JP7287761B2 - 球面軸受の軸受半径決定方法 - Google Patents

球面軸受の軸受半径決定方法 Download PDF

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Publication number
JP7287761B2
JP7287761B2 JP2018143393A JP2018143393A JP7287761B2 JP 7287761 B2 JP7287761 B2 JP 7287761B2 JP 2018143393 A JP2018143393 A JP 2018143393A JP 2018143393 A JP2018143393 A JP 2018143393A JP 7287761 B2 JP7287761 B2 JP 7287761B2
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Japan
Prior art keywords
bearing
contact surface
rotating body
dresser
torque
Prior art date
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Active
Application number
JP2018143393A
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English (en)
Japanese (ja)
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JP2020019081A5 (cg-RX-API-DMAC10.html
JP2020019081A (ja
Inventor
弘行 篠崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2018143393A priority Critical patent/JP7287761B2/ja
Priority to SG10201906617WA priority patent/SG10201906617WA/en
Priority to TW108125357A priority patent/TWI819035B/zh
Priority to KR1020190090753A priority patent/KR102847013B1/ko
Priority to US16/523,093 priority patent/US12208488B2/en
Priority to CN201910687844.0A priority patent/CN110774168B/zh
Publication of JP2020019081A publication Critical patent/JP2020019081A/ja
Publication of JP2020019081A5 publication Critical patent/JP2020019081A5/ja
Application granted granted Critical
Publication of JP7287761B2 publication Critical patent/JP7287761B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0084—Other grinding machines or devices the grinding wheel support being angularly adjustable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/007—Weight compensation; Temperature compensation; Vibration damping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B24B41/047—Grinding heads for working on plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/16—Bushings; Mountings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
JP2018143393A 2018-07-31 2018-07-31 球面軸受の軸受半径決定方法 Active JP7287761B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2018143393A JP7287761B2 (ja) 2018-07-31 2018-07-31 球面軸受の軸受半径決定方法
SG10201906617WA SG10201906617WA (en) 2018-07-31 2019-07-17 Coupling mechanism with spherical bearing, method of determining bearing radius of spherical bearing, and substrate polishing apparatus
TW108125357A TWI819035B (zh) 2018-07-31 2019-07-18 具備球面軸承之連結機構、球面軸承之軸承半徑決定方法、及基板研磨裝置
US16/523,093 US12208488B2 (en) 2018-07-31 2019-07-26 Coupling mechanism with spherical bearing, method of determining bearing radius of spherical bearing, and substrate polishing apparatus
KR1020190090753A KR102847013B1 (ko) 2018-07-31 2019-07-26 구면 베어링을 구비한 연결 기구, 구면 베어링의 베어링 반경 결정 방법, 및 기판 연마 장치
CN201910687844.0A CN110774168B (zh) 2018-07-31 2019-07-29 具备球面轴承的连结机构、球面轴承的轴承半径决定方法以及基板研磨装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018143393A JP7287761B2 (ja) 2018-07-31 2018-07-31 球面軸受の軸受半径決定方法

Publications (3)

Publication Number Publication Date
JP2020019081A JP2020019081A (ja) 2020-02-06
JP2020019081A5 JP2020019081A5 (cg-RX-API-DMAC10.html) 2021-06-10
JP7287761B2 true JP7287761B2 (ja) 2023-06-06

Family

ID=69229455

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018143393A Active JP7287761B2 (ja) 2018-07-31 2018-07-31 球面軸受の軸受半径決定方法

Country Status (6)

Country Link
US (1) US12208488B2 (cg-RX-API-DMAC10.html)
JP (1) JP7287761B2 (cg-RX-API-DMAC10.html)
KR (1) KR102847013B1 (cg-RX-API-DMAC10.html)
CN (1) CN110774168B (cg-RX-API-DMAC10.html)
SG (1) SG10201906617WA (cg-RX-API-DMAC10.html)
TW (1) TWI819035B (cg-RX-API-DMAC10.html)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016144860A (ja) 2015-01-30 2016-08-12 株式会社荏原製作所 連結機構、基板研磨装置、連結機構の回転中心位置決定方法、連結機構の回転中心位置決定プログラム、回転体の最大押付荷重決定方法、および回転体の最大押付荷重決定プログラム

