CN111029332A - 具有高散热和电磁屏蔽性的扇出型封装结构及其制备方法 - Google Patents
具有高散热和电磁屏蔽性的扇出型封装结构及其制备方法 Download PDFInfo
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- CN111029332A CN111029332A CN201911373185.XA CN201911373185A CN111029332A CN 111029332 A CN111029332 A CN 111029332A CN 201911373185 A CN201911373185 A CN 201911373185A CN 111029332 A CN111029332 A CN 111029332A
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- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
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CN201911373185.XA CN111029332A (zh) | 2019-12-27 | 2019-12-27 | 具有高散热和电磁屏蔽性的扇出型封装结构及其制备方法 |
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CN201911373185.XA CN111029332A (zh) | 2019-12-27 | 2019-12-27 | 具有高散热和电磁屏蔽性的扇出型封装结构及其制备方法 |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111755350A (zh) * | 2020-05-26 | 2020-10-09 | 甬矽电子(宁波)股份有限公司 | 封装结构制作方法和封装结构 |
WO2021244304A1 (zh) * | 2020-05-30 | 2021-12-09 | 华为技术有限公司 | 一种芯片封装结构及电子设备 |
CN113785393A (zh) * | 2021-07-28 | 2021-12-10 | 广东省科学院半导体研究所 | 扇出型封装及扇出型封装的制备方法 |
JP2022037904A (ja) * | 2020-08-25 | 2022-03-09 | ズハイ アクセス セミコンダクター シーオー.,エルティーディー | 線路プリセット放熱埋め込み型パッケージ構造及びその製造方法 |
JP2022542332A (ja) * | 2020-06-16 | 2022-10-03 | 珠海越亜半導体股▲分▼有限公司 | 放熱兼電磁シールドの埋め込みパッケージ構造及びその製造方法並びに基板 |
-
2019
- 2019-12-27 CN CN201911373185.XA patent/CN111029332A/zh active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111755350A (zh) * | 2020-05-26 | 2020-10-09 | 甬矽电子(宁波)股份有限公司 | 封装结构制作方法和封装结构 |
WO2021244304A1 (zh) * | 2020-05-30 | 2021-12-09 | 华为技术有限公司 | 一种芯片封装结构及电子设备 |
JP2022542332A (ja) * | 2020-06-16 | 2022-10-03 | 珠海越亜半導体股▲分▼有限公司 | 放熱兼電磁シールドの埋め込みパッケージ構造及びその製造方法並びに基板 |
JP7236549B2 (ja) | 2020-06-16 | 2023-03-09 | 珠海越亜半導体股▲分▼有限公司 | 放熱兼電磁シールドの埋め込みパッケージ構造の製造方法 |
JP2022037904A (ja) * | 2020-08-25 | 2022-03-09 | ズハイ アクセス セミコンダクター シーオー.,エルティーディー | 線路プリセット放熱埋め込み型パッケージ構造及びその製造方法 |
JP7277521B2 (ja) | 2020-08-25 | 2023-05-19 | ズハイ アクセス セミコンダクター シーオー.,エルティーディー | 線路プリセット放熱埋め込み型パッケージ構造及びその製造方法 |
CN113785393A (zh) * | 2021-07-28 | 2021-12-10 | 广东省科学院半导体研究所 | 扇出型封装及扇出型封装的制备方法 |
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