CN110506083B - 导电糊剂 - Google Patents
导电糊剂 Download PDFInfo
- Publication number
- CN110506083B CN110506083B CN201880022499.2A CN201880022499A CN110506083B CN 110506083 B CN110506083 B CN 110506083B CN 201880022499 A CN201880022499 A CN 201880022499A CN 110506083 B CN110506083 B CN 110506083B
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- conductive paste
- powder
- conductive
- mass
- viscosity
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- 239000000843 powder Substances 0.000 claims abstract description 118
- 239000002270 dispersing agent Substances 0.000 claims abstract description 48
- 229920005989 resin Polymers 0.000 claims abstract description 40
- 239000011347 resin Substances 0.000 claims abstract description 40
- 238000007646 gravure printing Methods 0.000 claims abstract description 38
- 239000000654 additive Substances 0.000 claims abstract description 26
- 230000000996 additive effect Effects 0.000 claims abstract description 25
- 239000003960 organic solvent Substances 0.000 claims abstract description 24
- QGLWBTPVKHMVHM-KTKRTIGZSA-N (z)-octadec-9-en-1-amine Chemical compound CCCCCCCC\C=C/CCCCCCCCN QGLWBTPVKHMVHM-KTKRTIGZSA-N 0.000 claims abstract description 20
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims abstract description 20
- 239000001856 Ethyl cellulose Substances 0.000 claims abstract description 17
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229920001249 ethyl cellulose Polymers 0.000 claims abstract description 17
- 235000019325 ethyl cellulose Nutrition 0.000 claims abstract description 17
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 claims abstract description 15
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229940116411 terpineol Drugs 0.000 claims abstract description 15
- 239000000203 mixture Substances 0.000 claims abstract description 14
- 239000003985 ceramic capacitor Substances 0.000 claims abstract description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 15
- 229910002113 barium titanate Inorganic materials 0.000 claims description 6
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 4
- 238000007639 printing Methods 0.000 abstract description 42
- 238000003860 storage Methods 0.000 abstract description 15
- 229910052751 metal Inorganic materials 0.000 abstract description 9
- 239000002184 metal Substances 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000000926 separation method Methods 0.000 description 16
- 239000002245 particle Substances 0.000 description 15
- 239000010410 layer Substances 0.000 description 12
- 239000011230 binding agent Substances 0.000 description 9
- 230000007774 longterm Effects 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 238000005245 sintering Methods 0.000 description 8
- 238000010008 shearing Methods 0.000 description 7
- 239000006185 dispersion Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 239000003112 inhibitor Substances 0.000 description 3
- PLDDOISOJJCEMH-UHFFFAOYSA-N neodymium oxide Inorganic materials [O-2].[O-2].[O-2].[Nd+3].[Nd+3] PLDDOISOJJCEMH-UHFFFAOYSA-N 0.000 description 3
- 230000007847 structural defect Effects 0.000 description 3
- 238000004438 BET method Methods 0.000 description 2
- 238000004220 aggregation Methods 0.000 description 2
- WMWLMWRWZQELOS-UHFFFAOYSA-N bismuth(iii) oxide Chemical compound O=[Bi]O[Bi]=O WMWLMWRWZQELOS-UHFFFAOYSA-N 0.000 description 2
- 230000000740 bleeding effect Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 2
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229910052761 rare earth metal Inorganic materials 0.000 description 2
- 239000006228 supernatant Substances 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- FFQALBCXGPYQGT-UHFFFAOYSA-N 2,4-difluoro-5-(trifluoromethyl)aniline Chemical compound NC1=CC(C(F)(F)F)=C(F)C=C1F FFQALBCXGPYQGT-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910000416 bismuth oxide Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 1
- 239000002003 electrode paste Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000008012 organic excipient Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 229910001404 rare earth metal oxide Inorganic materials 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000010936 titanium Chemical group 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/10—Intaglio printing ; Gravure printing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-065321 | 2017-03-29 | ||
