CN110709967B - 改善在氧化硅上的超薄非晶硅膜的连续性的预处理方法 - Google Patents
改善在氧化硅上的超薄非晶硅膜的连续性的预处理方法 Download PDFInfo
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- H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H10P14/6336—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
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- H10P50/264—Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials by chemical means
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- H10P50/695—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials characterised by their size, orientation, disposition, behaviour or shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks or sidewalls or to modify the mask
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- H10P76/40—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials
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- Chemical Vapour Deposition (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
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- Formation Of Insulating Films (AREA)
- Semiconductor Memories (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311074164.4A CN117293018A (zh) | 2017-07-24 | 2018-05-24 | 改善在氧化硅上的超薄非晶硅膜的连续性的预处理方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762536275P | 2017-07-24 | 2017-07-24 | |
| US62/536,275 | 2017-07-24 | ||
| PCT/US2018/034439 WO2019022826A1 (en) | 2017-07-24 | 2018-05-24 | PRETREATMENT APPARATUS FOR IMPROVING THE CONTINUITY OF ULTRA-THIN AMORPHOUS SILICON FILM ON SILICON OXIDE |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311074164.4A Division CN117293018A (zh) | 2017-07-24 | 2018-05-24 | 改善在氧化硅上的超薄非晶硅膜的连续性的预处理方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110709967A CN110709967A (zh) | 2020-01-17 |
| CN110709967B true CN110709967B (zh) | 2023-09-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201880036516.8A Active CN110709967B (zh) | 2017-07-24 | 2018-05-24 | 改善在氧化硅上的超薄非晶硅膜的连续性的预处理方法 |
| CN202311074164.4A Pending CN117293018A (zh) | 2017-07-24 | 2018-05-24 | 改善在氧化硅上的超薄非晶硅膜的连续性的预处理方法 |
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| CN202311074164.4A Pending CN117293018A (zh) | 2017-07-24 | 2018-05-24 | 改善在氧化硅上的超薄非晶硅膜的连续性的预处理方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10559465B2 (https=) |
| JP (1) | JP7242631B2 (https=) |
| KR (1) | KR102509390B1 (https=) |
| CN (2) | CN110709967B (https=) |
| WO (1) | WO2019022826A1 (https=) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20190035036A (ko) * | 2017-09-25 | 2019-04-03 | 삼성전자주식회사 | 박막 형성 장치 및 이를 이용한 비정질 실리콘 막 형성방법 |
| US11315787B2 (en) * | 2019-04-17 | 2022-04-26 | Applied Materials, Inc. | Multiple spacer patterning schemes |
| WO2021025874A1 (en) | 2019-08-06 | 2021-02-11 | Lam Research Corporation | Thermal atomic layer deposition of silicon-containing films |
| US11198606B2 (en) * | 2019-09-23 | 2021-12-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Structure for microelectromechanical systems (MEMS) devices to control pressure at high temperature |
| CN115803474A (zh) | 2020-07-23 | 2023-03-14 | 朗姆研究公司 | 具有受控膜性质和高沉积速率的保形热cvd |
| KR20230043795A (ko) | 2020-07-28 | 2023-03-31 | 램 리써치 코포레이션 | 실리콘-함유 막들의 불순물 감소 |
| CN112645277B (zh) * | 2020-12-11 | 2023-11-07 | 上海集成电路研发中心有限公司 | 一种新型红外探测器及制备方法 |
| US11640905B2 (en) * | 2020-12-17 | 2023-05-02 | Applied Materials, Inc. | Plasma enhanced deposition of silicon-containing films at low temperature |
| CN112599619A (zh) * | 2020-12-29 | 2021-04-02 | 成都晔凡科技有限公司 | 制造太阳能电池片的方法和太阳能电池片 |
| US12033848B2 (en) * | 2021-06-18 | 2024-07-09 | Applied Materials, Inc. | Processes for depositing sib films |
| WO2023283144A1 (en) | 2021-07-09 | 2023-01-12 | Lam Research Corporation | Plasma enhanced atomic layer deposition of silicon-containing films |
