CN110620124B - 摄像器件、信号处理器件和电子装置 - Google Patents

摄像器件、信号处理器件和电子装置 Download PDF

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Publication number
CN110620124B
CN110620124B CN201910870756.4A CN201910870756A CN110620124B CN 110620124 B CN110620124 B CN 110620124B CN 201910870756 A CN201910870756 A CN 201910870756A CN 110620124 B CN110620124 B CN 110620124B
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pixels
pixel
unit
sharing unit
pixel sharing
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CN110620124A (zh
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山本敦彦
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Sony Semiconductor Solutions Corp
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Sony Semiconductor Solutions Corp
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/10—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N25/67—Noise processing, e.g. detecting, correcting, reducing or removing noise applied to fixed-pattern noise, e.g. non-uniformity of response
    • H04N25/671—Noise processing, e.g. detecting, correcting, reducing or removing noise applied to fixed-pattern noise, e.g. non-uniformity of response for non-uniformity detection or correction
    • H04N25/672—Noise processing, e.g. detecting, correcting, reducing or removing noise applied to fixed-pattern noise, e.g. non-uniformity of response for non-uniformity detection or correction between adjacent sensors or output registers for reading a single image
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N25/68—Noise processing, e.g. detecting, correcting, reducing or removing noise applied to defects
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/703—SSIS architectures incorporating pixels for producing signals other than image signals
    • H04N25/704—Pixels specially adapted for focusing, e.g. phase difference pixel sets
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H10F39/8053—Colour filters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/813—Electronic components shared by multiple pixels, e.g. one amplifier shared by two pixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Color Television Image Signal Generators (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Optical Filters (AREA)
CN201910870756.4A 2013-10-31 2014-10-23 摄像器件、信号处理器件和电子装置 Expired - Fee Related CN110620124B (zh)

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JP2013226299A JP6180882B2 (ja) 2013-10-31 2013-10-31 固体撮像装置、信号処理装置、および電子機器
JP2013-226299 2013-10-31
CN201910870756.4A CN110620124B (zh) 2013-10-31 2014-10-23 摄像器件、信号处理器件和电子装置
CN201410572947.XA CN104600085B (zh) 2013-10-31 2014-10-23 固态摄像器件、信号处理器件和电子装置

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CN201410572947.XA Expired - Fee Related CN104600085B (zh) 2013-10-31 2014-10-23 固态摄像器件、信号处理器件和电子装置
CN201910870491.8A Expired - Fee Related CN110545389B (zh) 2013-10-31 2014-10-23 摄像器件
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CN201910870491.8A Expired - Fee Related CN110545389B (zh) 2013-10-31 2014-10-23 摄像器件
CN201910870831.7A Expired - Fee Related CN110581964B (zh) 2013-10-31 2014-10-23 摄像器件和电子装置

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Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9721983B2 (en) * 2015-05-15 2017-08-01 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device and manufacturing method thereof
JP6575926B2 (ja) * 2015-06-12 2019-09-18 リコーイメージング株式会社 撮影装置
JP2017055309A (ja) 2015-09-10 2017-03-16 キヤノン株式会社 撮像装置及びその制御方法
JP2017055308A (ja) * 2015-09-10 2017-03-16 キヤノン株式会社 撮像装置及びその制御方法
CN105578005B (zh) * 2015-12-18 2018-01-19 广东欧珀移动通信有限公司 图像传感器的成像方法、成像装置和电子装置
JP2018157371A (ja) * 2017-03-17 2018-10-04 キヤノン株式会社 撮像装置及び欠陥画素の補正方法
KR102354991B1 (ko) 2017-05-24 2022-01-24 삼성전자주식회사 픽셀 회로 및 이를 포함하는 이미지 센서
JP2019012968A (ja) * 2017-06-30 2019-01-24 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置、及び電子機器
JP2020108061A (ja) 2018-12-28 2020-07-09 キヤノン株式会社 撮像装置及び撮像システム
KR102787832B1 (ko) * 2020-05-22 2025-03-31 에스케이하이닉스 주식회사 이미지 센싱 장치
JP7499695B2 (ja) * 2020-12-24 2024-06-14 ゼタテクノロジーズ株式会社 固体撮像装置、固体撮像装置の信号処理方法、および電子機器
US12237349B2 (en) 2021-05-28 2025-02-25 Samsung Electronics Co., Ltd. Image sensor and image signal processing method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009206941A (ja) * 2008-02-28 2009-09-10 Canon Inc 撮像装置及び撮像装置を用いた撮像システム
CN102005461A (zh) * 2009-08-28 2011-04-06 索尼公司 固体摄像器件、固体摄像器件制造方法和电子装置
CN103209308A (zh) * 2012-01-12 2013-07-17 索尼公司 图像传感器、成像装置、电子设备和成像方法
CN103227897A (zh) * 2012-01-31 2013-07-31 索尼公司 固态图像传感器和相机系统
CN103369264A (zh) * 2012-03-30 2013-10-23 索尼公司 成像装置、成像方法、以及程序

