JP6754519B2 - Polishing method - Google Patents
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- JP6754519B2 JP6754519B2 JP2016026048A JP2016026048A JP6754519B2 JP 6754519 B2 JP6754519 B2 JP 6754519B2 JP 2016026048 A JP2016026048 A JP 2016026048A JP 2016026048 A JP2016026048 A JP 2016026048A JP 6754519 B2 JP6754519 B2 JP 6754519B2
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- 238000005498 polishing Methods 0.000 title claims description 268
- 238000000034 method Methods 0.000 title claims description 29
- 238000007665 sagging Methods 0.000 claims description 22
- 239000006061 abrasive grain Substances 0.000 claims description 17
- 238000007517 polishing process Methods 0.000 claims description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- 239000010935 stainless steel Substances 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 235000019589 hardness Nutrition 0.000 description 39
- 239000000463 material Substances 0.000 description 19
- 239000000314 lubricant Substances 0.000 description 10
- 230000001050 lubricating effect Effects 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000004458 analytical method Methods 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 229910052500 inorganic mineral Inorganic materials 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000011707 mineral Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000005389 magnetism Effects 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 239000002734 clay mineral Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 239000010450 olivine Substances 0.000 description 2
- 229910052609 olivine Inorganic materials 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000011435 rock Substances 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 239000005335 volcanic glass Substances 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 150000002500 ions Chemical group 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 229910052622 kaolinite Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/12—Lapping plates for working plane surfaces
- B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/12—Lapping plates for working plane surfaces
- B24B37/14—Lapping plates for working plane surfaces characterised by the composition or properties of the plate materials
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
本発明は研磨方法に関し、特に片面研磨試料を仕上研磨する際、耐摩耗性が大きく異なる素材からなる複合材料を研磨する際に用いて好適な技術に関する。 The present invention relates to a polishing method , and particularly to a technique suitable for use in finish polishing a single-sided polishing sample, or when polishing a composite material made of materials having significantly different abrasion resistance.
従来、定盤の上に研磨フィルムを設けた研磨装置としては、定盤上に弾性体を介して研磨フィルムを固定したもの、および、定盤上に直接研磨フィルムを固定した研磨装置が知られている。この公知の研磨装置としては、例えば、特許文献１に記載されるように、研磨定盤の上に粗加工用研磨フィルムと仕上げ研磨用研磨フィルムの２種類の研磨フィルムを搭載したものであり、必要に応じて、研磨定盤と研磨フィルムとの間に弾性体を装着させるものである。 Conventionally, as a polishing device in which a polishing film is provided on a surface plate, a polishing device in which the polishing film is fixed on the surface plate via an elastic body and a polishing device in which the polishing film is directly fixed on the surface plate are known. ing. As this known polishing apparatus, for example, as described in Patent Document 1, two types of polishing films, a polishing film for roughing and a polishing film for finish polishing, are mounted on a polishing surface plate. If necessary, an elastic body is mounted between the polishing surface plate and the polishing film.
研磨定盤と研磨フィルムとの間に弾性体を装着した場合、あるいは、遊離砥粒を散布した研磨布を用いた場合には、遊離砥粒が介在することもあって、研磨試料の軟らかい部位が過剰に研磨され、掘られてしまうとともに、軟らかい部位に囲まれた硬い部位の周縁部も過剰に研磨されるフチだれ現象を生じるという問題があった。 When an elastic body is mounted between the polishing surface plate and the polishing film, or when a polishing cloth on which free abrasive grains are sprayed is used, the free abrasive grains may intervene and the soft part of the polishing sample is used. Is excessively polished and dug, and there is a problem that a border dripping phenomenon occurs in which the peripheral edge of a hard portion surrounded by a soft portion is also excessively polished.
また、平らな研磨定盤に固定砥粒フィルムを装着した場合には、潤滑材、例えば水の膜が厚いと、固定砥粒フィルムと研磨試料との間に水が介在してまったく磨けないか、あるいは、研磨試料の研磨面が固定砥粒フィルムに吸盤のように吸い付き磨きにくい、という問題があった。さらに、削りくずが研磨試料の研磨面と固定砥粒フィルムとの間に入り込んで研磨試料の研磨面を傷つけるという問題もあった。 In addition, when the fixed abrasive grain film is mounted on a flat polishing surface plate, if the lubricant, for example, a film of water is thick, water may intervene between the fixed abrasive grain film and the polishing sample and polish at all. Alternatively, there is a problem that the polished surface of the polished sample sticks to the fixed abrasive grain film like a suction cup and is difficult to polish. Further, there is also a problem that shavings enter between the polishing surface of the polishing sample and the fixed abrasive grain film and damage the polishing surface of the polishing sample.
これらの問題を解決する技術として、特許文献２に記載されるように、平面ガラス板に平行な数ミリ幅の溝を幾つも形成した仕上げ研磨用定盤が知られている。 As a technique for solving these problems, as described in Patent Document 2, a surface plate for finish polishing in which a number of grooves having a width of several millimeters parallel to a flat glass plate are formed is known.
しかし、上記の従来の技術である研磨ラッピングフィルムは、材料を平滑に研磨するのに優れているフィルムであり広く流通しているが、研磨ラッピングフィルムを用いて平坦な研磨試料を作成する場合、研磨ラッピングフィルムを平面性が高い硬い板（ガラス板）の上に置き、水などの潤滑液を撒きながら手動で試料を研磨するため、砥粒度が小さくなるほど研磨する試料とフィルムが密着し、抵抗が大きくなり、研磨試料が研磨フィルム上をなめらかに滑らなくなりきれいに磨けない場合があるという問題が解決されていない上、この問題は、研磨試料の研磨面が大きくなるにしたがって、顕著化している。
同時に、削り屑により、研磨試料の研磨面に多数の傷がつく場合があるという問題が解決されていない上、この問題は、研磨試料の研磨面が大きくなるにしたがって、顕著化してしまう。
However, the above-mentioned polishing wrapping film, which is a conventional technique, is an excellent film for smoothly polishing a material and is widely distributed. However, when a flat polishing sample is prepared by using a polishing wrapping film, Since the polishing wrapping film is placed on a hard plate (glass plate) with high flatness and the sample is manually polished while sprinkling a lubricating liquid such as water, the smaller the abrasive grain size, the closer the sample to be polished and the film, and the resistance The problem that the polished sample does not slide smoothly on the polishing film and may not be polished cleanly has not been solved, and this problem becomes more remarkable as the polished surface of the polished sample becomes larger.
At the same time, the problem that shavings may cause a large number of scratches on the polished surface of the polished sample has not been solved, and this problem becomes more prominent as the polished surface of the polished sample becomes larger.
さらに、特許文献２に記載の技術では、手動による研磨のため、試料を鏡面仕上げにするのに長時間の作業を必要とするため、これを短縮したいという要求が生じており、この問題は、研磨試料の研磨面が大きくなるにしたがって、顕著化していた。
また、一定の方向（縦）の研磨であるため、試料表面を均等に磨きあげるのに熟練を有する。このため、作業者の熟練度合いによって研磨状態が異なってしまう場合があるという問題があった。この問題も、研磨試料の研磨面が大きくなるにしたがって、さらに顕著化してしまう。
Further, in the technique described in Patent Document 2, since manual polishing requires a long time work to make a sample mirror-finished, there is a demand for shortening this, and this problem is solved. It became more prominent as the polished surface of the polished sample became larger.
In addition, since the polishing is performed in a certain direction (vertical direction), he has skill in polishing the sample surface evenly. For this reason, there is a problem that the polishing state may differ depending on the skill level of the operator. This problem also becomes more prominent as the polished surface of the polished sample becomes larger.