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5804507A (en) 1995-10-27 1998-09-08 Applied Materials, Inc. Radially oscillating carousel processing system for chemical mechanical polishing
US5738574A (en) 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
JPH09314456A (ja) 1996-05-29 1997-12-09 Toshiba Mach Co Ltd 研磨布ドレッシング方法及び研磨装置
US6036583A (en) * 1997-07-11 2000-03-14 Applied Materials, Inc. Conditioner head in a substrate polisher and method
US5899798A (en) * 1997-07-25 1999-05-04 Obsidian Inc. Low profile, low hysteresis force feedback gimbal system for chemical mechanical polishing
US6116990A (en) 1997-07-25 2000-09-12 Applied Materials, Inc. Adjustable low profile gimbal system for chemical mechanical polishing
JP3630958B2 (ja) 1997-11-19 2005-03-23 キヤノン株式会社 レンズ保持装置
JP3890188B2 (ja) 1999-09-14 2007-03-07 キヤノン株式会社 研磨装置
US6755723B1 (en) * 2000-09-29 2004-06-29 Lam Research Corporation Polishing head assembly
US7137874B1 (en) 2000-11-21 2006-11-21 Memc Electronic Materials, Spa Semiconductor wafer, polishing apparatus and method
KR100939556B1 (ko) * 2001-12-06 2010-01-29 가부시키가이샤 에바라 세이사꾸쇼 탄성막 및 플렉시블 막
JP2005034959A (ja) * 2003-07-16 2005-02-10 Ebara Corp 研磨装置及びリテーナリング
JP5025374B2 (ja) 2007-08-02 2012-09-12 オリンパス株式会社 保持具、研磨方法
JP5236515B2 (ja) 2009-01-28 2013-07-17 株式会社荏原製作所 ドレッシング装置、化学的機械的研磨装置及び方法
JP2011124302A (ja) 2009-12-09 2011-06-23 Lapmaster Sft Corp 低重心エアバック式研磨ヘッド
TWI674171B (zh) * 2012-01-31 2019-10-11 日商荏原製作所股份有限公司 基板保持裝置、研磨裝置、及研磨方法
JP5976522B2 (ja) * 2012-05-31 2016-08-23 株式会社荏原製作所 研磨装置および研磨方法
JP5927083B2 (ja) * 2012-08-28 2016-05-25 株式会社荏原製作所 ドレッシングプロセスの監視方法および研磨装置
JP6403981B2 (ja) 2013-11-13 2018-10-10 株式会社荏原製作所 基板保持装置、研磨装置、研磨方法、およびリテーナリング
CN105856057B (zh) 2015-01-30 2019-06-04 株式会社荏原制作所 连结机构、基板研磨装置、旋转中心定位方法、最大按压负荷确定方法以及记录介质
JP6721967B2 (ja) * 2015-11-17 2020-07-15 株式会社荏原製作所 バフ処理装置および基板処理装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016144860A (ja) 2015-01-30 2016-08-12 株式会社荏原製作所 連結機構、基板研磨装置、連結機構の回転中心位置決定方法、連結機構の回転中心位置決定プログラム、回転体の最大押付荷重決定方法、および回転体の最大押付荷重決定プログラム

Also Published As

Publication number Publication date
US12208488B2 (en) 2025-01-28
CN110774168B (zh) 2023-07-07
JP2020019081A (ja) 2020-02-06
KR20200014219A (ko) 2020-02-10
US20200039030A1 (en) 2020-02-06
TW202007475A (zh) 2020-02-16
TWI819035B (zh) 2023-10-21
CN110774168A (zh) 2020-02-11
SG10201906617WA (en) 2020-02-27
KR102847013B1 (ko) 2025-08-20

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