CN110461920A - 用于树脂组合物的蚀刻液和蚀刻方法 - Google Patents

用于树脂组合物的蚀刻液和蚀刻方法 Download PDF

Info

Publication number
CN110461920A
CN110461920A CN201880021886.4A CN201880021886A CN110461920A CN 110461920 A CN110461920 A CN 110461920A CN 201880021886 A CN201880021886 A CN 201880021886A CN 110461920 A CN110461920 A CN 110461920A
Authority
CN
China
Prior art keywords
resin
etching solution
composition layer
mass
alkali
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201880021886.4A
Other languages
English (en)
Chinese (zh)
Inventor
丰田裕二
田边昌大
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Corp
Mitsubishi Paper Mills Ltd
Original Assignee
Mitsubishi Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Corp filed Critical Mitsubishi Corp
Publication of CN110461920A publication Critical patent/CN110461920A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/02—Etching, surface-brightening or pickling compositions containing an alkali metal hydroxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/02—Chemical treatment or coating of shaped articles made of macromolecular substances with solvents, e.g. swelling agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G03F7/2043—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means with the production of a chemical active agent from a fluid, e.g. an etching agent; with meterial deposition from the fluid phase, e.g. contamination resists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
CN201880021886.4A 2017-04-06 2018-04-02 用于树脂组合物的蚀刻液和蚀刻方法 Pending CN110461920A (zh)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2017-076148 2017-04-06
JP2017076148 2017-04-06
JP2017248831 2017-12-26
JP2017-248831 2017-12-26
JP2018-026675 2018-02-19
JP2018026675 2018-02-19
PCT/JP2018/014156 WO2018186362A1 (ja) 2017-04-06 2018-04-02 樹脂組成物用のエッチング液及びエッチング方法

Publications (1)

Publication Number Publication Date
CN110461920A true CN110461920A (zh) 2019-11-15

Family

ID=63713216

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880021886.4A Pending CN110461920A (zh) 2017-04-06 2018-04-02 用于树脂组合物的蚀刻液和蚀刻方法

Country Status (5)

Country Link
JP (1) JP6929936B2 (ja)
KR (1) KR102340959B1 (ja)
CN (1) CN110461920A (ja)
TW (1) TW201842165A (ja)
WO (1) WO2018186362A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115011348A (zh) * 2022-06-30 2022-09-06 湖北兴福电子材料有限公司 一种氮化铝蚀刻液及其应用

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6674075B1 (ja) * 2018-10-24 2020-04-01 三菱製紙株式会社 樹脂組成物のエッチング液及びエッチング方法
KR102327244B1 (ko) 2018-10-24 2021-11-16 미쓰비시 세이시 가부시키가이샤 수지 조성물의 에칭액 및 에칭 방법
JP6774589B1 (ja) * 2019-01-28 2020-10-28 三菱製紙株式会社 樹脂組成物のエッチング液及びエッチング方法
KR102364004B1 (ko) * 2019-04-03 2022-02-16 미쓰비시 세이시 가부시키가이샤 액정 폴리머용 에칭액 및 액정 폴리머의 에칭 방법
JP7341766B2 (ja) * 2019-07-19 2023-09-11 三菱製紙株式会社 樹脂組成物用のエッチング方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1479773A (zh) * 2000-07-18 2004-03-03 3M 挠性电路用液晶聚合物
JP2006012892A (ja) * 2004-06-22 2006-01-12 Mitsubishi Paper Mills Ltd デスミア液、およびデスミア方法
JP2006028207A (ja) * 2004-07-12 2006-02-02 Polyplastics Co 液晶性ポリマー成形品のメッキ前処理方法
TW201019054A (en) * 2008-11-07 2010-05-16 Chisso Corp Stripping liquid

