CN110379773B - 封装、电子设备、移动体和封装的制造方法 - Google Patents

封装、电子设备、移动体和封装的制造方法 Download PDF

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Publication number
CN110379773B
CN110379773B CN201910725387.XA CN201910725387A CN110379773B CN 110379773 B CN110379773 B CN 110379773B CN 201910725387 A CN201910725387 A CN 201910725387A CN 110379773 B CN110379773 B CN 110379773B
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straight line
package
groove
cover
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CN110379773A (zh
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松泽寿一郎
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Seiko Epson Corp
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Seiko Epson Corp
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
    • H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/069—Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/101—Marks applied to devices, e.g. for alignment or identification characterised by the type of information, e.g. logos or symbols
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/301—Marks applied to devices, e.g. for alignment or identification for alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/601—Marks applied to devices, e.g. for alignment or identification for use after dicing
    • H10W46/607—Located on parts of packages, e.g. on encapsulations or on package substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Gyroscopes (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
CN201910725387.XA 2013-11-11 2014-11-10 封装、电子设备、移动体和封装的制造方法 Active CN110379773B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910725387.XA CN110379773B (zh) 2013-11-11 2014-11-10 封装、电子设备、移动体和封装的制造方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2013232791A JP6318556B2 (ja) 2013-11-11 2013-11-11 パッケージの製造方法および電子デバイスの製造方法
JP2013-232791 2013-11-11
CN201410643722.9A CN104639088B (zh) 2013-11-11 2014-11-10 盖体、封装、电子设备、移动体以及封装的制造方法
CN201910725387.XA CN110379773B (zh) 2013-11-11 2014-11-10 封装、电子设备、移动体和封装的制造方法

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CN110379773A CN110379773A (zh) 2019-10-25
CN110379773B true CN110379773B (zh) 2023-04-21

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CN201410643722.9A Active CN104639088B (zh) 2013-11-11 2014-11-10 盖体、封装、电子设备、移动体以及封装的制造方法

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US (1) US9516773B2 (https=)
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* Cited by examiner, † Cited by third party
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JP2014216123A (ja) * 2013-04-24 2014-11-17 タイコエレクトロニクスジャパン合同会社 電気コネクタ組立体及びその実装構造
JP2015088643A (ja) * 2013-10-31 2015-05-07 セイコーエプソン株式会社 電子デバイスの製造方法、電子デバイス、電子機器、移動体、および蓋体
JP2015088644A (ja) * 2013-10-31 2015-05-07 セイコーエプソン株式会社 電子デバイスの製造方法、電子デバイス、電子機器、移動体、および蓋体
JP2015087282A (ja) * 2013-10-31 2015-05-07 セイコーエプソン株式会社 電子デバイスの製造方法、電子デバイス、電子機器、移動体、および蓋体
CN109979824B (zh) * 2018-12-04 2020-05-15 江苏长电科技股份有限公司 一种陶瓷封装陶瓷盖的定位贴装方法

Citations (9)

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CN1215919A (zh) * 1997-10-24 1999-05-05 日本电气株式会社 半导体装置
CN1339243A (zh) * 1999-10-01 2002-03-06 精工爱普生株式会社 布线基板、半导体装置及其制造、检测和安装方法、电路基板和电子装置
JP2004304017A (ja) * 2003-03-31 2004-10-28 Kyocera Kinseki Corp 電子部品パッケ−ジ
CN101272012A (zh) * 2007-03-23 2008-09-24 深圳富泰宏精密工业有限公司 接口保护机构及应用该接口保护机构的电子装置
CN102123570A (zh) * 2010-01-09 2011-07-13 鸿富锦精密工业（深圳）有限公司 电子装置
CN102867908A (zh) * 2011-07-04 2013-01-09 精工爱普生株式会社 电子器件用封装、电子器件以及电子设备
CN103296990A (zh) * 2012-02-29 2013-09-11 精工爱普生株式会社 基体、电子器件的制造方法以及电子设备
TW201341773A (zh) * 2012-02-27 2013-10-16 藤倉股份有限公司 壓力感測器模組及蓋體
JP2013217856A (ja) * 2012-04-11 2013-10-24 Seiko Epson Corp センサーデバイスおよび電子機器

