JP2020019081A5 - - Google Patents

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Publication number
JP2020019081A5
JP2020019081A5 JP2018143393A JP2018143393A JP2020019081A5 JP 2020019081 A5 JP2020019081 A5 JP 2020019081A5 JP 2018143393 A JP2018143393 A JP 2018143393A JP 2018143393 A JP2018143393 A JP 2018143393A JP 2020019081 A5 JP2020019081 A5 JP 2020019081A5
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JP
Japan
Prior art keywords
dresser
rotating body
torque
friction torque
bearing
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JP2018143393A
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English (en)
Japanese (ja)
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JP7287761B2 (ja
JP2020019081A (ja
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Priority claimed from JP2018143393A external-priority patent/JP7287761B2/ja
Priority to JP2018143393A priority Critical patent/JP7287761B2/ja
Priority to SG10201906617WA priority patent/SG10201906617WA/en
Priority to TW108125357A priority patent/TWI819035B/zh
Priority to KR1020190090753A priority patent/KR102847013B1/ko
Priority to US16/523,093 priority patent/US12208488B2/en
Priority to CN201910687844.0A priority patent/CN110774168B/zh
Publication of JP2020019081A publication Critical patent/JP2020019081A/ja
Publication of JP2020019081A5 publication Critical patent/JP2020019081A5/ja
Publication of JP7287761B2 publication Critical patent/JP7287761B2/ja
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JP2018143393A 2018-07-31 2018-07-31 球面軸受の軸受半径決定方法 Active JP7287761B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2018143393A JP7287761B2 (ja) 2018-07-31 2018-07-31 球面軸受の軸受半径決定方法
SG10201906617WA SG10201906617WA (en) 2018-07-31 2019-07-17 Coupling mechanism with spherical bearing, method of determining bearing radius of spherical bearing, and substrate polishing apparatus
TW108125357A TWI819035B (zh) 2018-07-31 2019-07-18 具備球面軸承之連結機構、球面軸承之軸承半徑決定方法、及基板研磨裝置
US16/523,093 US12208488B2 (en) 2018-07-31 2019-07-26 Coupling mechanism with spherical bearing, method of determining bearing radius of spherical bearing, and substrate polishing apparatus
KR1020190090753A KR102847013B1 (ko) 2018-07-31 2019-07-26 구면 베어링을 구비한 연결 기구, 구면 베어링의 베어링 반경 결정 방법, 및 기판 연마 장치
CN201910687844.0A CN110774168B (zh) 2018-07-31 2019-07-29 具备球面轴承的连结机构、球面轴承的轴承半径决定方法以及基板研磨装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018143393A JP7287761B2 (ja) 2018-07-31 2018-07-31 球面軸受の軸受半径決定方法

Publications (3)

Publication Number Publication Date
JP2020019081A JP2020019081A (ja) 2020-02-06
JP2020019081A5 true JP2020019081A5 (cg-RX-API-DMAC10.html) 2021-06-10
JP7287761B2 JP7287761B2 (ja) 2023-06-06

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JP2018143393A Active JP7287761B2 (ja) 2018-07-31 2018-07-31 球面軸受の軸受半径決定方法

Country Status (6)

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US (1) US12208488B2 (cg-RX-API-DMAC10.html)
JP (1) JP7287761B2 (cg-RX-API-DMAC10.html)
KR (1) KR102847013B1 (cg-RX-API-DMAC10.html)
CN (1) CN110774168B (cg-RX-API-DMAC10.html)
SG (1) SG10201906617WA (cg-RX-API-DMAC10.html)
TW (1) TWI819035B (cg-RX-API-DMAC10.html)

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5804507A (en) 1995-10-27 1998-09-08 Applied Materials, Inc. Radially oscillating carousel processing system for chemical mechanical polishing
US5738574A (en) 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
JPH09314456A (ja) 1996-05-29 1997-12-09 Toshiba Mach Co Ltd 研磨布ドレッシング方法及び研磨装置
US6036583A (en) * 1997-07-11 2000-03-14 Applied Materials, Inc. Conditioner head in a substrate polisher and method
US5899798A (en) * 1997-07-25 1999-05-04 Obsidian Inc. Low profile, low hysteresis force feedback gimbal system for chemical mechanical polishing
US6116990A (en) 1997-07-25 2000-09-12 Applied Materials, Inc. Adjustable low profile gimbal system for chemical mechanical polishing
JP3630958B2 (ja) 1997-11-19 2005-03-23 キヤノン株式会社 レンズ保持装置
JP3890188B2 (ja) 1999-09-14 2007-03-07 キヤノン株式会社 研磨装置
US6755723B1 (en) * 2000-09-29 2004-06-29 Lam Research Corporation Polishing head assembly
US7137874B1 (en) 2000-11-21 2006-11-21 Memc Electronic Materials, Spa Semiconductor wafer, polishing apparatus and method
KR100939556B1 (ko) * 2001-12-06 2010-01-29 가부시키가이샤 에바라 세이사꾸쇼 탄성막 및 플렉시블 막
JP2005034959A (ja) * 2003-07-16 2005-02-10 Ebara Corp 研磨装置及びリテーナリング
JP5025374B2 (ja) 2007-08-02 2012-09-12 オリンパス株式会社 保持具、研磨方法
JP5236515B2 (ja) 2009-01-28 2013-07-17 株式会社荏原製作所 ドレッシング装置、化学的機械的研磨装置及び方法
JP2011124302A (ja) 2009-12-09 2011-06-23 Lapmaster Sft Corp 低重心エアバック式研磨ヘッド
TWI674171B (zh) * 2012-01-31 2019-10-11 日商荏原製作所股份有限公司 基板保持裝置、研磨裝置、及研磨方法
JP5976522B2 (ja) * 2012-05-31 2016-08-23 株式会社荏原製作所 研磨装置および研磨方法
JP5927083B2 (ja) * 2012-08-28 2016-05-25 株式会社荏原製作所 ドレッシングプロセスの監視方法および研磨装置
JP6403981B2 (ja) 2013-11-13 2018-10-10 株式会社荏原製作所 基板保持装置、研磨装置、研磨方法、およびリテーナリング
CN105856057B (zh) 2015-01-30 2019-06-04 株式会社荏原制作所 连结机构、基板研磨装置、旋转中心定位方法、最大按压负荷确定方法以及记录介质
JP6592355B2 (ja) * 2015-01-30 2019-10-16 株式会社荏原製作所 連結機構および基板研磨装置
JP6721967B2 (ja) * 2015-11-17 2020-07-15 株式会社荏原製作所 バフ処理装置および基板処理装置

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