TWI819035B - 具備球面軸承之連結機構、球面軸承之軸承半徑決定方法、及基板研磨裝置 - Google Patents

具備球面軸承之連結機構、球面軸承之軸承半徑決定方法、及基板研磨裝置 Download PDF

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Publication number
TWI819035B
TWI819035B TW108125357A TW108125357A TWI819035B TW I819035 B TWI819035 B TW I819035B TW 108125357 A TW108125357 A TW 108125357A TW 108125357 A TW108125357 A TW 108125357A TW I819035 B TWI819035 B TW I819035B
Authority
TW
Taiwan
Prior art keywords
bearing
rotating body
contact surface
torque
dresser
Prior art date
Application number
TW108125357A
Other languages
English (en)
Chinese (zh)
Other versions
TW202007475A (zh
Inventor
篠崎弘行
Original Assignee
日商荏原製作所股份有限公司
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Filing date
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Application filed by 日商荏原製作所股份有限公司 filed Critical 日商荏原製作所股份有限公司
Publication of TW202007475A publication Critical patent/TW202007475A/zh
Application granted granted Critical
Publication of TWI819035B publication Critical patent/TWI819035B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0084—Other grinding machines or devices the grinding wheel support being angularly adjustable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/007—Weight compensation; Temperature compensation; Vibration damping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B24B41/047—Grinding heads for working on plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/16—Bushings; Mountings

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
TW108125357A 2018-07-31 2019-07-18 具備球面軸承之連結機構、球面軸承之軸承半徑決定方法、及基板研磨裝置 TWI819035B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-143393 2018-07-31
JP2018143393A JP7287761B2 (ja) 2018-07-31 2018-07-31 球面軸受の軸受半径決定方法

Publications (2)

Publication Number Publication Date
TW202007475A TW202007475A (zh) 2020-02-16
TWI819035B true TWI819035B (zh) 2023-10-21

Family

ID=69229455

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108125357A TWI819035B (zh) 2018-07-31 2019-07-18 具備球面軸承之連結機構、球面軸承之軸承半徑決定方法、及基板研磨裝置

Country Status (6)

Country Link
US (1) US12208488B2 (cg-RX-API-DMAC10.html)
JP (1) JP7287761B2 (cg-RX-API-DMAC10.html)
KR (1) KR102847013B1 (cg-RX-API-DMAC10.html)
CN (1) CN110774168B (cg-RX-API-DMAC10.html)
SG (1) SG10201906617WA (cg-RX-API-DMAC10.html)
TW (1) TWI819035B (cg-RX-API-DMAC10.html)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6755723B1 (en) * 2000-09-29 2004-06-29 Lam Research Corporation Polishing head assembly
WO2005007342A1 (ja) * 2003-07-16 2005-01-27 Ebara Corporation 研磨装置
TWI266674B (en) * 2001-12-06 2006-11-21 Ebara Corp Substrate holding device and polishing apparatus
TW201637773A (zh) * 2015-01-30 2016-11-01 荏原製作所股份有限公司 連結機構、基板研磨裝置、連結機構之轉動中心之位置決定方法、連結機構之轉動中心之位置決定程式、轉動體之最大按壓負荷決定方法、及轉動體之最大按壓負荷決定程式
WO2017086055A1 (ja) * 2015-11-17 2017-05-26 株式会社荏原製作所 バフ処理装置および基板処理装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5804507A (en) 1995-10-27 1998-09-08 Applied Materials, Inc. Radially oscillating carousel processing system for chemical mechanical polishing
US5738574A (en) 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
JPH09314456A (ja) 1996-05-29 1997-12-09 Toshiba Mach Co Ltd 研磨布ドレッシング方法及び研磨装置
US6036583A (en) * 1997-07-11 2000-03-14 Applied Materials, Inc. Conditioner head in a substrate polisher and method
US5899798A (en) * 1997-07-25 1999-05-04 Obsidian Inc. Low profile, low hysteresis force feedback gimbal system for chemical mechanical polishing
US6116990A (en) 1997-07-25 2000-09-12 Applied Materials, Inc. Adjustable low profile gimbal system for chemical mechanical polishing
JP3630958B2 (ja) 1997-11-19 2005-03-23 キヤノン株式会社 レンズ保持装置
JP3890188B2 (ja) 1999-09-14 2007-03-07 キヤノン株式会社 研磨装置
US7137874B1 (en) 2000-11-21 2006-11-21 Memc Electronic Materials, Spa Semiconductor wafer, polishing apparatus and method
JP5025374B2 (ja) 2007-08-02 2012-09-12 オリンパス株式会社 保持具、研磨方法
JP5236515B2 (ja) 2009-01-28 2013-07-17 株式会社荏原製作所 ドレッシング装置、化学的機械的研磨装置及び方法
JP2011124302A (ja) 2009-12-09 2011-06-23 Lapmaster Sft Corp 低重心エアバック式研磨ヘッド
TWI674171B (zh) * 2012-01-31 2019-10-11 日商荏原製作所股份有限公司 基板保持裝置、研磨裝置、及研磨方法
JP5976522B2 (ja) * 2012-05-31 2016-08-23 株式会社荏原製作所 研磨装置および研磨方法
JP5927083B2 (ja) * 2012-08-28 2016-05-25 株式会社荏原製作所 ドレッシングプロセスの監視方法および研磨装置
JP6403981B2 (ja) 2013-11-13 2018-10-10 株式会社荏原製作所 基板保持装置、研磨装置、研磨方法、およびリテーナリング
CN105856057B (zh) 2015-01-30 2019-06-04 株式会社荏原制作所 连结机构、基板研磨装置、旋转中心定位方法、最大按压负荷确定方法以及记录介质

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6755723B1 (en) * 2000-09-29 2004-06-29 Lam Research Corporation Polishing head assembly
TWI266674B (en) * 2001-12-06 2006-11-21 Ebara Corp Substrate holding device and polishing apparatus
WO2005007342A1 (ja) * 2003-07-16 2005-01-27 Ebara Corporation 研磨装置
US20070212988A1 (en) * 2003-07-16 2007-09-13 Osamu Nabeya Polishing apparatus
TW201637773A (zh) * 2015-01-30 2016-11-01 荏原製作所股份有限公司 連結機構、基板研磨裝置、連結機構之轉動中心之位置決定方法、連結機構之轉動中心之位置決定程式、轉動體之最大按壓負荷決定方法、及轉動體之最大按壓負荷決定程式
WO2017086055A1 (ja) * 2015-11-17 2017-05-26 株式会社荏原製作所 バフ処理装置および基板処理装置

Also Published As

Publication number Publication date
JP7287761B2 (ja) 2023-06-06
US12208488B2 (en) 2025-01-28
CN110774168B (zh) 2023-07-07
JP2020019081A (ja) 2020-02-06
KR20200014219A (ko) 2020-02-10
US20200039030A1 (en) 2020-02-06
TW202007475A (zh) 2020-02-16
CN110774168A (zh) 2020-02-11
SG10201906617WA (en) 2020-02-27
KR102847013B1 (ko) 2025-08-20

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