また、研磨試料の研磨面をＳＩＭＳ（二次イオン質量分析法）によって分析する場合には、研磨試料の軟らかい部位が過剰に研磨され掘られてしまうとともに、軟らかい部位に囲まれた硬い部位の周縁部も過剰に研磨されるフチだれ現象を生じた場合、分析面（研磨面）の平坦度が足りず、分析が上手くおこなえない場合があるという問題があった。この問題も、研磨試料の研磨面が大きくなるにしたがって、処理時間の増大に伴ってさらに顕著化していた。 Further, when the polished surface of the polished sample is analyzed by SIMS (secondary ion mass analysis method), the soft part of the polished sample is excessively polished and dug, and the peripheral edge of the hard part surrounded by the soft part is excavated. When the edge dripping phenomenon occurs in which the part is also excessively polished, there is a problem that the flatness of the analysis surface (polished surface) is insufficient and the analysis may not be performed well. This problem also became more prominent as the processing time increased as the polished surface of the polished sample became larger.
また、研磨試料が小さいものであると研磨による平坦化処理に係る時間も短いが、研磨試料が大きくなると、研磨による平坦化処理に係る時間が長くなるため、これを短縮したいという要求がある。さらに、研磨試料が大きくなると、研磨による平坦化処理が難しくなり、試料作成の効率および正確性が作業者の熟練度合いに依存してしまうため、これを作業者に因らないようにしたいという要求が生じていた。 Further, if the polishing sample is small, the time required for the flattening treatment by polishing is short, but if the polishing sample is large, the time required for the flattening treatment by polishing becomes long, and there is a demand for shortening this. Furthermore, as the size of the polished sample becomes large, the flattening process by polishing becomes difficult, and the efficiency and accuracy of sample preparation depend on the skill level of the operator. Therefore, there is a demand that this should not depend on the operator. Was occurring.
本発明は、上記の事情に鑑みてなされたもので、以下の目的を達成しようとするものである。
１．研磨試料でのダレ防止。
２．硬度差による領域ごとの研磨不均等防止。
３．研磨試料の貼りつき防止。
４．研磨試料面での傷発生防止。
５．研磨フィルムの破損防止。
６．研磨試料の大きさによる対応可能性実現。
７．作業者の熟練度に因らない研磨試料作成実現。
The present invention has been made in view of the above circumstances, and an object of the present invention is to achieve the following objects.
1. 1. Prevents sagging on polished samples.
2. 2. Prevents uneven polishing in each area due to the difference in hardness.
3. 3. Prevents sticking of polished samples.
4. Prevents scratches on the surface of the polished sample.
5. Prevents damage to the polishing film.
6. Achieves the possibility of handling depending on the size of the polished sample.
7. Realization of polishing sample creation regardless of the skill level of the operator.
本発明の研磨方法は、研磨試料面に対して平面性の高い研磨をするための柔軟な研磨フィルムを用いた仕上研磨用定盤において、
前記柔軟な研磨フィルムを搭載する平面形状の板体からなる定盤の研磨面には、複数の島状の島状凸部と該島状凸部の間に連続した溝状となる溝状凹部とが設けられ、
前記島状凸部が平面視して円形、楕円形または角数が６以上の多角形状である仕上研磨用定盤における前記定盤を、前記研磨面と直交する回転軸線に対して回転させる回転手段を有する仕上研磨装置を用いて研磨する方法であって、
平面定盤と研磨砥粒とを用いて前記研磨試料に縁ダレを発生させる第１工程と、
前記第１工程後に、前記仕上研磨装置と研磨フィルムとを用いて前記縁ダレをなくして前記研磨試料の研磨面を平坦面とする研磨をおこなう第２工程と、を有することにより上記課題を解決した。
本発明の研磨方法は、前記島状凸部の径寸法が前記溝状凹部の幅寸法の１．５〜２．５倍の範囲に設定されることができる。
本発明の研磨方法は、近接する前記島状凸部間の離間距離が、いずれも前記溝状凹部の幅寸法と等しくなるように平面配置されることができる。
本発明の研磨方法は、前記回転手段が前記回転軸線まわりに回転する回転板を有し、該回転板に前記定盤を保持する保持手段を有していることができる。
本発明の研磨方法は、前記定盤が磁性を有するステンレス製とされ、前記保持手段が、前記回転板と前記定盤とを磁着可能とされていることが好ましい。
本発明の研磨方法は、上記のいずれか記載の仕上研磨装置を用いて研磨する方法であって、
前記研磨砥粒がアルミナペーストとされる手段を採用することができる。
The polishing method of the present invention is used in a surface plate for finish polishing using a flexible polishing film for polishing a surface of a polishing sample with high flatness.
The polished surface of a surface plate made of a flat plate on which the flexible polishing film is mounted has a plurality of island-shaped island-shaped convex portions and groove-shaped concave portions that form a continuous groove between the island-shaped convex portions. And are provided,
Rotation of rotating the surface plate in a finish polishing surface plate in which the island-shaped convex portion is circular, elliptical, or polygonal with 6 or more angles in a plan view with respect to a rotation axis orthogonal to the polishing surface. It is a method of polishing using a finishing polishing device having means.
The first step of generating edge sagging on the polished sample using a flat surface plate and abrasive grains, and
After the first step, the above problem is solved by having a second step of using the finishing polishing device and a polishing film to eliminate the edge sagging and to make the polished surface of the polishing sample a flat surface. did.
In the polishing method of the present invention, the diameter dimension of the island-shaped convex portion can be set in the range of 1.5 to 2.5 times the width dimension of the groove-shaped concave portion.
In the polishing method of the present invention, the polishing methods can be arranged in a plane so that the distance between the adjacent island-shaped convex portions is equal to the width dimension of the groove-shaped concave portions .
In the polishing method of the present invention, the rotating means may have a rotating plate that rotates around the rotating axis, and the rotating plate may have a holding means for holding the surface plate.
In the polishing method of the present invention, it is preferable that the surface plate is made of magnetic stainless steel and the holding means is capable of magnetizing the rotating plate and the surface plate.
The polishing method of the present invention is a method of polishing using the finishing polishing apparatus according to any one of the above .
Means in which the abrasive grains are made of alumina paste can be adopted.
本発明の研磨方法は、研磨試料面に対して平面性の高い研磨をするための柔軟な研磨フィルムを用いた仕上研磨用定盤において、
前記柔軟な研磨フィルムを搭載する平面形状の板体からなる定盤の研磨面には、複数の島状の島状凸部と該島状凸部の間に連続した溝状となる溝状凹部とが設けられることにより、一方向ではなく多方向に延在する溝状凹部から効率的に排水効果を呈することができるため、潤滑材（例えば、水など）の排水容易性を向上することが可能となり、研磨試料の研磨面と研磨フィルムとが容易に接触し、研磨効率を向上させることができる。また、研磨試料から発生した削り屑を定盤の溝状凹部上の研磨フィルムの凹部へ容易に排出することにより、研磨面を傷つける頻度が著しく低下する。
また、島状凸部が溝状凹部で分割されていることで、研磨がおこなわれる領域に対応する島状凸部の縁部が一方向ではなく多方向に延在することになり、研磨試料面が硬度の異なる領域を有するような場合でも、ダレの発生を防止することが可能となる。
同時に、島状凸部が一方向ではなく多方向に延在する溝状凹部で分割されていることにより、研磨試料の研磨面と研磨フィルムとが相対的に移動して研磨をおこなう際に、研磨試料の研磨面と研磨フィルムとが密着してしまい、研磨がおこなえなくなることを防止できる。
また、潤滑材の排水が溝状凹部によって容易におこなわれることで、研磨試料の研磨面と研磨フィルムとが容易に接触することができ、研磨効率を向上させて研磨試料の研磨面が大きくなった場合でも処理時間を短縮することができる。
また、前記島状凸部が平面視して多角形状とされることにより、島状凸部が一方向ではなく多方向に延在する溝状凹部で分割されることになり、潤滑剤の排水と、研磨試料の貼りつき防止と、ダレ防止を効果的に実現することができる。
本発明の研磨方法は、上記のいずれか記載の仕上研磨用定盤における前記定盤を、前記研磨面と直交する回転軸線に対して回転させる回転手段を有することにより、研磨試料の研磨面と研磨フィルムとの接触する状態を回転により変化させて研磨をおこなうことができるため、回転を利用して潤滑剤の排水容易性をより向上し、研磨試料の貼りつき防止と、ダレ防止を効果的に実現することができる。
本発明の研磨方法は、上記のいずれか記載の仕上研磨装置を用いて研磨する方法であって、
平面定盤と研磨砥粒とを用いて前記研磨試料に縁ダレを発生させる第１工程と、
前記第１工程後に、前記仕上研磨装置と研磨フィルムとを用いて前記縁ダレをなくして前記研磨試料の研磨面を平坦面とする研磨をおこなう第２工程と、を有する手段を採用することができ、これにより、第１工程によって、研磨フィルムで削る量（表面積）を小さくすることができるため、平坦化にかかる作業時間をより短縮して、迅速に研磨をおこなうことが可能となる。
また研磨フィルムと研磨試料との間にもさらなる隙間を形成することができるので、削り屑をより逃げやすくするとともに、外部に排出しやすくして、試料表面を傷つける率を低減することができる。
The polishing method of the present invention is used in a surface plate for finish polishing using a flexible polishing film for polishing a surface of a polishing sample with high flatness.
