CN110931381A - 一种连续测试的集成电路封装测试装置 - Google Patents
一种连续测试的集成电路封装测试装置 Download PDFInfo
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- CN110931381A CN110931381A CN201911263042.3A CN201911263042A CN110931381A CN 110931381 A CN110931381 A CN 110931381A CN 201911263042 A CN201911263042 A CN 201911263042A CN 110931381 A CN110931381 A CN 110931381A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- Microelectronics & Electronic Packaging (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112490155A (zh) * | 2020-11-27 | 2021-03-12 | 深圳名仕堂贸易有限公司 | 一种芯片的封装系统 |
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CN204188767U (zh) * | 2014-09-25 | 2015-03-04 | 深圳市科汇龙科技有限公司 | 一种带有ng板挡板机构的电路板测试机下料设备 |
CN204789907U (zh) * | 2015-06-02 | 2015-11-18 | 罗能干 | 一种全自动的pcb测试装置 |
CN206931563U (zh) * | 2017-06-22 | 2018-01-26 | 珠海市中芯集成电路有限公司 | 晶圆测试装置 |
CN207650119U (zh) * | 2017-12-22 | 2018-07-24 | 昆山成功环保科技有限公司 | 一种晶圆自动检测系统 |
CN207800562U (zh) * | 2018-01-09 | 2018-08-31 | 南通斯迈尔精密设备有限公司 | 一种半导体封装测试设备轨道宽度快速调整机构 |
CN208037328U (zh) * | 2018-03-10 | 2018-11-02 | 深圳市百联创新科技有限公司 | 一种电路板筛选输送机 |
CN108827395A (zh) * | 2018-08-07 | 2018-11-16 | 河海大学常州校区 | 适用于led性能测试的光、电、热参数在线采集系统 |
CN108919102A (zh) * | 2018-08-31 | 2018-11-30 | 湖北龙腾电子科技有限公司 | 一种自动检测机 |
CN208795768U (zh) * | 2018-08-15 | 2019-04-26 | 苏州市高威电子有限公司 | 一种基板封装测试治具 |
CN110045159A (zh) * | 2019-05-24 | 2019-07-23 | 杭州易正科技有限公司 | 一种取放料方便的bga封装的测试座 |
-
2019
- 2019-12-11 CN CN201911263042.3A patent/CN110931381B/zh active Active
Patent Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5482471A (en) * | 1993-02-24 | 1996-01-09 | Texas Instruments Incorporated | Socket apparatus for IC package testing |
US20080124202A1 (en) * | 2006-11-28 | 2008-05-29 | Chu Sung-Yong | Apparatus for rotating a test tray in a handler |
CN101852686A (zh) * | 2009-03-30 | 2010-10-06 | 京元电子股份有限公司 | 直线往复测试模块及其测试系统 |
CN102654559A (zh) * | 2012-05-10 | 2012-09-05 | 致茂电子(苏州)有限公司 | 测试半导体封装堆叠晶片的测试系统及其半导体自动化测试机台 |
CN202870223U (zh) * | 2012-11-12 | 2013-04-10 | 珠海格力电器股份有限公司 | 检测装置 |
CN203941072U (zh) * | 2014-05-13 | 2014-11-12 | 运丰电子科技(深圳)有限公司 | Pcb板冷热冲击测试机 |
CN204188767U (zh) * | 2014-09-25 | 2015-03-04 | 深圳市科汇龙科技有限公司 | 一种带有ng板挡板机构的电路板测试机下料设备 |
CN204789907U (zh) * | 2015-06-02 | 2015-11-18 | 罗能干 | 一种全自动的pcb测试装置 |
CN206931563U (zh) * | 2017-06-22 | 2018-01-26 | 珠海市中芯集成电路有限公司 | 晶圆测试装置 |
CN207650119U (zh) * | 2017-12-22 | 2018-07-24 | 昆山成功环保科技有限公司 | 一种晶圆自动检测系统 |
CN207800562U (zh) * | 2018-01-09 | 2018-08-31 | 南通斯迈尔精密设备有限公司 | 一种半导体封装测试设备轨道宽度快速调整机构 |
CN208037328U (zh) * | 2018-03-10 | 2018-11-02 | 深圳市百联创新科技有限公司 | 一种电路板筛选输送机 |
CN108827395A (zh) * | 2018-08-07 | 2018-11-16 | 河海大学常州校区 | 适用于led性能测试的光、电、热参数在线采集系统 |
CN208795768U (zh) * | 2018-08-15 | 2019-04-26 | 苏州市高威电子有限公司 | 一种基板封装测试治具 |
CN108919102A (zh) * | 2018-08-31 | 2018-11-30 | 湖北龙腾电子科技有限公司 | 一种自动检测机 |
CN110045159A (zh) * | 2019-05-24 | 2019-07-23 | 杭州易正科技有限公司 | 一种取放料方便的bga封装的测试座 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112490155A (zh) * | 2020-11-27 | 2021-03-12 | 深圳名仕堂贸易有限公司 | 一种芯片的封装系统 |
CN112490155B (zh) * | 2020-11-27 | 2021-09-07 | 湖南长半科技有限公司 | 一种芯片的封装系统 |
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CN110931381B (zh) | 2021-12-14 |
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Address after: Building A, Building 201, Yingdafeng Industrial Park, No. 393 Jihua Road, Shuijing Community, Jihua Street, Longgang District, Shenzhen City, Guangdong Province, 518100 Patentee after: Shenzhen Chuangxin Online Testing Service Co.,Ltd. Address before: 518000 401, building a, yingdafeng Industrial Park, No. 393, Jihua Road, Jihua street, Longgang District, Shenzhen, Guangdong Province Patentee before: Shenzhen insell Electronic Co.,Ltd. |
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