CN110663112A - 功率模块及用于制造功率模块的方法 - Google Patents

功率模块及用于制造功率模块的方法 Download PDF

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Publication number
CN110663112A
CN110663112A CN201880031155.8A CN201880031155A CN110663112A CN 110663112 A CN110663112 A CN 110663112A CN 201880031155 A CN201880031155 A CN 201880031155A CN 110663112 A CN110663112 A CN 110663112A
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CN
China
Prior art keywords
conductor layer
power module
layer
conduit
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201880031155.8A
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English (en)
Chinese (zh)
Inventor
R·姆莱德
S·莫洛夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN110663112A publication Critical patent/CN110663112A/zh
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/071—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next and on each other, i.e. mixed assemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20936—Liquid coolant with phase change
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN201880031155.8A 2017-05-29 2018-05-01 功率模块及用于制造功率模块的方法 Withdrawn CN110663112A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP17173262.1A EP3410478A1 (en) 2017-05-29 2017-05-29 Power module and method for manufacturing the power module
EP17173262.1 2017-05-29
PCT/JP2018/018023 WO2018221149A1 (en) 2017-05-29 2018-05-01 Power module and method for manufacturing the power module

Publications (1)

Publication Number Publication Date
CN110663112A true CN110663112A (zh) 2020-01-07

Family

ID=58800718

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880031155.8A Withdrawn CN110663112A (zh) 2017-05-29 2018-05-01 功率模块及用于制造功率模块的方法

Country Status (5)

Country Link
US (1) US11121059B2 (enExample)
EP (1) EP3410478A1 (enExample)
JP (1) JP6872291B2 (enExample)
CN (1) CN110663112A (enExample)
WO (1) WO2018221149A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11967899B2 (en) 2020-05-22 2024-04-23 Marel Power Solutions Fluid cooled inverter
US11849539B2 (en) * 2020-08-13 2023-12-19 Toyota Motor Engineering & Manufacturing North America, Inc. Embedded cooling systems utilizing heat pipes
US12193202B2 (en) 2021-09-15 2025-01-07 Marel Power Solutions, Inc. Air cooled compact power systems
KR20240058926A (ko) 2021-09-15 2024-05-07 마렐 파워 솔루션즈, 인코포레이티드 소형 전력 변환기
JP2024080085A (ja) * 2022-12-01 2024-06-13 ナブテスコ株式会社 部品内蔵型回路基板および部品内蔵型回路基板の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001063667A1 (en) * 2000-02-23 2001-08-30 Teracom Ab Apparatus for heat transport away from heated elements and a method for manufacturing the apparatus
EP2308274B1 (de) * 2008-07-31 2012-05-09 Robert Bosch GmbH Leiterplatine mit elektronischem bauelement
CN103635012A (zh) * 2012-08-21 2014-03-12 三星电机株式会社 印刷电路板以及用于制造该印刷电路板的方法

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Publication number Priority date Publication date Assignee Title
JPH05235492A (ja) * 1992-02-26 1993-09-10 Hitachi Ltd 配線基板
JP4140100B2 (ja) * 1998-10-29 2008-08-27 ソニー株式会社 ヒートパイプ内蔵プリント配線基板
FR2786656B1 (fr) * 1998-11-27 2001-01-26 Alstom Technology Composant electronique de puissance comportant des moyens de refroidissement
US6292366B1 (en) * 2000-06-26 2001-09-18 Intel Corporation Printed circuit board with embedded integrated circuit
US20040229391A1 (en) * 2003-04-25 2004-11-18 Kazuyuki Ohya LED lamp manufacturing process
JP4350606B2 (ja) * 2004-07-23 2009-10-21 シャープ株式会社 プリント配線板の製造方法
KR20050117482A (ko) * 2005-06-29 2005-12-14 주식회사 써모랩 냉각장치가 내장된 인쇄회로기판 및 그의 제작방법
US20090165302A1 (en) * 2007-12-31 2009-07-02 Slaton David S Method of forming a heatsink
JP2009290021A (ja) * 2008-05-29 2009-12-10 Toshiba Corp 部品内蔵プリント配線板、同配線板の製造方法および電子機器
EP3088829B1 (en) * 2013-12-24 2020-04-08 Furukawa Electric Co., Ltd. Heat receiving structure and heat sink
JP6398405B2 (ja) * 2014-07-15 2018-10-03 富士電機株式会社 半導体装置及び半導体装置の製造方法
US9567204B2 (en) * 2014-08-29 2017-02-14 Taiwan Semiconductor Manufacturing Co., Ltd. Microelectrochemical systems (MEMS) device having a seal layer arranged over or lining a hole in fluid communication with a cavity of the MEMS device
WO2016071324A1 (en) * 2014-11-03 2016-05-12 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Hermetically sealed heat pipe structure synthesized with support structure and method for producing it
JP6816722B2 (ja) * 2015-10-22 2021-01-20 Ａｇｃ株式会社 配線基板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001063667A1 (en) * 2000-02-23 2001-08-30 Teracom Ab Apparatus for heat transport away from heated elements and a method for manufacturing the apparatus
EP2308274B1 (de) * 2008-07-31 2012-05-09 Robert Bosch GmbH Leiterplatine mit elektronischem bauelement
CN103635012A (zh) * 2012-08-21 2014-03-12 三星电机株式会社 印刷电路板以及用于制造该印刷电路板的方法

Also Published As

Publication number Publication date
EP3410478A1 (en) 2018-12-05
WO2018221149A1 (en) 2018-12-06
US11121059B2 (en) 2021-09-14
JP2020505771A (ja) 2020-02-20
US20200161212A1 (en) 2020-05-21
JP6872291B2 (ja) 2021-05-19

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Application publication date: 20200107