The polished surface of a surface plate made of a flat plate on which the flexible polishing film is mounted has a plurality of island-shaped island-shaped convex portions and groove-shaped concave portions that form a continuous groove between the island-shaped convex portions. By providing and, the drainage effect can be efficiently exhibited from the groove-shaped recesses extending in multiple directions instead of one direction, so that the ease of drainage of the lubricating material (for example, water) can be improved. This makes it possible to easily contact the polished surface of the polished sample with the polishing film, and the polishing efficiency can be improved. Further, since the shavings generated from the polishing sample are easily discharged to the recess of the polishing film on the groove-shaped recess of the surface plate, the frequency of damaging the polished surface is remarkably reduced.
Further, since the island-shaped convex portion is divided by the groove-shaped concave portion, the edge portion of the island-shaped convex portion corresponding to the region to be polished extends in multiple directions instead of one direction, and the polishing sample. Even when the surfaces have regions with different hardness, it is possible to prevent the occurrence of sagging.
At the same time, since the island-shaped convex portion is divided by the groove-shaped concave portion extending in multiple directions instead of one direction, the polishing surface of the polishing sample and the polishing film move relatively to perform polishing. It is possible to prevent the polishing surface of the polishing sample and the polishing film from coming into close contact with each other and prevent polishing from being performed.
Further, since the lubricating material is easily drained by the groove-shaped recesses, the polished surface of the polishing sample and the polishing film can be easily brought into contact with each other, improving the polishing efficiency and increasing the polishing surface of the polishing sample. Even in this case, the processing time can be shortened.
Further, since the island-shaped convex portion has a polygonal shape in a plan view, the island-shaped convex portion is divided into groove-shaped concave portions extending in multiple directions instead of one direction, and the lubricant is drained. Therefore, it is possible to effectively prevent the polishing sample from sticking and sagging.
The polishing method of the present invention has a rotating means for rotating the surface plate of the finish polishing surface plate according to any one of the above with respect to a rotation axis orthogonal to the polishing surface, thereby making the surface plate of the polishing sample and the polishing surface of the polishing sample. Since the state of contact with the polishing film can be changed by rotation to perform polishing, the ease of draining the lubricant is further improved by using rotation, and it is effective to prevent the polishing sample from sticking and sagging. Can be realized.
The polishing method of the present invention is a method of polishing using the finishing polishing apparatus according to any one of the above.
The first step of generating edge sagging on the polished sample using a flat surface plate and abrasive grains, and
After the first step, it is possible to employ a means having a second step of using the finishing polishing device and a polishing film to eliminate the edge sagging and to make the polished surface of the polishing sample a flat surface. As a result, the amount (surface surface) to be ground by the polishing film can be reduced by the first step, so that the working time required for flattening can be further shortened, and polishing can be performed quickly.
Further, since a further gap can be formed between the polishing film and the polishing sample, the shavings can be more easily escaped and discharged to the outside, and the rate of damaging the sample surface can be reduced.
本発明の研磨方法は、前記島状凸部の径寸法が前記溝条凹部の幅寸法の１．５〜２．５倍の範囲に設定されることにより、潤滑剤の排水と、研磨試料の貼りつき防止と、ダレ防止を効果的に実現することができる。 In the polishing method of the present invention, the diameter dimension of the island-shaped convex portion is set in the range of 1.5 to 2.5 times the width dimension of the groove recess, thereby draining the lubricant and collecting the polishing sample. It is possible to effectively prevent sticking and sagging.
本発明の研磨方法は、近接する前記島状凸部間の離間距離が、いずれも前記溝条凹部の幅寸法と等しくなるように平面配置されることにより、潤滑剤の排水と、研磨試料の貼りつき防止と、ダレ防止を効果的に実現することができる。 In the polishing method of the present invention, the distance between the adjacent island-shaped convex portions is arranged in a plane so as to be equal to the width dimension of the groove recesses, whereby the drainage of the lubricant and the polishing sample are arranged. It is possible to effectively prevent sticking and sagging.
本発明の研磨方法は、前記回転手段が前記回転軸線まわりに回転する回転板を有し、該回転板に前記定盤を保持する保持手段を有していることにより、潤滑剤の排水と、研磨試料の貼りつき防止と、ダレ防止を効果的に実現することて、研磨処理を作業者の熟練度に依存せずにおこなうことが可能となる。 In the polishing method of the present invention, the rotating means has a rotating plate that rotates around the rotating axis, and the rotating plate has a holding means for holding the surface plate, whereby drainage of the lubricant and drainage of the lubricant are performed. By effectively preventing the polishing sample from sticking and sagging, it is possible to perform the polishing process without depending on the skill level of the operator.
本発明の研磨方法は、前記定盤が磁性を有するステンレス製とされ、前記保持手段が、前記回転板と前記定盤とを磁着可能とされていることにより、研磨フィルムの交換容易性と、研磨フィルムの定盤への密着性を向上することができる。 In the polishing method of the present invention, the surface plate is made of magnetic stainless steel, and the holding means is capable of magnetizing the rotating plate and the surface plate, so that the polishing film can be easily replaced. , The adhesion of the polishing film to the surface plate can be improved.
本発明の研磨方法は、上記のいずれか記載の仕上研磨装置を用いて研磨する方法であって、
前記研磨砥粒がアルミナペーストとされる手段を採用することができ、これにより、第１工程によって、研磨フィルムで削る量（表面積）を小さくすることができるため、平坦化にかかる作業時間をより短縮して、迅速に研磨をおこなうことが可能となる。
また研磨フィルムと研磨試料との間にもさらなる隙間を形成することができるので、削り屑をより逃げやすくするとともに、外部に排出しやすくして、試料表面を傷つける率を低減することができる。
The polishing method of the present invention is a method of polishing using the finishing polishing apparatus according to any one of the above .
A means in which the polishing abrasive grains are made into an alumina paste can be adopted, whereby the amount (surface area) of the polishing film to be ground can be reduced by the first step, so that the working time required for flattening can be further reduced. It can be shortened and polishing can be performed quickly.
Further, since a further gap can be formed between the polishing film and the polishing sample, the shavings can be more easily escaped and discharged to the outside, and the rate of damaging the sample surface can be reduced.
