CN110709967B - 改善在氧化硅上的超薄非晶硅膜的连续性的预处理方法 - Google Patents
改善在氧化硅上的超薄非晶硅膜的连续性的预处理方法 Download PDFInfo
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- CN110709967B CN110709967B CN201880036516.8A CN201880036516A CN110709967B CN 110709967 B CN110709967 B CN 110709967B CN 201880036516 A CN201880036516 A CN 201880036516A CN 110709967 B CN110709967 B CN 110709967B
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- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
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- Inorganic Chemistry (AREA)
- Plasma & Fusion (AREA)
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- General Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Formation Of Insulating Films (AREA)
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311074164.4A CN117293018A (zh) | 2017-07-24 | 2018-05-24 | 改善在氧化硅上的超薄非晶硅膜的连续性的预处理方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762536275P | 2017-07-24 | 2017-07-24 | |
| US62/536,275 | 2017-07-24 | ||
| PCT/US2018/034439 WO2019022826A1 (en) | 2017-07-24 | 2018-05-24 | PRETREATMENT APPARATUS FOR IMPROVING THE CONTINUITY OF ULTRA-THIN AMORPHOUS SILICON FILM ON SILICON OXIDE |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311074164.4A Division CN117293018A (zh) | 2017-07-24 | 2018-05-24 | 改善在氧化硅上的超薄非晶硅膜的连续性的预处理方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110709967A CN110709967A (zh) | 2020-01-17 |
| CN110709967B true CN110709967B (zh) | 2023-09-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880036516.8A Active CN110709967B (zh) | 2017-07-24 | 2018-05-24 | 改善在氧化硅上的超薄非晶硅膜的连续性的预处理方法 |
| CN202311074164.4A Pending CN117293018A (zh) | 2017-07-24 | 2018-05-24 | 改善在氧化硅上的超薄非晶硅膜的连续性的预处理方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311074164.4A Pending CN117293018A (zh) | 2017-07-24 | 2018-05-24 | 改善在氧化硅上的超薄非晶硅膜的连续性的预处理方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10559465B2 (enExample) |
| JP (1) | JP7242631B2 (enExample) |
| KR (1) | KR102509390B1 (enExample) |
| CN (2) | CN110709967B (enExample) |
| WO (1) | WO2019022826A1 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20190035036A (ko) * | 2017-09-25 | 2019-04-03 | 삼성전자주식회사 | 박막 형성 장치 및 이를 이용한 비정질 실리콘 막 형성방법 |
| US11315787B2 (en) * | 2019-04-17 | 2022-04-26 | Applied Materials, Inc. | Multiple spacer patterning schemes |
| WO2021025874A1 (en) | 2019-08-06 | 2021-02-11 | Lam Research Corporation | Thermal atomic layer deposition of silicon-containing films |
| US11198606B2 (en) * | 2019-09-23 | 2021-12-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Structure for microelectromechanical systems (MEMS) devices to control pressure at high temperature |
| KR20230043795A (ko) | 2020-07-28 | 2023-03-31 | 램 리써치 코포레이션 | 실리콘-함유 막들의 불순물 감소 |
| CN112645277B (zh) * | 2020-12-11 | 2023-11-07 | 上海集成电路研发中心有限公司 | 一种新型红外探测器及制备方法 |
| US11640905B2 (en) * | 2020-12-17 | 2023-05-02 | Applied Materials, Inc. | Plasma enhanced deposition of silicon-containing films at low temperature |
| CN112599619A (zh) * | 2020-12-29 | 2021-04-02 | 成都晔凡科技有限公司 | 制造太阳能电池片的方法和太阳能电池片 |
| KR20240032126A (ko) | 2021-07-09 | 2024-03-08 | 램 리써치 코포레이션 | 실리콘-함유 막들의 플라즈마 강화 원자 층 증착 |
| KR20240046605A (ko) * | 2021-08-24 | 2024-04-09 | 램 리써치 코포레이션 | 멀티-패터닝에서 인-시츄 코어 보호 |
| TW202419657A (zh) * | 2022-07-20 | 2024-05-16 | 美商應用材料股份有限公司 | 共形鉬沉積 |
| CN120153457A (zh) * | 2022-09-06 | 2025-06-13 | 朗姆研究公司 | 掺杂硅或硼层的形成 |
| US20250112039A1 (en) * | 2023-10-03 | 2025-04-03 | Applied Materials, Inc. | Seam-free single operation amorphous silicon gap fill |
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| JP2006332634A (ja) * | 2005-04-28 | 2006-12-07 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
| KR20080031747A (ko) * | 2005-07-13 | 2008-04-10 | 에스. 오. 이. 떼끄 씰리꽁 오 냉쉴라또흐 떼끄놀로지 | 두꺼운 절연층의 거칠기도 감소 방법 |
| JP2008141204A (ja) * | 2007-11-30 | 2008-06-19 | Renesas Technology Corp | 半導体集積回路装置の製造方法 |
| WO2016196073A1 (en) * | 2015-06-03 | 2016-12-08 | Applied Materials, Inc. | Apparatus and methods for spacer deposition and selective removal in an advanced patterning process |
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| JP3181357B2 (ja) | 1991-08-19 | 2001-07-03 | 株式会社東芝 | 半導体薄膜の形成方法および半導体装置の製造方法 |
| JPH05160394A (ja) * | 1991-10-11 | 1993-06-25 | Sony Corp | Mis型半導体装置及びその製造方法 |
| US5800878A (en) | 1996-10-24 | 1998-09-01 | Applied Materials, Inc. | Reducing hydrogen concentration in pecvd amorphous silicon carbide films |
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| JP2020528670A (ja) | 2020-09-24 |
| CN117293018A (zh) | 2023-12-26 |
| CN110709967A (zh) | 2020-01-17 |
| KR102509390B1 (ko) | 2023-03-14 |
| US10559465B2 (en) | 2020-02-11 |
| KR20200023509A (ko) | 2020-03-04 |
| US20190027362A1 (en) | 2019-01-24 |
| JP7242631B2 (ja) | 2023-03-20 |
| WO2019022826A1 (en) | 2019-01-31 |
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