EP3120379A4 - Abrasive pad and glass substrate abrading method - Google Patents
Abrasive pad and glass substrate abrading method Download PDFInfo
- Publication number
- EP3120379A4 EP3120379A4 EP15764427.9A EP15764427A EP3120379A4 EP 3120379 A4 EP3120379 A4 EP 3120379A4 EP 15764427 A EP15764427 A EP 15764427A EP 3120379 A4 EP3120379 A4 EP 3120379A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- glass substrate
- abrasive pad
- abrading method
- substrate abrading
- abrasive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
- B24B37/245—Pads with fixed abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
- B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D2203/00—Tool surfaces formed with a pattern
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014056538A JP6452295B2 (en) | 2014-03-19 | 2014-03-19 | Polishing pad and glass substrate polishing method |
PCT/US2015/020859 WO2015142774A1 (en) | 2014-03-19 | 2015-03-17 | Abrasive pad and glass substrate abrading method |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3120379A1 EP3120379A1 (en) | 2017-01-25 |
EP3120379A4 true EP3120379A4 (en) | 2017-11-01 |
Family
ID=54145183
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP15764427.9A Withdrawn EP3120379A4 (en) | 2014-03-19 | 2015-03-17 | Abrasive pad and glass substrate abrading method |
Country Status (6)
Country | Link |
---|---|
US (1) | US20170066099A1 (en) |
EP (1) | EP3120379A4 (en) |
JP (1) | JP6452295B2 (en) |
KR (1) | KR20160135269A (en) |
CN (1) | CN106104766A (en) |
WO (1) | WO2015142774A1 (en) |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3517245B1 (en) | 2011-12-30 | 2023-12-13 | Saint-Gobain Ceramics & Plastics Inc. | Shaped abrasive particle and method of forming same |
CN104114327B (en) | 2011-12-30 | 2018-06-05 | 圣戈本陶瓷及塑料股份有限公司 | Composite molding abrasive grains and forming method thereof |
WO2013106602A1 (en) | 2012-01-10 | 2013-07-18 | Saint-Gobain Ceramics & Plastics, Inc. | Abrasive particles having particular shapes and methods of forming such particles |
CA2987793C (en) | 2012-01-10 | 2019-11-05 | Saint-Gobain Ceramics & Plastics, Inc. | Abrasive particles having complex shapes and methods of forming same |
KR101888347B1 (en) | 2012-05-23 | 2018-08-16 | 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 | Shaped abrasive particles and methods of forming same |
BR112014032152B1 (en) | 2012-06-29 | 2022-09-20 | Saint-Gobain Ceramics & Plastics, Inc | ABRASIVE PARTICLES HAVING PARTICULAR FORMATS AND ABRASIVE ARTICLES |
CN104822494B (en) | 2012-10-15 | 2017-11-28 | 圣戈班磨料磨具有限公司 | The method of abrasive particle and this particle of formation with given shape |
CN107685296B (en) | 2013-03-29 | 2020-03-06 | 圣戈班磨料磨具有限公司 | Abrasive particles having a particular shape, methods of forming such particles, and uses thereof |
WO2015048768A1 (en) | 2013-09-30 | 2015-04-02 | Saint-Gobain Ceramics & Plastics, Inc. | Shaped abrasive particles and methods of forming same |
JP6290428B2 (en) | 2013-12-31 | 2018-03-07 | サンーゴバン アブレイシブズ,インコーポレイティド | Abrasive articles containing shaped abrasive particles |
US9771507B2 (en) | 2014-01-31 | 2017-09-26 | Saint-Gobain Ceramics & Plastics, Inc. | Shaped abrasive particle including dopant material and method of forming same |
AU2015247826A1 (en) | 2014-04-14 | 2016-11-10 | Saint-Gobain Ceramics & Plastics, Inc. | Abrasive article including shaped abrasive particles |
BR112016023880A2 (en) | 2014-04-14 | 2017-08-15 | Saint Gobain Ceramics | abrasive article including molded abrasive particles |