本発明によれば、研磨試料でのダレ発生を防止し、研磨試料の研磨面に有する硬度差による領域ごとの研磨不均等の発生を防止し、研磨試料の研磨フィルムへの貼りつき発生を防止し、削り屑に起因する研磨試料面での傷発生を防止し、貼りつきや他の原因による研磨フィルムの破損を防止し、研磨試料の大きさによる対応可能性を実現し、作業者の熟練度に因らない研磨試料作成実現することができるという効果を奏することが可能となる。 According to the present invention, it is possible to prevent the occurrence of sagging in the polished sample, prevent the occurrence of uneven polishing in each region due to the difference in hardness on the polished surface of the polished sample, and prevent the occurrence of sticking of the polished sample to the polishing film. However, it prevents scratches on the surface of the polished sample due to shavings, prevents sticking and damage to the polishing film due to other causes, realizes responsiveness depending on the size of the polished sample, and is skilled by workers. It is possible to achieve the effect that it is possible to prepare a polished sample regardless of the degree.
以下、本発明に係る仕上研磨用定盤、仕上研磨装置の第１実施形態を、図面に基づいて説明する。本発明は、これに限定されて解釈されるものではなく、本発明の範囲を逸脱しない限りにおいて、当業者の知識に基づいて、種々の変更、修正、改良を加えうるものである。
図１は、本実施形態における仕上研磨用定盤を示す平面図であり、図２は、本実施形態における仕上研磨用定盤を示す拡大断面図であり、図３は、本実施形態における仕上研磨装置を示す模式正面図であり、図において、符号１は、仕上研磨用定盤である。
Hereinafter, the first embodiment of the finish polishing surface plate and the finish polishing apparatus according to the present invention will be described with reference to the drawings. The present invention is not construed as being limited to this, and various changes, modifications, and improvements can be made based on the knowledge of those skilled in the art without departing from the scope of the present invention.
FIG. 1 is a plan view showing a surface plate for finish polishing in the present embodiment, FIG. 2 is an enlarged cross-sectional view showing a surface plate for finish polishing in the present embodiment, and FIG. 3 is a finish in the present embodiment. It is a schematic front view which shows the polishing apparatus, and in the figure, reference numeral 1 is a surface plate for finish polishing.
本実施形態に係る仕上研磨用定盤１は、硬度の異なる複合材料を研磨して試料薄片とする際に仕様されるものであり、図１，図２に示すように、例えば、板体２の表面に、複数の島状の島状凸部５と、島状凸部５の間に連続した溝状となる溝状凹部４とが設けられている。 The finish polishing surface plate 1 according to the present embodiment is specified when composite materials having different hardness are polished into sample flakes, and as shown in FIGS. 1 and 2, for example, a plate body 2 A plurality of island-shaped island-shaped convex portions 5 and groove-shaped concave portions 4 having a continuous groove shape between the island-shaped convex portions 5 are provided on the surface of the above.
板体２としては、例えば、公知の磁性を有する金属板などが用いられ、好ましくは、磁性を有するステンレス板からなることができる。板体２としては、φ１００〜３００ｍｍ、好ましくはφ１５０ｍｍ程度（±１５ｍｍ）または２００ｍｍ程度（±２０ｍｍ）、厚さ１．５〜３ｍｍ、好ましくは２ｍｍ程度（±０．２ｍｍ）の平円盤形状を有するものとされる。また、ＳＵＳ２００番台のものを適用することができる。 As the plate body 2, for example, a known metal plate having magnetism or the like is used, and preferably, it can be made of a stainless steel plate having magnetism. The plate body 2 has a flat disk shape of about φ100 to 300 mm, preferably about φ150 mm (± 15 mm) or about 200 mm (± 20 mm), and a thickness of about 1.5 to 3 mm, preferably about 2 mm (± 0.2 mm). It is supposed to be. Further, those in the SUS200 series can be applied.
島状凸部５は、図１，図２に示すように、平面視六角形とされており、個々の島状凸部５が、最密状態となる位置関係となるように互いに離間して配置されている。
島状凸部５の径寸法Ｔ１は、研磨試料８における研磨面の大きさに対応して設定することができるが、研磨試料８の研磨試料面径寸法に対して、１／２〜３／２の範囲に設定される。具体的には、島状凸部５の径寸法Ｔ１は、８ｍｍ〜２０ｍｍの範囲である１２ｍｍ程度（±１．２ｍｍ）に設定されることができる。なお、島状凸部５の径寸法Ｔ１とは、島状凸部５の対向する辺と辺との距離とされる。
As shown in FIGS. 1 and 2, the island-shaped convex portions 5 are hexagonal in a plan view, and the individual island-shaped convex portions 5 are separated from each other so as to be in the closest positional relationship. Have been placed.
The diameter dimension T1 of the island-shaped convex portion 5 can be set according to the size of the polishing surface in the polishing sample 8, but is 1/2 to 3/3/3/3 of the polishing sample surface diameter dimension of the polishing sample 8. It is set in the range of 2. Specifically, the diameter dimension T1 of the island-shaped convex portion 5 can be set to about 12 mm (± 1.2 mm), which is in the range of 8 mm to 20 mm. The diameter dimension T1 of the island-shaped convex portion 5 is the distance between the opposite sides of the island-shaped convex portion 5.
隣接する島状凸部５の離間距離は互いに等しくなるように設定されている。なお、板体２の縁部位置においては島状凸部５の輪郭が六角形ではなくなるが、隣接する島状凸部５の離間距離が等しくなるように形成されていればよい。 The separation distances of the adjacent island-shaped convex portions 5 are set to be equal to each other. Although the contour of the island-shaped convex portion 5 is not hexagonal at the edge position of the plate body 2, it is sufficient that the island-shaped convex portions 5 are formed so that the distances between the adjacent island-shaped convex portions 5 are equal.
島状凸部５の平面輪郭として本実施形態においては六角形としたが、平面に最密状態で配置できるものであればこれに限られるものではなく、円形、楕円形、あるいは、角数が6より大きい多角形等を採用することもできる。この場合、後述する溝状凹部４の幅寸法は場所によって不均等になるが、島状凸部５の配置状態が六角形のときと同じように維持されていればよい。 The planar contour of the island-shaped convex portion 5 is hexagonal in the present embodiment, but it is not limited to this as long as it can be arranged in the most dense state on the plane, and the shape is circular, elliptical, or the number of angles. Polygons larger than 6 can also be adopted. In this case, the width dimension of the groove-shaped concave portion 4 described later becomes uneven depending on the location, but the arrangement state of the island-shaped convex portion 5 may be maintained in the same manner as in the case of a hexagon.
島状凸部５の輪郭位置において、その端部は、溝状凹部４を研削により形成した状態、すなわち、島状凸部５あるいは溝状凹部４の側面が板体２主面の法線方向に等しくなるように切り立った状態に形成される。 At the contour position of the island-shaped convex portion 5, the end portion thereof is in a state where the groove-shaped concave portion 4 is formed by grinding, that is, the side surface of the island-shaped convex portion 5 or the groove-shaped concave portion 4 is in the normal direction of the main surface of the plate body 2. It is formed in a steep state so as to be equal to.
溝状凹部４は、図１，図２に示すように、隣接する島状凸部５と島状凸部５との間に形成され、溝条凹部４の幅寸法Ｔ２が、島状凸部５間の離間距離と等しくなるように設けられている。溝条凹部４の幅寸法Ｔ２は、板体２の全面で等しくなるように設定され、島状凸部５の径寸法Ｔ１の半分程度と等しくなるように設定されている。具体的には、溝条凹部４の幅寸法Ｔ２は、４ｍｍ〜１０ｍｍの範囲である６ｍｍ程度（±０．６ｍｍ）に設定されることができる。 As shown in FIGS. 1 and 2, the groove-shaped concave portion 4 is formed between the adjacent island-shaped convex portion 5 and the island-shaped convex portion 5, and the width dimension T2 of the groove-shaped concave portion 4 is the island-shaped convex portion. It is provided so as to be equal to the separation distance between the five. The width dimension T2 of the groove recess 4 is set to be equal to the entire surface of the plate body 2, and is set to be equal to about half of the diameter dimension T1 of the island-shaped convex portion 5. Specifically, the width dimension T2 of the groove recess 4 can be set to about 6 mm (± 0.6 mm), which is in the range of 4 mm to 10 mm.