Family Cites Families (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6657665B1 (en) * 1998-12-31 2003-12-02 Eastman Kodak Company Active Pixel Sensor with wired floating diffusions and shared amplifier
US7859581B2 (en) * 2003-07-15 2010-12-28 Eastman Kodak Company Image sensor with charge binning and dual channel readout
JP4556722B2 (ja) * 2004-05-31 2010-10-06 コニカミノルタホールディングス株式会社 撮像装置
JP4479373B2 (ja) * 2004-06-28 2010-06-09 ソニー株式会社 イメージセンサ
US20060000733A1 (en) * 2004-07-02 2006-01-05 Albritton Charles W Rigid container with vacuum channel walls
JP4794978B2 (ja) * 2005-10-25 2011-10-19 キヤノン株式会社 画像処理装置、制御方法、及びプログラム
DE102006007332A1 (de) * 2006-02-16 2007-08-30 Schoeller Arca Systems Services Gmbh Mehrfach verwendbare Transporteinheit für Folienrollen und dergleichen
JP4193874B2 (ja) * 2006-05-25 2008-12-10 ソニー株式会社 固体撮像装置とその製造方法、及びカメラモジュール
JP5045380B2 (ja) * 2007-11-13 2012-10-10 ソニー株式会社 撮像装置および撮像データ補正方法並びにプログラム
US7745779B2 (en) * 2008-02-08 2010-06-29 Aptina Imaging Corporation Color pixel arrays having common color filters for multiple adjacent pixels for use in CMOS imagers
TWI504256B (zh) * 2008-04-07 2015-10-11 Sony Corp 固態成像裝置，其訊號處理方法，及電子設備
JP2010010760A (ja) * 2008-06-24 2010-01-14 Sony Corp 撮像装置および方法
JP4661912B2 (ja) 2008-07-18 2011-03-30 ソニー株式会社 固体撮像素子およびカメラシステム
JP2010130237A (ja) * 2008-11-26 2010-06-10 Sony Corp 欠陥補正回路及びそれを備えた撮像装置
JP5254762B2 (ja) * 2008-11-28 2013-08-07 キヤノン株式会社 撮像装置、撮像システム、及び撮像装置における信号の補正方法
TWI422020B (zh) * 2008-12-08 2014-01-01 Sony Corp 固態成像裝置
GB2466213B (en) * 2008-12-12 2013-03-06 Cmosis Nv Pixel array with shared readout circuitry
JP5149143B2 (ja) * 2008-12-24 2013-02-20 シャープ株式会社 固体撮像素子およびその製造方法、電子情報機器
JP5267867B2 (ja) * 2009-03-06 2013-08-21 ルネサスエレクトロニクス株式会社 撮像装置
JP5359465B2 (ja) * 2009-03-31 2013-12-04 ソニー株式会社 固体撮像装置、固体撮像装置の信号処理方法および撮像装置
JP5458690B2 (ja) * 2009-06-22 2014-04-02 ソニー株式会社 固体撮像装置およびカメラ
JP5306081B2 (ja) * 2009-07-01 2013-10-02 株式会社東芝 信号処理回路
JP5471117B2 (ja) * 2009-07-24 2014-04-16 ソニー株式会社 固体撮像装置とその製造方法並びにカメラ
JP5379601B2 (ja) * 2009-08-07 2013-12-25 キヤノン株式会社 欠陥画素データ補正装置、撮像装置及び欠陥画素データ補正方法
JP4881987B2 (ja) * 2009-10-06 2012-02-22 キヤノン株式会社 固体撮像装置および撮像装置
JP5600924B2 (ja) * 2009-11-17 2014-10-08 ソニー株式会社 固体撮像装置とその製造方法並びにカメラ
JP5655355B2 (ja) * 2009-11-02 2015-01-21 ソニー株式会社 画素欠陥補正装置、撮像装置、画素欠陥補正方法、およびプログラム
JP2011129975A (ja) * 2009-12-15 2011-06-30 Sony Corp 撮像装置および欠陥検出方法
WO2011089898A1 (ja) * 2010-01-20 2011-07-28 パナソニック株式会社 変位推定方法、変位推定装置
EP2546196A1 (en) * 2010-03-11 2013-01-16 Mitsubishi Chemical Corporation Method and jig for producing silicon
SG10201503516VA (en) * 2010-05-12 2015-06-29 Pelican Imaging Corp Architectures for imager arrays and array cameras
JP5541718B2 (ja) * 2010-08-19 2014-07-09 キヤノン株式会社 撮像装置及びその欠陥画素検出方法
US8390712B2 (en) * 2010-12-08 2013-03-05 Aptina Imaging Corporation Image sensing pixels with feedback loops for imaging systems
JP5325202B2 (ja) * 2010-12-28 2013-10-23 シャープ株式会社 固体撮像素子およびその製造方法、電子情報機器
WO2012117616A1 (ja) * 2011-02-28 2012-09-07 富士フイルム株式会社 撮像装置及び欠陥画素補正方法
EA023144B1 (ru) * 2011-04-13 2016-04-29 Басф Се Аминные и диаминные соединения и их применение для обратной пенной флотации силиката из железной руды
JP2012234393A (ja) * 2011-05-02 2012-11-29 Sony Corp 画像処理装置、および画像処理方法、並びにプログラム
US9977096B2 (en) * 2011-07-07 2018-05-22 Biosense Webster (Israel) Ltd. Connector with active shielding
JP6003291B2 (ja) * 2011-08-22 2016-10-05 ソニー株式会社 固体撮像装置及び電子機器
JP2013055500A (ja) * 2011-09-02 2013-03-21 Sony Corp 固体撮像素子およびカメラシステム
JP5542243B2 (ja) * 2011-09-29 2014-07-09 富士フイルム株式会社 画像処理装置、方法及びプログラム並びに撮像装置
US8576979B2 (en) * 2011-10-11 2013-11-05 Omnivision Technologies, Inc. Arithmetic counter circuit, configuration and application for high performance CMOS image sensors
JP6026102B2 (ja) * 2011-12-07 2016-11-16 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子および電子機器
JP5994344B2 (ja) * 2012-04-04 2016-09-21 ソニー株式会社 固体撮像装置、電子機器
US9040892B2 (en) * 2012-07-27 2015-05-26 Apple Inc. High dynamic range image sensor having symmetric interleaved long and short exposure pixels
US8902336B2 (en) * 2013-01-30 2014-12-02 Altasens, Inc. Dynamic, local edge preserving defect pixel correction for image sensors with spatially arranged exposures