| JP2017065321A JP6939015B2 (ja) | 2017-03-29 | 2017-03-29 | 積層セラミックコンデンサ内部電極用のグラビア印刷用導電性ペースト |
| PCT/JP2018/006313 WO2018180048A1 (ja) | 2017-03-29 | 2018-02-21 | 導電性ペースト |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110506083A CN110506083A (zh) | 2019-11-26 |
| CN110506083B true CN110506083B (zh) | 2022-04-05 |
Family
ID=63675271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880022499.2A Active CN110506083B (zh) | 2017-03-29 | 2018-02-21 | 导电糊剂 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6939015B2 (ja) |
| KR (1) | KR102501339B1 (ja) |
| CN (1) | CN110506083B (ja) |
| TW (1) | TWI762596B (ja) |
| WO (1) | WO2018180048A1 (ja) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020090415A1 (ja) * | 2018-10-31 | 2020-05-07 | 昭栄化学工業株式会社 | Ｎｉペーストおよび積層セラミックコンデンサ |
| KR20210110285A (ko) * | 2018-12-25 | 2021-09-07 | 스미토모 긴조쿠 고잔 가부시키가이샤 | 도전성 페이스트, 전자 부품, 및 적층 세라믹 콘덴서 |
| WO2021177420A1 (ja) * | 2020-03-04 | 2021-09-10 | 住友金属鉱山株式会社 | 導電性ペースト、電子部品及び積層セラミックコンデンサ |
| JPWO2022168446A1 (ja) | 2021-02-02 | 2022-08-11 | ||
| CN116783070A (zh) | 2021-02-02 | 2023-09-19 | 株式会社村田制作所 | 复合结构体、层叠陶瓷电子部件前体、层叠陶瓷电子部件前体的制造方法、以及层叠陶瓷电子部件的制造方法 |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003187638A (ja) * | 2001-12-20 | 2003-07-04 | Murata Mfg Co Ltd | グラビア印刷用導電性ペーストおよびその製造方法、ならびに積層セラミック電子部品 |
| JP2003242835A (ja) * | 2001-12-13 | 2003-08-29 | Murata Mfg Co Ltd | グラビア印刷用導電性ペーストおよびその製造方法、ならびに積層セラミック電子部品 |
| JP2004182951A (ja) * | 2002-12-06 | 2004-07-02 | Murata Mfg Co Ltd | グラビア印刷用導電性インク、及び積層セラミック電子部品 |
| JP2012046779A (ja) * | 2010-08-25 | 2012-03-08 | Toyota Central R&D Labs Inc | 表面被覆金属ナノ粒子、その製造方法、およびそれを含む金属ナノ粒子ペースト |
| JP2012174797A (ja) * | 2011-02-18 | 2012-09-10 | Sumitomo Metal Mining Co Ltd | 積層セラミックコンデンサ内部電極に用いられるグラビア印刷用導電性ペースト |
| CN103137243A (zh) * | 2011-11-22 | 2013-06-05 | 旭硝子株式会社 | 导电糊剂以及导电糊剂的制备方法 |
| JP2013151753A (ja) * | 2013-03-04 | 2013-08-08 | Dowa Electronics Materials Co Ltd | 極性媒体との親和性に優れた銀微粉および銀インク |
| CN104769044A (zh) * | 2012-11-06 | 2015-07-08 | 株式会社则武 | 导电性糊剂组合物 |
| WO2016204105A1 (ja) * | 2015-06-15 | 2016-12-22 | 株式会社大阪ソーダ | 金属ナノ微粒子製造用組成物 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3180718B2 (ja) | 1997-06-02 | 2001-06-25 | 松下電器産業株式会社 | グラビア電極インキ及びその製造方法及び積層セラミック電子部品の製造方法 |
| KR101447271B1 (ko) * | 2011-12-02 | 2014-10-07 | 제일모직주식회사 | 태양전지 전극용 페이스트 조성물, 이를 이용하여 형성된 전극 및 이를 포함하는 태양전지 |
| JP6613551B2 (ja) * | 2014-07-31 | 2019-12-04 | 住友金属鉱山株式会社 | 積層セラミックコンデンサ内部電極用ペースト、及び積層セラミックコンデンサ |
-
2017
- 2017-03-29 JP JP2017065321A patent/JP6939015B2/ja active Active
-
2018
- 2018-02-21 KR KR1020197031008A patent/KR102501339B1/ko active IP Right Grant
- 2018-02-21 WO PCT/JP2018/006313 patent/WO2018180048A1/ja active Application Filing
- 2018-02-21 CN CN201880022499.2A patent/CN110506083B/zh active Active
- 2018-03-05 TW TW107107162A patent/TWI762596B/zh active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003242835A (ja) * | 2001-12-13 | 2003-08-29 | Murata Mfg Co Ltd | グラビア印刷用導電性ペーストおよびその製造方法、ならびに積層セラミック電子部品 |
| JP2003187638A (ja) * | 2001-12-20 | 2003-07-04 | Murata Mfg Co Ltd | グラビア印刷用導電性ペーストおよびその製造方法、ならびに積層セラミック電子部品 |
| JP2004182951A (ja) * | 2002-12-06 | 2004-07-02 | Murata Mfg Co Ltd | グラビア印刷用導電性インク、及び積層セラミック電子部品 |
| JP2012046779A (ja) * | 2010-08-25 | 2012-03-08 | Toyota Central R&D Labs Inc | 表面被覆金属ナノ粒子、その製造方法、およびそれを含む金属ナノ粒子ペースト |
| JP2012174797A (ja) * | 2011-02-18 | 2012-09-10 | Sumitomo Metal Mining Co Ltd | 積層セラミックコンデンサ内部電極に用いられるグラビア印刷用導電性ペースト |
| CN103137243A (zh) * | 2011-11-22 | 2013-06-05 | 旭硝子株式会社 | 导电糊剂以及导电糊剂的制备方法 |
| CN104769044A (zh) * | 2012-11-06 | 2015-07-08 | 株式会社则武 | 导电性糊剂组合物 |
| JP2013151753A (ja) * | 2013-03-04 | 2013-08-08 | Dowa Electronics Materials Co Ltd | 極性媒体との親和性に優れた銀微粉および銀インク |
| WO2016204105A1 (ja) * | 2015-06-15 | 2016-12-22 | 株式会社大阪ソーダ | 金属ナノ微粒子製造用組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110506083A (zh) | 2019-11-26 |
| JP6939015B2 (ja) | 2021-09-22 |
| JP2018168238A (ja) | 2018-11-01 |
| TWI762596B (zh) | 2022-05-01 |
| WO2018180048A1 (ja) | 2018-10-04 |
| KR102501339B1 (ko) | 2023-02-17 |
| TW201840756A (zh) | 2018-11-16 |
| KR20190129980A (ko) | 2019-11-20 |
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