また、溝条凹部４は、島状凸部５の頂部から深さ寸法が５０〜３００μｍの範囲、好ましくは、１００〜２００μｍ程度（±１０μｍ）となるように彫り込まれている。溝状凹部４は、隣接する島状凸部５と島状凸部５との間に延在するとともに、すべての溝状凹部４が板体２表面で連続して接続した状態とされている。 Further, the groove recess 4 is engraved so that the depth dimension from the top of the island-shaped convex portion 5 is in the range of 50 to 300 μm, preferably about 100 to 200 μm (± 10 μm). The groove-shaped recess 4 extends between the adjacent island-shaped convex portion 5 and the island-shaped convex portion 5, and all the groove-shaped recesses 4 are continuously connected on the surface of the plate body 2. ..
溝状凹部４は、金属からなる板体２の表面にエッチング、研削、切削等の公知の方法によって形成されることができる。 The groove-shaped recess 4 can be formed on the surface of the plate body 2 made of metal by a known method such as etching, grinding, or cutting.
溝状凹部４と島状凸部５との境目の角部６は、溝状凹部４の深さの半分の曲率半径と同程度に角を丸めることもできる。 The corner portion 6 at the boundary between the groove-shaped concave portion 4 and the island-shaped convex portion 5 can be rounded to the same extent as the radius of curvature of half the depth of the groove-shaped concave portion 4.
本実施形態における仕上研磨用定盤１に搭載される研磨フィルム７については、特段説明しないが、例えば、公知の固定砥粒フィルムが用いられ、砥粒径が０．３μｍ〜３μｍ程度の仕上げ用途のものとされる。 The polishing film 7 mounted on the finish polishing surface plate 1 in the present embodiment will not be particularly described, but for example, a known fixed abrasive grain film is used, and a finishing application having an abrasive particle size of about 0.3 μm to 3 μm is used. It is supposed to be.
研磨試料８は、研磨試料面が硬度の異なる領域を有し、この研磨試料面における高硬度領域と低硬度領域とのモース硬度の差が３以上であることができる。研磨試料面に硬度差があると、ダレが発生しやすいが、本実施形態の仕上研磨用定盤１では、このような研磨試料であっても、好適に研磨をおこなうことができる。
また、高硬度領域として、モース硬度４〜８程度とされ、ガラス、鉱物、金属等などを含むことができ、低硬度領域として、樹脂より柔らかい粘度鉱物などを含むことができる。低硬度領域として、モース硬度１〜３程度とされインジウムを挙げることができる。
研磨試料としては、例えば、径寸法２５ｍｍ程度の樹脂製円筒基材の表面に岩石等の研磨試料を複数埋込んだものとすることができる。
The polished sample 8 has regions having different hardness on the surface of the polished sample, and the difference in Mohs hardness between the high hardness region and the low hardness region on the polished sample surface can be 3 or more. If there is a difference in hardness on the surface of the polished sample, sagging is likely to occur, but the surface plate 1 for finish polishing of the present embodiment can suitably polish even such a polished sample.
Further, the high hardness region has a Mohs hardness of about 4 to 8, and can include glass, minerals, metals and the like, and the low hardness region can include viscous minerals softer than the resin. As a low hardness region, indium having a Mohs hardness of about 1 to 3 can be mentioned.
As the polishing sample, for example, a plurality of polishing samples such as rocks may be embedded in the surface of a resin cylindrical base material having a diameter of about 25 mm.
本実施形態における仕上研磨装置１０は、図３に示すように、仕上研磨用定盤１を、研磨面となる主面と直交する回転軸線Ｃに対して回転させる回転手段として、回転軸線Ｃまわりに回転する回転板１１と、回転板１１を回転させるモータ等の駆動源１２とを有し、さらに、回転板１１に仕上研磨用定盤１を保持する保持手段として、回転板１１と仕上研磨用定盤１とを磁着可能とする磁着部１３と、回転板１１上側位置より、例えば水とされる潤滑材９を研磨面に供給可能な供給手段１４と、を有している。 As shown in FIG. 3, the finish polishing apparatus 10 in the present embodiment rotates the surface plate 1 for finish polishing around the rotation axis C as a rotation means for rotating the surface plate 1 for polishing with respect to the rotation axis C orthogonal to the main surface serving as the polishing surface. A rotary plate 11 and a drive source 12 such as a motor for rotating the rotary plate 11 are provided, and as a holding means for holding the finish polishing surface plate 1 on the rotary plate 11, the rotary plate 11 and the finish polishing are performed. It has a magnetized portion 13 capable of magnetizing the surface plate 1 and a supply means 14 capable of supplying, for example, a lubricant 9 as water to the polished surface from a position above the rotating plate 11.
回転板１１は、図３に示すように、仕上研磨用定盤１と同程度の径寸法、あるいは、仕上研磨用定盤１よりも大きな円盤とされ、その上面が平面とされて磁着部１３が埋め込まれている。回転板１１は、回転軸１１ａを介して駆動源１２に接続され、回転軸１１ａは回転板１１下面の中心位置に立設されている。
磁着部１３は、図３に示すように、回転板１１の全面に均一の厚さとして設けられて、その上面が平面とされた異方性ゴム磁石シートとされるか、回転板１１の上面と面一とされて磁着のオンオフを切り替えることの可能な電磁石とすることもできる。
As shown in FIG. 3, the rotating plate 11 is a disk having the same diameter as the surface plate 1 for finish polishing or larger than the surface plate 1 for finish polishing, and the upper surface thereof is flat and the magnetized portion. 13 is embedded. The rotary plate 11 is connected to the drive source 12 via the rotary shaft 11a, and the rotary shaft 11a is erected at the center position of the lower surface of the rotary plate 11.
As shown in FIG. 3, the magnetized portion 13 is provided as an anisotropic rubber magnet sheet having a uniform thickness on the entire surface of the rotating plate 11 and the upper surface thereof is flat, or the rotating plate 11 It can also be an electromagnet that is flush with the top surface and can switch magnetism on and off.
仕上研磨装置１０は、図４に示すように、研磨フィルム７を搭載した仕上研磨用定盤１を回転板１１に載置して、駆動源１２により回転板１１を回転させるとともに、供給手段１４から潤滑剤９を研磨フィルム７上面に供給し、研磨試料８を押しつけることで研磨処理をおこなう。すると、余分な潤滑材９は板材２の全面で連続するいずれかの溝状凹部３から排出され、研磨フィルム７は仕上研磨用定盤１の溝状凹部３の部分において溝状凹部３に落込んだ状態になり、研磨フィルム７の表面には溝状凹部３に対応する形状で円弧状凹部４ａが形成される。 As shown in FIG. 4, the finish polishing apparatus 10 places the finish polishing surface plate 1 on which the polishing film 7 is mounted on the rotating plate 11, rotates the rotating plate 11 by the drive source 12, and supplies the means 14 The lubricant 9 is supplied to the upper surface of the polishing film 7 and the polishing sample 8 is pressed against the polishing film 7 to perform the polishing treatment. Then, the excess lubricating material 9 is discharged from any of the groove-shaped recesses 3 continuous on the entire surface of the plate material 2, and the polishing film 7 drops into the groove-shaped recesses 3 at the groove-shaped recesses 3 of the finish polishing surface plate 1. In the packed state, an arc-shaped recess 4a is formed on the surface of the polishing film 7 in a shape corresponding to the groove-shaped recess 3.