| US20240355624A1 (en) * | 2021-08-24 | 2024-10-24 | Lam Research Corporation | In-situ core protection in multi-patterning |
| TW202419657A (zh) * | 2022-07-20 | 2024-05-16 | 美商應用材料股份有限公司 | 共形鉬沉積 |
| WO2024054413A1 (en) * | 2022-09-06 | 2024-03-14 | Lam Research Corporation | Doped silicon or boron layer formation |
| US20250112039A1 (en) * | 2023-10-03 | 2025-04-03 | Applied Materials, Inc. | Seam-free single operation amorphous silicon gap fill |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006332634A (ja) * | 2005-04-28 | 2006-12-07 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
| KR20080031747A (ko) * | 2005-07-13 | 2008-04-10 | 에스. 오. 이. 떼끄 씰리꽁 오 냉쉴라또흐 떼끄놀로지 | 두꺼운 절연층의 거칠기도 감소 방법 |
| JP2008141204A (ja) * | 2007-11-30 | 2008-06-19 | Renesas Technology Corp | 半導体集積回路装置の製造方法 |
| WO2016196073A1 (en) * | 2015-06-03 | 2016-12-08 | Applied Materials, Inc. | Apparatus and methods for spacer deposition and selective removal in an advanced patterning process |
Family Cites Families (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3181357B2 (ja) | 1991-08-19 | 2001-07-03 | 株式会社東芝 | 半導体薄膜の形成方法および半導体装置の製造方法 |
| JPH05160394A (ja) * | 1991-10-11 | 1993-06-25 | Sony Corp | Mis型半導体装置及びその製造方法 |
| US5800878A (en) | 1996-10-24 | 1998-09-01 | Applied Materials, Inc. | Reducing hydrogen concentration in pecvd amorphous silicon carbide films |
| US6294219B1 (en) * | 1998-03-03 | 2001-09-25 | Applied Komatsu Technology, Inc. | Method of annealing large area glass substrates |
| JP4094127B2 (ja) | 1998-07-16 | 2008-06-04 | 株式会社アルバック | アモルファスシリコン製造装置 |
| US6391785B1 (en) | 1999-08-24 | 2002-05-21 | Interuniversitair Microelektronica Centrum (Imec) | Method for bottomless deposition of barrier layers in integrated circuit metallization schemes |
| JP2002158173A (ja) * | 2000-09-05 | 2002-05-31 | Sony Corp | 薄膜の製造方法、半導体薄膜、半導体装置、半導体薄膜の製造方法、及び半導体薄膜製造装置 |
| US7186630B2 (en) | 2002-08-14 | 2007-03-06 | Asm America, Inc. | Deposition of amorphous silicon-containing films |
| US20040067631A1 (en) * | 2002-10-03 | 2004-04-08 | Haowen Bu | Reduction of seed layer roughness for use in forming SiGe gate electrode |
| KR20040054433A (ko) * | 2002-12-18 | 2004-06-25 | 엘지.필립스 엘시디 주식회사 | 구동회로 일체형 액정표시장의 스위칭 소자 또는구동소자의 제조방법 |
| US6939794B2 (en) | 2003-06-17 | 2005-09-06 | Micron Technology, Inc. | Boron-doped amorphous carbon film for use as a hard etch mask during the formation of a semiconductor device |
| TWI235496B (en) | 2003-07-04 | 2005-07-01 | Toppoly Optoelectronics Corp | Crystallization method of polysilicon layer |
| US7485572B2 (en) | 2006-09-25 | 2009-02-03 | International Business Machines Corporation | Method for improved formation of cobalt silicide contacts in semiconductor devices |
| US7622386B2 (en) | 2006-12-06 | 2009-11-24 | International Business Machines Corporation | Method for improved formation of nickel silicide contacts in semiconductor devices |
| US20080254619A1 (en) | 2007-04-14 | 2008-10-16 | Tsang-Jung Lin | Method of fabricating a semiconductor device |
| KR20090013286A (ko) | 2007-08-01 | 2009-02-05 | 삼성전자주식회사 | 반도체 소자 제조설비 |
| KR101499232B1 (ko) * | 2008-04-10 | 2015-03-06 | 삼성디스플레이 주식회사 | 규소 결정화용 마스크 및 이를 이용한 다결정 규소 박막형성 방법과 박막 트랜지스터의 제조 방법 |
| KR101436564B1 (ko) | 2008-05-07 | 2014-09-02 | 한국에이에스엠지니텍 주식회사 | 비정질 실리콘 박막 형성 방법 |
| US8525139B2 (en) | 2009-10-27 | 2013-09-03 | Lam Research Corporation | Method and apparatus of halogen removal |
| US8178443B2 (en) | 2009-12-04 | 2012-05-15 | Novellus Systems, Inc. | Hardmask materials |
| US8247332B2 (en) | 2009-12-04 | 2012-08-21 | Novellus Systems, Inc. | Hardmask materials |