WO2015184355A1 (en) | 2014-05-30 | 2015-12-03 | Saint-Gobain Abrasives, Inc. | Method of using an abrasive article including shaped abrasive particles |
US9914864B2 (en) | 2014-12-23 | 2018-03-13 | Saint-Gobain Ceramics & Plastics, Inc. | Shaped abrasive particles and method of forming same |
TWI634200B (en) | 2015-03-31 | 2018-09-01 | 聖高拜磨料有限公司 | Fixed abrasive articles and methods of forming same |
WO2016161157A1 (en) | 2015-03-31 | 2016-10-06 | Saint-Gobain Abrasives, Inc. | Fixed abrasive articles and methods of forming same |
JP2018516767A (en) | 2015-06-11 | 2018-06-28 | サン−ゴバン セラミックス アンド プラスティクス,インコーポレイティド | Abrasive articles containing shaped abrasive particles |
JP6754519B2 (en) * | 2016-02-15 | 2020-09-16 | 国立研究開発法人海洋研究開発機構 | Polishing method |
JP6309161B2 (en) | 2016-03-25 | 2018-04-11 | バンドー化学株式会社 | Abrasive |
EP4071224A3 (en) | 2016-05-10 | 2023-01-04 | Saint-Gobain Ceramics and Plastics, Inc. | Methods of forming abrasive articles |
CN105773458B (en) * | 2016-05-16 | 2017-08-29 | 衢州学院 | A kind of high solids content nanometer spherical silicon dioxide polishing film and preparation method thereof |
EP4349896A2 (en) | 2016-09-29 | 2024-04-10 | Saint-Gobain Abrasives, Inc. | Fixed abrasive articles and methods of forming same |
US10563105B2 (en) | 2017-01-31 | 2020-02-18 | Saint-Gobain Ceramics & Plastics, Inc. | Abrasive article including shaped abrasive particles |
US10759024B2 (en) | 2017-01-31 | 2020-09-01 | Saint-Gobain Ceramics & Plastics, Inc. | Abrasive article including shaped abrasive particles |
US10865148B2 (en) | 2017-06-21 | 2020-12-15 | Saint-Gobain Ceramics & Plastics, Inc. | Particulate materials and methods of forming same |
USD859767S1 (en) * | 2017-07-07 | 2019-09-10 | Inland Diamond Products Company | Flexible abrasive pad |
USD873517S1 (en) * | 2017-07-21 | 2020-01-21 | 3M Innovative Properties Company | Floor scrubbing pad |
USD866892S1 (en) * | 2017-07-28 | 2019-11-12 | 3M Innovative Properties Company | Scouring pad |
KR102608901B1 (en) | 2018-12-24 | 2023-12-01 | 삼성전자주식회사 | Wafer Grinding Wheel |
US20220212314A1 (en) * | 2019-04-15 | 2022-07-07 | Arizona Board Of Regents On Behalf Of The University Of Arizona | Pitch layer pad for smoothing optical surfaces |
JP3224896U (en) * | 2019-11-13 | 2020-01-30 | バンドー化学株式会社 | Polishing pad |
JP2021098250A (en) * | 2019-12-20 | 2021-07-01 | スリーエム イノベイティブ プロパティズ カンパニー | Polishing sheet and polishing method |
KR20220116556A (en) | 2019-12-27 | 2022-08-23 | 세인트-고바인 세라믹스 앤드 플라스틱스, 인크. | Abrasive articles and methods of forming same |
CN113211336B (en) * | 2021-03-31 | 2022-03-08 | 安徽禾臣新材料有限公司 | Polishing pad for polishing corners of electronic display screen and production method thereof |
CN114043380B (en) * | 2021-11-18 | 2022-11-29 | 北京烁科精微电子装备有限公司 | Grinding pad and grinding device with same |
WO2023225356A1 (en) * | 2022-05-20 | 2023-11-23 | 3M Innovative Properties Company | Abrasive assembly with abrasive segments |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5078753A (en) * | 1990-10-09 | 1992-01-07 | Minnesota Mining And Manufacturing Company | Coated abrasive containing erodable agglomerates |
EP1094918A1 (en) * | 1998-02-19 | 2001-05-02 | Minnesota Mining And Manufacturing Company | Abrasive article and method for grinding glass |
WO2011058969A1 (en) * | 2009-11-10 | 2011-05-19 | 昭和電工株式会社 | Method for manufacturing glass substrate for use in magnetic recording medium |
WO2012138705A2 (en) * | 2011-04-05 | 2012-10-11 | Universal Photonics, Inc. | A self-conditioning polishing pad and a method of making the same |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4799939A (en) * | 1987-02-26 | 1989-01-24 | Minnesota Mining And Manufacturing Company | Erodable agglomerates and abrasive products containing the same |