このように、溝状凹部３からの余分な潤滑材９の排出と、研磨フィルム７の表面に形成される円弧状凹部１０とにより、仕上研磨用定盤１の溝状凹部３による排水効果により、例えば水とされた余分な潤滑材９が排出され、島状凸部５の上方における研磨試料８の研磨面と研磨フィルム７との間には潤滑材９がほぼ介在しない状態となる。これにより、島状凸部５の上方で研磨試料８の研磨面と研磨フィルム７が容易に接触し、研磨効率を向上させることができる。 As described above, due to the discharge of the excess lubricating material 9 from the groove-shaped recess 3 and the arc-shaped recess 10 formed on the surface of the polishing film 7, the drainage effect of the groove-shaped recess 3 of the finish polishing surface plate 1 For example, the excess lubricating material 9 made of water is discharged, and the lubricating material 9 is substantially not interposed between the polishing surface of the polishing sample 8 and the polishing film 7 above the island-shaped convex portion 5. As a result, the polishing surface of the polishing sample 8 and the polishing film 7 can easily come into contact with each other above the island-shaped convex portion 5, and the polishing efficiency can be improved.
また、研磨試料８の研磨面と研磨フィルム７との接触面積が円弧状凹部４ａの形成により制限されるため、研磨試料８の研磨面が研磨フィルム７に吸い付きにくいので、研磨に必要な作用力を低減するか研磨処理時間を短縮することができる。研磨試料８から発生した削り屑Ｋが定盤の溝状凹部３上の研磨フィルムの円弧状凹部４ａへ排出されるので、研磨面を傷つける頻度が著しく低下する。
研磨試料面に硬度差がある複合材料からなる研磨試料８を研磨する場合でも、ダレや、部分的に研磨状態が異なることを防止して平面性、平坦性の高い研磨が可能である。
Further, since the contact area between the polishing surface of the polishing sample 8 and the polishing film 7 is limited by the formation of the arcuate recess 4a, the polishing surface of the polishing sample 8 is less likely to adhere to the polishing film 7, and thus an action required for polishing. The force can be reduced or the polishing process time can be shortened. Since the shavings K generated from the polishing sample 8 are discharged to the arc-shaped recess 4a of the polishing film on the groove-shaped recess 3 of the surface plate, the frequency of damaging the polished surface is significantly reduced.
Even when polishing a polishing sample 8 made of a composite material having a difference in hardness on the surface of the polishing sample, it is possible to perform polishing with high flatness and flatness by preventing sagging and partial difference in polishing state.
本実施形態によれば、研磨試料８そのものが破壊される可能性があるので、一品ものなど、代替のない貴重なサンプルは機械擂りしたくないという要求を満たして、作業熟練度が低くても、容易に平面性、平坦性の高い研磨試料８を作成することが短時間で可能となる。 According to this embodiment, the polishing sample 8 itself may be destroyed. Therefore, even if the work skill level is low, the requirement that a valuable sample without a substitute such as a single item is not mechanically squeezed is satisfied. It is possible to easily prepare a polished sample 8 having high flatness and flatness in a short time.
以下、本発明に係る仕上研磨用定盤の第２実施形態を、図面に基づいて説明する。
図５は、本実施形態における仕上研磨用定盤を示す平面図である。
本実施形態において上述した第１および第２実施形態と異なるのは島状凸部５と溝状凹部３との寸法に関する点であり、これ以外の対応する構成要素に関しては、同一の符号を付してその説明を省略する。
Hereinafter, a second embodiment of the finish polishing surface plate according to the present invention will be described with reference to the drawings.
FIG. 5 is a plan view showing a surface plate for finish polishing in this embodiment.
In this embodiment, the difference from the first and second embodiments described above is in the dimensions of the island-shaped convex portion 5 and the groove-shaped concave portion 3, and the other corresponding components are designated by the same reference numerals. And the explanation is omitted.
本実施形態においては、溝状凹部３の幅寸法Ｔ２が、島状凸部５の径寸法Ｔ１より小さくされているとともに、島状凸部５の径寸法Ｔ１は、２〜８ｍｍの範囲である４ｍｍ程度（±４ｍｍ）に設定されることができる。
溝条凹部４の幅寸法Ｔ２が、島状凸部５間の離間距離と等しくなるように設けられている。溝条凹部４の幅寸法Ｔ２は、板体２の全面で等しくなるように設定されている。具体的には、溝条凹部４の幅寸法Ｔ２は、１〜４ｍｍの範囲である２ｍｍ程度（±０．２ｍｍ）に設定されることができる。
In the present embodiment, the width dimension T2 of the groove-shaped concave portion 3 is smaller than the diameter dimension T1 of the island-shaped convex portion 5, and the diameter dimension T1 of the island-shaped convex portion 5 is in the range of 2 to 8 mm. It can be set to about 4 mm (± 4 mm).
The width dimension T2 of the groove recess 4 is provided so as to be equal to the separation distance between the island-shaped convex portions 5. The width dimension T2 of the groove recess 4 is set to be equal on the entire surface of the plate body 2. Specifically, the width dimension T2 of the groove recess 4 can be set to about 2 mm (± 0.2 mm), which is in the range of 1 to 4 mm.
研磨試料８は、研磨試料面が硬度の異なる領域を有し、この研磨試料面における高硬度領域と低硬度領域とのモース硬度の差が３以上であることができる。研磨試料面に硬度差があると、ダレが発生しやすいが、本実施形態の仕上研磨用定盤１では、このような研磨試料であっても、好適に研磨をおこなうことができる。
研磨試料としては、例えば、径寸法５〜１０ｍｍ程度の樹脂製円筒基材の表面に岩石等の研磨試料を複数埋込んだものとすることができる。
The polished sample 8 has regions having different hardness on the surface of the polished sample, and the difference in Mohs hardness between the high hardness region and the low hardness region on the polished sample surface can be 3 or more. If there is a difference in hardness on the surface of the polished sample, sagging is likely to occur, but the surface plate 1 for finish polishing of the present embodiment can suitably polish even such a polished sample.
As the polishing sample, for example, a plurality of polishing samples such as rocks may be embedded in the surface of a resin cylindrical base material having a diameter of about 5 to 10 mm.
本実施形態においては、溝条凹部４の幅寸法Ｔ２と島状凸部５の径寸法Ｔ１とが上記のように設定されていることにより、第１実施形態における研磨試料８に比べて、小さな研磨試料８に対応して研磨をおこなうことができる。 In the present embodiment, the width dimension T2 of the groove recess 4 and the diameter dimension T1 of the island-shaped convex portion 5 are set as described above, so that the width dimension T2 is smaller than that of the polishing sample 8 in the first embodiment. Polishing can be performed corresponding to the polishing sample 8.
また、本実施形態においては、まず、通常の溝条凹部４のない定盤にアルミナペーストを供給して第１研磨工程をおこない、その後、本実施形態の仕上研磨用定盤１と研磨フィルム７を用いて、第２研磨工程をおこなった。 Further, in the present embodiment, first, the alumina paste is supplied to a normal surface plate without groove recesses 4 to perform the first polishing step, and then the finish polishing surface plate 1 and the polishing film 7 of the present embodiment are performed. The second polishing step was carried out using.
第１研磨工程では、溝条凹部４と島状凸部５とを有さない定盤で処理をおこなうことにより、研磨試料面における硬度の差を有する高硬度領域と低硬度領域とが含まれた場合には、ダレが生じる場合がある。また、低硬度領域が研磨されすぎてしまう場合もある。
しかし、本実施形態においては、第１研磨工程の後に、第２研磨工程を施すことにより、第１研磨工程（第１工程）によって、研磨フィルムで削る量（表面積）を小さくすることができるため、第２研磨工程（第２工程）によって平坦化にかかる作業時間をより短縮して、迅速に研磨をおこなうことが可能となる。
In the first polishing step, a surface plate having no groove concave portion 4 and an island-shaped convex portion 5 is used for processing, so that a high hardness region and a low hardness region having a difference in hardness on the surface of the polished sample are included. In that case, sagging may occur. In addition, the low hardness region may be over-polished.
