SG10201906617WA - Coupling mechanism with spherical bearing, method of determining bearing radius of spherical bearing, and substrate polishing apparatus - Google Patents

Coupling mechanism with spherical bearing, method of determining bearing radius of spherical bearing, and substrate polishing apparatus

Info

Publication number
SG10201906617WA
SG10201906617WA SG10201906617WA SG10201906617WA SG10201906617WA SG 10201906617W A SG10201906617W A SG 10201906617WA SG 10201906617W A SG10201906617W A SG 10201906617WA SG 10201906617W A SG10201906617W A SG 10201906617WA SG 10201906617W A SG10201906617W A SG 10201906617WA
Authority
SG
Singapore
Prior art keywords
bearing
spherical bearing
coupling mechanism
polishing apparatus
determining
Prior art date
Application number
SG10201906617WA
Inventor
Shinozaki Hiroyuki
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201906617WA publication Critical patent/SG10201906617WA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0084—Other grinding machines or devices the grinding wheel support being angularly adjustable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/007—Weight compensation; Temperature compensation; Vibration damping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B24B41/047—Grinding heads for working on plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/16—Bushings; Mountings

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
SG10201906617WA 2018-07-31 2019-07-17 Coupling mechanism with spherical bearing, method of determining bearing radius of spherical bearing, and substrate polishing apparatus SG10201906617WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018143393A JP7287761B2 (en) 2018-07-31 2018-07-31 Bearing radius determination method for spherical bearings

Publications (1)

Publication Number Publication Date
SG10201906617WA true SG10201906617WA (en) 2020-02-27

Family

ID=69229455

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201906617WA SG10201906617WA (en) 2018-07-31 2019-07-17 Coupling mechanism with spherical bearing, method of determining bearing radius of spherical bearing, and substrate polishing apparatus

Country Status (6)

Country Link
US (1) US20200039030A1 (en)
JP (1) JP7287761B2 (en)
KR (1) KR20200014219A (en)
CN (1) CN110774168B (en)
SG (1) SG10201906617WA (en)
TW (1) TWI819035B (en)

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09314456A (en) * 1996-05-29 1997-12-09 Toshiba Mach Co Ltd Abrasive cloth dressing method and grinding device
US6036583A (en) * 1997-07-11 2000-03-14 Applied Materials, Inc. Conditioner head in a substrate polisher and method
US5899798A (en) * 1997-07-25 1999-05-04 Obsidian Inc. Low profile, low hysteresis force feedback gimbal system for chemical mechanical polishing
JP3630958B2 (en) * 1997-11-19 2005-03-23 キヤノン株式会社 Lens holding device
JP3890188B2 (en) * 1999-09-14 2007-03-07 キヤノン株式会社 Polishing equipment
US6755723B1 (en) * 2000-09-29 2004-06-29 Lam Research Corporation Polishing head assembly
EP1335814A1 (en) * 2000-11-21 2003-08-20 Memc Electronic Materials S.P.A. Semiconductor wafer, polishing apparatus and method
KR100914988B1 (en) * 2001-12-06 2009-09-02 가부시키가이샤 에바라 세이사꾸쇼 Substrate holding device and polishing device
JP2005034959A (en) * 2003-07-16 2005-02-10 Ebara Corp Polishing device and retainer ring
JP5025374B2 (en) * 2007-08-02 2012-09-12 オリンパス株式会社 Holder, polishing method
JP5236515B2 (en) * 2009-01-28 2013-07-17 株式会社荏原製作所 Dressing apparatus, chemical mechanical polishing apparatus and method
JP2011124302A (en) * 2009-12-09 2011-06-23 Lapmaster Sft Corp Low center of gravity airbag type polishing head
JP5927083B2 (en) * 2012-08-28 2016-05-25 株式会社荏原製作所 Dressing process monitoring method and polishing apparatus
JP6592355B2 (en) 2015-01-30 2019-10-16 株式会社荏原製作所 Connecting mechanism and substrate polishing apparatus
CN105856057B (en) * 2015-01-30 2019-06-04 株式会社荏原制作所 Link mechanism, substrate grinding device, rotation center localization method, maximum pressing load determination method and recording medium
JP6721967B2 (en) * 2015-11-17 2020-07-15 株式会社荏原製作所 Buff processing device and substrate processing device

Also Published As

Publication number Publication date
JP7287761B2 (en) 2023-06-06
CN110774168B (en) 2023-07-07
CN110774168A (en) 2020-02-11
US20200039030A1 (en) 2020-02-06
JP2020019081A (en) 2020-02-06
KR20200014219A (en) 2020-02-10
TW202007475A (en) 2020-02-16
TWI819035B (en) 2023-10-21

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SG10201906617WA (en) Coupling mechanism with spherical bearing, method of determining bearing radius of spherical bearing, and substrate polishing apparatus