JPS63234037A (en) * | 1987-02-26 | 1988-09-29 | ミネソタ マイニング アンド マニユフアクチユアリング カンパニー | Polishing article and its production |
US6458018B1 (en) * | 1999-04-23 | 2002-10-01 | 3M Innovative Properties Company | Abrasive article suitable for abrading glass and glass ceramic workpieces |
US6322427B1 (en) * | 1999-04-30 | 2001-11-27 | Applied Materials, Inc. | Conditioning fixed abrasive articles |
US6394888B1 (en) * | 1999-05-28 | 2002-05-28 | Saint-Gobain Abrasive Technology Company | Abrasive tools for grinding electronic components |
JP2001225273A (en) * | 2000-02-15 | 2001-08-21 | Xebec Technology Co Ltd | Polishing/grinding material |
ATE302092T1 (en) * | 2000-04-28 | 2005-09-15 | 3M Innovative Properties Co | ABRASIVES AND METHOD FOR GRINDING GLASS |
US8545583B2 (en) * | 2000-11-17 | 2013-10-01 | Wayne O. Duescher | Method of forming a flexible abrasive sheet article |
JP4530611B2 (en) * | 2002-12-06 | 2010-08-25 | 株式会社ノリタケカンパニーリミテド | Resinoid grinding wheel |
US6951504B2 (en) * | 2003-03-20 | 2005-10-04 | 3M Innovative Properties Company | Abrasive article with agglomerates and method of use |
US8002612B2 (en) * | 2004-04-08 | 2011-08-23 | 3M Innovative Properties Company | Attachment system for a sanding tool |
US7618306B2 (en) * | 2005-09-22 | 2009-11-17 | 3M Innovative Properties Company | Conformable abrasive articles and methods of making and using the same |
US8142891B2 (en) * | 2008-12-17 | 2012-03-27 | 3M Innovative Properties Company | Dish-shaped abrasive particles with a recessed surface |
US8142532B2 (en) * | 2008-12-17 | 2012-03-27 | 3M Innovative Properties Company | Shaped abrasive particles with an opening |
TWI613285B (en) * | 2010-09-03 | 2018-02-01 | 聖高拜磨料有限公司 | Bonded abrasive article and method of forming |
JP6188286B2 (en) * | 2012-07-13 | 2017-08-30 | スリーエム イノベイティブ プロパティズ カンパニー | Polishing pad and glass, ceramics, and metal material polishing method |
-
2014
- 2014-03-19 JP JP2014056538A patent/JP6452295B2/en not_active Expired - Fee Related
-
2015
- 2015-03-17 KR KR1020167028467A patent/KR20160135269A/en unknown
- 2015-03-17 EP EP15764427.9A patent/EP3120379A4/en not_active Withdrawn
- 2015-03-17 US US15/123,444 patent/US20170066099A1/en not_active Abandoned
- 2015-03-17 WO PCT/US2015/020859 patent/WO2015142774A1/en active Application Filing
- 2015-03-17 CN CN201580014499.4A patent/CN106104766A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5078753A (en) * | 1990-10-09 | 1992-01-07 | Minnesota Mining And Manufacturing Company | Coated abrasive containing erodable agglomerates |
EP1094918A1 (en) * | 1998-02-19 | 2001-05-02 | Minnesota Mining And Manufacturing Company | Abrasive article and method for grinding glass |
WO2011058969A1 (en) * | 2009-11-10 | 2011-05-19 | 昭和電工株式会社 | Method for manufacturing glass substrate for use in magnetic recording medium |
WO2012138705A2 (en) * | 2011-04-05 | 2012-10-11 | Universal Photonics, Inc. | A self-conditioning polishing pad and a method of making the same |
Non-Patent Citations (1)
Title |
---|
See also references of WO2015142774A1 * |
Also Published As
Publication number | Publication date |
---|---|
KR20160135269A (en) | 2016-11-25 |
EP3120379A1 (en) | 2017-01-25 |
CN106104766A (en) | 2016-11-09 |
JP2015178155A (en) | 2015-10-08 |
US20170066099A1 (en) | 2017-03-09 |
WO2015142774A1 (en) | 2015-09-24 |
JP6452295B2 (en) | 2019-01-16 |
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