CN110774168B - 具备球面轴承的连结机构、球面轴承的轴承半径决定方法以及基板研磨装置 - Google Patents

具备球面轴承的连结机构、球面轴承的轴承半径决定方法以及基板研磨装置 Download PDF

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Publication number
CN110774168B
CN110774168B CN201910687844.0A CN201910687844A CN110774168B CN 110774168 B CN110774168 B CN 110774168B CN 201910687844 A CN201910687844 A CN 201910687844A CN 110774168 B CN110774168 B CN 110774168B
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CN
China
Prior art keywords
contact surface
bearing
spherical bearing
rotating body
dresser
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CN201910687844.0A
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English (en)
Chinese (zh)
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CN110774168A (zh
Inventor
筱崎弘行
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Ebara Corp
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Ebara Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0084—Other grinding machines or devices the grinding wheel support being angularly adjustable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/007—Weight compensation; Temperature compensation; Vibration damping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B24B41/047—Grinding heads for working on plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/16—Bushings; Mountings

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
CN201910687844.0A 2018-07-31 2019-07-29 具备球面轴承的连结机构、球面轴承的轴承半径决定方法以及基板研磨装置 Active CN110774168B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-143393 2018-07-31
JP2018143393A JP7287761B2 (ja) 2018-07-31 2018-07-31 球面軸受の軸受半径決定方法

Publications (2)

Publication Number Publication Date
CN110774168A CN110774168A (zh) 2020-02-11
CN110774168B true CN110774168B (zh) 2023-07-07

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910687844.0A Active CN110774168B (zh) 2018-07-31 2019-07-29 具备球面轴承的连结机构、球面轴承的轴承半径决定方法以及基板研磨装置

Country Status (6)

Country Link
US (1) US12208488B2 (cg-RX-API-DMAC10.html)
JP (1) JP7287761B2 (cg-RX-API-DMAC10.html)
KR (1) KR102847013B1 (cg-RX-API-DMAC10.html)
CN (1) CN110774168B (cg-RX-API-DMAC10.html)
SG (1) SG10201906617WA (cg-RX-API-DMAC10.html)
TW (1) TWI819035B (cg-RX-API-DMAC10.html)

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5804507A (en) 1995-10-27 1998-09-08 Applied Materials, Inc. Radially oscillating carousel processing system for chemical mechanical polishing
US5738574A (en) 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
JPH09314456A (ja) 1996-05-29 1997-12-09 Toshiba Mach Co Ltd 研磨布ドレッシング方法及び研磨装置
US6036583A (en) * 1997-07-11 2000-03-14 Applied Materials, Inc. Conditioner head in a substrate polisher and method
US5899798A (en) * 1997-07-25 1999-05-04 Obsidian Inc. Low profile, low hysteresis force feedback gimbal system for chemical mechanical polishing
US6116990A (en) 1997-07-25 2000-09-12 Applied Materials, Inc. Adjustable low profile gimbal system for chemical mechanical polishing
JP3630958B2 (ja) 1997-11-19 2005-03-23 キヤノン株式会社 レンズ保持装置
JP3890188B2 (ja) 1999-09-14 2007-03-07 キヤノン株式会社 研磨装置
US6755723B1 (en) * 2000-09-29 2004-06-29 Lam Research Corporation Polishing head assembly
US7137874B1 (en) 2000-11-21 2006-11-21 Memc Electronic Materials, Spa Semiconductor wafer, polishing apparatus and method
KR100939556B1 (ko) * 2001-12-06 2010-01-29 가부시키가이샤 에바라 세이사꾸쇼 탄성막 및 플렉시블 막
JP2005034959A (ja) * 2003-07-16 2005-02-10 Ebara Corp 研磨装置及びリテーナリング
JP5025374B2 (ja) 2007-08-02 2012-09-12 オリンパス株式会社 保持具、研磨方法
JP5236515B2 (ja) 2009-01-28 2013-07-17 株式会社荏原製作所 ドレッシング装置、化学的機械的研磨装置及び方法
JP2011124302A (ja) 2009-12-09 2011-06-23 Lapmaster Sft Corp 低重心エアバック式研磨ヘッド
TWI674171B (zh) * 2012-01-31 2019-10-11 日商荏原製作所股份有限公司 基板保持裝置、研磨裝置、及研磨方法
JP5976522B2 (ja) * 2012-05-31 2016-08-23 株式会社荏原製作所 研磨装置および研磨方法
JP5927083B2 (ja) * 2012-08-28 2016-05-25 株式会社荏原製作所 ドレッシングプロセスの監視方法および研磨装置
JP6403981B2 (ja) 2013-11-13 2018-10-10 株式会社荏原製作所 基板保持装置、研磨装置、研磨方法、およびリテーナリング
CN105856057B (zh) 2015-01-30 2019-06-04 株式会社荏原制作所 连结机构、基板研磨装置、旋转中心定位方法、最大按压负荷确定方法以及记录介质
JP6592355B2 (ja) * 2015-01-30 2019-10-16 株式会社荏原製作所 連結機構および基板研磨装置
JP6721967B2 (ja) * 2015-11-17 2020-07-15 株式会社荏原製作所 バフ処理装置および基板処理装置

Also Published As

Publication number Publication date
JP7287761B2 (ja) 2023-06-06
US12208488B2 (en) 2025-01-28
JP2020019081A (ja) 2020-02-06
KR20200014219A (ko) 2020-02-10
US20200039030A1 (en) 2020-02-06
TW202007475A (zh) 2020-02-16
TWI819035B (zh) 2023-10-21
CN110774168A (zh) 2020-02-11
SG10201906617WA (en) 2020-02-27
KR102847013B1 (ko) 2025-08-20

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