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6330540A (ja) * 1986-07-23 1988-02-09 Canon Electronics Inc 樹脂表面の改質方法
JP2000013032A (ja) * 1998-06-19 2000-01-14 Hitachi Chem Co Ltd 多層プリント配線板の製造方法
US6923919B2 (en) * 2000-07-18 2005-08-02 3M Innovative Properties Company Liquid crystal polymers for flexible circuits
JP2003101244A (ja) 2001-09-27 2003-04-04 Ibiden Co Ltd 多層プリント配線板の製造方法および多層プリント配線板
JP2003261699A (ja) * 2002-03-08 2003-09-19 Toray Eng Co Ltd 液晶ポリマー用エッチング液及びそれを用いるエッチング方法
JP4104154B2 (ja) * 2005-03-31 2008-06-18 東レエンジニアリング株式会社 液晶ポリマーのエッチング液及び液晶ポリマーのエッチング方法。
JP5138277B2 (ja) 2007-05-31 2013-02-06 京セラＳｌｃテクノロジー株式会社 配線基板およびその製造方法
JPWO2017038713A1 (ja) 2015-08-31 2018-06-14 住友ベークライト株式会社 プリント配線板の製造方法、半導体装置の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1479773A (zh) * 2000-07-18 2004-03-03 3M 挠性电路用液晶聚合物
JP2006012892A (ja) * 2004-06-22 2006-01-12 Mitsubishi Paper Mills Ltd デスミア液、およびデスミア方法
JP2006028207A (ja) * 2004-07-12 2006-02-02 Polyplastics Co 液晶性ポリマー成形品のメッキ前処理方法
TW201019054A (en) * 2008-11-07 2010-05-16 Chisso Corp Stripping liquid

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115011348A (zh) * 2022-06-30 2022-09-06 湖北兴福电子材料有限公司 一种氮化铝蚀刻液及其应用
CN115011348B (zh) * 2022-06-30 2023-12-29 湖北兴福电子材料股份有限公司 一种氮化铝蚀刻液及其应用

Also Published As

Publication number Publication date
JPWO2018186362A1 (ja) 2020-01-16
TW201842165A (zh) 2018-12-01
JP6929936B2 (ja) 2021-09-01
WO2018186362A1 (ja) 2018-10-11
KR20190120771A (ko) 2019-10-24
KR102340959B1 (ko) 2021-12-17

Similar Documents

Publication Publication Date Title
CN110461920A (zh) 用于树脂组合物的蚀刻液和蚀刻方法
JP6514808B2 (ja) 配線基板の製造方法
JP6514807B2 (ja) 配線基板の製造方法
CN102484951A (zh) 印刷电路板、积层多层基板及其制造方法
CN101583489A (zh) 绝缘树脂片层叠体、层叠该绝缘树脂片层叠体而成的多层印刷布线板
TWI400024B (zh) 配線基板及其製造方法
KR20200000700U (ko) 프린트 배선판
KR102327244B1 (ko) 수지 조성물의 에칭액 및 에칭 방법
JP6774589B1 (ja) 樹脂組成物のエッチング液及びエッチング方法
TWI396492B (zh) 配線基板之製造方法
CN105430925B (zh) 厚铜线路板制作方法
JP7341766B2 (ja) 樹脂組成物用のエッチング方法
JP6674075B1 (ja) 樹脂組成物のエッチング液及びエッチング方法
JP2020033492A (ja) 樹脂組成物用のエッチング液
JP3242925U (ja) エッチング装置
JP3240214U (ja) エッチング装置
JP2022106534A (ja) 熱硬化性樹脂用デスミア液
JP2022042708A (ja) 樹脂組成物のエッチング方法
JP2017011147A (ja) 配線板および配線板の製造方法
JPH07226590A (ja) 多層配線板及びその製造法
JPH03268384A (ja) スルーホール付配線板の製造方法
JP2017228614A (ja) 電子部品の製造方法
JPH10310687A (ja) 樹脂複合体および無電解めっき用接着剤
JPH029195A (ja) スルーホール付印刷配線板の製造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
AD01 Patent right deemed abandoned

Effective date of abandoning: 20230228

AD01 Patent right deemed abandoned