CN110982273A - 具有受控的导热率分布的树脂片材及其制造方法 - Google Patents

具有受控的导热率分布的树脂片材及其制造方法 Download PDF

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Publication number
CN110982273A
CN110982273A CN201910921966.1A CN201910921966A CN110982273A CN 110982273 A CN110982273 A CN 110982273A CN 201910921966 A CN201910921966 A CN 201910921966A CN 110982273 A CN110982273 A CN 110982273A
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thermal conductivity
resin sheet
resin
region
resin composition
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Chinese (zh)
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高松纪仁
大崎明彦
福田健
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Shin Etsu Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D7/00—Producing flat articles, e.g. films or sheets
    • B29D7/01—Films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/14—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by endowing the walls of conduits with zones of different degrees of conduction of heat
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/001—Particular heat conductive materials, e.g. superconductive elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005—Thermal joints
    • F28F2013/006—Heat conductive materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2245/00—Coatings; Surface treatments
    • F28F2245/06—Coatings; Surface treatments having particular radiating, reflecting or absorbing features, e.g. for improving heat transfer by radiation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2270/00—Thermal insulation; Thermal decoupling

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN201910921966.1A 2018-10-03 2019-09-27 具有受控的导热率分布的树脂片材及其制造方法 Pending CN110982273A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018188049A JP2020055961A (ja) 2018-10-03 2018-10-03 制御された熱伝導率分布を有する樹脂シート及びその製造方法
JP2018-188049 2018-10-03

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CN110982273A true CN110982273A (zh) 2020-04-10

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CN201910921966.1A Pending CN110982273A (zh) 2018-10-03 2019-09-27 具有受控的导热率分布的树脂片材及其制造方法

Country Status (5)

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US (1) US20200141668A1 (ja)
JP (1) JP2020055961A (ja)
KR (1) KR20200038421A (ja)
CN (1) CN110982273A (ja)
TW (1) TW202028316A (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102657683B1 (ko) * 2021-09-17 2024-04-17 한국기초과학지원연구원 히드록실화된 보론 나이트라이드의 제조방법 및 이를 포함하는 열전도성 조성물
CN114426691B (zh) * 2022-02-11 2023-04-07 电子科技大学 一种石墨烯电磁屏蔽复合材料及其制备方法

Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000141505A (ja) * 1998-11-09 2000-05-23 Polymatech Co Ltd 高分子複合材料の成形方法および磁場配向プレス成形装置
US20010004546A1 (en) * 1999-12-17 2001-06-21 Masayuki Tobita Heat conductive mold and manufacturing method thereof
JP2001291431A (ja) * 2000-04-10 2001-10-19 Jsr Corp 異方導電性シート用組成物、異方導電性シート、その製造方法および異方導電性シートを用いた接点構造
US20010045426A1 (en) * 2000-02-19 2001-11-29 Helmut Eberhardt Apparatus and method for heating a workpiece of metal
JP2001351445A (ja) * 2000-06-09 2001-12-21 Jsr Corp 複合シートの製造方法および複合シート
US20030205404A1 (en) * 2000-04-10 2003-11-06 Jsr Corporation Composite sheet and process for producing the same
JP2006335957A (ja) * 2005-06-03 2006-12-14 Polymatech Co Ltd 熱伝導性成形体の製造方法及び熱伝導性成形体
CN101045858A (zh) * 2006-03-30 2007-10-03 丰田合成株式会社 高导热性绝缘体及其制造方法
CN103374226A (zh) * 2012-04-17 2013-10-30 信越化学工业株式会社 绝缘放热片材和氮化硼的造粒方法
CN103958578A (zh) * 2011-10-19 2014-07-30 日东电工株式会社 导热片、led安装用基板以及led模块
WO2015103435A1 (en) * 2013-12-31 2015-07-09 Balandin Alexander A Thermal interface materials with alligned fillers
CN105189621A (zh) * 2013-03-14 2015-12-23 沙特基础全球技术有限公司 功能梯度聚合物制品及其制备方法
JP2017098485A (ja) * 2015-11-27 2017-06-01 住友理工株式会社 放熱性成形体
CN107953628A (zh) * 2017-11-16 2018-04-24 东莞市弗勒特电子科技有限公司 一种三维高导热垫片及其制备方法
CN108328938A (zh) * 2017-01-20 2018-07-27 株洲晨昕中高频设备有限公司 一种导热石墨片及其生产方法
CN109071843A (zh) * 2016-04-28 2018-12-21 积水保力马科技株式会社 导热组合物、导热片及导热片的制造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4345958B2 (ja) 2003-02-24 2009-10-14 独立行政法人物質・材料研究機構 異方性成形体の製造装置および異方性成形体の製造方法
JP5244256B1 (ja) 2012-12-25 2013-07-24 日進工業株式会社 射出成形方法及び射出成形品
JP6626647B2 (ja) 2014-09-05 2019-12-25 Ｔｏｙｏ Ｔｉｒｅ株式会社 熱伝導率可変材料、当該熱伝導率可変材料を用いた熱制御装置、及び当該熱伝導率可変材料を用いた熱制御方法

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000141505A (ja) * 1998-11-09 2000-05-23 Polymatech Co Ltd 高分子複合材料の成形方法および磁場配向プレス成形装置
US20010004546A1 (en) * 1999-12-17 2001-06-21 Masayuki Tobita Heat conductive mold and manufacturing method thereof
US20010045426A1 (en) * 2000-02-19 2001-11-29 Helmut Eberhardt Apparatus and method for heating a workpiece of metal
JP2001291431A (ja) * 2000-04-10 2001-10-19 Jsr Corp 異方導電性シート用組成物、異方導電性シート、その製造方法および異方導電性シートを用いた接点構造
US20030205404A1 (en) * 2000-04-10 2003-11-06 Jsr Corporation Composite sheet and process for producing the same
JP2001351445A (ja) * 2000-06-09 2001-12-21 Jsr Corp 複合シートの製造方法および複合シート
JP2006335957A (ja) * 2005-06-03 2006-12-14 Polymatech Co Ltd 熱伝導性成形体の製造方法及び熱伝導性成形体
CN101045858A (zh) * 2006-03-30 2007-10-03 丰田合成株式会社 高导热性绝缘体及其制造方法
CN103958578A (zh) * 2011-10-19 2014-07-30 日东电工株式会社 导热片、led安装用基板以及led模块
CN103374226A (zh) * 2012-04-17 2013-10-30 信越化学工业株式会社 绝缘放热片材和氮化硼的造粒方法
CN105189621A (zh) * 2013-03-14 2015-12-23 沙特基础全球技术有限公司 功能梯度聚合物制品及其制备方法
WO2015103435A1 (en) * 2013-12-31 2015-07-09 Balandin Alexander A Thermal interface materials with alligned fillers
JP2017098485A (ja) * 2015-11-27 2017-06-01 住友理工株式会社 放熱性成形体
CN109071843A (zh) * 2016-04-28 2018-12-21 积水保力马科技株式会社 导热组合物、导热片及导热片的制造方法
CN108328938A (zh) * 2017-01-20 2018-07-27 株洲晨昕中高频设备有限公司 一种导热石墨片及其生产方法
CN107953628A (zh) * 2017-11-16 2018-04-24 东莞市弗勒特电子科技有限公司 一种三维高导热垫片及其制备方法

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KR20200038421A (ko) 2020-04-13
TW202028316A (zh) 2020-08-01
JP2020055961A (ja) 2020-04-09
US20200141668A1 (en) 2020-05-07

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