However, in the present embodiment, by performing the second polishing step after the first polishing step, the amount (surface surface) to be ground by the polishing film can be reduced by the first polishing step (first step). In the second polishing step (second step), the work time required for flattening can be further shortened, and polishing can be performed quickly.
また研磨フィルム７と研磨試料８との間にもさらなる隙間を形成することができるので、削り屑Ｋをより逃げやすくするとともに、外部に排出しやすくして、試料表面を傷つける率を低減することができる。 Further, since a further gap can be formed between the polishing film 7 and the polishing sample 8, the shavings K can be more easily escaped and discharged to the outside to reduce the rate of damaging the sample surface. Can be done.
以下、本発明にかかる実施例を説明する。 Hereinafter, examples of the present invention will be described.
図６は、溝状凹部４のない定盤を用いて、第２実施形態における第１工程をおこなった研磨試料を示す画像である。
ここで、遊離砥粒として０．３μｍのアルミナペーストを用いて研磨処理をおこなった。図に示すように、材質硬度の違いにより、著しい縁ダレが発生していることがわかる。
なお、図において、研磨試料における硬度は、
硬度：粘土鉱物( 黒い部分)< 火山ガラス（薄灰色）< 火成鉱物（白い多角形）
となっている。
FIG. 6 is an image showing a polished sample obtained by performing the first step in the second embodiment using a surface plate having no groove-shaped recess 4.
Here, the polishing treatment was performed using an alumina paste of 0.3 μm as the free abrasive grains. As shown in the figure, it can be seen that significant edge sagging occurs due to the difference in material hardness.
In the figure, the hardness of the polished sample is
Hardness: Clay mineral (black part) <Volcanic glass (light gray) <Ignition mineral (white polygon)
It has become.
図７は、図６に示した研磨試料に対して、上述の第２実施形態における仕上研磨用定盤１を用いて第２工程をおこなった研磨試料を示す画像である。
ここで、研磨フィルム（ラッピングフィルム）として砥粒径３μｍのものを用いて、３００ｒｐｍで回転板１１を回転させた状態で１分間研磨後、研磨フィルム（ラッピングフィルム）として砥粒径０．５μｍのものを用いて、３００ｒｐｍで回転板１１を回転させた状態で２分間仕上げ研磨をおこなった。
図に示すように、材質硬度の違いが合っても、ダレが発生しておらず、平坦化されていることがわかる。
FIG. 7 is an image showing a polishing sample obtained by performing the second step on the polishing sample shown in FIG. 6 using the finish polishing surface plate 1 in the above-mentioned second embodiment.
Here, a polishing film (wrapping film) having an abrasive particle size of 3 μm is used, and after polishing for 1 minute in a state where the rotating plate 11 is rotated at 300 rpm, the polishing film (wrapping film) has an abrasive particle size of 0.5 μm. Finish polishing was performed for 2 minutes in a state where the rotating plate 11 was rotated at 300 rpm.
As shown in the figure, it can be seen that even if the difference in material hardness is matched, no sagging occurs and the material is flattened.
図８は、溝状凹部４のない定盤を用いて、第２実施形態における第１工程をおこなった研磨試料を示す画像である。
ここで、遊離砥粒として０．３μｍのアルミナペーストを用いて研磨処理をおこなった。図に示すように、材質硬度の違いにより、著しい縁ダレが発生していることがわかる。
なお、図において、研磨試料における硬度は、
硬度：粘土鉱物( 黒い部分)< 火山ガラス（薄灰色）< 火成鉱物（白い多角形）
となっている。
FIG. 8 is an image showing a polished sample obtained by performing the first step in the second embodiment using a surface plate having no groove-shaped recess 4.
Here, the polishing treatment was performed using an alumina paste of 0.3 μm as the free abrasive grains. As shown in the figure, it can be seen that significant edge sagging occurs due to the difference in material hardness.
In the figure, the hardness of the polished sample is
Hardness: Clay mineral (black part) <Volcanic glass (light gray) <Ignition mineral (white polygon)
It has become.
図９は、図８に示した研磨試料に対して、上述の第２実施形態における仕上研磨用定盤１を用いて第２工程をおこなった研磨試料を示す画像である。
ここで、研磨フィルム（ラッピングフィルム）として砥粒径０．５μｍのものを用いて、３００ｒｐｍで回転板１１を回転させた状態で３分間研磨をおこなった。
図に示すように、材質硬度の違いが合っても、ダレが発生しておらず、平坦化されていることがわかる。
なお、研磨試料８として、輝石（モース硬度６．５−７）カンラン石（同硬度 ７）スピネル（モース硬度８）インジウム金属（モース硬度１．２）カオリナイト；粘土（鉱石 モース硬度１−２）鉄ニッケル合金（モース硬度４）といったものを含むことができる。
FIG. 9 is an image showing a polishing sample obtained by performing the second step on the polishing sample shown in FIG. 8 using the finish polishing surface plate 1 in the above-mentioned second embodiment.
Here, using a polishing film (wrapping film) having an abrasive particle size of 0.5 μm, polishing was performed for 3 minutes in a state where the rotating plate 11 was rotated at 300 rpm.
As shown in the figure, it can be seen that even if the difference in material hardness is matched, no sagging occurs and the material is flattened.
As the polishing sample 8, olivine (Mohs hardness 6.5-7) olivine (same hardness 7) spinel (Mohs hardness 8) indium metal (Mohs hardness 1.2) kaolinite; clay (Mohs hardness 1-2) ) An iron-nickel alloy (Mohs hardness 4) can be included.
これらの結果から、実施形態における仕上研磨用定盤１を用いて第２工程をおこなった研磨試料は、充分な平面化・平坦化を実現することができることがわかる。
これにより、本発明において平坦化された研磨試料８は、ＳＩＭＳ（二次イオン質量分析法）への適用に必要な平滑度を充分満たすことが可能となる。具体的には、SIMSによる分析が可能かどうか見極める目安である、偏光顕微鏡の反射光で焦点深度の比較的浅い対物レンズ（Nikon L Plan 2.5x0.075 EPI）を用いて試料表面を好適に観察できる状態を満たすことができる。
From these results, it can be seen that the polished sample subjected to the second step using the finish polishing surface plate 1 in the embodiment can realize sufficient flattening and flattening.
This makes it possible for the polished sample 8 flattened in the present invention to sufficiently satisfy the smoothness required for application to SIMS (secondary ion mass spectrometry). Specifically, the sample surface is suitably observed using an objective lens (Nikon L Plan 2.5x0.075 EPI) with a relatively shallow depth of focus using the reflected light of a polarizing microscope, which is a guideline for determining whether analysis by SIMS is possible. You can meet the conditions that you can.
本発明は、硬度が著しく異なる複合材料を迅速かつ平滑に研磨することを可能にするものであり、材料科学分野を始めとして、難加工材の処理に携わる各分野において広く利用することができる。 The present invention makes it possible to quickly and smoothly polish composite materials having significantly different hardnesses, and can be widely used in various fields involved in the processing of difficult-to-process materials, including the field of materials science.
１…仕上研磨用定盤
２…板体
３…溝状凹部
４ａ…円弧状凹部
５…島状凸部
６…角部
７…研磨フィルム
８…研磨試料
９…潤滑材
１０…仕上研磨装置
１１…回転板
１１ａ…回転軸
１２…駆動源１２
１３…磁着部（異方性ゴム磁石シート）
Ｋ…削り屑
1 ... Surface plate for finish polishing 2 ... Plate body 3 ... Groove-shaped recess 4a ... Arc-shaped recess 5 ... Island-shaped convex portion 6 ... Corner 7 ... Polishing film 8 ... Polishing sample 9 ... Lubricant 10 ... Finish polishing device 11 ... Rotating plate 11a ... Rotating shaft 12 ... Drive source 12
13 ... Magnetized part (anisotropic rubber magnet sheet)
K ... Shavings
Claims (6)
前記柔軟な研磨フィルムを搭載する平面形状の板体からなる定盤の研磨面には、複数の島状の島状凸部と該島状凸部の間に連続した溝状となる溝状凹部とが設けられ、
前記島状凸部が平面視して円形、楕円形または角数が６以上の多角形状である仕上研磨用定盤における前記定盤を、前記研磨面と直交する回転軸線に対して回転させる回転手段を有する仕上研磨装置を用いて研磨する方法であって、
平面定盤と研磨砥粒とを用いて前記研磨試料に縁ダレを発生させる第１工程と、
前記第１工程後に、前記仕上研磨装置と研磨フィルムとを用いて前記縁ダレをなくして前記研磨試料の研磨面を平坦面とする研磨をおこなう第２工程と、を有することを特徴とする研磨方法。 In a surface plate for finish polishing using a flexible polishing film for polishing with high flatness on the surface of the polishing sample.