| US20110244142A1 (en) | 2010-03-30 | 2011-10-06 | Applied Materials, Inc. | Nitrogen doped amorphous carbon hardmask |
| TW201216331A (en) | 2010-10-05 | 2012-04-16 | Applied Materials Inc | Ultra high selectivity doped amorphous carbon strippable hardmask development and integration |
| US20120202315A1 (en) | 2011-02-03 | 2012-08-09 | Applied Materials, Inc. | In-situ hydrogen plasma treatment of amorphous silicon intrinsic layers |
| TWI492298B (zh) * | 2011-08-26 | 2015-07-11 | 應用材料股份有限公司 | 雙重圖案化蝕刻製程 |
| US20130189845A1 (en) | 2012-01-19 | 2013-07-25 | Applied Materials, Inc. | Conformal amorphous carbon for spacer and spacer protection applications |
| US20130196078A1 (en) | 2012-01-31 | 2013-08-01 | Joseph Yudovsky | Multi-Chamber Substrate Processing System |
| CN104603914B (zh) | 2012-09-07 | 2017-07-14 | 应用材料公司 | 多腔室真空系统中的多孔电介质、聚合物涂布基板和环氧化物的集成处理 |
| TW201441408A (zh) | 2013-03-15 | 2014-11-01 | 應用材料股份有限公司 | 包含氮化矽之膜的電漿輔助原子層沉積 |
| US9171754B2 (en) | 2013-05-24 | 2015-10-27 | Globalfoundries Inc. | Method including an etching of a portion of an interlayer dielectric in a semiconductor structure, a degas process and a preclean process |
| US9412656B2 (en) | 2014-02-14 | 2016-08-09 | Taiwan Semiconductor Manufacturing Co., Ltd. | Reverse tone self-aligned contact |
| JP2016047777A (ja) * | 2014-08-27 | 2016-04-07 | 国立大学法人大阪大学 | グラフェン薄膜の製造方法、並びにグラフェン薄膜を備えた電子素子およびセンサ |
| US9865459B2 (en) | 2015-04-22 | 2018-01-09 | Applied Materials, Inc. | Plasma treatment to improve adhesion between hardmask film and silicon oxide film |
| KR20170016107A (ko) * | 2015-08-03 | 2017-02-13 | 삼성전자주식회사 | 반도체 장치 제조 방법 |
| US10418243B2 (en) | 2015-10-09 | 2019-09-17 | Applied Materials, Inc. | Ultra-high modulus and etch selectivity boron-carbon hardmask films |
| TWI715645B (zh) | 2015-10-22 | 2021-01-11 | 美商應用材料股份有限公司 | 正形及縫隙填充非晶矽薄膜的沉積 |
| WO2018052760A1 (en) * | 2016-09-13 | 2018-03-22 | Applied Materials, Inc. | Borane mediated dehydrogenation process from silane and alkylsilane species for spacer and hardmask application |
| US10276379B2 (en) * | 2017-04-07 | 2019-04-30 | Applied Materials, Inc. | Treatment approach to improve film roughness by improving nucleation/adhesion of silicon oxide |
| US10745282B2 (en) * | 2017-06-08 | 2020-08-18 | Applied Materials, Inc. | Diamond-like carbon film |
-
2018
- 2018-05-24 KR KR1020207005305A patent/KR102509390B1/ko active Active
- 2018-05-24 JP JP2020503041A patent/JP7242631B2/ja active Active
- 2018-05-24 WO PCT/US2018/034439 patent/WO2019022826A1/en not_active Ceased
- 2018-05-24 CN CN201880036516.8A patent/CN110709967B/zh active Active
- 2018-05-24 US US15/988,771 patent/US10559465B2/en active Active
- 2018-05-24 CN CN202311074164.4A patent/CN117293018A/zh active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006332634A (ja) * | 2005-04-28 | 2006-12-07 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
| KR20080031747A (ko) * | 2005-07-13 | 2008-04-10 | 에스. 오. 이. 떼끄 씰리꽁 오 냉쉴라또흐 떼끄놀로지 | 두꺼운 절연층의 거칠기도 감소 방법 |
| JP2008141204A (ja) * | 2007-11-30 | 2008-06-19 | Renesas Technology Corp | 半導体集積回路装置の製造方法 |
| WO2016196073A1 (en) * | 2015-06-03 | 2016-12-08 | Applied Materials, Inc. | Apparatus and methods for spacer deposition and selective removal in an advanced patterning process |
Also Published As
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|---|---|
| US10559465B2 (en) | 2020-02-11 |
| WO2019022826A1 (en) | 2019-01-31 |
| CN110709967A (zh) | 2020-01-17 |
| JP7242631B2 (ja) | 2023-03-20 |
| KR102509390B1 (ko) | 2023-03-14 |
| CN117293018A (zh) | 2023-12-26 |
| US20190027362A1 (en) | 2019-01-24 |
| KR20200023509A (ko) | 2020-03-04 |
| JP2020528670A (ja) | 2020-09-24 |
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