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009206941A (ja) * 2008-02-28 2009-09-10 Canon Inc 撮像装置及び撮像装置を用いた撮像システム
CN102005461A (zh) * 2009-08-28 2011-04-06 索尼公司 固体摄像器件、固体摄像器件制造方法和电子装置
CN103209308A (zh) * 2012-01-12 2013-07-17 索尼公司 图像传感器、成像装置、电子设备和成像方法
CN103227897A (zh) * 2012-01-31 2013-07-31 索尼公司 固态图像传感器和相机系统
CN103369264A (zh) * 2012-03-30 2013-10-23 索尼公司 成像装置、成像方法、以及程序

Also Published As

Publication number Publication date
CN110581964A (zh) 2019-12-17
CN104600085A (zh) 2015-05-06
CN110545389A (zh) 2019-12-06
CN104600085B (zh) 2019-09-13
CN110620124A (zh) 2019-12-27
US20200029056A1 (en) 2020-01-23
JP2015088947A (ja) 2015-05-07
US10992890B2 (en) 2021-04-27
CN110545389B (zh) 2022-03-18
CN110581964B (zh) 2022-03-18
US10462430B2 (en) 2019-10-29
US20210218916A1 (en) 2021-07-15
JP6180882B2 (ja) 2017-08-16
US20150116566A1 (en) 2015-04-30

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