The polished surface of a surface plate made of a flat plate on which the flexible polishing film is mounted has a plurality of island-shaped island-shaped convex portions and groove-shaped concave portions that form a continuous groove between the island-shaped convex portions. And are provided,
Circular and in plan view the island-shaped convex portion, the surface plate in the polishing platen finish oval or angular speed is Ru polygonal der of 6 or more, rotate relative to the axis of rotation perpendicular to the polishing surface A method of polishing using a finishing polishing device having a rotating means.
The first step of generating edge sagging on the polished sample using a flat surface plate and abrasive grains, and
Polishing, characterized in that the after the first step, having a second step of polishing the flat surface of the polishing surface of the polishing sample by eliminating the edge sagging with said finishing polishing apparatus and the polishing film Method .
ことを特徴とする請求項１から３のいずれか記載の研磨方法。 The polishing according to any one of claims 1 to 3, wherein the rotating means has a rotating plate that rotates around the rotating axis, and the rotating plate has a holding means for holding the surface plate. Method .
前記保持手段が、前記回転板と前記定盤とを磁着可能とされている
ことを特徴とする請求項４記載の研磨方法。 The surface plate is made of magnetic stainless steel.
The polishing method according to claim 4 , wherein the holding means is capable of magnetizing the rotating plate and the surface plate.
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| DE112017000827.1T DE112017000827T5 (en) | 2016-02-15 | 2017-02-09 | Faceplate for final polishing, final polishing and polishing process |
| US16/076,940 US20190047111A1 (en) | 2016-02-15 | 2017-02-09 | Surface plate for finish polishing, finish polishing device, and polishing method |
| PCT/JP2017/004746 WO2017141812A1 (en) | 2016-02-15 | 2017-02-09 | Surface plate for finish polishing, finish polishing device, and polishing method |
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| JPS5317095A (en) | 1976-07-30 | 1978-02-16 | Matsushita Electric Works Ltd | Sensing part heat receiving plate of fire sensor |
| JPS591161A (en) * | 1982-06-28 | 1984-01-06 | Hitachi Ltd | Lapping stool and lapping method |
| JPS60228070A (en) * | 1985-03-25 | 1985-11-13 | Hitachi Ltd | Both sides polishing machine |
| JPS61241059A (en) * | 1985-04-16 | 1986-10-27 | Toshiba Corp | Grinding device |
| US5212910A (en) * | 1991-07-09 | 1993-05-25 | Intel Corporation | Composite polishing pad for semiconductor process |
| KR0165625B1 (en) * | 1993-06-02 | 1999-02-01 | 기타지마 요시토시 | Grinding tape and method of manufacturing the grinding tape |
| JP3251419B2 (en) * | 1994-03-18 | 2002-01-28 | 三菱マテリアルシリコン株式会社 | Surface plate for polishing semiconductor wafers |
| US6083083A (en) * | 1994-04-22 | 2000-07-04 | Kabushiki Kaisha Toshiba | Separation type grinding surface plate and grinding apparatus using same |
| EP0728055A1 (en) * | 1994-09-08 | 1996-08-28 | Struers A/S | Grinding/polishing cover sheet for placing on a rotatable grinding/polishing disc |
| JPH09277163A (en) * | 1996-04-16 | 1997-10-28 | Sony Corp | Polishing method and polishing device |
| US5910471A (en) * | 1997-03-07 | 1999-06-08 | Minnesota Mining And Manufacturing Company | Abrasive article for providing a clear surface finish on glass |
| JPH10315121A (en) * | 1997-05-13 | 1998-12-02 | Toshiba Mach Co Ltd | Surface grinding device |
| US6261162B1 (en) * | 1998-03-25 | 2001-07-17 | Ebara Corporation | Polishing apparatus and method of manufacturing grinding plate |
| KR100471527B1 (en) * | 1999-03-30 | 2005-03-09 | 가부시키가이샤 니콘 | Polishing body, polisher, polishing method, and method for producing semiconductor device |
| TW467802B (en) * | 1999-10-12 | 2001-12-11 | Hunatech Co Ltd | Conditioner for polishing pad and method for manufacturing the same |
| JP2001150332A (en) * | 1999-11-22 | 2001-06-05 | Nec Corp | Polishing pad and polishing method |
| US6666751B1 (en) * | 2000-07-17 | 2003-12-23 | Micron Technology, Inc. | Deformable pad for chemical mechanical polishing |
| JP2002331453A (en) * | 2001-05-08 | 2002-11-19 | Shin Etsu Handotai Co Ltd | Wafer polishing method and wafer polishing device |
| US7314402B2 (en) * | 2001-11-15 | 2008-01-01 | Speedfam-Ipec Corporation | Method and apparatus for controlling slurry distribution |
| JP2004023009A (en) * | 2002-06-20 | 2004-01-22 | Nikon Corp | Polishing body, polishing device, semiconductor device, and method of manufacturing the same |
| JP4484466B2 (en) * | 2003-07-10 | 2010-06-16 | パナソニック株式会社 | Polishing method and viscoelastic polisher used in the polishing method |
| US7134947B2 (en) * | 2003-10-29 | 2006-11-14 | Texas Instruments Incorporated | Chemical mechanical polishing system |
| JP2005177897A (en) * | 2003-12-17 | 2005-07-07 | Nec Electronics Corp | Polishing method, polishing device, and method of manufacturing semiconductor device |
| JP3872081B2 (en) * | 2004-12-29 | 2007-01-24 | 東邦エンジニアリング株式会社 | Polishing pad |
| JP5317095B2 (en) * | 2008-04-28 | 2013-10-16 | 独立行政法人産業技術総合研究所 | Finishing surface plate |
| JP5151800B2 (en) * | 2008-08-20 | 2013-02-27 | 信越半導体株式会社 | Carrier for double-side polishing apparatus, double-side polishing apparatus and double-side polishing method using the same |
| WO2010063647A1 (en) * | 2008-12-03 | 2010-06-10 | Struers A/S | Abrasive disc |
| US9649742B2 (en) * | 2013-01-22 | 2017-05-16 | Nexplanar Corporation | Polishing pad having polishing surface with continuous protrusions |
| JP6452295B2 (en) * | 2014-03-19 | 2019-01-16 | スリーエム イノベイティブ プロパティズ カンパニー | Polishing pad and glass substrate polishing method |
| JP2016026048A (en) | 2015-11-03 | 2016-02-12 | 株式会社三洋物産 | Game machine |
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2016
- 2016-02-15 JP JP2016026048A patent/JP6754519B2/en active Active
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2017
- 2017-02-09 US US16/076,940 patent/US20190047111A1/en active Pending
- 2017-02-09 DE DE112017000827.1T patent/DE112017000827T5/en active Pending
- 2017-02-09 WO PCT/JP2017/004746 patent/WO2017141812A1/en active Application Filing
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| Publication number | Publication date |
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| WO2017141812A1 (en) | 2017-08-24 |
| JP2017144495A (en) | 2017-08-24 |
| DE112017000827T5 (en) | 2018-10-25 |
| US20190047111A1 (en) | 2019-02-14 |
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