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JPH0511535U (ja) 1991-07-18 1993-02-12 シチズン時計株式会社 水晶振動子
JP3567822B2 (ja) * 1999-10-29 2004-09-22 株式会社村田製作所 電子部品と通信機装置および電子部品の製造方法
JP2001274649A (ja) 2000-03-24 2001-10-05 Daishinku Corp 水晶振動デバイスの気密封止方法
JP4277259B2 (ja) 2003-04-11 2009-06-10 セイコーエプソン株式会社 圧電デバイスおよび圧電デバイスの製造方法
US7342298B1 (en) * 2004-03-09 2008-03-11 Xilinx, Inc. Metal lid with improved adhesion to package substrate
JP2005353885A (ja) 2004-06-11 2005-12-22 Seiko Epson Corp 電子デバイスの製造方法
JP2006073679A (ja) 2004-08-31 2006-03-16 Citizen Watch Co Ltd 電子部品封止体の製造方法および製造装置
JP4244053B2 (ja) * 2006-06-16 2009-03-25 エプソントヨコム株式会社 圧電デバイスを備えた電子モジュール
US8053954B2 (en) * 2006-08-10 2011-11-08 Su-Pei Yang Piezoelectric speaker
JP2008153485A (ja) * 2006-12-19 2008-07-03 Epson Toyocom Corp 電子部品の製造方法
JP4893578B2 (ja) 2007-10-17 2012-03-07 株式会社大真空 電子部品の封止方法
CN101640258A (zh) * 2008-07-30 2010-02-03 深圳富泰宏精密工业有限公司 电池盖开合机构
US8208246B2 (en) * 2009-03-19 2012-06-26 Kabushiki Kaisha Toshiba Electronic apparatus
JP5410863B2 (ja) 2009-04-09 2014-02-05 シチズンホールディングス株式会社 レーザ光源
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JP2012034086A (ja) 2010-07-29 2012-02-16 Nippon Dempa Kogyo Co Ltd 圧電デバイスの製造方法及び圧電デバイス
JP2013012977A (ja) * 2011-06-30 2013-01-17 Nippon Dempa Kogyo Co Ltd 圧電デバイス及び圧電デバイスの製造方法
JP5756712B2 (ja) * 2011-08-17 2015-07-29 日本電波工業株式会社 水晶デバイス
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CN1215919A (zh) * 1997-10-24 1999-05-05 日本电气株式会社 半导体装置
CN1339243A (zh) * 1999-10-01 2002-03-06 精工爱普生株式会社 布线基板、半导体装置及其制造、检测和安装方法、电路基板和电子装置
JP2004304017A (ja) * 2003-03-31 2004-10-28 Kyocera Kinseki Corp 電子部品パッケ−ジ
CN101272012A (zh) * 2007-03-23 2008-09-24 深圳富泰宏精密工业有限公司 接口保护机构及应用该接口保护机构的电子装置
CN102123570A (zh) * 2010-01-09 2011-07-13 鸿富锦精密工业（深圳）有限公司 电子装置
CN102867908A (zh) * 2011-07-04 2013-01-09 精工爱普生株式会社 电子器件用封装、电子器件以及电子设备
TW201341773A (zh) * 2012-02-27 2013-10-16 藤倉股份有限公司 壓力感測器模組及蓋體
CN103296990A (zh) * 2012-02-29 2013-09-11 精工爱普生株式会社 基体、电子器件的制造方法以及电子设备
JP2013217856A (ja) * 2012-04-11 2013-10-24 Seiko Epson Corp センサーデバイスおよび電子機器

Also Published As

Publication number Publication date
JP6318556B2 (ja) 2018-05-09
US20150130548A1 (en) 2015-05-14
JP2015094614A (ja) 2015-05-18
CN104639088A (zh) 2015-05-20
CN104639088B (zh) 2019-09-06
CN110379773A (zh) 2019-10-25
US9516773B2 (en) 2016-12-06

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