442A/zh
Application granted granted Critical
Publication of CN111048442B publication Critical patent/CN111048442B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
    • B08B1/143—Wipes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/60—Cleaning only by mechanical processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN201910964641.1A 2018-10-12 2019-10-11 基板清洗部件及基板清洗装置 Active CN111048442B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-193312 2018-10-12
JP2018193312A JP7166132B2 (ja) 2018-10-12 2018-10-12 基板洗浄部材および基板洗浄装置

Publications (2)

Publication Number Publication Date
CN111048442A CN111048442A (zh) 2020-04-21
CN111048442B true CN111048442B (zh) 2024-10-11

Family

ID=68280895

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910964641.1A Active CN111048442B (zh) 2018-10-12 2019-10-11 基板清洗部件及基板清洗装置

Country Status (7)

Country Link
US (1) US11501983B2 (https=)
EP (1) EP3636356B1 (https=)
JP (1) JP7166132B2 (https=)
KR (1) KR102708935B1 (https=)
CN (1) CN111048442B (https=)
SG (1) SG10201909509UA (https=)
TW (1) TWI820206B (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7476339B2 (ja) 2020-04-06 2024-04-30 エルジー エナジー ソリューション リミテッド 電気化学素子用の分離膜及びその製造方法
JP6892176B1 (ja) * 2020-11-19 2021-06-23 不二越機械工業株式会社 ワーク洗浄装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB772599A (en) * 1954-01-23 1957-04-17 Service Eng Ltd Improvements relating to brushing machines

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5375291A (en) 1992-05-18 1994-12-27 Tokyo Electron Limited Device having brush for scrubbing substrate
US5937469A (en) 1996-12-03 1999-08-17 Intel Corporation Apparatus for mechanically cleaning the edges of wafers
JPH11283952A (ja) * 1998-03-30 1999-10-15 Shibaura Mechatronics Corp ブラシ洗浄装置
US6299698B1 (en) * 1998-07-10 2001-10-09 Applied Materials, Inc. Wafer edge scrubber and method
US6467120B1 (en) * 1999-09-08 2002-10-22 International Business Machines Corporation Wafer cleaning brush profile modification
US20040040576A1 (en) 2002-08-29 2004-03-04 Yuxia Sun Wafer cleaning brush
KR100562502B1 (ko) * 2003-07-02 2006-03-21 삼성전자주식회사 반도체 기판의 가장자리부 처리 장치 및 방법
JP3933670B2 (ja) 2005-03-29 2007-06-20 東京エレクトロン株式会社 基板洗浄方法及び基板洗浄装置
JP4768556B2 (ja) 2006-09-15 2011-09-07 Ｎｅｃ液晶テクノロジー株式会社 基板洗浄装置及び基板洗浄方法
JP2007272236A (ja) 2007-04-11 2007-10-18 Advanced Display Inc 基板端面洗浄装置、基板端面洗浄方法及び半導体装置の製造方法
JP2008282865A (ja) 2007-05-08 2008-11-20 Fuji Electric Device Technology Co Ltd スクラブ洗浄装置及びそれに用いられるロールスポンジアセンブリ
KR101020676B1 (ko) * 2008-11-26 2011-03-09 세메스 주식회사 기판 세정 장치
WO2010125663A1 (ja) * 2009-04-30 2010-11-04 アイオン株式会社 洗浄用スポンジローラ
JP5535687B2 (ja) 2010-03-01 2014-07-02 株式会社荏原製作所 基板洗浄方法及び基板洗浄装置
JP5645752B2 (ja) * 2011-05-25 2014-12-24 株式会社荏原製作所 基板洗浄方法及びロール洗浄部材
US9704729B2 (en) * 2013-06-13 2017-07-11 K.C. Tech Co., Ltd. Substrate cleaning apparatus and method and brush assembly used therein
JP7224128B2 (ja) * 2018-08-09 2023-02-17 株式会社荏原製作所 基板用洗浄具、基板洗浄装置、基板処理装置、基板処理方法および基板用洗浄具の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB772599A (en) * 1954-01-23 1957-04-17 Service Eng Ltd Improvements relating to brushing machines

Also Published As

Publication number Publication date
US20200118843A1 (en) 2020-04-16
TW202017030A (zh) 2020-05-01
JP7166132B2 (ja) 2022-11-07
KR102708935B1 (ko) 2024-09-25
TWI820206B (zh) 2023-11-01
US11501983B2 (en) 2022-11-15
JP2020061514A (ja) 2020-04-16
SG10201909509UA (en) 2020-05-28
KR20200041791A (ko) 2020-04-22
CN111048442A (zh) 2020-04-21
EP3636356A1 (en) 2020-04-15
EP3636356B1 (en) 2024-12-18

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